AF4410N
N-Channel Enhancement Mode Power MOSFET Features
- Simple Drive Requirement - Low On-resistance - Fast Switching
General Description
The advanced power MOSFET provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SO-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. ID (A) 10
Product Summary
BVDSS (V) 30 RDS(ON) (mΩ) 13.5
Pin Assignments
S S S G
1 2 3 4 8 7 6 5
Pin Descriptions
D D D D
Pin Name S G D
Description Source Gate Drain
SO-8
Ordering information
AX Feature F :MOSFET PN 4410N X X X Package S: SO-8 Lead Free Blank : Normal L : Lead Free Package Packing Blank : Tube or Bulk A : Tape & Reel
This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
Rev. 1.1 Aug 30, 2005 1/5
AF4410N
N-Channel Enhancement Mode Power MOSFET Absolute Maximum Ratings
Symbol VDS VGS ID IDM PD TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (Note 1) Pulsed Drain Current (Note 2) Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range TA=25ºC TA=70ºC TA=25ºC Rating 30 ±25 10 8 50 2.5 0.02 -55 to 150 -55 to 150 Units V V A A W W/ºC ºC ºC
Thermal Data
Symbol Rthj-amb Parameter Thermal Resistance Junction-ambient (Note 1) Max. Maximum 50 Units ºC/W
Electrical Characteristics at TJ=25ºC unless otherwise specified
Symbol BVDSS ∆BVDSS / ∆TJ RDS(ON) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Static Drain-Source On-Resistance (Note 3) Gate Threshold Voltage Forward Transconductance Drain-Source Leakage Current (TJ=25oC) Drain-Source Leakage Current (TJ=70oC) Gate-Source Leakage Total Gate Charge (Note 3) Gate-Source Charge Gate-Drain (“Miller”) Charge Turn-On Delay Time (Note 3) Rise Time Turn-Off Delay Time Fall-Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VGS=0V, ID=250uA Reference to 25oC, ID=1mA VGS=10V, ID=10A VGS=4.5V, ID=5A VDS=VGS, ID=250uA VDS=15V, ID=10A VDS=30V, VGS=0V VDS=24V, VGS=0V VGS=±25V ID=10A, VDS=15V, VGS=5V VDS=25V, ID=1A, RG=3.3Ω, VGS=5V RD=25Ω VGS=0V, VDS=15V, f=1.0MHz Min. 30 1 Typ. 0.037 20 13.5 4 7 14 16 21 15 1160 240 165 Max. 13.5 22 3 1 uA 25 ±100 nA nC Units V V/oC mΩ V S
ns
pF
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage (Note 3) Reverse Recovery Time Reverse Recovery Charge
2
Test Conditions IS=2.1A, VGS=0V IS=5A, VGS=0V, dl/dt=100A/µs
o
Min. -
Typ. 17.1 12
Max. 1.2 -
Unit V ns nC
Note 1: Surface mounted on 1 in copper pad of FR4 board, 125 C/W when mounted on Min. copper pad. Note 2: Pulse width limited by Max. junction temperature. Note 3: Pulse width ≤ 300us, duty cycle ≤ 2%.
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Rev. 1.1 Aug 30, 2005
AF4410N
N-Channel Enhancement Mode Power MOSFET Typical Performance Characteristics
Anachip Corp. www.anachip.com.tw 3/5
Rev. 1.1 Aug 30, 2005
AF4410N
N-Channel Enhancement Mode Power MOSFET Typical Performance Characteristics (Continued)
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Rev. 1.1 Aug 30, 2005
AF4410N
N-Channel Enhancement Mode Power MOSFET Marking Information
SO-8
( Top View )
8
Logo Part Number
4410N AA Y W X
1
Lot code: "X": Non-Lead Free; "X": Lead Free "A~Z": 01~26; "A~Z": 27~52 Week code: "A~Z": 01~26; "A~Z": 27~52 Year code: "4" =2004 Factory code ~
Package Information
Package Type: SO-8
D
8
7
6
5 E1 E
1 2 e 3 B 4 DETAIL A L
θ
A1
A
C
DETAIL A
1. All Dimensions Are in Millimeters. 2. Dimension Does Not Include Mold Protrusions.
Symbol A A1 B C D E E1 L θ e
Dimensions In Millimeters Min. Nom. Max. 1.35 1.55 1.75 0.10 0.18 0.25 0.33 0.41 0.51 0.19 0.22 0.25 4.80 4.90 5.00 5.80 6.15 6.50 3.80 3.90 4.00 0.38 0.71 1.27 o o o 0 4 8 1.27 TYP.
Anachip Corp. www.anachip.com.tw 5/5
Rev. 1.1 Aug 30, 2005
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