HLMP-0504-B0000

Data Sheet HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 2.5 mm × 7.6 mm Rectangular LED Lamps Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to provide high on-off contrast and a flat high intensity emitting surface. Borderless package design allows creation of uninterrupted light emitting areas. Features          Broadcom Rectangular light emitting surface Flat high sterance emitting surface Stackable on 2.54-mm (0.100-in.) centers Ideal as flush mounted panel indicators Ideal for backlighting legends Long life: solid state reliability AlInGaP LED technology Choice of four bright colors – Deep Red – Red – Yellow – Green IC compatible/low current requirements AV02-1554EN September 8, 2021 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Package Dimensions 7.62 (0.300) 7.11 (0.280) 7.62 (0.300) 6.99 (0.275) 0.46 (0.018) SQ. NOMINAL 2.54 (0.100) NOMINAL CATHODE LEAD 29.21 (1.15) MIN. 8.00 (0.315) 7.37 (0.290) 2.54 (0.100) 2.16 (0.085) 1.27 (0.50) NOMINAL 2.54 (0.100) 2.29 (0.090) BOTTOM VIEW NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1 TAPER FROM BASE TO THE TOP OF LAMP. SIDE VIEW Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA Color Part Number Min. Typ. Deep Red HLMP-R100 2.1 — Red HLMP-0301 2.1 — Yellow Green Broadcom HLMP-0301-C00xx 1.3 — HLMP-0401 3.6 — HLMP-0401-B00xx 1.4 — HLMP-0401-D00xx 3.6 — HLMP-0504 2.6 — HLMP-0504-B00xx 1.6 — HLMP-0504-C00xx 2.6 — AV02-1554EN 2 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Absolute Maximum Ratings at TA = 25°C Parameter HLMP-R100 HLMP-0301 HLMP-0401 HLMP-0504 Units Peak Forward Current 300 90 60 90 mA Average Forward Currenta 20 25 20 25 mA DC Currentb 30 30 20 30 mA Power Dissipation 87 135 85 135 mW Reverse Voltage (IR = 100 µA) 5 5 5 5 V Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100 °C a. See Figure 4 to establish pulsed operating conditions. b. For Deep Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series, derate linearly from 50°C at 0.2 mA/°C. Electrical/Optical Characteristics at TA = 25°C HLMP-R100 Sym. Description Min. HLMP-0301 HLMP-0401 HLMP-0504 Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units Test Conditions 21/2 Included Angle Between Half Luminous Intensity Points — 100 — — 100 — — 100 — — 100 — P Peak Wavelength — 660 — — 632 — — 590 — — 570 — nm Measurement at Peak d Dominant Wavelength — 640 — — 626 — — 589 — — 569 — nm Note b 1/2 Spectral Line Halfwidth — 20 — — 14 — — 12 — — 13 — nm s Speed of Response — 30 — — 90 — — 90 — — 500 — ns C Capacitance — 30 — — 16 — — 18 — — 18 — pF RJ-PIN Thermal Resistance — 260 — — 260 — — 260 — — 260 — VF Forward Voltage — 2.0 2.4 — 2.0 2.6 — 2.0 2.6 — 2.1 3.0 V IF = 20 mA, Figure 2 VR Reverse Breakdown Voltage 5.0 — — 5.0 — — 5.0 — — 5.0 — — V IR = 100 µA v Luminous Efficacy — 65 — — 180 — — 500 — — 640 — Deg. Note a, Figure 5 VF = 0; f = 1 MHz °C/W Junction to Cathode Lead lm/W Note c a. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. b. The dominant wavelength,d, is derived from the CIE chromaticity diagram and represents the single wavelength that defines the color of the device. c. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Broadcom AV02-1554EN 3 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Part Numbering System H L M P - x1 x2 x3 x4 - Code Description Option x1 Package Type R x5 x6 x7 x8 x9 Rectangular 2.5 mm × 7.6 mm 0 x2 Color 1 Deep Red 3 Red 4 Yellow 5 Green x3 x4 Product Specific Designation x5 Minimum Intensity Bin Refer to Intensity Bin Table x6 Maximum Intensity Bin 0 Open binning (No maximum IV bin limit) x7 Color Bin Selection 0 Full color bin range x8 x9 Packaging Option 00 Bulk 02 Tape and Reel, Straight Leads Broadcom AV02-1554EN 4 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Bin Information Intensity Bin Limits Intensity Range (mcd) Color Deep Red/Red Bin Min. Intensity Range (mcd) Max. Color Yellow Bin Min. Max. C 1.5 2.4 B 1.6 2.5 D 2.4 3.8 C 2.5 4.0 E 3.8 6.1 D 4.0 6.5 F 6.1 9.7 E 6.5 10.3 G 9.7 15.5 F 10.3 16.6 H 15.5 24.8 G 16.6 26.5 I 24.8 39.6 H 26.5 42.3 J 39.6 63.4 I 42.3 67.7 K 63.4 101.5 J 67.7 108.2 L 101.5 162.4 K 108.2 173.2 M 162.4 234.6 L 173.2 250.0 N 234.6 340.0 M 250.0 360.0 O 340.0 540.0 N 360.0 510.0 P 540.0 850.0 O 510.0 800.0 Q 850.0 1200.0 P 800.0 1250.0 R 1200.0 1700.0 Q 1250.0 1800.0 S 1700.0 2400.0 R 1800.0 2900.0 T 2400.0 3400.0 S 2900.0 4700.0 U 3400.0 4900.0 T 4700.0 7200.0 V 4900.0 7100.0 U 7200.0 11700.0 W 7100.0 10200.0 V 11700.0 18000.0 X 10200.0 14800.0 W 18000.0 27000.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is ±18%. Maximum tolerance for each bin limit is ±18%. Broadcom AV02-1554EN 5 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Intensity Range (mcd) Color Bin Min. Max. Green B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Color Categories Lambda (nm) Color Category Number Min. Max. Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Yellow Tolerance for each bin limit is ±0.5 nm. Maximum tolerance for each bin limit is ±18%. Packaging Option Matrix Packaging Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 02 Tape and Reel, straight leads, minimum increment 1300 pieces/reel NOTE: Broadcom All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification/information. AV02-1554EN 6 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Figure 1: Relative Intensity vs. Wavelength 1 RELATIVE INTENSITY 0.9 DEEP RED GREEN 0.8 YELLOW 0.7 RED 0.6 0.5 0.4 0.3 0.2 0.1 0 450 500 550 600 650 700 750 WAVELENGTH - nm Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Luminous Intensity vs. Forward Current 30 25 1.8 20 GREEN DEEP RED, RED, YELLOW 15 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA 2 10 5 0 0 1 2 FORWARD VOLTAGE - V 3 DEEP RED 1.6 1.4 RED, YELLOW 1.2 1 0.8 GREEN 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA Broadcom AV02-1554EN 7 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Figure 4: Maximum Tolerable Peak Current vs. Peak Duration (IPEAK MAX determined from temperature derated IDC MAX). 10 100 IPEAK MAX. RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED IDC MAX. MAXIMUM DC CURRENT z 1 tP – PULSE DURATION – s HER, ORANGE, YELLOW, and GREEN 300 H IPEAK MAX. IDC MAX. z 1 10,000 00 H 1000 3 KHz 100 2 1 KHz 10 3 z 1 4 10 KH 1.0 5 1 TE – 1.5 A SH R EFRE z 100 H 1 KHz z 300 H 3 KHz z 10 KH z 30 KH 2.0 10 9 8 7 6 f–R 3.0 Hz 100 K RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT 4.0 1000 10000 tp – PULSE DURATION – s Deep RED Figure 5: Relative Luminous Intensity vs. Angular Displacement 20 30 40 50 10 0 1.0 0.8 0.6 60 70 80 90 Broadcom 0.4 0.2 10 20 30 40 50 60 70 80 90 100 AV02-1554EN 8 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet 2.5 mm × 7.6 mm Rectangular LED Lamps Precautions  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED.   Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition. Wave Solderinga, b Manual Solder Dipping Pre-heat Temperature 105°C max. — Pre-heat Time 60s max. — Peak Temperature 250°C max. 260°C max. Dwell Time 3s max. 5s max. a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Over-stressing the LED during the soldering process might cause premature failure to the LED due to delamination.    1.59 mm Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use nonmetal material because it absorbs less heat during the wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. The recommended PC board plated through holes (PTH) size for LED component leads follows. LED Component Lead Size Diagonal Plated ThroughHole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 in.) Dambar shear- 0.65 mm off area (max.) (0.026 in.) 0.919 mm (0.036 in.) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in.) (0.041 to 0.045 in.) Dambar shear- 0.70 mm off area (max.) (0.028 in.) NOTE: 0.99 mm (0.039 in.) Refer to application note AN1027 for more information on soldering LED components. AV02-1554EN 9 HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504 Data Sheet  2.5 mm × 7.6 mm Rectangular LED Lamps Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Figure 6: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245qC ± 5 qC (maximum peak temperature = 250qC) TEMPERATURE (qC) 200 Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-1554EN 10 Copyright © 2015–2021 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, go to www.broadcom.com. All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. 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