MF-MSMF150-2

AE C- Test Qualification for Passive Components in Automotive Applications n 100 % electrically compatible with all previous generations of 1812 SMT devices n Compatible with Pb and Pb-free solder reflow profiles n RoHS compliant* and halogen free** OM & PL AE IAN C T, CO * M *H PL AL IA O NT GE N n Surface mount packaging for automated C * Q2 RoH 00 S C an OM d PL IA N n Compliant with AEC-Q200 Rev-C- Stress *R oH S T Features assembly n Agency recognition: n Standard 4532 mm (1812 mils) footprint n Patents pending MF-MSMF Series - PTC Resettable Fuses Electrical Characteristics Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF050/30X MF-MSMF050/40X*** MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/12 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X*** MF-MSMF260 ***TUV approval pending. V max. Volts I max. Amps 60.0 60.0 30.0 60.0 30.0 15.0 30.0 40.0 13.2 24.0 6.0 16.0 24.0 6.0 6.0 12.0 24.0 8.0 8.0 16.0 6.0 40 40 80 40 10 100 40 20 100 40 100 100 20 100 100 100 20 100 40 100 100 Ihold Itrip Amperes at 23 °C Hold Trip 0.10 0.30 0.14 0.34 0.20 0.40 0.20 0.40 0.30 0.60 0.50 1.00 0.50 1.00 0.50 1.00 0.75 1.50 0.75 1.50 1.10 2.20 1.10 2.20 1.10 2.20 1.25 2.50 1.50 3.00 1.50 3.00 1.50 3.00 1.60 2.80 2.00 4.00 2.50 5.00 2.60 5.20 Resistance Ohms at 23 °C RMin. R1Max. 0.70 0.40 0.40 0.40 0.30 0.15 0.15 0.15 0.11 0.11 0.04 0.04 0.06 0.05 0.03 0.03 0.03 0.035 0.020 0.015 0.015 15.00 6.50 6.00 6.00 3.00 1.00 1.30 1.30 0.45 0.45 0.21 0.21 0.18 0.14 0.120 0.120 0.120 0.099 0.080 0.100 0.080 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.5 1.5 6.0 1.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 1.50 0.15 0.06 0.15 0.10 0.15 0.15 0.15 0.20 0.20 0.30 0.30 0.50 0.40 0.5 0.5 1.50 2.0 2.0 5.0 5.0 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 1.0 0.8 0.8 1.2 0.8 Environmental Characteristics Operating Temperature.......................................... -40 °C to +85 °C Passive Aging........................................................ +85 °C, 1000 hours................................................ ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours.............................. ±5 % typical resistance change Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±10 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change Condition A Moisture Sensitivity Level (MSL)........................... Level 1 ESD Classification - HBM...................................... Class 6 Test Procedures And Requirements For Model MF-MSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max Time to Trip............................................................ At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... ANSI/J-STD-002.................................................... 95 % min. coverage UL File Number..................................................... E174545 http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E174545, or click here TÜV Certificate Number........................................ R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213, or click here *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Applications n Overcurrent and overtemperature n Point-of-sale (POS) equipment protection of automotive electronics n Hard disk drives n PC motherboards n PC peripherals n PCMCIA cards n USB port protection - USB 2.0, 3.0 & OTG n HDMI 1.4 Source protection MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see next page for outline drawings) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF050/30X MF-MSMF050/40X MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/12 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 Min. 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) A Max. 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) Min. 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) B Max. 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) Min. 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.55 (0.022) 0.40 (0.016) 0.40 (0.016) 0.55 (0.022) 0.55 (0.022) 0.45 (0.018) 0.45 (0.018) 0.70 (0.028) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.70 (0.028) 0.55 (0.022) 0.55 (0.022) 0.70 (0.028) 0.48 (0.019) C Max. 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) Packaging: MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel. MF-MSMF050 through MF-MSMF260 = 2000 pcs. per reel. MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Style 1 1 1 1 1 1 2 2 1 1 1 1 2 1 1 1 2 1 1 2 1 MM DIMENSIONS: (INCHES)  MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see previous page for dimensions) Style 1 Top and Bottom View A Side View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) Recommended Storage: 40 °C max./70 % RH max. 2.7 ± 0.1 (.106 ± .004) D Top View Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002D Category 2. 3.2 ± 0.1 (0.126 ± .004) B Style 2 Terminal material: Electroless Ni under immersion Au 1.5 ± 0.05 (.059 ± .002) Bottom View Side View A Recommended Pad Layout C 8 C 2.95 ± 0.10 (.114 ± .004) B 1.68 ± 0.05 (.066 ± .002) D 3.1 ± 0.10 (.122 ± .004) Typical Time to Trip at 23 °C MF-MSMF150/12 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-MSMF110/24X MF-MSMF010 MF-MSMF200 10 MF-MSMF030 Time to Trip (Seconds) MF-MSMF050/40X MF-MSMF150/24X 1 MF-MSMF260 MF-MSMF250/16X 0.1 MF-MSMF160 MF-MSMF150 MF-MSMF125 0.01 MF-MSMF110 MF-MSMF075 MF-MSMF014 & MF-MSMF020/60 MF-MSMF020 MF-MSMF075/24 0.001 MF-MSMF050 0.1 1 10 MF-MSMF110/16 MF-MSMF050/30X 100 Fault Current (Amps) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.  MF-MSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF050/30X MF-MSMF050/40X MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/12 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 -40 ˚C 0.16 0.23 0.29 0.29 0.44 0.77 0.77 0.77 1.15 1.15 1.59 1.59 2.00 1.80 2.17 2.17 2.10 2.30 3.08 3.90 4.00 -20 ˚C 0.14 0.19 0.26 0.26 0.39 0.68 0.68 0.68 1.01 1.01 1.43 1.43 1.70 1.63 1.95 1.95 1.90 2.20 2.71 3.42 3.52 0 ˚C 0.12 0.17 0.23 0.23 0.35 0.59 0.59 0.59 0.88 0.88 1.26 1.26 1.40 1.43 1.72 1.72 1.70 1.90 2.35 2.96 3.06 Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 0.10 0.08 0.07 0.14 0.12 0.10 0.20 0.17 0.15 0.20 0.17 0.15 0.30 0.26 0.23 0.50 0.44 0.40 0.50 0.44 0.40 0.50 0.44 0.40 0.75 0.65 0.60 0.75 0.65 0.60 1.10 0.95 0.87 1.10 0.95 0.87 1.10 0.95 0.88 1.25 1.08 0.99 1.50 1.30 1.18 1.50 1.30 1.18 1.50 1.25 1.13 1.60 1.45 1.30 2.00 1.80 1.60 2.50 2.24 1.98 2.60 2.34 2.08 60 ˚C 0.06 0.09 0.14 0.14 0.21 0.37 0.37 0.37 0.55 0.55 0.80 0.80 0.80 0.91 1.09 1.09 1.00 1.15 1.50 1.85 1.95 70 ˚C 0.05 0.08 0.12 0.12 0.18 0.33 0.33 0.33 0.49 0.49 0.71 0.71 0.73 0.81 0.97 0.97 0.88 1.03 1.40 1.29 1.39 85 ˚C 0.03 0.06 0.10 0.10 0.15 0.29 0.25 0.25 0.43 0.43 0.60 0.60 0.61 0.68 0.82 0.82 0.69 0.91 1.25 0.94 1.04 Solder Reflow Recommendations Notes: tp TP CRITICAL ZONE T L TO TP RAMP-UP TL TS MAX. RAMP-DOWN TS MIN. • All temperatures refer to topside of the package, measured on the package body surface. • If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. • Compatible with Pb and Pb-free solder reflow profiles. BI-WEEKLY DATE CODE: • Excess solder may cause a short circuit, especially during hand WEEKS 49-50 = Y ® soldering. Please refer to the Multifuse Polymer PTC Soldering YEAR CODE: Recommendation guidelines. ts PREHEAT 5 = 2005 • Designed for single solder reflow operations. 25 8 MINS. t 25 *C TO PEAK Time How to Order 115Y Temperature tL • MF-MSMF models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. MF - MSMF 075/24 - 2 Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION EXAMPLES: MF-MSMF020 = 02 MF-MSMF050 = 50 MF-MSMF075 & 075/24 = 75 MF-MSMF110 & 110/16 = 11 MF-MSMF150 & 150/12 = 15 MF-MSMF200 = 20 PART IDENTIFICATION EXAMPLES: MF-MSMF020/60 = 2 115Y BI-WEEKLY DATE CODE: Multifuse® Product MF-MSMF050/30X & /40X = 4 WEEKS 49-50 = Y Designator MF-MSMF110/24X = 6 MF-MSMF150/24X = 8 YEAR CODE: Series MF-MSMF250/16X = C 5 = 2005 MSMF = 4532 mm (1812 mils) 8 Inspect solder joint to determine if solder joint is Surface Mount Component Process Time BI-WEEKLY DATE CODE: PART IDENTIFICATION EXAMPLES: Materials Temperature acceptable (i.e. exhibits wetting C of joint’s surface). MF-MSMF020 = 02 WEEKS 5-6 = C Description Interval Hold Current, Ihold MF-MSMF050 = 50 Use the following criteria (ref. acceptability of printed Apply 010-260 Amps - 2.60 MF-MSMF075 & 075/24 = 75 1. solder (0.10 paste to • SnAmps) 96.5 / Ag 3.0 / Cu 0.5 Room temperature board assemblies, IPC-A-610): MF-MSMF110 & 110/16 = 11 Higher Voltage Option test board (8 - 10 mil thick) Alloy water soluble or no MF-MSMF150 & 150/12 = 15 A) Acceptable (see Figure 1) Blank = Standard clean Voltage solder paste MF-MSMF200 = 20 /12, /16, /24, (see note 1) (1) The solder connection wetting angle (solder to MF-MSMF SERIES, REV. AO, 05/18 /30, /40, /60 = Specific •Voltage Rated single sided epoxy glass component and solder to PCB termination) X = Multifuse® freeXpansion Specifications are subject to change without notice. (G10) (UL approved) does not exceed 90 °. Design™ MF-MSMF Series PART IDENTIFICATION EXAMPLES: The device characteristics and parameters in this data sheet can and do vary in different applications • PC board approx. 4x4x.06 in. MF-MSMF020/60 = 2 (2) Solder balls that do not violate minimum Packaging and actual device performance may vary over time. MF-MSMF050/30X & /40X = 4 2. test unitsper ontoEIA board electrical clearances and are attached Place Packaged 481-16 units/board Users should verify actual device performance in their specific applications. MF-MSMF110/24X = 6 (soldered) to a metal surface. 3. Ramp -2 =up Tape and Reel Convection oven (see note 2) 2.5 °C ± MF-MSMF150/24X = 8 0.5 °/sec. B) Unacceptable (see Figure 2) 4. Preheat (TS) 150 °C to 190 °C 8 90 ± 30 sMF-MSMF250/16X = C ec. (1) Solder connection wetting angle exceeding 5. Time above liquidus (TL) 220 °C c. C 60-90 seBI-WEEKLY DATE CODE: 90 °.  MF-MSMF Series Tape and Reel Specifications MF-MSMF-110/24X MF-MSMF010 - MF-MSMF050 - MF-MSMF150/24X MF-MSMF030 MF-MSMF260 MF-MSMF250/16X Tape Dimensions per EIA-481-1 per EIA 481-1 per EIA 481-1 12.0 ± 0.30 12.0 ± 0.30 12.0 ± 0.30 W (0.472 ± 0.012) (0.472 ± 0.012) (0.472 ± 0.012) 4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10 P0 (0.157 ± 0.004) (0.157 ± 0.004) (0.157 ± 0.004) 8.0 ± 0.10 8.0 ± 0.10 8.0 ± 0.10 P1 (0.315 ± 0.004) (0.315 ± 0.004) (0.315 ± 0.004) 2.0 ± 0.05 2.0 ± 0.05 2.0 ± 0.05 P2 (0.079 ± 0.002) (0.079 ± 0.002) (0.079 ± 0.002) 3.58 ± 0.10 3.66 ± 0.15 3.70 ± 0.10 A0 (0.141 ± 0.004) (0.144 ± 0.006) (0.146 ± 0.004) 4.93 ± 0.10 4.98 ± 0.10 5.10 ± 0.10 B0 (0.194 ± 0.004) (0.196 ± 0.004) (0.200 ± 0.004) 5.9 5.9 5.9 B1 max. (0.232) (0.232) (0.232) 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0 D0 (0.059 + 0.004/-0) (0.059 + 0.004/-0) (0.059 + 0.004/-0) 5.5 ± 0.05 5.5 ± 0.05 5.5 ± 0.05 F (0.217 ± 0.002) (0.217 ± 0.002) (0.217 ± 0.002) 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 E1 (0.069 ± 0.004) (0.069 ± 0.004) (0.069 ± 0.004) 10.25 10.25 10.25 E2 min. (0.404) (0.404) (0.404) 0.6 0.6 0.6 T max. (0.024) (0.024) (0.024) 0.1 0.1 0.1 T1 max. (0.004) (0.004) (0.004) 1.30 ± 0.10 0.95 ± 0.10 1.50 ± 0.10 K0 (0.051 ± 0.004) (0.037 ± 0.004) (0.059 ± 0.004) 390 390 390 Leader min. (15.35) (15.35) (15.35) 160 160 160 Trailer min. (6.30) (6.30) (6.30) Reel Dimensions 185 185 185 A max. (7.28) (7.28) (7.28) 50 50 50 N min. (1.97) (1.97) (1.97) 12.4 + 2.0/-0.0 12.4 + 2.0/-0.0 12.4 + 2.0/-0.0 W1 (0.488 + 0.079/-0.0) (0.488 + 0.079/-0.0) (0.488 + 0.079/-0.0) 18.4 18.4 18.4 W2 max. (0.724) (0.724) (0.724) T D0 P2 MM DIMENSIONS: (INCHES) P0 E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB)