BD23B

BeRex Triple Band 2-Way SMT Power Divider 1900~2500MHz PCS, WCDMA & TD-SCDMA, WiBro Device Features and Description BD23B  25dB Typical Isolation  0.4dB Typical Insertion Loss  Small Size and Low Profile  MSL 1 moisture rating  Lead-free/Green/RoHS compliant package Application: commercial, space, military wireless system  Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad  Chip is fully passivated for enhanced performance and reliability  Can be used without back side ground soldering (This may degrade the performance at the high frequency edge. Refer to the following typical test data) Electrical specifications Parameters Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Amplitude Balance Phase Balance Unit MHz dB dB dB dB dB deg Min 1900 Typ 0 .4 Max 2500 0 .8 15 25 -23 -25 0.05 1.0 -15 -15 0.2 2.0 All specifications apply with the following test conditions, 1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system 2. Insertion Loss: Above 3.0dB 3. Back side ground was soldered Absolute Maximum Ratings Parameters Input Power Storage Temperature Operating Temperature Rating 1W CW -55 to +155C -40C to +85C Operation of this device above any of these parameters may result in permanent damage. http: //www.berex.com BeRex Evaluation Board Drawing BD23B Function Block Diagram Pins 1,3,4,6 and 7 must be DC and RF grounded. Typical Test Data With Back Side Ground Soldering Parameters Unit WCDMA & TD-SCDMA Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance MHz dB dB dB dB deg dB 1900 0.38 18.7 -21.4 -20.9 0.0 0.03 2075 0.39 21.6 -26.7 -24.5 0.2 0.04 2250 0.44 25.8 -25.2 -23.0 0.3 0.06 2200 0.42 24.2 -27.0 -23.7 0.3 0.05 WiBro 2350 0.46 28.5 -21.6 -21.6 0.5 0.06 2500 0.54 23.8 -17.4 -20.8 0.7 0.09 Without Back Side Ground Soldering Parameters Unit WCDMA & TD-SCDMA Frequency Range Insertion Loss Isolation IRL(S11) ORL(S22,S33) Phase Diff. Amplitude Balance MHz dB dB dB dB deg dB 1900 0.36 19.2 -24.2 -22.3 1.7 0.07 2075 0.38 22.2 -26.0 -25.0 1.6 0.06 2250 0.45 25.7 -20.4 -21.9 1.7 0.07 2200 0.42 24.7 -22.1 -22.8 1.7 0.07 WiBro 2350 0.49 25.8 -17.6 -20.4 1.7 0.06 2500 0 .6 20.5 -14.2 -19.3 1.8 0.06 http: //www.berex.com BeRex Insertion Loss vs. Frequency BG 0 -1 NBG BD23B Isolation vs. Frequency BG 0 -5 -10 -15 -20 -25 -30 1900 NBG Insertion Loss [dB] -3 -4 -5 -6 1900 2100 2300 2500 Isolation [dB] -2 2100 2300 2500 Freq [MHz] Freq [MHz] IRL vs. Frequency BG 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 1900 NBG ORL vs. Frequency BG 0.00 -5.00 -10.00 NBG ORL [dB] IRL [dB] -15.00 -20.00 -25.00 -30.00 1900 2100 2300 2500 2100 2300 2500 Freq [MHz] Freq [MHz] Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering http: //www.berex.com BeRex Package Drawing BD23B http: //www.berex.com BeRex Suggested PCB Land Pattern and PAD Layout PCB Land Pattern 0.047"(1.20) BD23B PCB Mounting RF In 0.018"(0.45) 0.076"(1.92) 0.157"(3.98) 0.040"(1.01) RF Out1 0.030"(0.76) 0.198"(5.02) RF Out2 Visit http://www.berex.com for PCB layout Tape & Reel Packaging information: SOIC8 SOIC8-Part orientation Tape Width (mm): 12 Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Direction of feed Lead plating finish 100% Tin Matte finish. (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns) MSL / ESD Rating MSL Rating: Standard: Level 3 at +265C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F NOTICE BeRex Corporation reserves the right to make changes of product specification or to discontinue product at any time without notice. http: //www.berex.com