TISP7015DR-S

oH VE S CO AV R M AI SIO PL LA N IA BL S NT E TISP7015 *R TRIPLE ELEMENT THYRISTOR OVERVOLTAGE PROTECTORS TISP7015 (VLV) Overvoltage Protector Three Terminal Very Low Voltage (VLV) Protection D Package (Top View) Ion-Implanted Breakdown Region - Precise and Stable Voltage DEVICE ‘7015 T1 1 8 NC VDRM V(BO) NC 2 7 NC V V NC 3 6 G 8 15 T2 4 5 NC MD7XAJA NC - No internal connection Protection for Signal, Data and Control Lines - ISDN - T1/E1 - RS232 & RS485 Device Symbol T2 T1 Low Capacitance ...................................................... 40 pF max. Rated for International Surge Wave Shapes Voltage Waveshape 8/20 10/700 Standard IEC 61000-4-5 ITU-T K.20/45/21 GR-1089-CORE 10/1000 IPPSM A 150 40 30 SD7XAD ............................................ UL Recognized Components G Description The TISP7015 is a 3-point overvoltage protector designed for protecting against metallic (differential mode) and simultaneous longitudinal (common mode) impulses. These devices are designed to limit overvoltages between signal, data and control port conductors, connected to terminals T1 and T2, and a protective ground, G. Each terminal pair has a symmetrical voltage-triggered bidirectional thyristor characteristic (Figure 1). Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The device switches off when the diverted current falls below the holding current value. Terminals marked NC do not have any internal connections and may be left floating or tied to some circuit point. How To Order Device TISP7015 Package D, Small-outline Carrier For Standard For Lead Free Termination Finish Termination Finish Order As Order As Embossed Tape Reeled TISP7015DR TISP7015DR-S Tube TISP7015D TISP7015D-S *RoHS Directive 2002/95/EC Jan 27 2003 including Annex JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7015 (VLV) Overvoltage Protector Absolute Maximum Ratings, TJ = 25 °C (Unless Otherwise Noted) Rating Repetitive peak off-state voltage Symbol Value Unit VDRM ±8 V Non-repetitive peak on-state pulse current (see Notes 1 and 2) 8/20 (IEC 61000-4-5, clause 7.2, R = 0, comb ination wave generator) 5/310 (ITU-T recommendation K.44, 10/700 generator used for K.20/45/21) 150 IPPSM A 40 10/1000 (Telcordia GR-1089-CORE, 10/1000 voltage wave shape) 30 Non-repetitive peak on-state current (see Notes 1, 2 and 3) ITSM 4 A Junction temperature TJ -40 to +150 °C Storage temperature range Tstg -65 to +150 °C 50/60 Hz, 1 s NOTES: 1. Initially, the TISP7015 must be in thermal equilibrium at the specified TA. The surge may be repeated after the TISP7015 returns to its initial conditions. 2. These non-repetitive rated currents are peak values of either polarity. 3. Total return current, IG, value. Electrical Characteristics, TJ = 25 °C (Unless Otherwise Noted) Parameter Test Conditions Min Max Unit VD = ±VDRM ±4 µA dv/dt = ±250 V/ms, RSOURCE = 300 Ω dv/dt = ±250 V/ms, RSOURCE = 300 Ω ±15 V ±100 mA ±4 V IDRM Repetitive peak offstate current V(BO) Breakover voltage I(BO) Breakover current VT On-state voltage IH Holding current IT = ±5 A, t W = 100 µs IT = ±5 A, di/dt = +/-30 mA/ms ID Off-state current VD = ±0.85VDRM, TA = 85 °C Off-state capacitance f = 1 MHz, Vd = 30 mV rms, VD = 0 (see Note 4) CKA Typ mA ±30 ±10 µA 32 40 pF Typ Max Unit 160 °C/W NOTE 4: Three-terminal guarded measurement, unmeasured terminal voltage bias is zero. Thermal Characteristics Parameter RθJA Junction to free air thermal resistance Test Conditions Ptot = 0.8 Ω, TA = 25 °C, 5 cm 2, FR4 PCB Min JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7015 (VLV) Overvoltage Protector Parameter Measurement Information +i Quadrant I ITSP Switching Characteristic ITSM V(BO) I(BO) IH IDRM VD V DRM -v ID ID VD V DRM +v IDRM IH I(BO) V(BO) ITSM I Quadrant III ITSP Switching Characteristic -i Figure 1. Voltage-Current Characteristic for any Terminal Pair JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. PM4AC TISP7015 (VLV) Overvoltage Protector MECHANICAL DATA Device Symbolization Code Devices will be coded as below. Device Symbolization Code TISP7015 7015 JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP7015 (VLV) Overvoltage Protector MECHANICAL DATA D008 Plastic Small-outline Package This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. D008 8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95 4.80 - 5.00 (0.189 - 0.197) 5.80 - 6.20 (0.228 - 0.244) 8 7 6 5 1 2 3 4 INDEX 3.81 - 4.00 (0.150 - 0.157) 1.35 - 1.75 (0.053 - 0.069) 0.25 - 0.50 x 45 ° N0M (0.010 - 0.020) 7 ° NOM 3 Places 0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031) DIMENSIONS ARE: NOTES: A. B. C. D. 0.36 - 0.51 (0.014 - 0.020) 8 Places Pin Spacing 1.27 (0.050) (see Note A) 6 places 4.60 - 5.21 (0.181 - 0.205) 4°±4° 7 ° NOM 4 Places 0.190 - 0.229 (0.0075 - 0.0090) 0.51 - 1.12 (0.020 - 0.044) MM (INCHES) Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within ±0.051 (0.002). JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MDXXAA E TISP7015 (VLV) Overvoltage Protector MECHANICAL DATA D008 Tape DImensions D008 Package (8-pin Small Outline) Single-Sprocket Tape 3.90 - 4.10 (.154 - .161) 1.50 - 1.60 (.059 - .063) 0.40 (.016) 1.95 - 2.05 (.077 - .081) 7.90 - 8.10 (.311 - .319) 0.8 MIN. (.03) 5.40 - 5.60 (.213 - .220) 6.30 - 6.50 (.248 - .256) ø Carrier Tape Embossment DIMENSIONS ARE: 1.50 MIN. (.059) 11.70 - 12.30 (.461 - .484) Cover 0 MIN. Tape Direction of Feed 2.0 - 2.2 (.079 - .087) MM (INCHES) NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: MDXXATC 330 +0.0/-4.0 (12.99 +0.0/-.157) Reel hub diameter: 100 ± 2.0 (3.937 ± .079) Reel axial hole: 13.0 ± 0.2 (.512 ± .008) B. 2500 devices are on a reel. “TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. “Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries. JULY 2000 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.