MF-LSMF185/33X-2

F CO M & PL A E IA C NT, CO * M *H A PL L IA O G NT EN Features AE S oH n Compliant with AEC-Q200 Rev-D Stress Test Qualification for Passive Components in Automotive Applications n Low profile n Compatible with Pb and Pb-free solder reflow profiles n RoHS compliant* and halogen free** n Surface mount packaging for automated assembly n Agency recognition: n Standard 7451 mm (2920 mils) footprint *R C- *R Q2 oH 00 S CO and M PL IA NT n High power ratings MF-LSMF Series - PTC Resettable Fuses Electrical Characteristics Model MF-LSMF185/33X Vmax Volts Amps 33 40 24 MF-LSMF300/24X 24 MF-LSMF400/12X Itrip at 23 °C MF-LSMF260X MF-LSMF300X Imax Ihold 6 12 40 40 40 40 Amps 1.85 2.60 3.00 3.00 4.00 3.7 5.2 5.0 5.2 8.0 Resistance Max. Time to Trip at 23 °C Ohms at 23 °C RMin 0.045 0.020 0.015 0.015 0.005 R1Max Amps 0.150 0.075 0.048 0.075 0.050 Seconds 8.0 8.0 8.0 8.0 8.0 Tripped Power Dissipation at 23 °C Watts 2.5 5.0 15.0 15.0 15.0 Agency Recognition AEC-Q200 Compliant cUL TÜV Typ. E174545 R50256634 1.5 3 3 3 3 3 3 3 3 1.5 1.5 1.5 1.5 3 3 3 3 3 3 Environmental Characteristics Item Condition Criteria Operating Temperature -40 °C to +85 °C Passive Aging +85 °C, 1000 hours ±5 % typical resistance change -40 °C to +85 °C, 20 times ±10 % typical resistance change Recommended Storage Humidity Aging Thermal Shock Solvent Resistance Vibration Moisture Sensitivity Level (MSL) ESD Classification +40 °C max. / 70 % R.H. max. +85 °C, 85 % R.H. 1000 hours MIL-STD-202, Method 215 MIL-STD-883C, Method 2007.1 Condition A See Note ±5 % typical resistance change No change (marking still legible) No change (Rmin < R < R1max) Class 6 (per AEC-Q200-2, HBM) Test Procedures and Requirements Item Visual/Mechanical Resistance Time to Trip Hold Current Trip Cycle Life Trip Endurance Solderability Test Condition Verify dimensions and materials In still air @ 23 °C At specified current, Vmax, 23 °C, still air 30 min. at Ihold, still air Vmax, Imax, 100 cycles Vmax, Imax, 48 hours 245 °C ±5 °C, 5 seconds Accept/Reject Criteria Per MF physical description Rmin ≤ R ≤ Rmax T ≤ max. time to trip (seconds) No trip No arcing or burning No arcing or burning 95 % min. coverage WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov * RoHS Directive 2015/863, Mar 31, 2015 and Annex. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Applications n Industrial controls n IEEE ports n Portable electronics MF-LSMF Series - PTC Resettable Fuses Product Dimensions Model A Min. 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) MF-LSMF185/33X MF-LSMF260X MF-LSMF300X MF-LSMF300/24X MF-LSMF400/12X Max. 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) Min. 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) B Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 0.75 (0.030) 0.75 (0.030) 0.35 (0.014) 0.75 (0.030) 0.65 (0.026) C D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Max. 1.60 (0.063) 1.60 (0.063) 0.85 (0.033) 1.60 (0.063) 1.60 (0.063) Min. 0.25 (.010) 0.25 (.010) 0.25 (.010) 0.25 (.010) 0.25 (.010) E Max. 2.00 (.079) 2.00 (.079) 2.00 (.079) 2.00 (.079) 2.00 (.079) DIMENSIONS: Top View Top View BottomBottom View View A Terminal material: Side View Side View A C C Recommended Pad Layout Recommended Pad Layout Electroless Ni under immersion Au 9 9 B 5.3 ± 0.10 5.3 ± 0.10 (.209 ± .004) (.209 ± .004) B X X D E D MM (INCHES) 2.0 ± 0.05 2.0 ± 0.05 (.079 ± .002) (.079 ± .002) E Typical Time to Trip at 23 ˚C 4.6 ± 0.10 4.6 ± 0.10 (.181 ± .004) (.181 ± .004) How to Order 100 MF - LSMF 185/33X - 2 Multifuse Product Designator Series LSMF = 7451 mm (2920 mils) Surface Mount Component Hold Current, Ihold 185-400 (1.85 Amps - 4.00 Amps) Higher Voltage Option /12 = 12 Volt Rated /24 = 24 Volt Rated /33 = 33 Volt Rated X = Multifuse® freeXpansion™ Design MF-LSMF Series Packaging -2 = Tape and Reel* * Packaged per EIA-481 ® MF-LSMF260X Time to Trip (seconds) 10 MF-LSMF185/33X MF-LSMF400/12X 1 MF-LSMF300/24X MF-LSMF300X 0.1 Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION EXAMPLES: MF-LSMF185/33X = 9 MF-LSMF260X = E MF-LSMF300X = F MF-LSMF300/24X = J MF-LSMF400/12X = K 0.01 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. E X BI-WEEKLY DATE CODE: WEEKS 47-48 = X Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  MF-LSMF Series - PTC Resettable Fuses 3312 - 2 mm SMD Trimming Potentiometer Thermal Derating Chart - Ihold (Amps) Model MF-LSMF185/33X -40 ˚C 2.80 -20 ˚C 2.47 Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 1.85 1.54 1.39 0 ˚C 2.17 60 ˚C 1.22 70 ˚C 1.07 85 ˚C 0.85 MF-LSMF260X 3.75 3.35 3.00 2.60 2.35 2.15 2.05 1.80 1.30 MF-LSMF300X 4.53 4.02 3.51 3.00 2.52 2.26 1.99 1.75 1.34 MF-LSMF300/24X 4.00 3.55 3.20 3.00 2.50 2.25 2.15 1.85 1.50 MF-LSMF400/12X 5.30 4.70 4.25 4.00 3.30 3.00 2.85 2.45 2.00 Packaging Quantity MF-LSMF185/33X ~ MF-LSMF400/12X = 3000 pcs. per reel Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP • Wave soldering is permissible only if the device is on the top of the PCB, opposite the heat source. TL Temperature tL • Hand soldering is not recommended for these devices. TS MAX. RAMP-DOWN TS MIN. • MF-LSMF models are intended for reflow soldering (including but not limited to heating plate, hot air, IR, nitrogen, and vapor phase). • All temperatures refer to the topside of the device, measured on the device body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. ts • Compatible with Pb and Pb-free solder reflow profiles. PREHEAT • Excess solder may cause a short circuit. • Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering Recommendations document for more details. 25 t 25 °C TO PEAK Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) PREHEAT: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Tsmin to Tsmax) (ts) TIME MAINTAINED ABOVE: Materials Temperature Temperature (TL) (tL)/ Ag 3.0 / Cu 0.5 1. Apply solder paste to •Time Sn 96.5 Room temperature test board (8 - 10 mil thick) Alloy water soluble or no Peak Temperature (Tp) clean solder paste Time(see within °C of Actual Peak Temperature (tp) note5 1) • single sided epoxy glass Ramp-Down Rate (G10) (UL approved) • PC25board 4x4x.06 in. Time °C toapprox. Peak Temperature Process Description 2. Place test units onto board 6 units/board MF-LSMF 3. Ramp up SERIES, REV. H, 08/20 Convection oven Specifications 4. Preheat (Tare S) subject to change without notice. (see note 2) Pb-Free Assembly 3 °C / second max. 150 °C 200 °C 60~180 seconds Inspect solder joint to determine if solder joint is Time acceptable (i.e. exhibits wetting of joint’s surface). I217 nterv°C al Use the following criteria (ref. acceptability of printed 60~150 seconds board assemblies, IPC-A-610): 260 °C A) Acceptable (see Figure 1) 20~40 seconds (1) The solder connection wetting angle (solder to 6 °C / second max. component and solder to PCB termination) does not exceed 90 °. 8 minutes max. (2) Solder balls that do not violate minimum electrical clearances and are attached (soldered) to a metal surface. 2.5 °C ± 0.5 °/sec. B) Unacceptable (see Figure 2) 90 ± 30 sec. 150 °C to 190 °C Users should verify actual device performance in their specific applications. (1) Solder connection wetting angle exceeding 5. above liquidus (TLand ) this document are subject to specific legal2disclaimers 20 °C 60the -90last sepage c. of this document, TheTime products described herein as set forth on and at www.bourns.com/docs/legal/disclaimer.pdf. 90 °. 6. Peak temperature (TP) 250 °C +0 °/-5 ° (2) Incomplete reflow of solder paste. 10-20 sec. within  MF-LSMF Series Tape and Reel Specifications MF-LSMF185/33X, MF-LSMF260X, Tape Dimensions per EIA 481 MF-LSMF300X MF-LSMF300/24X, MF-LSMF400/12X 16.0 ± 0.30 16.0 ± 0.30 W (0.630 ± 0.012) (0.630 ± 0.012) 4.0 ± 0.10 4.0 ± 0.10 P0 (0.157 ± 0.004) (0.157 ± 0.004) 40 ± 0.20 40 ± 0.20 10P0 (1.575 ± 0.008) (1.575 ± 0.008) 8.0 ± 0.10 8.0 ± 0.10 P1 (0.315 ± 0.004) (0.315 ± 0.004) 2.0 ± 0.10 2.0 ± 0.10 P2 (0.079 ± 0.004) (0.079 ± 0.004) 5.74 ± 0.10 5.70 ± 0.10 A0 (0.226 ± 0.004) (0.224 ± 0.004) 8.02 ± 0.10 8.10 ± 0.10 B0 (0.316 ± 0.004) (0.319 ± 0.004) 12.1 12.1 B1 max. (0.476) (0.476) 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 D 0 (0.059 + 0.004/-0) (0.059 + 0.004/-0) 7.5 ± 0.10 7.5 ± 0.10 F (0.295 ± 0.004) (0.295 ± 0.004) 1.75 ± 0.10 1.75 ± 0.10 E1 (0.069 ± 0.004) (0.069 ± 0.004) 14.25 14.25 E2 min. (0.561) (0.561) 0.6 0.6 T max. (0.024) (0.024) 0.1 0.1 T max. 1 (0.004) (0.004) 0.91 ± 0.10 1.70 ± 0.10 K0 (0.036 ± 0.004) (0.067 ± 0.004) 390 390 Leader min. (15.35) (15.35) 160 160 Trailer min. (6.30) (6.30) Reel Dimensions A max. N min. W1 W2 max. 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) DIMENSIONS: T D0 P2 P0 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 W1(MEASURED AT HUB) Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Bourns PPTC Resettable Fuses 3312 - ®2 Multifuse mm SMD® Trimming Potentiometer Application Notice • Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s application, including the PPTC device characteristics stated in the applicable data sheet. • Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated within the user’s application during the PTC selection and qualification process. • Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions are expected to be repetitive or prolonged. • In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC devices if the thermal expansion is inhibited. • Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely affect the performance of polymer PTC devices. • Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene, which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect on the device. • Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf MFAN 12/18 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.  Legal Disclaimer Notice This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its affiliates (collectively, “Bourns”). Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change without notice. 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