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PA341DW

PA341DW

  • 厂商:

    APEX

  • 封装:

    SIP10

  • 描述:

    IC OPAMP POWER 1 CIRCUIT 10SIP

  • 数据手册
  • 价格&库存
PA341DW 数据手册
PA341 High Voltage Power Operational Amplifier RoHS COMPLIANT FEATURES • • • • • • • • RoHS Compliant Monolithic MOS Technology Low Cost High Voltage Operation 350V Low Quiescent Current Typ. 2.2mA No Second Breakdown High Output Current 120mA PEAK Available in Die Form CPA341 APPLICATIONS • • • • • Piezo Electric Positioning Electrostatic Transducer and Deflection Deformable Mirror Focusing Biochemistry Stimulators Computer to Vacuum Tube Interface DESCRIPTION The PA341 is a high voltage monolithic MOSFET operational amplifier which achieves performance fea‐ tures previously found only in hybrid designs while increasing reliability. Inputs are protected from excessive common mode and differential mode voltages. The safe operating area (SOA) has no second breakdown lim‐ itation and can be observed with all type loads by choosing an appropriate current limiting resistor. External compensation provides the user flexibility in choosing optimum gain and bandwidth for the application. The PA341CE is packaged in a hermetically sealed 8‐pin TO‐3 package. The metal case of the PA341CE is isolated in excess of full supply voltage. The PA341DF is packaged in a 24 pin PSOP (JEDEC MO‐166) package. The metal heat slug of the PA341DF is isolated in excess of full supply voltage. The PA341DW is packaged in Apex Microtechnology’s hermetic ceramic SIP. The alumina ceramic isolates the die in excess of full supply voltage. Figure 1: Equivalent Schematic +VS CC1 CC2 +IN ILIM -IN OUT -VS www.apexanalog.com © Apex Microtechnology Inc. All rights reserved Mar 2018 PA341U Rev D PA341 TYPICAL CONNECTION Figure 2: Typical Connection RF +V S 100nF * CC RI +V S V OUT CC1 + CC2 OUT CL PA341 RCL -V S RL * Use 10 μF per Amp -V S 100nF * PINOUT AND DESCRIPTION TABLE Figure 3: External Connections -V S 7 6 +IN +V S 8 5 -IN TOP VIEW 4 OUT CL 1 2 CC2 PA341CE 3 CC1 24 NC 23 NC 22 NC OUT 21 NC 20 CC1 19 18 NC C 17 1 NC 2 NC 3 NC 4 NC 5 -IN 6 NC 7 +IN 8 NC 9 NC 10 NC 1 2 3 4 5 6 7 8 9 -IN +IN NC NC -V S +V S CL CC2 10 C2 16 NC CL 15 14 NC +V S 13 11 NC 12 -V S PA341DF CC1 OUT PA341DW For CC values, see graphs on page 8 & 9. Note: CC must be rated for full supply voltage. Note: PA341CE Recommended mounting torque is 4‐7 in•lbs (0.45 ‐ 0.79 N•m) CAUTION: The use of compressible, thermally conductive insulators may void warranty. 2 PA341U Rev D PA341 PA341CE Pin Number Name Description 1 CL Connect to the current limit resistor. Output current flows into/out of this pin through RCL.. The output pin and the load are connected to the other side of RCL. 2, 3 CC Compensation capacitor connection. Select value based on Phase Compensation. See applicable section. 4 OUT The output. Connect this pin to load and to the feedback resistors. 5 ‐IN The inverting input. 6 +IN The non‐inverting input. 7 ‐Vs The negative supply rail. 8 +Vs The positive supply rail. Name Description PA341DF Pin Number 5 ‐IN The inverting input. 7 +IN The non‐inverting input. 12 ‐Vs The negative supply rail. 13 +Vs The positive supply rail. 15 CL Connect to the current limit resistor. Output current flows into/out of this pin through RCL.. The output pin and the load are connected to the other side of RCL. 17, 19 CC Compensation capacitor connection. Select value based on Phase Compensation. See applicable section. 21 OUT The output. Connect this pin to load and to the feedback resistors. All Others NC No connection. Pin Number Name Description 1 ‐IN The inverting input. 2 +IN The non‐inverting input. 3, 4 NC No connection. 5 ‐Vs The negative supply rail. 6 +Vs The positive supply rail. 7 CL Connect to the current limit resistor. Output current flows into/out of this pin through RCL.. The output pin and the load are connected to the other side of RCL. 8, 9 CC Compensation capacitor connection. Select value based on Phase Compensation. See applicable section. 10 OUT The output. Connect this pin to load and to the feedback resistors. PA341DW PA341U Rev D 3 PA341 SPECIFICATIONS Unless otherwise noted TC = 25°C, CC = 6.8pF. DC input specifications are ± value given. Power supply voltage is typical rating. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage, total Output Current, continuous within SOA Symbol PA341CE Min Input Voltage, differential Input Voltage, common mode Min Max Units * * V IO 60 * * mA 120 * * mA 12 * 9 W PD VIN (Diff) -16 +16 * * * * V Vcm -VS +VS * * * * V TJ Temperature, storage Temperature Range, powered (case) Max 350 Temperature, pin solder, 10s max. Temperature, junction 1 Min PA341DW +Vs to ‐Vs Output Current, peak Power Dissipation, continuous @ Tc = 25°C Max PA341DF TC 350 220 220 °C 150 * * °C ‐65 +150 * * * * °C ‐40 125 * * * * °C 1. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dis‐ sipation to achieve high MTTF. For guidance, refer to heatsink data sheet. CAUTION 4 The PA341 is constructed from MOSFET transistors. ESD handling procedures must be observed. The substrate (DW package) contains beryllia (BeO). Do not crush, or subject to temperatures in excess of 850°C to avoid generating toxic fumes. PA341U Rev D PA341 INPUT Test Conditions Parameter PA341CE, PA341DF Min Typ Max 12 25° to 85°C ‐25° to 25°C Offset Voltage, initial Offset Voltage vs. temperature 1 Offset Voltage vs. temperature 1 PA341DW Min Units Typ Max 40 * * mV 17 250 * * µV/°C 18 500 * * µV/°C Offset Voltage vs. supply 4.5 * µV/V Offset Voltage vs. time 80 * µV/kh Bias Current, initial 2 5/50 Bias Current vs. supply Offset Current, initial 2 Input Impedance, DC Input Capacitance 50/200 100 2000 pA 0.2/2 15 50 pA/V 2.5/50 50/200 100 1000 pA 1011 * Ω 3 * pF Common Mode, voltage range +VS‐12 * V Common Mode, voltage range ‐VS+12 * V Common Mode Rejection, DC VCM = ±90V DC Noise, broad band 10 kHz BW, RS = 1 kΩ 84 115 * 337 * dB * µV RMS 1. Sample tested by wafer to 95%. 2. Specifications separated by / indicate values for the PA341CE and PA341DF respectively. GAIN Parameter Open Loop @ 15 Hz Test Conditions RL = 5k Ω PA341CE, PA341DF Min Typ 90 103 Max PA341DW Max Units Min Typ * * dB Bandwidth, gain bandwidth prod‐ @ 1 MHz uct 10 * MHz Power Bandwidth 35 * kHz PA341U Rev D 280V p‐p 5 PA341 OUTPUT Parameter Voltage Swing Test Conditions IO = 40mA PA341CE, PA341DF Min Typ Max ±VS‐12 ±VS‐10 PA341DW Min Typ * * Max Units V Current, peak 1 120 * mA Current, continuous 60 * mA Settling Time to 0.1% 10V step Av =‐10 2 * µs Slew Rate CC = 4.7pF 32 * V/µs Resistance, 10mA 2 RCL = 0 Ω 91 * Ω Resistance, 40mA 2 RCL = 0 Ω 65 * Ω 1. Guaranteed but not tested. 2. The selected value of RCL must be added to the values given for total output resistance. POWER SUPPLY Parameter Voltage Current, quiescent 6 Test Conditions PA341CE, PA341DF PA341DW Units Min Typ Max Min Typ Max ±10 ±150 ±175 * * * V 2.2 2.5 * * mA PA341U Rev D PA341 THERMAL Parameter Test Conditions PA341CE, PA341DF Min Typ Max PA341DW Min Typ Max Units PA341CE Resistance, AC junction to case F > 60 Hz 5.4 6.5 °C/W PA341DF Resistance, AC junction to case F > 60 Hz 6 7 °C/W PA341DW Resistance, AC junction F > 60 Hz to case 7 10 °C/W PA341CE Resistance, DC junction to case F < 60 Hz 9 10.4 °C/W PA341DF Resistance, DC junction to case F < 60 Hz 9 11 °C/W PA341DW Resistance, DC junction F < 60 Hz to case PA341CE Resistance, junction to air Full temp range PA341DF Resistance, junction to air 1 Full temp range PA341DW Resistance, junction to air Full temp range Temperature Range, case Meets full range spec's 12 14 30 °C/W 25 °C/W 30 ‐25 °C/W +85 * °C/W * °C 1. Rating applies with solder connection of heatslug to a minimum 1 square inch foil area of the printed circuit board. Note: *The specification of PA341DW is identical to the specification for PA341CE, PA341DF in applicable column to the left. PA341U Rev D 7 PA341 TYPICAL PERFORMANCE GRAPHS Figure 4: Power Derating Figure 5: VBE for ILIMIT 0.85 T = TC 12 PA341CE PA341DF 0.80 Wϯϰϭt 0.75 T = TC 9 VBE (V) /ŶƚĞƌŶĂůWŽǁĞƌŝƐƐŝƉĂƟŽŶ͕W;tͿ 15 6 T = TA VBE+ 0.70 0.65 0.60 VBE- 3 0.55 T = TA 0 0 25 50 75 100 0.50 -40 -20 125 Temperature, T (°C) 0 20 40 60 80 100 120 Temperature (°C) Figure 6: Small Signal Response Figure 7: Phase Response -90 80 -100 0.75pF 68pF 0.75pF -110 60 2.2pF 6.8pF 40 Phase, Ɍ;ΣͿ Open Loop Gain, A (dB) -80 100 15pF 20 2.2pF -120 6.8pF -130 -140 15pF -150 68pF -160 0 -170 -20 10 100 1k 10k 100k Frequency, F (Hz) 8 1M 10M -180 10k 100k 1M 10M Frequency, F (Hz) PA341U Rev D PA341 Figure 8: Gain and Compensation Figure 9: Power Response 1000 100 Output Voltage, VOUT (VP-P) ŽŵƉĞŶƐĂƟŽŶ͕Ɖ& 125°C 85°C 10 25°C 55°C 1 0.1 0.1 1 2.2pF 6.8pF 15pF 100 33pF 68pF 10 10k 10 100k Gain 1M Frequency, F (Hz) Figure 10: Harmonic Distortion Figure 11: Slew Rate 10 30 ^ůĞǁZĂƚĞ;V/μs) ŝƐƚŽƌƟŽŶ;йͿ 1 30VP-P 0.1 60VP-P 180VP-P 0.01 0.001 100 20 10 A V = 20 C C = 15pF R L = 2K ZŝƐĞ 0 1k 10k Frequency, F (Hz) PA341U Rev D &Ăůů 100k 5 15 25 35 45 55 65 75 85 ŽŵƉĞŶƐĂƟŽŶĂƉĂĐŝƚŽƌ͕CC;Ɖ&) 9 PA341 Figure 12: Quiescent Current Figure 13: Common Mode Rejection ŽŵŵŽŶDŽĚĞZĞũĞĐƟŽŶ͕DZ;ĚͿ Normalized Quiescent Current (%) 120 102 100 125°C 25°C 98 96 20 -40°C 100 80 60 40 20 0 10 60 100 140 180 220 260 300 340 100 Total Supply Voltage (V) 100k Figure 15: Output Voltage Swing 100 30 WŽƐŝƟǀĞ 90 25 VDROP+@85°C VDROP From VS (V) WŽǁĞƌ^ƵƉƉůLJZĞũĞĐƟŽŶ͕W^Z;ĚͿ 10k Frequency, F (Hz) Figure 14: Power Supply Rejection 80 EĞŐĂƟǀĞ 70 60 20 VDROP-@85°C 15 VDROP-@27°C 10 5 50 VDROP+@27°C 40 10 0 100 1k 10k Frequency, F (Hz) 10 1k 100k 0 20 40 60 80 100 120 Output Current, IO (mA) PA341U Rev D PA341 SAFE OPERATING AREA (SOA) The MOSFET output stage of the PA341 is not limited by second breakdown considerations as in bipolar output stages. However there are still three distinct limitations: 1. Voltage withstand capability of the transistors. 2. Current handling capability of the die metalization. 3. Temperature of the output MOSFETS. These limitations can be seen in the SOA (see Safe Operating Area graphs). Note that each pulse capabil‐ ity line shows a constant power level (unlike second breakdown limitations where power varies with voltage stress). These lines are shown for a case temperature of 25°C and correspond to thermal resistances of 5.2°C/ W for the PA341CE and DF and 10.4°C/W for the PA341DW respectively. Pulse stress levels for other case temperatures can be calculated in the same manner as DC power levels at different temperatures. The out‐ put stage is protected against transient flyback by the parasitic diodes of the output stage MOSFET structure. However, for protection against sustained high energy flyback external fast‐recovery diodes must be used. Figure 16: PA341CE and DF SOA KƵƚƉƵƚƵƌƌĞŶƚ&ƌŽŵнVSŽƌͲVS ;ŵA) 200 ϮϬ 120 100 50 40 30 20 10 Ϭŵ ^ DC ͕d C= 85  °C ͕d C= 12 5° C  5 4 3 WƵůƐĞƵƌǀĞƐΛϭϬйƵƚLJLJĐůĞDĂdž 2 200 300 500 10 20 30 50 100 ^ƵƉƉůLJƚŽKƵƚƉƵƚŝīĞƌĞŶƟĂů͕VS-VO (V) PA341U Rev D 11 PA341 Figure 17: PA341DW SOA KƵƚƉƵƚƵƌƌĞŶƚ&ƌŽŵнVSŽƌͲVS ;ŵA) 200 120 100 ϮϬ Ϭŵ ^ 50 40 30  DC ͕d C= ͕d 85 °C C= 12 5° C  20 10 5 4 3 2 10 WƵůƐĞƵƌǀĞƐΛϭϬйƵƚLJLJĐůĞDĂdž 20 30 50 100 200 300 500 ^ƵƉƉůLJƚŽKƵƚƉƵƚŝīĞƌĞŶƟĂů͕VS-VO (V) 12 PA341U Rev D PA341 GENERAL Please read Application Note 1 “General Operating Considerations” which covers stability, supplies, heat sinking, mounting, current limit, SOA interpretation, and specification interpretation. Visit www.apexana‐ log.com for Apex Microtechnology’s complete Application Notes library, Technical Seminar Workbook, and Evaluation Kits. TYPICAL APPLICATION Ref: APPLICATION NOTE 20: “Bridge Mode Operation of Power Amplifiers” Two PA341 amplifiers operated as a bridge driver for a piezo transducer provides a low cost 660 V total drive capability. The RN CN network serves to raise the apparent gain of A2 at high frequencies. If RN is set equal to R the amplifiers can be compensated identically and will have matching bandwidths. Figure 18: Typical Application (Low Cost 660 VP-P Piezo Driver) PHASE COMPENSATION Open loop gain and phase shift both increase with increasing temperature. The PHASE COMPENSATION typical graph shows closed loop gain and phase compensation capacitor value relationships for four case temperatures. The curves are based on achieving a phase margin of 50°. Calculate the highest case tempera‐ ture for the application (maximum ambient temperature and highest internal power dissipation) before choosing the compensation. Keep in mind that when working with small values of compensation, parasitics may play a large role in performance of the finished circuit. The compensation capacitor must be rated for at least the total voltage applied to the amplifier and should be a temperature stable type such as NPO or COG. OTHER STABILITY CONCERNS There are two important concepts about closed loop gain when choosing compensation. They stem from the fact that while “gain” is the most commonly used term, ß (the feedback factor) is really what counts when designing for stability. 1. Gain must be calculated as a non‐inverting circuit (equal input and feedback resistors can provide a signal gain of ‐1, but for calculating offset errors, noise, and stability, this is a gain of 2). PA341U Rev D 13 PA341 2. Including a feedback capacitor changes the feedback factor or gain of the circuit. Consider RIN=4.7k, RF=47k for a gain of 11. Compensation of 4.7 to 6.8pF would be reasonable. Adding 33pF parallel to the 47K rolls off the circuit at 103 kHz, and at 2 MHz has reduced gain from 11 to roughly 1.5 and the circuit is likely to oscillate. As a general rule the DC summing junction impedance (parallel combination of the feedback resistor and all input resistors) should be limited to 5k ohms or less. The amplifier input capacitance of about 6pF, plus capacitance of connecting traces or wires and (if used) a socket will cause undesirable circuit performance and even oscillation if these resistances are too high. In circuits requiring high resistances, measure or esti‐ mate the total sum point capacitance, multiply by RIN/RF, and parallel RF with this value. Capacitors included for this purpose are usually in the single digit pF range. This technique results in equal feedback factor calcu‐ lations for AC and DC cases. It does not produce a roll off, but merely keeps ß constant over a wide frequency range. Paragraph 6 of Application Note 19 details suitable stability tests for the finished circuit. CURRENT LIMIT For proper operation, the current limiting resistor, RCL, must be connected as shown in Figure 2, “Typical Connections”. The current limit can be predicted as follows: V BE I LIMIT  A  = ------------------R CL    The “VBE for ILIMIT” performance graph is used to find VBE. On this graph, the VBE+ and VBE− curves show the voltages across the current limiting resistor at which current limiting is turned on. The VBE+ curve shows these turn‐on voltages when the amplifier is sourcing current, and the VBE− curve shows these voltages when the amplifier is sinking current. The current limit can be thought of as a ceiling or limit for safe operation. For continuous operation it is any value between the desired load current and 60 mA (as long as the curves on the SOA graph are not exceeded, please refer to Safe Operating Area). As an example, suppose the desired load current for the application is 20 mA. In this case we may set a current limit of 30 mA. Starting with the smaller VBE− of 0.6 we have: 0.6V R CL = ----------- = 20 1.03 For the larger VBE+ this RCL resistor will allow for a maximum current of: 0.7V I LIMIT  A  = ----------- = 35mA 20 This value is still acceptable because it is less than 60 mA. For the case of continuous load currents, check that the current limit does not exceed 60 mA. The VBE values used above are approximate and can vary with process. To allow for this possibility the user can reduce the VBE = 0.6 value by 20%. This results in a RCL value of 16 Ω. Using this same RCL value and allowing for a 20% increase in the other VBE, the current limit maximum is 52 mA. The absolute minimum value of the current limiting resistor is bounded by the largest current and the largest VBE in the application. The largest VBE is determined by the coldest temperature in the application. In general the largest VBE is VBE+ = 0.78V, which occurs at T = − 40°C. The largest allowed current occurs in pulsed applications where, from the SOA graph, we can see current pulses of 120 mA. This gives us an abso‐ lute minimum RCL value of 0.78V/0.12 (A) = 6.5 Ω. 14 PA341U Rev D PA341 HEATSINKING The PA341DF package has a large exposed integrated copper heatslug to which the monolithic amplifier is directly attached. The solder connection of the heatslug to a minimum of 1 square inch foil area, on the printed circuit board will result in thermal performance of 25°C/W junction to air rating of the PA341DF. Sol‐ der connection to an area of 1 to 2 square inches is recommended. This may be adequate heatsinking but the large number of variables involved suggest temperature measurements be made on the top of the package. Do not allow the temperature to exceed 85°C. OVERVOLTAGE PROTECTION Although the PA341 can withstand differential input voltages up to 16V, in some applications additional external protection may be needed. Differential inputs exceeding 16V will be clipped by the protection cir‐ cuitry. However, if more than a few milliamps of current is available from the overload source, the protection circuitry could be destroyed. For differential sources above 16V, adding series resistance limiting input cur‐ rent to 1mA will prevent damage. Alternatively, 1N4148 signal diodes connected anti‐parallel across the input pins is usually sufficient. In more demanding applications where bias current is important, diode con‐ nected JFETs such as 2N4416 will be required. See Q1 and Q2 in Figure 19. In either case the differential input voltage will be clamped to 0.7V. This is sufficient overdrive to produce the maximum power bandwidth. In the case of inverting circuits where the +IN pin is grounded, the diodes mentioned above will also afford protection from excessive common mode voltage. In the case of non‐inverting circuits, clamp diodes from each input to each supply will provide protection. Note that these diodes will have substantial reverse bias voltage under normal operation and diode leakage will produce errors. Some applications will also need over‐voltage protection devices connected to the power supply rails. Unidirectional zener diode transient suppressors are recommended. The zeners clamp transients to voltages within the power supply rating and also clamp power supply reversals to ground. Whether the zeners are used or not the system power supply should be evaluated for transient performance including power‐on overshoot and power‐off polarity reversals as well as line regulation. See Z1 and Z2 in Figure 19. Figure 19: Overvoltage Protection PA341U Rev D 15 PA341 PACKAGE OPTIONS Part Number Apex Package Style Description PA341CE CE 8‐pin TO‐3 PA341DF DF 24‐pin MO‐166 PA341DW DW 10‐pin SIP PACKAGE STYLE CE 16 PA341U Rev D PA341 PACKAGE STYLE DF 3.30 .130 3.00 [ .118 ] 16.00 .630 15.80 [ .623 ] .30 .012 .10 [ .004 ] 13.00 9.00 .354 ] [ .512 2.95 [.116] 6.20 5.80 .228 ] [ .244 1.27 [.050] .61 [.024] MAX. 11.10 .437 10.90 [.429] 14.50 .571 13.90 [.548] A B 2.90 [.114] MAX. 2 PLACES .90 [.084] REF. 1.10 [.043] MAX. 2 PLACES PIN 1 & ESD ID .61 [.024] MAX. 2.24 [.088] 14°±1° TOP & BOTTOM ALL SIDES 1.53[.060] 6.13[.242] R.46 [R.018] TYP. 3.07 [.121] 1.00 [.0394] 1.42 [.056] .32 .013 .23 [ .009] 0.53 .021 0.40 .016 [ ] .56 [.022] TYP. 0-4° 3.18 [.125] TYP .15 [.006] REF 1.47 [.058] 1.17 [.046] 13.34 [.525] 16.27 [.641] Surface Mount Layout 1.00 [.0394] .10 .00 DETAIL A 000] [ ..004 1.60 [.063] REF. 1.10 .043 .80 [ .031] DETAIL B NOTES: 1. 2. 3. 4. 5. 6. 7. Dimensions are millimeters & [inches]. Bracketed alternate units are for reference only. Dimple on lid & ESD triangle denote pin 1. Pins & Heat Slug: CDA 194 copper with bismuth solder finish Mold compound: MP-8000AN epoxy Package weight: .086 oz. [2.44 g] Suggested surface mount layout for reference only. PA341U Rev D 17 PA341 PACKAGE STYLE DW .022 [0.55] .16 [4.17] 1.00 [25.40] .50 [12.70] .09 [2.3] .75 [18.97] .21 [5.21] .24 [6.0] .04 [0.89] NOTES: 1. Dimensions are inches & [mm]. 2. Triangle printed on lid denotes pin 1. 3. Pins: Alloy 510 phosphor bronze plated with matte tin tin (150 - 300μ") over nickel (50 μ" max.) underplate. 4. Package Material: Alumina with hermetic glass seal. 5. Package weight: .1 oz [2.8 g] .010±.002 [0.25±0.05] .100 [2.54] TYP. .019±.002 [0.48±0.05] TYP. NEED TECHNICAL HELP? CONTACT APEX SUPPORT! For all Apex Microtechnology product questions and inquiries, call toll free 800-546-2739 in North America. For inquiries via email, please contact apex.support@apexanalog.com. International customers can also request support by contacting their local Apex Microtechnology Sales Representative. To find the one nearest to you, go to www.apexanalog.com IMPORTANT NOTICE Apex Microtechnology, Inc. has made every effort to insure the accuracy of the content contained in this document. However, the information is subject to change without notice and is provided "AS IS" without warranty of any kind (expressed or implied). Apex Microtechnology reserves the right to make changes without further notice to any specifications or products mentioned herein to improve reliability. This document is the property of Apex Microtechnology and by furnishing this information, Apex Microtechnology grants no license, expressed or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Apex Microtechnology owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Apex Microtechnology integrated circuits or other products of Apex Microtechnology. This consent does not extend to other copying such as copying for general distribution, advertising or promotional purposes, or for creating any work for resale. APEX MICROTECHNOLOGY PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN PRODUCTS USED FOR LIFE SUPPORT, AUTOMOTIVE SAFETY, SECURITY DEVICES, OR OTHER CRITICAL APPLICATIONS. PRODUCTS IN SUCH APPLICATIONS ARE UNDERSTOOD TO BE FULLY AT THE CUSTOMER OR THE CUSTOMER’S RISK. Apex Microtechnology, Apex and Apex Precision Power are trademarks of Apex Microtechnology, Inc. All other corporate names noted herein may be trademarks of their respective holders. 18 PA341U Rev D
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