TMG3993
Gesture, Color, ALS, and Proximity
Sensor Module with mobeam™
Barcode Emulation
General Description
The device features advanced Gesture detection, Proximity
detection, Digital Ambient Light Sense (ALS), Color Sense
(RGBC), and optical pattern generation/transmission for
broadcast. The slim modular package,
2.36mm × 3.95mm × 1.36mm, incorporates an IR LED and
factory calibrated LED driver.
Gesture detection utilizes four directional photodiodes to
sense reflected IR energy (sourced by the integrated LED) to
convert physical motion information (i.e. velocity, direction and
distance) to a digital information. The architecture of the
gesture engine features automatic activation (based on
Proximity engine results), ambient light subtraction, cross-talk
cancelation, dual 8-bit data converters, power saving
inter-conversion delay, 32-dataset FIFO, and interrupt driven
I 2C communication. The gesture engine accommodates a wide
range of mobile device gesturing requirements: simple
North-South-East-West gestures or more complex gestures can
be accurately sensed. Power consumption and noise are
minimized with adjustable IR LED timing.
The Proximity detection feature provides object detection
(E.g. mobile device screen to user’s ear) by photodiode
detection of reflected IR energy (sourced by the integrated
LED). Detect/release events are interrupt driven, and occur
whenever proximity result crosses upper and/or lower
threshold settings. The proximity engine features offset
adjustment registers to compensate for system offset caused
by unwanted IR energy reflections appearing at the sensor. The
IR LED intensity is factory trimmed to eliminate the need for
end-equipment calibration due to component variations.
Proximity results are further improved by automatic ambient
light subtraction.
The Color and ALS detection feature provides red, green, blue
and clear light intensity data. Each of the R, G, B, C channels
have a UV and IR blocking filter and a dedicated data converter
producing16-bit data simultaneously. This architecture allows
applications to accurately measure ambient light and sense
color which enables devices to calculate illuminance and color
temperature, control display backlight, and chromaticity.
mobeam™ barcode emulation is achieved using the IRBeam
optical pattern generation/transmission feature. IRBeam is
primarily intended for 1-D barcode transmission over IR to
point-of-sale (POS) terminals.
ams Datasheet
[v1-08] 2017-Apr-13
Page 1
Document Feedback
TMG3993 − General Description
The IRBeam engine features a 1024-bit RAM for pattern storage
and specialized control logic that is tailored to repetitively
broadcast a barcode pattern using the integrated LED. The
IRBeam engine features adjustable timing, looping, and IR
intensity to maximize successful barcode reception rate among
the multitude of different barcode scanner/readers currently in
use globally.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TMG3993, Gesture, Color, ALS, and
Proximity Sensor Module with mobeam™ Barcode Emulation
are listed below:
Figure 1:
Added Value of Using TMG3993
Benefits
Features
• Single Device Integrated Optical
Solution
• Gesture Detection, Proximity, Color/ALS and IRBeam
Support
• Power Management Features
• Ambient Light Sensing
• UV and IR blocking filters
• Programmable Gain & Integration Time
• 16.7M:1 Dynamic Range
• Complex Gesture Sensing
•
•
•
•
•
•
• Ideal for Operation Behind Dark Glass
• Very High Sensitivity
• Proximity Detection
•
•
•
•
•
•
• Barcode Pattern Generation and
Transmission
• IRBeam Hardware Support
• Pattern Storage in Internal RAM
• Dual Use of a Single Internal LED
• Integrated LED driver with current control for both Proximity
and IRBeam
Page 2
Document Feedback
Four separate diodes sensitive to different directions
Ambient Light Rejection
Offset Compensation
Programmable Driver for IR LED current
32 Dataset storage FIFO
Interrupt Driven I²C Communication
Trimmed to provide consistent reading
Ambient Light Rejection
Proximity Offset Compensation
Saturation Indicator bit
Programmable Driver for IR LED current
98000:1 Dynamic Range
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − General Description
Applications
The TMG399x applications include:
• Gesture Detection
• Color Sense
• Ambient Light Sensing
• Cell Phone Touch Screen Disable
• Mechanical Switch Replacement
• Printed Bar Code Emulation
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TMG3993 Block Diagram
Block Diagram: “Pattern Burst Engine” is used for IRBeam operational mode.
ams Datasheet
[v1-08] 2017-Apr-13
Page 3
Document Feedback
TMG3993 − Pin Assignment
The TMG3993 pin assignments are described below.
Pin Assignment
Figure 3:
Pin Diagram
(Top View)
Package drawing is not to scale.
VDD
1
8
SDA
SCL
2
7
INT
GND
3
6
LDR
LEDA
4
5
LEDK
NORTH
TMD and TMG Package
Figure 4:
Pin Description
Pin Number
Pin Name
1
VDD
Supply voltage.
2
SCL
I²C serial clock input terminal.
3
GND
Ground. All voltages are referenced to GND.
4
LEDA
LED Anode.
5
LEDK
LED Cathode. Connect to LDR pin when using internal LED driver circuit.
6
LDR
LED drive. Current sink for LED.
7
INT
Interrupt. Open drain output (active low) and logic level output for
external IR LED circuit.
8
SDA
I²C serial data I/O terminal.
Page 4
Document Feedback
Description
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings (1)
Symbol
Parameter
VDD
Supply voltage
LEDA
Supply voltage
Digital I/O terminal voltage
LDR
(SDA, INT)
TSTRG
ESDHBM
Min
Max
Units
Comments
3.8
V
All voltages are with respect to GND
4.8
V
TA = 0ºC to 70ºC
4.4
V
TA = -30ºC to 85ºC
3.8
V
4.4
V
TA = -30ºC to 85ºC (2)
4.8
V
TA = 0ºC to 70ºC (2)
3.8
V
TA = -30ºC to 85ºC (3)
- 0.5
Max voltage
Output terminal current
-1
20
mA
Storage temperature range
- 40
85
ºC
ESD tolerance, human
body model
±2000
V
Note(s):
1. All voltages with respect to GND
2. Measured with LDR = OFF.
3. LDR = ON.
ams Datasheet
[v1-08] 2017-Apr-13
Page 5
Document Feedback
TMG3993 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
Parameter
VDD
TA
Min
Typ
Max
Units
Supply voltage
2.4
3
3.6
V
Operating free-air temperature (1)
-30
85
ºC
Note(s):
1. While the device is operational across the temperature range, performance will vary with temperature. Specifications are stated at
25°C unless otherwise noted.
Figure 7:
Operating Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Symbol
Parameter
fOSC
Oscillator Frequency
IDD
VOL
Supply current (1)
INT, SDA output low
voltage
Page 6
Document Feedback
Conditions
Min
Typ
Max
Units
3.525
3.675
3.825
MHz
Active ALS state
(PON=AEN=1,
PEN=PBEN=0)
220
330
Low slew rate
(PON=PBEN=1,
AEN=PEN=SLEW=0)
560
High slew rate
(PON=PBEN=SLEW=1,
AEN=PEN=0)
650
Proximity, During LDR
Pulse (PPULSE: 8 pulses) (2)
790
Gesture, During LDR Pulse
(GPULSE = 8) (3)
790
Wait state (PON=1,
AEN=PEN=PBEN=0)
38
Sleep state (4)
1.0
3 mA sink current
6 mA sink current
μA
0
0
10
0.4
0.6
V
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Electrical Characteristics
Symbol
Parameter
Conditions
Leakage current, SDA,
SCL, INT pins
Min
Typ
−5
Max
5
ILEAK
μA
Leakage current, LDR
pin
VIH
VIL
Units
SCL, SDA input high
voltage
SCL, SDA input low
voltage
−10
TMG39931
TMG39935
10
0.7 VDD
V
TMG39933
TMG39937
1.26
TMG39931
TMG39935
0.3 VDD
V
TMG39933
TMG39937
0.54
Note(s):
1. Values are shown at the V DD pin and do not include current through the IR LED.
2. Current consumption during an LDR pulse is referenced as “IDEVICE ANALOG” later in this document when calculating average power
consumption.
3. Current consumption by the device during sleep is also used to approximate “IDEVICE DRIVE” referenced later in this document when
calculating average power consumption.
4. Sleep state occurs when PON = 0 and I2C bus is idle. If Sleep state has been entered as the result of operational flow, SAI = 1, PON
will remain high.
Figure 8:
Optical Characteristics (RGBC), V DD = 3V, TA = 25ºC
Ratio of Color to Clear Channel
Parameter
Color ADC count value
ratio: Color/Clear
Test
Conditions
Red
Channel
Green
Channel
Blue
Channel
Min
Max
Min
Max
Min
Max
White LED, 2700 K
45%
65%
19%
39%
12%
45%
λD = 465 nm (1)
0%
15%
8%
42%
70%
100%
λD = 525 nm (2)
4%
25%
55%
85%
10%
50%
λD = 615 nm (3)
80%
110%
0%
14%
3%
32%
Note(s):
1. The 465nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 465nm, spectral halfwidth Δλ½ = 22nm.
2. The 525nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 525nm, spectral halfwidth Δλ½ = 35nm.
3. The 615nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: dominant wavelength
λ D = 615nm, spectral halfwidth Δλ½ = 15nm.
ams Datasheet
[v1-08] 2017-Apr-13
Page 7
Document Feedback
TMG3993 − Electrical Characteristics
Figure 9:
RGBC Characteristics, VDD = 3 V, TA = 25ºC, AGAIN = 16×, AEN, ATIME = 0XF6 (unless otherwise noted)
Parameter
Conditions
Min
Typ
Max
Units
Dark ADC count value
Ee = 0, AGAIN : 64×,
ATIME=0xDC (100ms)
0
1
3
counts (1)
ADC integration time step size
ATIME = 0xFF
2.78
ms
ADC number of integration steps
1
256
steps
ADC counts per step (2)
0
1024
counts
0
65535
counts
ADC count value
ATIME = 0xC0
AGAIN = 1×
0.058
0.062
0.067
AGAIN = 4×
0.237
0.25
0.263
AGAIN = 64×
3.75
4
4.37
Clear Channel Irradiance Responsivity (3)
White LED, 2700 K
17.6
22.0
26.4
ADC Noise (4)
AGAIN =16x
Gain scaling, relative to 16× gain setting
0.005
X
counts/
(μW/ cm2)
% full Scale
Note(s):
1. The typical value based on 3-sigma distribution. An AGAIN setting of 16x correlates to a typically dark ADC count value less than or
equal to 1.
2. Actual step sizes are 1024, however and addition count must be added when calculating the full-scale count value. For example, an
ATIME setting of 0xFF results in a full-scale count value of 1025.
3. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 2700K.
4. Number of data samples is 1000.
Page 8
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Electrical Characteristics
Figure 10:
Gesture Characteristics, V DD = 3 V, TA = 25ºC, GEN = 1 (unless otherwise noted)
Parameter
Conditions
Min
ADC conversion time step size (1)
LED pulse count (2)
Typ
Max
1.39
GPULSE
1
ms
64
GPLEN = 0
4.0
GPLEN = 1
8.0
GPLEN = 2
16.0
GPLEN = 3
32.0
GLDRIVE = 0
100
GLDRIVE = 1
50
GLDRIVE = 2
25
GLDRIVE = 3
12.5
LEDBOOST = 0
100
LEDBOOST = 1
150
LEDBOOST = 2
200
LEDBOOST = 3
300
Units
LED pulse width (3)
pulses
μs
mA
LED drive current (4)
Photodiode relative deviation (5)
Gesture Noise (6)
-25
GPULSE: 16 Pulses,
GPLEN : 8 μs,
GGAIN : 4x,
GLDRIVE = 0,
LEDBOOST = 0
0.78
%
25
%
1.25
% full
Scale
Note(s):
1. Each N/S or E/W pair requires a conversion time of 696.6μs. For all four directions the conversion requires twice as much time.
2. This parameter ensured by design and characterization and is not 100% tested.
3. Value may be as much as 1.36μs longer than specified.
4. GLDRIVE current may vary from the typical value. LEDBOOST multiplies LDR current by the percentage selected.
5. This is the percent mismatch between the N, S, W, and E channels. No glass or aperture above the module.
6. Number of data samples is 128. This is the standard deviation expressed as percent of full scale signal.
ams Datasheet
[v1-08] 2017-Apr-13
Page 9
Document Feedback
TMG3993 − Electrical Characteristics
Figure 11:
Gesture Optical Characteristics, V DD = 3 V, TA = 25ºC, GGAIN = 8x, GEN = 1, Angle of Incident light = 0º
(unless otherwise noted)
Parameter
Conditions
ADC integration time step size
Min
GDIMS = 0
Typ
1.36
ADC count value
0
Gain scaling, relative to 1× gain setting
Max
ms
255
GGAIN : 2x
2
GGAIN : 4x
4
GGAIN : 8x
8
Units
counts
X
Figure 12:
Proximity Characteristics, VDD = 3 V, TA = 25ºC, PEN = 1 (unless otherwise noted)
Parameter
Conditions
Min
ADC conversion time
LED pulse count (1)
Typ
Max
696.6
PPULSE
1
μs
64
PPLEN = 0
4.0
PPLEN = 1
8.0
PPLEN = 2
16.0
PPLEN = 3
32.0
LDRIVE = 0
100
LDRIVE = 1
50
LDRIVE = 2
25
LDRIVE = 3
12.5
LEDBOOST = 0
100
LEDBOOST = 1
150
LEDBOOST = 2
200
LEDBOOST = 3
300
LED pulse width (2)
Units
pulses
μs
mA
LED drive current (3), (4)
%
Page 10
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Electrical Characteristics
Parameter
Conditions
Min
Proximity Offset
(no target response) (5)
PGAIN = 2 (4x)
LDRIVE = 0
LEDBOOST = 1
PPLEN = 2
PPULSE= 2 (3 pulses)
100mm X 100mm 90%
reflective Kodak Grey
Card at 100mm
Proximity Response (6)
PGAIN = 2 (4x)
LDRIVE = 0
LEDBOOST = 1
PPLEN = 2
PPULSE= 2 (3 pulses)
100mm X 100mm 90%
reflective Kodak Grey
Card at 100mm distance
Typ
Max
4
106
Units
counts
132
158
Counts
Note(s):
1. This parameter ensured by design and characterization and is not 100% tested.
2. Value may be as much as 1.36μs longer than specified.
3. Value is factory-adjusted to meet the Proximity response specification. Considerable variation (relative to the typical value) is possible
after adjustment. LEDBOOST increases current setting (as defined by LDRIVE or GLDRIVE). For example, if LDRIVE = 0 and
LEDBOOST = 300%, LDR current is 300mA.
4. LEDBOOST multiplies LDR current by the percentage selected.
5. Proximity offset value varies with power supply characteristics and system noise.
6. Correlated result by characterization. Refer to Figure 25 and Figure 26 for typical operating settings.
Figure 13:
Proximity and Gesture Test Circuit
22
VDD
1µF
GND
4
1
TMG399x
3
5
6
LEDA
1µF
22µF
LEDK
LDR
Note(s):
1. The circuit shown above is used during evaluation of the device and during characterization data collection.
ams Datasheet
[v1-08] 2017-Apr-13
Page 11
Document Feedback
TMG3993 − Electrical Characteristics
Figure 14:
Wait Characteristics, VDD = 3 V, TA = 25ºC, WEN = 1 (unless otherwise noted)
Parameter
Conditions
Wait step size
Min
Typ
Max
Units
2.78
ms
Figure 15:
Pattern Generation/Burst Operating Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Symbol
Parameter
Conditions
t(PBT min)
Minimum bit time
PBEN = 1
Page 12
Document Feedback
Min
Typ
0.27
Max
Units
μs
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Timing Characteristics
Timing Characteristics
Figure 16:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Parameter (1)
Description
Min
Max
Units
0
400
kHz
fSCL
Clock frequency (I²C only)
tBUF
Bus free time between start and stop condition
1.3
μs
tHD;STA
Hold time after (repeated) start condition. After
this period, the first clock is generated.
0.6
μs
tSU;STA
Repeated start condition setup time
0.6
μs
tSU;STO
Stop condition setup time
0.6
μs
tHD;DAT
Data hold time
0
ns
tSU;DAT
Data setup time
100
ns
tLOW
SCL clock low period
1.3
μs
tHIGH
SCL clock high period
0.6
μs
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Note(s):
1. Specified by design and characterization; not production tested.
Timing Diagrams
Figure 17:
Timing Parameter Measurement Drawing
tHIGH
tR
tLOW
tF
VIH
SCL
VIL
tHD; STA
tSU; DAT
tHD; DAT
tSU; STA
tSU; STO
tBUF
SDA
VIH
VIL
STOP START
ams Datasheet
[v1-08] 2017-Apr-13
START
STOP
Page 13
Document Feedback
TMG3993 − Typical Operating Characteristics
Typical Operating
Characteristics
Normalized Responsivity
Figure 18:
Spectral Responsivity
λ - Wavelength - nm
Normalized Response (%)
Figure 19:
RGBC Responsivity vs. Angular Displacement
Angle of Incident Light - (º)
Page 14
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Typical Operating Characteristics
LDR Current
Figure 20:
Typical LDR Current vs. Voltage
LDR Voltage - V
Normalized Response (%)
Figure 21:
Gesture Photodiodes Responsivity vs. Angular Displacement
Angle of Incedent Light - (º)
ams Datasheet
[v1-08] 2017-Apr-13
Page 15
Document Feedback
TMG3993 − Typical Operating Characteristics
Temperature Coefficient - ppm/ºC
Figure 22:
Responsivity Temperature Coefficient
λ - Wavelength - nm
Illuminance (lux)
Figure 23:
Theoretical Illuminance (Lux) vs. Counts (Clear Channel)
Clear Channel (counts)
Note(s):
1. Illustration depicts the theoretical relationship between illuminance and the Clear Channel result in Counts.
Page 16
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Typical Operating Characteristics
Forward Current (mA DC)
Figure 24:
950nm LED Forward Voltage vs. Current
Forward Voltage (V)
Note(s):
1. The voltage on the LDR pin (V LEDA – VLED FORWORD) must be sufficiently large to guarantee proper operation of the regulated current
sink.
Counts
Figure 25:
Proximity Response vs. Target Distance (4μs, 8μs)
Distance - mm
ams Datasheet
[v1-08] 2017-Apr-13
Page 17
Document Feedback
TMG3993 − Typical Operating Characteristics
Counts
Figure 26:
Proximity Response vs. Target Distance (16μs, 32μs)
Distance - mm
Page 18
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − I²C Protocol
I²C Protocol
The device uses I 2C serial communication protocol for
communication. The device supports 7-bit chip addressing and
both standard and fast clock frequency modes. Read and Write
transactions comply with the standard set by Philips (now NXP).
Internal to the device, an 8-bit buffer stores the register address
location of the desired byte to read or write. This buffer
auto-increments upon each byte transfer and is retained
between transaction events (I.e. valid even after the master
issues a STOP command and the I 2C bus is released). During
consecutive Read transactions, the future/repeated I 2C Read
transaction may omit the memory address byte normally
following the chip address byte; the buffer retains the last
register address + 1.
I²C Write Transaction
A Write transaction consists of a START, CHIP-ADDRESS WRITE,
REGISTER-ADDRESS, DATA BYTE(S), and STOP. Following each
byte (9 TH clock pulse) the slave places an ACKNOWLEDGE/NOTACKNOWLEDGE (ACK/NACK) on the bus. If NACK is transmitted
by the slave, the master may issue a STOP.
I²C Read Transaction
A Read transaction consists of a START, CHIP-ADDRESS WRITE,
REGISTER-ADDRESS, START, CHIP-ADDRESS READ, DATA BYTE(S),
and STOP. Following all but the final byte the master places an
ACK on the bus (9 TH clock pulse). Termination of the Read
transaction is indicated by a NACK being placed on the bus by
the master, followed by STOP.
Alternately, if the previous I 2C transaction was a Read, the
internal register address buffer is still valid, allowing the
transaction to proceed without “re”-specifying the register
address. In this case the transaction consists of a START,
CHIP-ADDRESS READ, DATA BYTE(S), and STOP. Following all but
the final byte the master places an ACK on the bus (9 TH clock
pulse). Termination of the Read transaction is indicated by a
NACK being placed on the bus by the master, followed by STOP.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at:
www.i2c-bus.org/references.
ams Datasheet
[v1-08] 2017-Apr-13
Page 19
Document Feedback
TMG3993 − Detailed Description
Detailed Description
Gesture detection, proximity detection, and RGBC color
sense/ambient light sense functionality are controlled by a
state machine, as depicted in Figure 32, which reconfigures
on-chip analog resources when each functional engine is
entered. Functional states/engines can be individually included
or excluded from the progression of state machine flow. Each
functional engine contains controls (E.g. Gain, ADC integration
time, wait time, persistence, thresholds, etc.) that govern
operation. Control of the Led Drive pin, LDR, is shared between
Proximity, Gesture, and Pattern Burst functionality;
consequently, while Pattern Burst functionality is activated,
Gesture and Proximity should be deactivated.
Pattern Burst functionality uses a digital core that is
independent of the analog sensor operation. The logic internal
to the digital core is activated when PBEN=1, enabling Barcode
Patterns (IRBeam) to be burst. The scanner receives the IR burst
which emulates the pattern of reflected light during scan of a
traditional paper barcode. In this operational mode the LDR pin
is exclusively acquired. If proximity or gesture engines are also
enabled, data generated will be invalid. The color/ALS engine
does not use the IR LED, but cross talk from IR LED emissions
during an optical pattern transmission may affect results.
Most of the functional engines are controlled by dedicated
registers; however, controls for Gesture, and Pattern Burst are
all accessed by the same address space: 0xA0 to 0xAF. Because
each functional block serves a different purpose and utilizes
common on-chip resources, only one may be activated at a
time. For example, if Gesture and Pattern Burst engines are both
activated simultaneously, the data stored in address 0xAx is
available to both engines, but will only cause the intended
engine to function properly.
Figure 27:
Simplified State Diagram
Page 20
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Detailed Description
Figure 28:
Detailed State Diagram
As depicted in Figure 27 and Figure 28, the operational cycle of
the device is divided into two parallel functional modes: Pattern
Burst and Gesture/Proximity/Color.
Upon power-up, POR, the device initializes and immediately
enters the low power SLEEP state. In this operational state the
internal oscillator and other circuitry are not active, resulting in
ultra-low power consumption. If I2C transaction occurs during
this state, the oscillator and I2C core wakeup temporarily to
service the communication. Once the Power ON bit, PON, is
enabled, the internal oscillator and attendant circuitry are
active, but power consumption remains low until one of the
functional engine blocks are entered. The first time the SLEEP
state is exited and any of the analog engines are enabled (PEN,
GEN, AEN =1) an EXIT SLEEP pause occurs; followed by an
immediate entry into the selected engine. If multiple engines
are enabled, then the operational flow progresses in the
following order: idle, proximity, gesture (if GMODE = 1), wait,
color/ALS, and sleep (if SAI = 1 and INT pin is asserted).
ams Datasheet
[v1-08] 2017-Apr-13
Page 21
Document Feedback
TMG3993 − Detailed Description
The wait operational state functions to reduce the power
consumption and data collection rate. If wait is enabled,
WEN=1, the delay is adjustable from 2.78ms to 8.54s, as set by
the value in the WTIME register and WLONG control bit.
Sleep After Interrupt Operation
After all the enabled engines/operational states have executed,
causing a hardware interrupt, the state machine returns to
either IDLE or SLEEP, as selected by the Sleep After Interrupt bit,
SAI. SLEEP is entered when two conditions are met: SAI = 1, and
the INT pin has been asserted. Entering SLEEP does not
automatically change any of the register settings (E.g. PON bit
is still high, but the normal operational state is over-ridden by
SLEEP state). SLEEP state is terminated by an I2C clear of the INT
pin or if SAI bit is cleared.
Proximity Operation
The Proximity detection feature provides object detection
measurement by photodiode detection of reflected IR energy
sourced by the integrated LED. The following registers and
control bits govern proximity operation and the operational
flow is depicted in Figure 30.
Page 22
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Detailed Description
Figure 29:
Proximity Controls
Register/Bit
Address
Description
ENABLE
0x80
Power ON
ENABLE
0x80
Proximity Enable
ENABLE
0x80
Proximity Interrupt Enable
PITHL
0x89
Proximity low threshold
PITHH
0x8B
Proximity high threshold
PERS
0x8C
Proximity Interrupt Persistence
PPULSE
0x8E
Proximity Pulse Length
PPULSE
0x8E
Proximity Pulse Count
CONTROL
0x8F
Proximity Gain Control
CONTROL
0x8F
LED Drive Strength
CONFIG2
0x90
CONFIG2
0x90
STATUS
0x93
Proximity Saturation
STATUS
0x93
Proximity Interrupt
STATUS
0x93
Proximity Valid
PDATA
0x9C
Proximity Data
POFFSET_NE
0x9D
Proximity Offset North/East
POFFSET_SW
0x9E
Proximity Offset South/West
CONFIG3
0x9F
Proximity Gain Compensation Enable
CONFIG3
0x9F
Proximity Mask North Enable
CONFIG3
0x9F
Proximity Mask South Enable
CONFIG3
0x9F
Proximity Mask West Enable
CONFIG3
0x9F
Proximity Mask East Enable
PICLEAR
0xE5
Proximity Interrupt Clear
AICLEAR
0xE7
All Non-Gesture Interrupt Clear
Proximity Saturation Interrupt Enable
LED Boost
Note(s):
1. ENABLE must be low for proximity or gesture operation.
ams Datasheet
[v1-08] 2017-Apr-13
Page 23
Document Feedback
TMG3993 − Detailed Description
Figure 30:
Detailed Proximity Diagram
PROXIMITY ENGINE
ENTER
PROX
PEN = 1
COLLECT
PROX
DATA
DATA TO
PDATA
PVALID = 1
PITHL
GFIFOTH). Next, the host reads the FIFO Level register,
GFIFOLVL, to determine the amount of valid data in the FIFO.
Finally, the host begins to read address 0xFC (page read), and
continues to read (clock-out data) until the FIFO is empty
(Number of bytes is 4x GFIFOLVL). For example, if
GFIFOLVL = 2, then the host should initiate a read at address
0xFC, and sequentially read all eight bytes. As the four-byte
blocks are read, GFIFOLVL register is decremented and the
internal FIFO pointers are updated.
Figure 87:
Gesture FIFO Access Registers
Registers
Address
Bits
GFIFO_N
0xFC
7:0
Gesture North FIFO
GFIFO_S
0xFD
7:0
Gesture South FIFO
GFIFO_W
0xFE
7:0
Gesture West FIFO
GFIFO_E
0xFF
7:0
Gesture East FIFO
ams Datasheet
[v1-08] 2017-Apr-13
Description
Page 81
Document Feedback
TMG3993 − Applications Information
Applications Information
Power Supply Considerations
Systems using Proximity detection are capable of driving the
integrated LED with as much as 300mA of pulsed current;
however typical systems require much lower settings of 100mA
or less. As a result of the rapidly switching current on LDR pin,
a few design considerations must be kept in mind to get the
best performance. The key goal is to reduce the power supply
noise coupled back into the device during the LED pulses.
Systems where battery voltage does not exceed the maximum
specified LDR pin voltage (including battery recharge
conditions), the LEDA may be directly connected to the battery.
This is beneficial because noise generated by LED pulsing is not
couple into the supply of the optical device. Another advantage
for this configuration, depending on system design, may be a
reduction or removal of additional bulk capacitance connected
to LEDA.
In many systems, there is a quiet analog supply and a noisy
digital supply. By connecting the quiet supply to the V DD pin
and the noisy supply to the LED, the key goal can be meet.
Place a 1μF low-ESR decoupling capacitor as close as possible
to the V DD pin and another at the LEDA pin, along with a bulk
storage capacitor, 4.7μF or larger, (as needed) somewhere along
the trace to supply surge currents when the LED is pulsed.
If operating from a single supply, use a 22 Ω resistor in series
with the V DD supply line and a 1μF low ESR capacitor to filter
any power supply noise. The previous capacitor placement
recommendations apply.
Figure 88:
Typical Application Hardware Circuit
Page 82
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Applications Information
Communications Considerations
VBUS in the above figures refers to the I 2C bus voltage. Separate
part numbers are assigned to each of the
I 2C VBUS options: VBUS = VDD, or VBUS=1.8 V.
The I 2C signals and the Interrupt are open-drain outputs and
require pull−up resistors. The pull-up resistor (RP) value is a
function of the I 2C bus speed, the I 2C bus voltage, and the
capacitive load. For example, ams EVM hardware
communicates at 400 kbit/s and uses 1.5 kΩ pull-up resistors.
The ams EVM hardware uses a 10 kΩ pull-up resistor (RPI) on
interrupt pin.
LED Drive Considerations
The LED cathode is connected to the LDR pin which functions
as a regulated current sink. When selecting the power supply
for the LED, that is, the voltage placed on the LEDA pin, it is
important to choose a supply capable of supplying a sufficient
amount of current and voltage. LEDA voltage must be larger
than the sum of the LED forward voltage drop and the voltage
on the LDR/ LEDA current sink regulator.
ams Datasheet
[v1-08] 2017-Apr-13
Page 83
Document Feedback
TMG3993 − Package Drawings & Markings
Package Drawings & Markings
Figure 89:
Package Mechanical Drawing & Marking
0.72
RoHS
Green
Note(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerance is ±0.05mm unless otherwise noted.
3. Contacts are copper with NiPdAu plating.
4. This package contains no lead (Pb).
5. This drawing is subject to change without notice.
Page 84
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − PCB Pad Layout
PCB Pad Layout
Suggested PCB pad layout guidelines for the surface mount
module are shown. Flash Gold is recommended as a surface
finish for the landing pads.
Figure 90:
Recommended PCB Pad Layout
Note(s):
1. All linear dimensions are in millimeters.
2. Dimension tolerances are ±0.05mm unless otherwise noted.
3. This drawing is subject to change without notice.
ams Datasheet
[v1-08] 2017-Apr-13
Page 85
Document Feedback
TMG3993 − Packaging Mechanical Data
Packaging Mechanical Data
Figure 91:
Tape & Reel Mechanical Drawing
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ±0.10mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
4. Each reel is 330 millimeters in diameter and contains 5000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481−B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
Page 86
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Soldering & Storage Information
Soldering & Storage
Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 92:
Soldering Profile
Parameter
Reference
Average temperature gradient in preheating
Device
2.5 ºC/s
tsoak
2 to 3 minutes
Time above 217 ºC (T1)
t1
Max 60 s
Time above 230 ºC (T2)
t2
Max 50 s
Time above Tpeak - 10 ºC (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260 ºC
Soak time
Temperature gradient in cooling
Max -5 ºC/s
Figure 93:
Soldering Reflow Profile Graph
NottoScale
Tpeak
T3
T2
Temperaturein°C
T1
Timeinseconds
ams Datasheet
[v1-08] 2017-Apr-13
t3
t2
Page 87
Document Feedback
TMG3993 − Soldering & Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping. Devices are dry packed in a sealed
aluminized envelope called a moisture-barrier bag with silica
gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
• Shelf Life: 12 months
• Ambient Temperature: < 40°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the allowable moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the following conditions:
• Floor Life: 168 hours
• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Page 88
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Ordering & Contact Information
Ordering & Contact Information
Figure 94:
Ordering Information
Ordering Code
Address
Interface
Delivery Form
TMG39931
0x39
I²C Vbus = VDD Interface
Module-8, 2.36mm Width
TMG39933
0x39
I²C Vbus = 1.8V Interface
Module-8, 2.36mm Width
TMG39935 (1)
0x29
I²C Vbus = VDD Interface
Module-8, 2.36mm Width
TMG39937
0x29
I²C Vbus = 1.8V Interface
Module-8, 2.36mm Width
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-08] 2017-Apr-13
Page 89
Document Feedback
TMG3993 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
Page 90
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
ams Datasheet
[v1-08] 2017-Apr-13
Page 91
Document Feedback
TMG3993 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Page 92
Document Feedback
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Revision Information
Revision Information
Changes from 1-07 (2016-Oct-25) to current revision 1-08 (2017-Apr-13)
Page
Updated equation above Figure 67
65
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
ams Datasheet
[v1-08] 2017-Apr-13
Page 93
Document Feedback
TMG3993 − Content Guide
Content Guide
1
2
3
3
General Description
Key Benefits & Features
Applications
Block Diagram
4
5
6
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
13
13
Timing Characteristics
Timing Diagrams
14
Typical Operating Characteristics
19
19
19
I²C Protocol
I²C Write Transaction
I²C Read Transaction
20
22
22
26
29
36
Detailed Description
Sleep After Interrupt Operation
Proximity Operation
Color and Ambient Light Sense Operation
Gesture Operation
Pattern Burst Operation: IRBeam Mode
43
46
46
47
48
49
50
50
51
53
54
Register Description
RAM Registers (0x00 - 0x7F)
Pattern RAM
Enable Register (ENABLE 0x80)
ADC Integration Time Register (ATIME 0x81)
Wait Time Register (WTIME 0x83)
ALS Interrupt Threshold Registers (0x84 − 0x87)
Proximity Interrupt Threshold Registers (0x89, 0x8B)
Interrupt Persistence Register (PERS 0x8C)
Configuration Register One (CONFIG1 0x8D)
Proximity Pulse Count and Length Register (PPULSE
0x8E)
Control Register (CONTROL 0x8F)
Configuration Register Two (CONFIG2 0x90)
Revision ID Register (REVID 0x91)
ID Register (ID 0x92)
Status Register (STATUS 0x93)
RGBC Data Registers (0x94 − 0x9B)
Proximity Data Registers (PDATA 0x9C)
Proximity North/East Offset
(POFFSET_NE 0x9D)
Proximity South/West Offset
(POFFSET_SW 0x9E)
Configuration Three Register (CONFIG3 0x9F)
Configuration Register A0 (CONFIG_A0), IRBeam Mode
Configuration Register A1 (CONFIG_A1), IRBeam Mode
Configuration Register A2 (CONFIG_A2), IRBeam Mode
Configuration Register A3 (CONFIG_A3), IRBeam Mode
Configuration Register A4 (CONFIG_A4), IRBeam Mode
55
56
57
57
58
59
59
60
61
62
63
64
64
65
65
Page 94
Document Feedback
ams Datasheet
[v1-08] 2017-Apr-13
TMG3993 − Content Guide
66
66
67
67
68
68
69
71
73
74
75
76
77
78
79
79
80
81
Configuration Register A5 (CONFIG_A5), IRBeam Mode
Configuration Register A6 (CONFIG_A6), IRBeam Mode
Configuration Register A7 (CONFIG_A7), IRBeam Mode
Configuration Register A8 (CONFIG_A8), IRBeam Mode
Configuration Register A0 (CONFIG_A0), Gesture Mode
Configuration Register A1 (CONFIG_A1), Gesture Mode
Configuration Register A2 (CONFIG_A2), Gesture Mode
Configuration Register A3 (CONFIG_A3), Gesture Mode
Configuration Register A4 (CONFIG_A4), Gesture Mode
Configuration Register A5 (CONFIG_A5), Gesture Mode
Configuration Register A6 (CONFIG_A6), Gesture Mode
Configuration Register A7 (CONFIG_A7), Gesture Mode
Configuration Register A9 (CONFIG_A9), Gesture Mode
Configuration Register AA (CONFIG_AA), Gesture Mode
Configuration Register AB (CONFIG_AB), Gesture Mode
Configuration Register AE (GFLVL),
Gesture Mode
Configuration Register AF (GSTATUS),
Gesture Mode
Clear Interrupt Registers (0xE3, 0xE7)
Gesture FIFO Access Registers (0xFC − 0xFF)
82
82
83
83
Applications Information
Power Supply Considerations
Communications Considerations
LED Drive Considerations
84
85
86
Package Drawings & Markings
PCB Pad Layout
Packaging Mechanical Data
87
87
88
88
88
88
88
Soldering & Storage Information
Soldering Information
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
89
90
91
92
93
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
80
ams Datasheet
[v1-08] 2017-Apr-13
Page 95
Document Feedback
工商网监
湘ICP备2023018690号
