SM75057

oH V SC AV ER OM AI SIO PL LA N IA BL S NT E Features ■ Low height of 5.65 mm Applications ■ Telecom SM YYW 7505 W7 *R ■ Operating temperature -40 °C to +85 °C ■ Lead free version available (see How to Order) ■ Lead free versions are RoHS compliant* SM75057E - T1/E1 Transformer Electrical Specifications @ 25 °C OCL (1-3) mH min. @ 10 kHz, 0.1 V ................1.2 OCL (6-8) mH min. @ 10 kHz, 0.1 V ................1.2 OCL (1-3) µH min. @ 10 kHz, 0.1 V, (-40 °C to +85 °C) ..........................600 OCL (6-8) µH min. @ 10 kHz, 0.1 V, (-40 °C to +85 °C) ..........................600 LL (1-3) µH max. @ 100 kHz, 0.1 V short (16-14) ....................................0.6 LL (6-8) µH max. @ 100 kHz, 0.1 V short (11-9) ......................................0.6 Cww (16-1) pF max. @ 100 kHz, 0.1 V ................30 Cww (11-6) pF max. @ 100 kHz, 0.1 V 30 Turns Ratio (1-3) : (16-14) ......................1 : 2 ±2 % (6-8) : (11-9) ........................1 : 2 ±2 % DCR (1-3) ..........................0.5 to 0.8 ohm DCR (6-8) ..........................0.5 to 0.8 ohm DCR (16-14) ......................0.9 to 1.6 ohm DCR (11-9) ........................0.9 to 1.6 ohm Polarity (1, 16, 6, 11) ............Same phase HIPOT Between Windings................2000 VAC Packaging Specifications Tape & Reel..........................700 pcs./reel Product Dimensions 12.70 MAX. (.500) 16 9.40 MAX. (.370) 9 Electrical Schematic 1 16 SM75057 (DATE) 1 8 7.00 MAX. (.276) 3 6 14 11 1.27 (.050) 8.89 (.350) 8 9 5.65 MAX. (.222) 0.51 (.020) 16 PLCS. Soldering Profile 240 °C 4 °C/S 150 °C COOLING IN STILL AIR 0.25 (.010) 0°-8° 45 S MAX. 90 S MAX. 30 S MAX. SOLDERING COOLING PREHEATING 8.89 (.350) 1.91 (.075) 8.33 (.328) 1.27 (.050) How to Order SM75057E __ Model Termination Blank = Tin-lead L = Tin only (lead free) 16X 0.74 ± 0.03 (.029 ± .001) Recommended PAD layout DIMENSIONS ARE: MM (INCHES) TOLERANCE: ± 0.254 (.010) 02/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.