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EK68

EK68

  • 厂商:

    APEX

  • 封装:

    -

  • 描述:

    KIT EVALUATION FOR PA162DK

  • 数据手册
  • 价格&库存
EK68 数据手册
EK68 Evaluation Kit APPLICABLE PARTS (SOLD SEPARATELY) • PA162DK INTRODUCTION Fast and easy breadboarding of circuits using the PA162DK is possible with the EK68 evaluation kit. The EK68 includes the EVAL68 board. The use of EVAL68 allows for a large area of breadboarding space to work with while allowing for the surface mount installation of PA162DK. The PA162DK amplifier may be mounted directly to the EVAL68. The EK68 is designed for mounting of the PA162DK without the need to solder attach the device terminals. The HS33 heat sink is designed to hold the part in place while providing thermal control and electrical contact simultaneously. The obvious advantage is the ease of removal and replacement of the PA162DK as required. External connection to the evaluation board can be made via the terminals at the edge of the circuit board. Figure 1: PCB Layout 6.00 TOP VIEW INPUT GND IN-A IN-B BNC_B -VS C7 C8 C2 C3 IN-C BNC_C -IN +IN +IN -IN -IN +IN +IN -IN OUT(B) OUT(A) BNC_A 4.05 OUTPUT GND C1 C4 C6 C5 -VS GND +VS GND EVAL68 rev COMP. SIDE OUT(C) OUT(D) BNC_D IN-D +VS GND BOTTOM VIEW www.apexanalog.com © Apex Microtechnology Inc. All rights reserved Dec 2015 EK68U Rev D EK68 Figure 2: Assembly Diagram for EK68 PARTS LIST Reference Part # Description EVAL68 Evaluation Board, PA162DK 1 C1, C4, C8, C6 PCE3927CT-ND CAP, 47uF, 50V 4 C2, C3, C5, C7 1825B105K201NX Cap, 200V, 1uF, Ceramic 4 HS33 Heat Sink 1 146510CJ BNC Jacks 4 571-0100 Banana Jacks 4 571-0500 Banana Jacks 3 MS06 Mating Socket 4 QTY Required #4 hardware and thermal grease not included. 2 EK68U Rev D EK68 BEFORE YOU GET STARTED • • • • • • • • All Apex amplifiers should be handled using ESD precaution. Review the Apex product datasheet and operating conditions. Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. Always use adequate power supply bypass capacitors, Apex recommends at least 10µF per amp of output current, as well as a 0.1 to 1µF high-quality ceramic capacitor between the power supplies and ground. Do not change connections while the circuit is powered In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage. Initially set all power supplies to the minimum operating levels allowed in the product datasheet. Check for oscillations. ASSEMBLY The PA162DK and capacitors are surface mount components and should be assembled to the EVAL68 using surface mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. If a solder reflow furnace is not available, a heat plate capable of solder reflow temperatures may be used. The heat slug on the back of the PA162DK provides maximum heat dissipation capabilities when in direct contact to the heat sink. Thermal grease should be used when mounting the heat sink to the evaluation board. Mating sockets strips are provided to facilitate adding additional components as required. Please use care when handling and assembling the PA162DK. Make certain that the package pin to pad alignment is correct and that the pins are seated on each pad. The PA162DK heat slug and heat sink must be electrically connected to the most negative power supply potential (-Vs). Note: All grounds must be tied together on the EVAL68 board. NEED TECHNICAL HELP? CONTACT APEX SUPPORT! For all Apex Microtechnology product questions and inquiries, call toll free 800-546-2739 in North America. For inquiries via email, please contact apex.support@apexanalog.com. International customers can also request support by contacting their local Apex Microtechnology Sales Representative. To find the one nearest to you, go to www.apexanalog.com IMPORTANT NOTICE Apex Microtechnology, Inc. has made every effort to insure the accuracy of the content contained in this document. However, the information is subject to change without notice and is provided "AS IS" without warranty of any kind (expressed or implied). Apex Microtechnology reserves the right to make changes without further notice to any specifications or products mentioned herein to improve reliability. This document is the property of Apex Microtechnology and by furnishing this information, Apex Microtechnology grants no license, expressed or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Apex Microtechnology owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Apex Microtechnology integrated circuits or other products of Apex Microtechnology. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale. APEX MICROTECHNOLOGY PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN PRODUCTS USED FOR LIFE SUPPORT, AUTOMOTIVE SAFETY, SECURITY DEVICES, OR OTHER CRITICAL APPLICATIONS. PRODUCTS IN SUCH APPLICATIONS ARE UNDERSTOOD TO BE FULLY AT THE CUSTOMER OR THE CUSTOMER’S RISK. Apex Microtechnology, Apex and Apex Precision Power are trademarks of Apex Microtechnology, Inc. All other corporate names noted herein may be trademarks of their respective holders. EK68U Rev D 3

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