AS8202

AS8202 TTP/C-C2 Communication Controller Preliminary Data Sheet Rev. 1.0, October 2000 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 Key Features • • • • • • • • • • • • • • Dedicated controller supporting TTP/C (time triggered protocol class C) Suited for dependable distributed real-time systems with guaranteed response time Application fields: Automotive (by-wire braking, steering, vehicle dynamics control, drive train control), Aerospace (aircraft electronic systems), Industrial systems, Railway systems TTP/C asynchronous data rate up to 5 MBit/s @ clock 40 MHz, synchronous data rate 25 MBit/s @ clock 40 MHz Single power supply 3.3V 0.35µm CMOS process Temperature range: -40°C to 125° C 2k x 16 RAM message, status and control area (communication network interface) RAM for instruction code and configuration data 16 Bit non-multiplexed host CPU interface 16 Bit RISC architecture 16k x 16 internal FLASH memory for firmware and scheduling information software tools, design-in support, development boards available ( http://www.tttech.com) 80 pin TQFP Package General Description The AS8202 communications controller is an integrated device supporting serial communication according to the TTP/C specification. It performs all communications tasks such as reception and transmission of messages in a TTP® cluster without interaction of the host CPU. TTP® provides mechanisms that allow the deployment in high-dependability distributed realtime systems. It provides following services: • • • • predictable transmission of messages with minimal jitter fault-tolerant distributed clock synchronisation consistent membership service with small delay masking of single faults ram_data[15:0] ram_address[11:0] ram_ceb ram_oeb ram_web ram_readyb time_signalb led[0]/time_tick led[1]/time_overflow led[2]/microtick xin0 xout0 resetb plloff rxd[1:0] rxclk[1:0] rxdv[1:0] rxer[1:0] Receiver Controller network interface (CNI) Host Processor Interface TTP/C protocol processor core Bus guardian xin1 xout1 TTP/C Bus Media Drivers Quartz or Oscillator Reset & Time base Transmitter txd[1:0] cts[1:0] txclk[1:0] FLASH memory Instruction RAM memory Network configuration memory (MEDL) test_se ftest stest fidis mtest Test Interface Figure 1 AS8202 Block Diagram Rev. 1.0, October 2000 Page 2 of 2 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 The CNI (communication network interface) forms a temporal firewall. It decouples the controller network from the host subsystem by use of a dual ported RAM. This prevents the propagation of control errors. The interface to the host CPU is implemented as 16 bit wide nonmultiplexed asynchronous bus interface. TTP/C follows a conflict-free media access strategy called time-division-multiple access (TDMA). This means, TTP/C deploys a time slot technique based on a global time which is permanently synchronised. Each node is assigned a time slot in which it is allowed to perform transmit operation. The sequence of time slots is called TDMA round, a set of TDMA rounds forms a cluster cycle. After one cluster cycle the operation of the network repeats. The sequence of interactions forming the cluster cycle is defined in a static time schedule, called message-descriptor-list (MEDL). The definition of the MEDL in conjunction with the global time determines the response time for a service request. The membership of all nodes in the network is evaluated by the communication controller. This information is presented in a consistent fashion to all correct cluster members. During operation, the status of every other node is propagated within one TDMA round. The MEDL is loaded into the configuration memory when the system starts up. P a c k a g e a n d P i n As s i g n m e n t Type: TQFP 80, plastic package ram-data[7] ram-data[6] ram-data[5] ram-data[4] ram-data[3] ram-data[2] ram-data[1] ram-data[0] Vss Vdd ram-address[11] ram-address[10] ram-address[9] ram-address[8] ram-address[7] ram-address[6] ram-address[5] Vss ram-address[4] ram-address[3] 60 61 Vdd Vss ram-data[8] ram-data[9] ram-data[10] ram-data[11] ram-data[12] ram-data[13] ram-data[14] ram-data[15] Vdd Vss ram-ceb ram-oeb ram-web ram-readyb to Vss to Vdd n.c. n.c. 80 1 41 40 ram-address[2] ram-address[1] ram-address[0] mtest led[2]/time-overflow led[1]/time-tick led[0]/microtick Vss Vdd time-signalb resetb fidis ftest plloff stest test-se Vss xin1 xout1 Vdd 21 AS8202 TTP/C Communications Controller (TOP VIEW) Figure 2 TQFP 80 pin package and pin assignment Rev. 1.0, October 2000 Vdd xout0 xin0 Vss txd[0] cts[0] txclk[0] rxer[0] rxclk[0] rxdv[0] rxd[0] Vdd Vss txd[1] cts[1] txclk[1] rxer[1] rxclk[1] rxdv[1] rxd[1] 20 Page 3 of 3 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 Pin Description Pin 1,12,21,32,51,61,71 4,13,24,33,43,52,62,72 2 3 5 6 7 8 9 10 11 14 15 16 17 18 19 20 22 23 Name Vdd Vss xout0 xin0 txd[0] cts[0] txclk[0] rxer[0] rxclk[0] rxdv[0] rxd[0] txd[1] cts[1] txclk[1] rxer[1] rxclk[1] rxdv[1] rxd[1] xout1 xin1 Dir P P O I OPU OPD IPD IPU IPD IPU IPU OPU OPD IPD IPU IPD IPU IPU O I Description positive power supply Negative power supply Main clock: analog pad from oscillator / leave open when providing external clock Main clock: analog pad from oscillator / use as input when providing external clock Transmit data channel 0 Transmit enable channel 0 TTP/C synchronous: Transmit clock channel 0 TTP/C synchronous: Receive error channel 0 TTP/C synchronous: Receive clock channel 0 TTP/C synchronous: Receive data valid channel 0 Receive data channel 0 Transmit data channel 1 Transmit enable channel 1 TTP/C synchronous: Transmit clock channel 1 TTP/C synchronous: Receive error channel 1 TTP/C synchronous: Receive clock channel 1 TTP/C synchronous: Receive data valid channel 1 Receive data channel 1 Bus guardian clock: analog pad from oscillator / leave open when providing external clock Bus guardian clock: analog pad from oscillator / use as input when providing external clock Test input, connect to Vss Test input, connect to Vss PLL disable pin Test input, connect to Vss Test input, connect to Vss main reset input signal, active low CNI control signal, CNI time signal Configurable: either generic output port (f.e. to drive LEDs) or timing signal TIME_TICK Configurable: either generic output port (f.e. to drive LEDs) or timing signal TIME_OVERFLOW Configurable: either generic output port (f.e. to drive LEDs) or timing signal TIME_OVERFLOW Test input, connect to Vss Host interface (CNI) address bus Host interface (CNI) data bus, tristate Host interface (CNI) chip enable, active low Host interface (CNI) output enable, active low Host interface (CNI) write enable, active low Host interface (CNI) transfer finish signal, active low Connect to Vss Connect to Vdd Do not connect Do not connect Input CMOS with pull up Output CMOS Output with pull up when tristate Power Pin 25 26 27 28 29 30 31 34 35 36 37 38-42,44-50 53-60,63-70 73 74 75 76 77 78 79 80 I IPD OPD I/O test_se stest plloff ftest fidis resetb time_signalb led[0]/microtick led[1]/time_tick led[2]/time_overflow mtest ram_address[0:11] ram_data[0:15] ram_ceb ram_oeb ram_web ram_readyb to Vss to Vdd high Z high Z IPD IPD IPD IPD IPD I OPU OPD OPD OPD IPD I I/O IPU IPU IPU OPU P IPU Input CMOS Input CMOS with pull down Output with pull down when tristate Input/Output CMOS tristate IPU O OPU P Rev. 1.0, October 2000 Page 4 of 4 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 Electrical Specifications A bsolute Maximum Ratings (Non Operating) SYMBOL VDD Vin Iin Tstrg Tsold tsold H ESD 1. PARAMETER DC Supply Voltage Input Voltage on any Pin Input Current on any Pin Storage Temperature Soldering Temperature Soldering Time Humidity Electrostatic Discharge MIN -0.3 V - 0.3 V -100 mA -55 oC MAX 5.0 V VDD + 0.3 V 100 mA 150 oC 260 oC 10 sec 85 % NOTE 25°C 1) Reflow and Wave HBM: R = 1.5 k , C = 100 pF 5% 1000 V 300 oC all ceramic packages and DIL plastic packages, 260 oC for surface mounting plastic packages Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may effect device reliability (e.g. hot carrier degradation). R ecommended Operating Conditions PARAMETER DC Supply Voltage Circuit Ground Static Supply Current Operating Supply Current Main clock frequency Bus Guardian clock frequency Ambient Temperature 1. SYMBOL VDD VSS IDDS IDD CLK CLK2 Ta MIN 3.0 V 0.0 V ------5 MHz 4 MHz -40 oC TYP 3.3 V 0.0 V 700 µA 45 mA MAX 3.6 V 0.0 V 800 µA 56 mA 20 MHz 16 MHz +125 oC NOTE 1) 2) fCLK = 40 MHz, VDD = 3.6 V 3) oscillator pins xin0, xout0 oscillatpr pins xin1, xout1 1) 2. 3. The input and output parameter values in this table are directly related to ambient temperature and DC supply voltage. A temperature range other Tamin to Tamax or a supply voltage range other than VDDmin to VDDmax will affect these values and must be evaluated extra. Static supply current IDDS is exclusive of input/output drive requirements and is measured at maximum VDD with the clocks stopped and all inputs tied to VDD or VSS, configured to draw minimum current. Operating current is exclusive of input/output drive requirements and is measured at maximum VDD and maximum clock frequency 40 MHz. D C Characteristics and Voltage Levels CMOS I/O levels for specified voltage and temperature range unless otherwise noted. Inputs Pins Pin Name All inputs and IO pins without pull-up/down Inputs with pull-up Inputs with pull-down 1. 2. 3. Vil max 30% VDD 30% VDD 30% VDD Vih min 70% VDD 70% VDD 70% VDD Iil (1) min NA -50 µA NA max -1.0 µA -160 µA NA Iih(2) min NA NA 30 µA NOTE max 1.0 µA NA 160 µA CMOS input (3) CMOS with pull up (3) CMOS with pull down (3) Iil ist tested at VDDmax and Vin = 0 Iih ist tested at VDDmax and Vin = VDDmax CMOS input levels are in percentage of VDD, for pull-up/down refer to pin description above. Rev. 1.0, October 2000 Page 5 of 5 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 Output Pins Pin Name txd[0,1],cts[0,1],led[0,2] All other output pins (except xout0, xout1) All I/O pins 1. 2. 3. Vol, Iol is tested at VDD = 3.3V Voh, Ioh is tested at VDD = 3.3V Ioz is tested at VDD = 3.6V Vol V 0.4 0.4 0.4 Voh V 2.4 2.4 2.4 Iol (1) mA 4.0 2.0 2.0 Ioh(2) mA -4.0 -2.0 -2.0 Ioz(3) µA NA NA +/-10 NOTE CMOS output CMOS output CMOS output, Tristate A C Characteristics PARAMETER main clock external operating frequency main clock XTAL0 frequency main internal clock frequency XTAL1 operating frequency 1. SYMBOL clkext clkxt0 clk0 clkxt1 PIN xin0 xin0/xout0 --xin1/xout1 MIN 0 1 MHz --1 MHz MAX 40 MHz 20 MHz 40 MHz 20 MHz NOTE pin plloff = high PLL not used oscillator cell 1 1) pin plloff = low PLL in use 1) oscillator cell 2 1) XTAL frequency or external clock frequency for PLL input is fixed to 10 MHz, other frequencies applicable only without PLL function in use. Rev. 1.0, October 2000 Page 6 of 6 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 Application Information H ost CPU Interface The host CPU interface also referred as CNI (communication network interface) connects the application circuitry to the TTP controller. All ram_-lines provide asynchronous read/write access to a dual ported RAM. There are no setup/hold constraints referred to the microtick (main clock “clk0”). The signals have to be applied for certain duration to be synchronized to the main internal clock (microtick). The time_-lines signal to host CPU the global synchronous time of the TTP network and determine when to deliver, resp. to fetch data from the host interface. One of the lines may be connected to an interrupt input of the host CPU. Note that the microtick, time_overflow and the time_tick pins can be configured as general purpose output LED pins (see the LED Interface section below). Host Interface Ports Pin Name ram_address[0:11] ram_data[0:15] ram_ceb ram_web ram_oeb ram_readyb time_overflow microtick time_signal time_tick mode in inout (tri) In In In out out out out out width 12 16 1 1 1 1 1 1 1 1 comment DPRAM address bus, 12 bit DPRAM data bus, 16 bit DPRAM chip enable DPRAM write enable DPRAM output enable DPRAM ready Overflow of global time (global time is Zero) Microtick (internal main clock) CNI time signal Macrotick (global time is incremented) Asynchronous DPRAM interface Signals ram_address[0:11] and ram_web have to be stable before the falling edge of ram_ceb For a write access the host sets ceb, web, address and data until the DPRAM has taken the data and set readyb active low. The next access may start with readyb inactive again. A read cycle starts with valid address and ceb, the data is valid with readyb active low. A low level on oeb and ceb switches the data bus from tristate to output. Access times depend on the controller clock rate and controller activity, typical values are: controller cycle time write time read time readyb low time write ceb addres Tc Tw Tr Trb Min 25 ns (40 MHz) Min 4 Tc Min 5 Tc Min 1 Tc read valid valid tristate valid xx valid data web oeb ready b Tw Trb Tr Trb Page 7 of 7 Rev. 1.0, October 2000 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 R eset and Oscillator Pin Name xin0 xout0 xin1 xout1 plloff resetb mode in out in out in in width 1 1 1 1 1 1 Comment main oscillator input main oscillator output bus guardian oscillator input bus guardian oscillator output PLL disable external reset Table 1: Reset and Oscillator Ports External Reset Signal To issue a reset of the chip the resetb port has to be driven low for at least µs. After power-up the reset must overlap the build-up time of the oscillator circuit. Integrated Power-On Reset The Device has an internal Power-On Reset generator. When supply voltage ramps up, the internal reset signal is kept active (low) for about 33 µs typical. Parameter supply voltage slope power on reset active time after VDD > 1,0V Symbol dV/dt tpon_res Min 250 25 Typ 33 Max 49 Unit kV/s us Oscillator circuitry The internal oscillator cell requires an external quartz or an external oscillator respectively. The frequency applied on the main clock input (xin0, xout0) can be reduced by a factor of four by using the internal PLL. In order to generate an internal frequency of 40 MHz using the internal PLL, an external quartz or quartz oscillator with a frequency of 10 MHz is connected and the plloff input is tied low. The bus guardian clock has no internal PLL. 20MHz ‚1‘ 16MHz 10MHz ‚0‘ n.c. 16MHz 40MHz oscillator ‚1‘ 16MHz oscillator n.c. plloff plloff xout0 xin0 xout1 xin1 xout0 xin0 xout1 xin1 plloff xout0 xin0 xout1 xin1 AS8202 20 MHz AS8202 40 MHz AS8202 40 MHz Figure 3: Quartz Circuit PLL off Figure 4: Quartz Circuit PLL on Figure 5: Oscillator Circuit Rev. 1.0, October 2000 Page 8 of 8 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 T TP/C Asynchronous Bus Interface The TTP/C asynchronous bus interface uses MFM patterns to transmit/receive signals at a maximum data rate of 5 MBit/s on a shared media (physical bus). The pins can either be connected to drivers using recessive/dominant states on the wire as well as drivers using active push/pull functionality. Pin Name txd[0] cts[0] txclk[0] rxer[0] rxclk[0] rxdv[0] rxd[0] txd[1] cts[1] txclk[1] rxer[1] rxclk[1] rxdv[1] rxd[1] mode out out in in in in in out out in in in in in comment Transmit data channel 0 Transmit enable channel 0 no function (do not connect) no function (do not connect) no function (do not connect) no function (do not connect) Receive data channel 0 Transmit data channel 1 Transmit enable channel 1 no function (do not connect) no function (do not connect) no function (do not connect) no function (do not connect) Receive data channel 1 Table 2: TTP/C Asynchronous Bus Interface Pins T TP/C Synchronous Bus Interface The TTP/C synchronous bus interface uses a synchronous transfer method to transfer data at a rate of 25 MBit/s. PHY drivers used in commercial 100 MBit Ethernet applications can be connected to this interface. Pin Name txd[0] cts[0] txclk[0] rxer[0] rxclk[0] rxdv[0] rxd[0] txd[1] cts[1] txclk[1] rxer[1] rxclk[1] rxdv[1] rxd[1] mode out out in in in in in out out in in in in in comment Transmit data channel 0 Transmit enable channel 0 Transmit clock channel 0 Receive error channel 0 Receive clock channel 0 Receive data valid channel 0 Receive data channel 0 Transmit data channel 1 Transmit enable channel 1 Transmit clock channel 1 Receive error channel 1 Receive clock channel 1 Receive data valid channel 1 Receive data channel 1 Table 3: TTP/C Synchronous Bus Interface Pins Rev. 1.0, October 2000 Page 9 of 9 TTP/C-C2 Communication Controller – Preliminary Data Sheet AS8202 T est Interface The Test Interface supports the manufacturing test and characterisation of the chip. In the application environment test pins and special pins have to be connected as following: test_se, stest, ftest, fidis, mtest, Vpp : connect to Vss Tmr : connect to Vdd Tm0, Tm1 : do not connect Warning: Any other connection of this pins may cause permanent damage to the device. L ED Signals The LED signals can be used as a universal output port. The driver strength of the LED ports is 4mA. Note that the pins can be configured as special-function host interface pins (see the Host Interface section for more details). Ordering Information Part Number: Part Name: Package: AS8202 TTP/C-C2 Communication Controller TQFP 80 Support Software tools, hardware development boards, evaluation systems and extensive support on TTP system integration as well as consulting is provided by: TTTech Computertechnik AG Time-Triggered Technology and TTChip GmbH – a TTTech Company Schoenbrunnerstrasse 7 A1040 Vienna Austria Voice: +43 1 5853434 - 0 Fax: +43 1 5853434 - 90 email: office@tttech.com web: http://www.tttech.com Note: TTP® is a registered trademark of FTS Computertechnik GmbH. All other trademarks are the property oftheir respective holders. Copyright © 2000 TTTech Computertechnik AG Copyright © 2000, Austria Mikro Systeme International AG, Schloß Premstätten, 8141 Unterpremstätten, Austria. Telefon +43-(0)3136-500-0, Telefax +43-(0)3136-52501, E-Mail info@amsint.com All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, without the prior permission in writing by the copyright holder. To the best of its knowledge, Austria Mikro Systeme International asserts that the information contained in this publication is accurate and correct. Rev. 1.0, October 2000 Page 10 of 10