APL5620

APL5620 2A, Ultra Low Dropout (0.24V Typical) Linear Regulator Features • • • • • • • • • • • • • • Ultra Low Dropout - 0.24V (typical) at 2A Output Current 0.8V Reference Voltage High Output Accuracy - ±1.5% Over Line, Load, and Temperature Range Fast Transient Response Adjustable Output Voltage Power-On-Reset Monitoring on Both VCNTL and VIN Pins Internal Soft-Start Current-Limit and Short Current-Limit Protections Thermal Shutdown with Hysteresis Open-Drain VOUT Voltage Indicator (POK) Low Shutdown Quiescent Current ( < 30µA ) Shutdown/Enable Control Function Simple TDFN3x3-10 Package with Exposed Pad Lead Free and Green Devices Available (RoHS Compliant) General Description The APL5620 is a 2A ultra low dropout linear regulator. The IC needs two supply voltages, one is a control voltage (V CNTL) for the control circuitry, the other is a main supply Voltage(VIN) for power conversion, to reduce power dissipation and provide extremely low dropout voltage. The APL5620 integrates many functions. A Power-On-Reset (POR) circuit monitors both supply voltages on VCNTL and VIN pins to prevent erroneous operations. The functions of thermal shutdown and current-limit protect the device against thermal and current over-loads. A POK indicates that the output voltage status with a delay time set internally. It can control other converter for power sequence. The APL5620 can be enabled by other power systems. Pulling and holding the EN voltage below 0.4V shuts off the output. The APL5620 is available in a TDFN3x3-10 package which features small size as TDFN3x3-10 and an Exposed Pad to reduce the junction-to-case resistance to extend power range of applications. Simplified Application Circuit VCNTL Applications • • • Motherboards, VGA Cards Notebook PCs Add-in Cards VCNTL POK POK VIN VOUT VIN Pin Configuration VOUT VOUT VOUT FB POK 1 2 3 4 5 10 VCNTL 9 VIN 8 VIN 7 VIN 6 EN VOUT APL5620 EN EN GND FB GND Enable Optional TDFN3x3-10 (Top View) = Exposed Pad (connected to ground plane for better heat dissipation) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. C opyright © A NPEC Electronics Corp. Rev. A.2 - Jun., 2009 1 www.anpec.com.tw APL5620 Ordering and Marking Information APL5620 Assembly Material Handling Code Temperature Range Package Code APL 5620 XXXXX Package Code QB : TDFN3x3-10 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device XXXXX - Date Code APL5620 QB : Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VCNTL VIN VOUT (Note 1) Rating -0.3 ~ 6 -0.3 ~ 6 -0.3 ~ VIN+0.3 -0.3 ~ 7 -0.3 ~ VCNTL+0.3 Internally Limited 150 -65 ~ 150 260 V W ο Parameter VCNTL Supply Voltage (VCNTL to GND) VIN Supply Voltage (VIN to GND) VOUT to GND Voltage POK to GND Voltage EN, FB to GND Voltage Unit V V V PD TJ TSTG TSDR Power Dissipation Maximum Junction Temperature Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds C C ο ο C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol θJA θJC Parameter Junction-to-Ambient Resistance in Free Air (Note 2) Typical Value TDFN3x3-10 50 6 Unit o C/W C/W Junction-to-Case Resistance in Free Air (Note 3) TDFN3x3-10 o Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package. 1 2 3 4 5 10 9 8 7 6 Measured Point PCB Copper C opyright © A NPEC Electronics Corp. Rev. A.2 - Jun., 2009 2 www.anpec.com.tw APL5620 Recommended Operating Conditions Symbol VCNTL VIN VOUT IOUT R2 COUT ESRCOUT TA TJ VCNTL Supply Voltage VIN Supply Voltage VOUT Output Voltage (when VCNTL-VOUT>1.7V) VOUT Output Current FB to GND IOUT = 2A at 25% nominal VOUT VOUT Output Capacitance IOUT = 1A at 25% nominal VOUT IOUT = 0.5A at 25% nominal VOUT ESR of VOUT Output Capacitor Ambient Temperature Junction Temperature Parameter Range 3.0 ~ 5.5 1.2 ~ 5.5 0.8 ~ VIN – VDROP 0~2 1k ~ 24k 8 ~ 770 8 ~ 1400 8 ~ 1700 0 ~ 200 -40 ~ 85 -40 ~ 125 mΩ ο ο Unit V V V A Ω µF C C Electrical Characteristics Refer to the typical application circuits. These specifications apply over VCNTL=5V, vIN=1.8v, VOUT=1.2V, and TA= -40 ~ 85oC, unless otherwise specified. Typical values are at TJ=25oC. Symbol SUPPLY CURRENT IVCNTL ISD VCNTL Supply Current EN = VCNTL, IOUT=0A 1.0 20 1.5 30 1 mA µA µA V V V V % % %/V Ω nA Parameter Test Conditions APL5620 Min. Typ. Max. Unit VCNTL Supply Current at Shutdown EN = GND VIN Supply Current at Shutdown EN = GND, VIN=5.5V POWER-ON-RESET (POR) Rising VCNTL POR Threshold VCNTL POR Hysteresis Rising VIN POR Threshold VIN POR Hysteresis OUTPUT VOLTAGE VREF Reference Voltage Output Voltage Accuracy Load Regulation Line Regulation VOUT Pull-Low Resistance FB Input Current DROPOUT VOLTAGES VOUT=2.5V VDROP VIN-to-VOUT Dropout Voltage VCNTL=4.5V, VOUT=1.8V IOUT=2A VOUT=1.2V TJ=25oC TJ=-40~125oC TJ=25 C TJ=-40~125oC TJ=25oC TJ=-40~125oC o 2.5 0.8 FB=VOUT, IOUT=10mA, TJ=25°C IOUT= 0~2A, TJ= -40~125 oC IOUT=0A ~2A IOUT=10mA, VCNTL= 3.0 ~ 5.5V VCNTL=3.3V, VEN=0V, VOUT