Surface Mount PTC
0ZCM Series
0ZCM Series – 0603 Chip
RoHS 2 Compliant
Product Features
- 0603 Chip Size, Fast Trip Time, Low DCR Resistance
- AEC-Q Compliant
- Meets Bel automotive qualification*
* - Largely based on internal AEC-Q test plan
Operating (Hold Current) Range
10mA – 200mA
Maximum Voltage
9 – 60V (per table)
Temperature Range
-40° C to 85° C
Agency Approval
TUV (Std. EN/IEC 60738-1-1 and EN/IEC 60730-1, Cert. R50102117)
UL Recognized Component (Std. UL1434, File E305051)
AEC-Q Compliant
LEAD FREE =
HALOGEN FREE =
Electrical Characteristics (23
Part Number
)
Hold
Current
Trip
Current
Rated
Voltage
Maximum
Current
Typical
Power
IH, A
IT, A
Vmax, Vdc
Imax, A
Max Time to Trip
Resistance Tolerance
Current
Time
Rmin
R1max
Pd, W
A
Sec
Ohms
Ohms
Agency
Approvals
New Rating
A 0ZCM0001FF2G
0.01
0.03
60
40
0.5
0.20
1.00
15.00
100.00
Y
Y
New Rating
B 0ZCM0002FF2G
0.02
0.06
60
40
0.5
0.20
1.00
12.00
70.00
Y
Y
New Rating C 0ZCM0003FF2G
0.03
0.09
30
40
0.5
0.20
1.00
6.00
50.00
Y
Y
New Rating D 0ZCM0004FF2G
0.04
0.12
24
40
0.5
0.20
1.00
4.00
40.00
Y
Y
E 0ZCM0005FF2G
0.05
0.15
15
40
0.5
0.50
0.10
3.80
30.00
Y
Y
0ZCM0008FF2G
0.08
0.20
15
40
0.5
0.60
0.10
2.80
14.00
Y
Y
0ZCM0008FA2G
0.08
0.20
15
40
0.5
0.60
0.10
2.80
14.00
Y
G 0ZCM0010FF2G
0.10
0.25
15
40
0.5
0.70
0.10
0.90
8.00
Y
Y
H 0ZCM0012FF2G
0.12
0.30
9
40
0.5
0.80
0.10
1.10
5.80
Y
Y
I 0ZCM0016FF2G
0.16
0.40
9
40
0.5
1.00
0.10
1.00
4.20
Y
Y
J 0ZCM0020FF2G
0.20
0.45
9
40
0.5
2.00
0.10
0.55
3.50
Y
Y
F
IH
Hold Current- The maximum current at which the device will not trip in still air at 23° C.
IT
Trip current- The minimum current at which the device will trip in still air at 23° C.
Vmax Maximum voltage device can withstand at its rated current without suffering dam age.
Imax Maximum fault current device can withstand at rated voltage (Vmax) without damage.
Pd
Typical power dissipated by device when in tripped state in 23° C still air environment.
Rmin Minimum device resistance at 23° C in initial un-soldered state.
R1max Maximum device resistance at 23° C, 1 hour after initial device trip, or after being soldered to PCB in end application.
Specifications subject to change without notice
belfuse.com/circuit-protection
Type 0ZCM Series
2/4
PTC’s – Basic Theory of Operation / “Tripped” Resistance Explanation
A Bel PTC consists of a block of polymeric material containing conductive carbon granules which is
sandwiched between two conductive metal plates. When this polymer block reaches approximately 125C,
either due to current passing through it via conductive chains of carbon particles or due to an external heat
source; it swells volumetrically. This expansion breaks apart a majority of the chains of carbon granules that
run randomly between the two conductive plates. This behavior results in a sharp increase in resistance
across the two plates which all but eliminates current flow through the device, allowing just enough residual
current flow to maintain the block’s internal temperature at 125C. Once this “tripped” state current is cut off,
the polymer brick cools and shrinks to its original size, thereby allowing its broken carbon chains to
reestablish themselves and permit the part to return to its low resistance state. Once cooled to room
ambient, the PTC will once again exhibit a resistance less than its “R1max” rating.
At currents below the device IHOLD rating, AND at temperatures below 100C, the PTC maintains a
resistance value below its R1 MAX rating.
The catalog data for each device specifies a "Typical Power" value. This is the power required to exactly
match the heat lost by the tripped device to its ambient surroundings at 23C. By Ohm's Law, power can be
stated as: W = E²/R. Thus the approximate resistance of a “Tripped” PTC can be determined by: R = E²/W,
where "E" is the voltage appearing across the PTC (usually the supply's open circuit voltage), and "W" is the
Typical Power value for the particular PTC.
Since the PPTC acts to maintain a constant internal temperature, its apparent resistance will change based
upon applied voltage and, to a lesser degree, ambient conditions. Consider the following example....
A PTC with a Typical Power of 1 watt protecting a circuit using a 60V supply will demonstrate an apparent,
tripped resistance "R" of:
R = 60²/1 = 3,600 ohms
This same tripped device when used to protect a 12V circuit would now present an apparent resistance of:
R = 12²/1 = 144 ohms
The value for Typical Power is "typical" because any physical factors that affect heat loss (such as ambient
temperature or air convection) will somewhat alter the level of power that the PTC needs to maintain its
internal temperature. In short, PTCs do not exhibit a constant, quantifiable tripped resistance value.
Average Time Current Characteristic Curve at 23°C
The Average Time Current Characteristic Curve and Temperature Rerating Curve are affected by a number of variables and these curves are
provided for guidance only.
Specifications subject to change without notice
Bel Fuse Inc.
206 Van Vorst Street
Jersey City, NJ 07302 USA
+1 201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit-protection
© 2019 Bel Fuse, Inc.
Rev. 0ZCM Sep2019
Type 0ZCM Series
3/4
Pad Layout
Termination Pad Materials
The dimensions in the table below provide the recommended
pad layout.
Matte Tin – Plated Copper
P
S
W
Nominal
Nominal
Nominal
mm
Inch
mm
Inch
mm
Inch
0.80
0.031
0.60
0.024
0.80
0.031
All dimensions in mm.
Mechanical Dimensions and Marking
Dimensions
Part Number
Marking Code
C
Min
Max
0ZCM0001FF2G
0.35
0.85
0ZCM0002FF2G
0.35
0.85
0ZCM0003FF2G
0.35
0.75
0ZCM0004FF2G
0.35
0.75
0ZCM0005FF2G
0.35
0.75
0ZCM0008FF2G
0.35
0.75
0ZCM0008FA2G
0.40
0.60
0ZCM0010FF2G
0.35
0.75
0ZCM0012FF2G
0.35
0.75
0ZCM0016FF2G
0.35
0.75
0ZCM0020FF2G
0.35
0.75
IH code
n
w
h
k
u
x
x
d
y
z
f
Temperature Derating Table
Temperature Derating
I Hold Value
0ZCM
-40
-20
0
23
30
40
50
60
70
85
163%
143%
123%
100%
95%
88%
80%
72%
66%
56%
Thermal Derating Curve
Cautionary Notes
Temperature Derating Curve
Percent of Hold and Trip Current
180%
160%
140%
120%
100%
80%
60%
40%
20%
0%
-40
-20
0
20
40
Temperature(°
C)
60
80
1. Operation beyond the specified maximum ratings or improper use
may result in damage and possible electrical arcing and/or flame.
2. These Polymer PTC (PPTC) devices are intended for protection
against occasional overcurrent/overtemperature fault conditions
and may not be suitable for use in applications where repeated
and/or prolonged fault conditions are anticipated.
3. Avoid contact of PTC device with chemical solvent. Prolonged
contact may adversely impact the PTC performance.
4. These PTC devices may not be suitable for use in circuits with a
large inductance, as the PTC trip can generate circuit voltage
spikes above the PTC rated voltage.
5. These devices may be used in both DC and AC circuits provided
that peak-to-peak line voltage when carrying AC does not exceed
the PTC’s Vmax rating. As PTCs are essentially thermal devices,
the RMS value of AC current carried by a PTC will produce
tripping parameters and times-to-trip similar to those of a DC
voltage of the same magnitude.
6. If potting is mandated, avoid rigid potting compounds as they will
encase the PTC and prevent it from volumetrically expanding to
properly respond to a trip event.
7. MSL: 2a (According to IPC J-Std-020).
Specifications subject to change without notice
Bel Fuse Inc.
206 Van Vorst Street
Jersey City, NJ 07302 USA
+1 201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit-protection
© 2019 Bel Fuse, Inc.
Rev. 0ZCM Sep2019
Type 0ZCM Series
4/4
Environmental Specifications
Temperature cycling
JESD22 Method JA-104
Biased humidity
MIL-STD-202 Method 103
Operational life
MIL-STD-202 Method 108
Resistance to solvents
MIL-STD-202 Method 215
Mechanical shock
MIL-STD-202 Method 213
Vibration
MIL-STD-202 Method 204
Resistance to soldering heat
MIL-STD-202 Method 210
Thermal shock
MIL-STD-202 Method 107
Solderability
ANSI/J-STD-002
Board flex(SMD)
AEC-Q200-005
Terminal strength
AEC-Q200-006
Solder Reflow and Rework Recommendations
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3° C/second max
Preheat :
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Time maintained above:
Temperature(TL )
Time (tL)
150° C
200° C
60-180 seconds
217° C
60-150 seconds
Peak/Classification Temperature(Tp) :
260° C
Time within 5° C of actual Peak :
Temperature (tp)
20-40 seconds
Ramp-Down Rate :
6° C/second max.
Time 25° C to Peak Temperature :
8 minutes max
Solder Reflow
Due to “lead free / RoHS 2 ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the
reflow profile are greater than those used for non-RoHS devices.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. Not Recommended For Wave Solder / Direct Immersion.
3. Recommended paste thickness range – 0.20 – 0.25mm.
4. Devices are compatible with standard industry cleaning solvents and methods.
5. MSL: 2a (According to IPC J-Std-020).
Caution
If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected.
Rework: MIL-STD-202G Method 210F, Test Condition A.
Standard Packaging
P/N Explanation and Ordering Information
Part Number
Tape/Reel Qty
0ZCM0001FF2G
Thu
0ZCM0020FF2G
4,000
4000 fuses in 7 inches dia. Reel, 8mm wide tape, 4mm
pitch, per EIA-481(equivalent IEC-286 part 3).
Specifications subject to change without notice
Bel Fuse Inc.
206 Van Vorst Street
Jersey City, NJ 07302 USA
+1 201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit-protection
© 2019 Bel Fuse, Inc.
Rev. 0ZCM Sep2019