ATS-TMDK-96

Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment* DIGI-KEY PART # ATS1071-ND ATS PART # ATS-51300K-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB B A Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for low profile components from 1.5 to 2.99mm Thermal Performance Table Air Velocity THERMAL RESISTANCE FT/MIN M/S °C/W (UNDUCTED) °C/W (DUCTED) 200 1.0 4.3 3.4 300 1.5 3.5 400 2.0 3 500 2.5 2.7 600 3.0 2.5 700 3.5 2.3 800 4.0 2.2 Product Details† Dimension A Dimension B Dimension C§ Dimension D TIM‡ FINISH 30 30 14.5 53.34 C1100F BLACK- ANODIZED For further technical information, please contact Advanced Thermal Solutions, Inc. at 1-781-769-2800 or www.qats.com * RoHS Compliant ‡ TIM = Thermal Interface Material † Dimensions are measured in millimeters ♦ Dimensions A & B refer to component size § Dimension C = the height of the heat sink shown above and does not include the height of the attachment method  To place an order, please visit www.digikey.com