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HLMP-1641

HLMP-1641

  • 厂商:

    AVAGO(博通)

  • 封装:

    径向

  • 描述:

    LED GRN DIFF 3MM ROUND T/H

  • 数据手册
  • 价格&库存
HLMP-1641 数据手册
Data Sheet HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Overview The Broadcom® 5V and 12V series lamps contain an integral current limiting resistor in series with the LED. This allows the lamp to be driven from a 5V/12V source without an external current limiter. Features   The diffused lamps provide a wide off-axis viewing angle.  The T-1¾ lamps are provided with sturdy leads suitable for wire wrap applications. The T-1¾ lamps may be front panel mounted by using the HLMP-0103 clip and ring.    Broadcom Integral current limiting resistor TTL compatible – Requires no external current limiter with 5V/12V supply Cost effective – Saves space and resistor cost Wide viewing angle Available in all colors – Red, Yellow, and Green in T-1 and T-1¾ packages AlInGaP LED technology AV02-0379EN March 22, 2022 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Package Dimensions Figure 1: T-1 Package 1.14 (.045) 0.51 (.020) 3.43 (.135) 2.92 (.115) Ø 2.79 (.110) 2.29 (.090) 24.1(.95) MIN. 0.65 (0.026) max. 1.52 (.060) 1.02 (.040) 3.17 (.125) 2.67 (.105) (0.022) 0.55 SQ. TYP. (0.016) 0.40 4.70 (.185) 4.19 (.165) 6.35 (.250) 5.58 (.220) Figure 2: T-1¾ Package 5.08 (0.200) 4.57 (0.180) 12.34 (0.486) 11.54 (0.454) 0.89 (0.035) 0.64 (0.025) 9.19 (0.362) 8.43 (0.332) 1.32 (0.052) 1.02 (0.040) 23.0 MIN. (0.90) 0.46 (0.018) SQUARE NOMINAL 1.27 (0.050) NOM. 6.1 (0.240) 5.6 (0.220) CATHODE 2.54 (0.100) NOM. NOTE: 1. All dimensions are in millimeters (inches). 2. An epoxy meniscus can extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see the Precautions section. Broadcom AV02-0379EN 2 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Device Selection Guide Color Red Package Description Package Outline T-1 Tinted Diffused Figure 1 T-1¾ Tinted Diffused Yellow T-1 Tinted Diffused T-1¾ Tinted Diffused Green T-1 Tinted Diffused T-1¾ Tinted Diffused 2θ1/2a Operating Voltage (V) Part Number HLMP- 60 5 60 12 60 5 Figure 2 Figure 1 Figure 2 Figure 1 Figure 2 Luminous Intensity IV (mcd) Min. Max. 1600 2.1 — 1600-D00xx 2.1 — 1601 2.1 — 3600 2.1 — 3600-D00xx 2.1 — 60 12 3601 2.1 — 60 5 1620 2.2 — 1620-C00xx 2.2 — 60 12 1621 2.2 — 60 5 3650 2.2 — 3650-C00xx 2.2 — 60 12 3651 2.2 — 60 5 1640 1.6 — 1640-B00xx 1.6 — 1640-FH0xx 10.6 54.6 60 12 1641 1.6 — 60 5 3680 1.6 — 3680-B00xx 1.6 — 60 12 3681 1.6 — 3681-B00xx 1.6 — a. θ1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity. Absolute Maximum Ratings Parameter DC Forward Voltage (TA = 25°C) Red/Yellow 5V Lamps Red/Yellow 12V Lamps Green 5V Lamps Green 12V Lamps 7.5Va 15Vb 7.5Va 15Vb 5V 5V 5V 5V Reverse Voltage (IR = 100 μA) Operating Temperature Range –40°C to +85°C –20°C to +85°C Storage Temperature Range –40°C to +100°C –40°C to +100°C a. Derate from TA = 50°C at 0.071 V/°C; see Figure 6. b. Derate from TA = 50°C at 0.086 V/°C; see Figure 7. Broadcom AV02-0379EN 3 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Optical and Electrical Characteristics at TA = 25°C Parameter Symbol Color Min. Typ. Max. Units PEAK Red Yellow Green — — — 632 590 570 — — — nm Dominant Wavelengtha d Red Yellow Green — — — 626 589 569 — — — nm Spectrum Line Halfwidth 1/2 Red Yellow Green — — — 14 12 13 — — — nm Thermal Resistanceb RθJ-PIN Red Yellow Green — — — 290 290 290 — — — °C/W Junction to Cathode Lead Thermal Resistancec RθJ-PIN Red Yellow Green — — — 210 210 210 — — — °C/W Junction to Cathode Lead Forward Current, 12V Devices IF Red Yellow Green — — — 13 13 13 20 20 20 mA VF = 12V Forward Current, 5V Devices IF Red Yellow Green — — — 10 10 10 15 15 15 mA VF = 5V Luminous Efficacyd V Red Yellow Green — — — 180 500 640 — — — Lumen/ Watt Reverse Breakdown Voltage VR Red Yellow Green 5 5 5 — — — — — — V Peak Wavelength Test Conditions IR = 100 µA a. The dominant wavelength, d, is derived from the Chromaticity diagram and represents the color of the lamp. b. For Figure 1, T-1 Package, package type. c. For Figure 2, T-1¾ Package, package type. d. Radiant intensity, le, in watts/steradian, can be found from the equation Ie = Iv / v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Broadcom AV02-0379EN 4 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Part Numbering System H L M P - x1 6 x2 x3 - x4 x5 x6 x7 x8 Code Description Option x1 Package Type 1 3 T-1¾ (5 mm) x2 Color 0 Red 2, 5 Yellow 4, 8 Green 0 5V 1 12V x3 Operating Voltage T-1 (3 mm) x4 Minimum Intensity Bin See the Intensity Bin Limits table. x5 Maximum Intensity Bin 0 Open bins (no maximum IV bin limit) x6 Color Bin Option 0 Full distribution x7 x8 Packaging Option 00 Bulk (loose forms packaging) A1, B1 Right angle housing, uneven leads A2, B2 Right angle housing, even leads Broadcom AV02-0379EN 5 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Bin Information Intensity Bin Limits Intensity Range (mcd) Intensity Range (mcd) Color Red Yellow Broadcom Bin Min. Max. D E F G H I J K L M N O P Q R S T U V W X Y Z C D E F G H I J K L M N O P Q R S T U V 2.4 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 2.5 4.0 6.5 10.3 16.6 26.5 42.3 67.7 108.2 173.2 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 3.8 6.1 9.7 15.5 24.8 39.6 63.4 101.5 162.4 234.6 340.0 540.0 850.0 1200.0 1700.0 2400.0 3400.0 4900.0 7100.0 10200.0 14800.0 21400.0 30900.0 4.0 6.5 10.3 16.6 26.5 42.3 67.7 108.2 173.2 250.0 360.0 510.0 800.0 1250.0 1800.0 2900.0 4700.0 7200.0 11700.0 18000.0 Color Yellow (cont.) Green Bin Min. Max. W B C D E F G H I J K L M N O P Q R S T U V W 18000.0 1.8 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 27000.0 2.9 4.7 7.6 12.0 19.1 30.7 49.1 78.5 125.7 201.1 289.0 417.0 680.0 1100.0 1800.0 2700.0 4300.0 6800.0 10800.0 16000.0 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. Color Categories Lambda (nm) Color Category # Min. Max. Green 6 5 4 3 2 1 3 2 4 5 561.5 564.5 567.5 570.5 573.5 582.0 584.5 587.0 589.5 592.0 564.5 567.5 570.5 573.5 576.5 584.5 587.0 589.5 592.0 593.0 Yellow Tolerance for each bin limit is ± 0.5 nm. AV02-0379EN 6 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Packaging Option Matrix Packaging Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pieces/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 pieces/bag B1 T-1¾ Right Angle Housing, uneven lead, minimum increment 500 pieces/bag B2 T-1¾ Right Angle Housing, even leads, minimum increment 500 pieces/bag NOTE: All categories are established for classification of products. Products might not be available in all categories. Contact your local Broadcom representative for further clarification or information. Figure 3: Relative Intensity vs. Wavelength 1 YELLOW GREEN 0.9 RED 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 550 600 650 700 WAVELENGTH - nm Figure 5: Forward Current vs. Applied Forward Voltage, 12V Devices 20 20 16 16 FORWARD CURRENT - mA FORWARD CURRENT - mA Figure 4: Forward Current vs. Applied Forward Voltage, 5V Devices 12 8 4 0 12 8 4 0 2 4 6 8 10 12 APPLIED FORWARD VOLTAGE - V Broadcom 14 16 0 0 2 4 6 8 10 12 14 16 APPLIED FORWARD VOLTAGE - V AV02-0379EN 7 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps 8 7.5 6 4 2 0 Figure 7: Maximum Allowed Applied Forward Voltage vs. Ambient Temperature RθJA = 175°C/W, 12V Devices VCC – APPLIED FORWARD VOLTAGE – V VCC – APPLIED FORWARD VOLTAGE – V Figure 6: Maximum Allowed Applied Forward Voltage vs. Ambient Temperature RθJA = 175°C/W, 5V Devices 0 20 40 60 16 15 12 8 4 0 80 85 0 20 TA – AMBIENT TEMPERATURE – C Figure 8: Relative Luminous Intensity vs. Angular Displacement for T-1 Package 20 30 1.0 30 0.8 50 60 80 85 Figure 9: Relative Luminous Intensity vs. Angular Displacement for T-1¾ Package 0 10 40 20 10 0 50 0.6 1.0 0.8 40 60 0.6 60 0.4 70 90 0.4 70 0.2 80 0.2 80 10 20 30 40 50 60 70 80 90 100 Figure 10: Relative Luminous Intensity vs. Applied Forward Voltage, 5V Devices 90 10 20 30 40 50 60 70 80 90 100 Figure 11: Relative Luminous Intensity vs. Applied Forward Voltage, 12V Devices 1.2 1.8 GREEN 1.6 1 1.4 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 12V) RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5V) 40 TA – AMBIENT TEMPERATURE – C 0.8 1.2 1 0.6 RED, YELLOW 0.8 0.4 0.6 0.4 0.2 0.2 0 0 0 2 4 APPLIED VOLTAGE - V Broadcom 6 8 0 2 4 6 8 10 12 14 16 APPLIED VOLTAGE - V AV02-0379EN 8 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Precautions  Lead Forming    The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, use the proper tool to precisely form and cut the leads to applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into the LED package. Use this method for the hand soldering operation, because the excess lead length also acts as small heat sink. Soldering and Handling   Take care during the PCB assembly and soldering process to prevent damage to the LED component. The LED component may be effectively hand soldered to the PCB. However, do this under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59 mm   Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Broadcom application note AN 1142 for details. The soldering iron used must have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering conditions: Wave Manual Solder Dipping Solderinga, b Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time 105°C max. 60s max. 250°C max. 3s max. — — 260°C max. 5s max. a. The preceding conditions refer to measurement with a thermocouple mounted at the bottom of the PCB. b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. Broadcom Set and maintain wave soldering parameters according to the recommended temperature and dwell time. Perform daily checks on the soldering profile to ensure that it always conforms to the recommended soldering conditions. NOTE: 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. Therefore, recalibrate the soldering profile again before loading a new type of PCB. 2. Take extra precautions during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceed 3s. Overstressing the LED during the soldering process might cause premature failure to the LED due to delamination.  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force on the LED. Use non-metal material because it will absorb less heat during the wave soldering process.  At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.  If the PCB board contains both through-hole (TH) LED and other surface-mount components, solder surfacemount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED.  The recommended PC board plated through holes (PTH) size for LED component leads follows: LED Component Lead Size Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) Dambar shear0.65 mm off area (max.) (0.026 in.) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) Dambar shear0.70 mm off area (max.) (0.028 in.)  Diagonal 0.636 mm (0.025 in.) 0.919 mm (0.036 in.) 0.707 mm (0.028 in.) 0.99 mm (0.039 in.) Plated ThroughHole Diameter 0.98 to 1.08 mm (0.039 to 0.043 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) Oversizing the PTH can lead to a twisted LED after clinching. On the other hand, undersizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN1027 for more information about soldering and handling of TH LED lamps. AV02-0379EN 9 HLMP-1600, HLMP-1601, HLMP-1620, HLMP-1621, HLMP-1640, HLMP-1641, HLMP-3600, HLMP-3601, HLMP-3650, HLMP-3651, HLMP-3680, HLMP-3681 Data Sheet T-1¾ (5-mm), T-1 (3-mm), 5V, 12V, Integrated Resistor LED Lamps Figure 12: Recommended Wave Soldering Profile 250 Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) LAMINAR HOT AIR KNIFE TURBULENT WAVE Flux: Rosin flux Solder bath temperature: 245qC ± 5 qC (maximum peak temperature = 250qC) TEMPERATURE (qC) 200 Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 150 Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force. 100 50 PREHEAT 0 Broadcom 10 20 30 40 50 60 TIME (SECONDS) 70 80 90 100 AV02-0379EN 10 Disclaimer Broadcom’s products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Copyright © 2015-2022 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Inc. and/or its subsidiaries. For more information, go to www.broadcom.com. All trademarks, trade names, service marks, and logos referenced herein belong to their respective companies. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Lead (Pb) Free RoHS Compliant
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