LC25WZBA-J57

Data Sheet 2.5Gb/s Buried Het Laser non-WDM applications LC25WZ This laser module employs the Bookham strained layer MQW Buried Heterostructure DFB laser chip, and has been designed specifically for use in 2.5Gb/s long distance single channel optical fiber systems. The device is packaged in a hermetically sealed 14-pin butterfly package incorporating an isolator and monitor photodiode for control of the power of the laser over life and all operating conditions. Features: • 2.5Gb/s operation • Narrow spectral line-width • Internal TEC with precision NTC thermistor for temperature control • Code reduction with single product for reaches up to 175km • GaInAsP SLMQW DFB single frequency laser chip • InGaAs monitor Photodiode • Hermetically sealed 14-pin butterfly package with optical isolator • RoHS compliant Applications: • TDM • On-off ramps • Long-Haul 1 Data Sheet Parameters Parameter Threshold current (Ith) Slope efficiency by product 2mW 3mW 4mW 10mW [1] Conditions Min Typ 10 Max 22 0.09 0.13 0.17 0.43 -10 Unit mA mW/mA 0.04 0.06 0.08 0.143 RF input reflection coef (S11) Forward voltage Peak wavelength (λp) Dispersion penalty Time averaged spectral linewidth Side-mode suppression Optical rise/fall time Monitor photo current Monitor dark current Thermistor resistance Heatpump current Heatpump voltage Change of λp with laser temp. [1] 50 measurement system, f = dc - 3GHz. dB V nm dB 1.3 [2] [3] 1.8 1560.61 2 1535.82 -20dB 32 [4] 0.1 40 0.6 nm dB 125 50 250 1200 100 10 ps µA nA k 70°C case temperature 70°C case temperature 20 to 35 250 600 1.0 0.09 900 2.4 mA V nm/°C [2] Submount temperature between 20°C & 35°C start of life to achieve required λp. [3] Standard product dispersion penalty will be compliant to the specified link length of 175km or 100km using an extinction ratio of 10dB. Fiber dispersion characteristics are derived from the following equation. So λ D(λ ) = (λ − 03 ) ps /(nm.km) 4 λ Where So = 0.092ps/(nm2km) and λ = 1302nm. [4] Measurements determined from 20 - 80% pk - pk. 4 Absolute Maximum Ratings Parameter Case operating temperature Laser submount operating temperature Storage temperature Laser current above Ith Laser reverse voltage Laser reverse current Monitor diode bias Heatpump voltage Fiber bend radius 30 Min 0 20 -40 Max 70 35 85 100 1.0 10 -10 2.4 Unit °C °C °C mA V µA V V mm 2 Data Sheet Outline Drawing Dimensions (mm) Figure 1: Outline Drawing Reliability/Quality Meets Qualification requirements of Telcordia GR-468-CORE for Central Office environment. Operating reliability 1510nm CLASS IIIb LASER PRODUCT 5 THIS PRODUCT COMPLIES WITH 21 CFR 1040.10 ISO14001:1996 EMS 504193 TL9000 Rev 3.0 (ISO9001:2000) FM15040 Caution - use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. BH13091 Rev 1.0 January 2007. ©Bookham 2006. Bookham is a registered trademark of Bookham Inc.