HLMP-EGxx, HLMP-ELxx and HLMP-EHxx
T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs
provide superior light output for excellent readability in
sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long
periods of time. Precision Optical Performance lamps
utilize the aluminum indium gallium phosphide (AlInGaP)
technology.
• Viewing angle: 15°, 23°, 30°
• High luminous output
• Colors:
590nm Amber
615nm Red-Orange
626nm Red
• Package options:
With or without lead standoff
These LED lamps are untinted, T-1¾ packages incorporating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction temperature limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
Benefits
• Superior performance for outdoor environments
• Suitable for auto-insertion onto PC board
• Superior resistance to moisture
• Untinted non-diffused for 15° and 30° lamps
• Untinted diffused for 23° lamps
Applications
• Traffic management:
- Traffic signals
- Pedestrian signals
- Work zone warning lights
- Variable message signs
• Commercial outdoor advertising
- Signs
- Marquees
Package Dimension
A
B
5.00 ± 0.20
(0.197 ±� 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ±� 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
0.70 (0.028)
MAX.
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
31.60
MIN.
(1.244)
1.50 ± 0.15
(0.059 ± 0.006)
31.60
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
1.00 MIN.
(0.039)
5.80 ± 0.20
(0.228 ± 0.008)
CATHODE
FLAT
0.50 ± 0.10
SQ. TYP.
(0.020 ± 0.004)
1.00 MIN.
(0.039)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
- LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
- LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS
= 0.965/0.889 (0.038/0.035).
4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
PART NO.
d
HLMP-XX13
12.42 ± 0.25
(0.489 ± 0.010)
11.59 ± 0.25
(0.446 ± 0.010)
HLMP-XX23
HLMP-XX37
5. FOR IDENTIFICATION OF POLARITY AFTER THE LEADS ARE TRIMMED OFF, PLEASE REFER TO THE ILLUSTRATION BELOW:
CATHODE
ANODE
7. MAJOR HEAT PATH IS THROUGH THE ANODE LEAD
11.96 ± 0.25
(0.471 ± 0.010)
Device Selection Guide
Typical Viewing
Angle 2θ½ (Deg) [4]
Color and Dominant
Wavelength (nm), Typ. [3]
Lamps without
Standoffs on Leads
(Outline Drawing A)
15°
Amber 590
HLMP-EL12-VY0DD
Lamps with
Standoffs on Leads
(Outline Drawing B)
Luminous Intensity
Iv (mcd) [1,2,5] @ 20mA
Min.
Max.
HLMP-EL13-VY0DD
4200
12000
7200
12000
HLMP-EL12-XYKDD
Red-Orange 615
HLMP-EH12-VY0DD
HLMP-EH13-VY0DD
4200
12000
Red 626
HLMP-EG12-VY0DD
HLMP-EG13-VY0DD
4200
12000
5500
9300
HLMP-EG12-WX0DD
23°
Amber 590
HLMP-EL22-UXKDD
HLMP-EL23-UXKDD
3200
9300
HLMP-EL22-UX0DD
HLMP-EL23-UX0DD
3200
9300
4200
7200
HLMP-EL22-VWKDD
Red-Orange 615
HLMP-EH22-TW0DD
HLMP-EH23-TW0DD
2500
7200
Red 626
HLMP-EG22-UX0DD
HLMP-EG23-UX0DD
3200
9300
4200
7200
HLMP-EG22-VW0DD
30°
Amber 590
HLMP-EL35-TW0DD
HLMP-EL37-TW0DD
2500
7200
HLMP-EL35-TWKDD
HLMP-EL37-TWKDD
2500
7200
3200
5500
HLMP-EL35-UVKDD
Red-Orange 615
HLMP-EH35-SV0DD
HLMP-EH37-SV0DD
1900
5500
Red 626
HLMP-EG35-TW0DD
HLMP-EG37-TW0DD
2500
7200
3200
5500
HLMP-EG35-UV0DD
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each intensity bin limit is ± 15%.
Part Numbering System
HLMP – E x x x - x x x x x
Mechanical Options
00 : Bulk Packaging
DD : Ammo Pack
YY : Flexi-Bin; Bulk Packaging
ZZ : Flexi-Bin; Ammo Pack
Color Bin Selections
0 : Full color distribution
2 : Amber color bin 2 only
4 : Amber color bin 4 only
K : Amber color bin 2 and 4 only
Z : Special Vf Bin Range
Maximum Intensity Bin
0 : No maximum intensity bin limitation
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
12 : 15 deg without lead standoffs
13 : 15 deg with lead standoffs
22 : 23 deg without lead standoffs
23 : 23 deg with lead standoffs
35 : 30 deg without lead standoffs
37 : 30 deg with lead standoffs
Color
G : 626nm Red
H : 615nm Red-Orange
L : 590nm Amber
Note: Please refer to AB 5337 for complete information on part numbering system.
Absolute Maximum Ratings at TA = 25°C
DC Forward Current [1]
50 mA
Peak Pulsed Forward Current
100 mA
Average Forward Current
30 mA
Reverse Voltage (Ir = 100 µA)
5V
Operating Temperature
–40°C to +100°C
Storage Temperature
–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
Electrical/ Optical Characteristics at TA = 25ºC
Parameter
Forward Voltage
Amber
Red
Red-Orange
Peak Wavelength
Amber
Red
Red-Orange
Dominant Wavelength [1]
Amber
Red
Red-Orange
Symbol
VF
Minimum
Average
1.80
2.20
2.10
2.00
Maximum Units
IF = 20mA
2.40
V
IF = 20mA
590
626
615
λPEAK
Test Condition
nm
λd
Reverse Voltage
VR
5
V
IR = 100μA
Spectral Halfwidth
Dλ½
17
nm
IF = 20 mA
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RθJ-PIN
240
ºC/W
LED Junction-to-Anode Lead
hV
480
150
260
lm/W
Luminous Flux
jV
1300
mlm
IF = 20mA
Luminous Efficiency [3]
he
30
lm/W
Emitted Luminous Flux/ Electrical
Power
Luminous Efficacy [2]
Amber
Red
Red-Orange
594.5
630.0
621.7
IF = 20mA
584.5
620.0
612.0
nm
Emitted Luminous Flux/Emitted
Radiant Flux
Notes:
1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant
wavelength is +/- 0.5nm.
2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is
the luminous efficacy in lumens/watt.
3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
Figure 1. Relative intensity vs. peak wavelength
60
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
50
FORWARD CURRENT - mA
2.5
Red
Red-Orange
40
Amber
30
20
10
0
0
0.5
1
1.5
2
2.5
2
1.5
1
0.5
0
3
FORWARD VOLTAGE - V
0.9
45
0.8
NORMALIZED INTENSITY
I F - FORWARD CURRENT - mA
1
50
40
35
30
25
20
15
100
0.3
0
-90
120
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Representative spatial radiation pattern for 15° viewing angle
lamps
1
1
0.9
0.9
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
0.4
0.1
Figure 4. Maximum forward current vs. ambient temperature
0.7
0.6
0.5
0.4
0.3
0.2
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.1
-60
-30
0
30
60
ANGULAR DISPLACEMENT -DEGREES
Figure 6. Representative spatial radiation pattern for 23° viewing angle
lamps
50
0.5
5
0
-90
40
0.6
0.2
40
60
80
TA - AMBIENT TEMPERATURE - ºC
30
0.7
10
20
20
Figure 3. Relative luminous intensity vs. forward current
55
0
10
DC FORWARD CURRENT - mA
Figure 2. Forward current vs. forward voltage
0
0
90
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 7. Representative spatial radiation pattern for 30° viewing angle
lamps
90
RELATIVE LOP
(NORMALIZE AT 25 °C )
10
Amber
Red-Orange
Red
1
0.1
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE - °C
Figure 8. Relative light output vs. junction temperature
Intensity Bin Limits (mcd at 20mA)
Bin Name
Minimum
Maximum
Bin Name
Minimum
Maximum
R
1500
1900
VD
1.8
2.0
S
1900
2500
VA
2.0
2.2
T
2500
3200
VB
2.2
2.4
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Bin Name
Minimum
Maximum
584.5
587.0
Tolerance for each bin limit is ± 0.05V
Amber Color Bin Limits (nm at 20mA)
Y
9300
12000
1
Z
12000
16000
2
587.0
589.5
1
16000
21000
4
589.5
592.0
27000
6
592.0
594.5
2
21000
Tolerance for each bin limit is ± 15%
Forward Voltage Bin Limits (V at 20mA)
Tolerance for each bin limit is ± 0.5nm
Note: Bin categories are established for classification of products.
Products may not available in all bin categories.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Anode
InGaN connection
Device between bottom surface of LED die and
Note: Electrical
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED
Recommended Wave Soldering Profile
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
TEMPERATURE (°C)
200
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
150
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
Figure 9. Recommended Wave Soldering Profile
40
60
50
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Figure 10. Dimension for ammo pack
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Figure 11. The arrangement of unit in ammo pack
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
10
Lamps Baby Label
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
OR
(ii) Color bin incorporate with VF Bin
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-0086EN - January 15, 2009
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