BL-HZD39T-TRB

BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Features: 1. Emitted Color : White 2. Mono-color type. 3. Suitable for all SMT assembly methods. 4. Compatible with infrared and vapor phase reflow solder process. 5. Compatible with automatic placement equipment. 6. This product doesn’t contain restriction Substance, comply ROHS standard. ●Package Dimensions: ● Applications: 1. 2. 3. Flash light . Backlighting : LCDs. Status indicators : Consumer & industrial electronics. NOTES: 1.All dimensions are in millimeters. 2.Tolerance is ±0.10mm unless otherwise specified. 3.Specifications are subject to change without notice. 4.LED weight is 0.05g. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Power Dissipation Forward Current Peak Forward Current ＊1 Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature Symbol Pd IF IFP VR Topr Tstg Tsol Rating 100 20 100 5 -25℃~80℃ -30℃~85℃ See Page5 Unit mW mA mA V ℃ ℃ - ＊1 Condition for IFP is pulse of 1/10 duty and 3msec width. Note: The values are based on 1-die performance. Ver.1.0 Page 1 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB Max. 3.8 1 0.32 0.32 ● Electrical and optical characteristics(Ta=25℃) Parameter Forward Voltage＊1 Luminous Intensity＊2 Reverse Current＊1 Viewing Angle＊2 Chromaticity Coordinates Symbol VF Iv IR 2θ1/2 x y Condition IF =20mA IF =20mA VR=5V IF =20mA IF =20mA Min. 2.0 0.26 0.26 Typ. 3.4 3.0 55 0.30 0.30 Unit V cd µA deg - ＊1 The values are based on 1-die performance. ＊2 The values are based on 2-dice performance ● Typical Electro-Optical Characteristics Curves Fig.1 IF-VF Characteristics 1000 4.0 Fig.2 VF-Ta Characteristics 3.8 IF (mA)-1die 100 3.6 VF(v) IF=20mA 20 10 5 3.4 3.2 3.0 1 2.5 3.0 3.5 4.0 4.5 5.0 -20 0 20 40 60 80 100 VF (V) Ta( C ) Fig.3 IV-IF Characteristics 100 200 Fig.4 IV-Ta Characteristics Relative IV-2dice 10 100 1.0 0.5 IV (in%) 0.5 1 5 10 50 50 0.1 20 -20 0 20 40 60 80 100 IF(mA)-1die Ta( C) Fig.5 Max-Ta Characteristics 30 Fig.6 Radiation diagram 0 10 20 30 25 RELATIVE RADIANT INTENSITY IF MAX(mA)-1die 20 15 40 1.0 0.9 0.8 50 60 70 0.7 80 90 0.5 0.3 0.1 0.2 0.4 0.6 10 5 0 -20 0 20 40 Ta( C) 60 80 100 Ver.1.0 Page 2 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 1.7±0.1 START 17.2±1.2 3.6 END 13.0± 0.5 TRAILER LEADER FIXING TAPE (2) (1) 71.0±1 3.6 (4) (3) 1.75 ± 0.1 5.5 ± 0.05 12.0 ± 0.3 4.0 ± 0.1 4.0 ± 0.1 1.5±0.1 2.0±0.05 0.3 NOTE: 1500 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 1500 pcs/reel 185 Bar Code Label 245 200 220 220 Aluminum Foil Bag 645 6 box/carton 210 470 Ver.1.0 Page 3 of 9 179±1 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (cd) Z 2 Max. (cd) - V F B i n L i m i ts ( A t 2 0 m A ) BIN CODE H J K L Min.(v) 3.0 3.2 3.4 3.6 Max.(v) 3.2 3.4 3.6 3.8 ● B IN ： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver1.0 Page 4 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB C o l o r B i n L i m i ts ( A t 2 0 m A ) Chromaticity Coordinates y x C o l o r B i n L i m i ts ( A t 2 0 m A ) BIN x 0.28 F-1 y 0.26 x 0.28 F-2 y 0.28 x 0.30 F-3 y 0.26 x 0.30 F-4 y 0.28 x 0.30 F-5 y 0.30 x 0.32 F-6 y 0.28 x 0.32 F-7 y 0.30 Chromaticity Coordinates 0.26 0.26 0.26 0.28 0.28 0.26 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.26 0.28 0.26 0.30 0.28 0.28 0.28 0.30 0.28 0.32 0.30 0.30 0.30 0.32 0.28 0.28 0.28 0.30 0.30 0.28 0.30 0.30 0.30 0.32 0.32 0.30 0.32 0.32 Ver.1.0 Page 5 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Connect with a power IF=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs High Ta=+85℃±5℃ Test time=1,000hrs Low Ta=-35℃±5℃ Test time=1,000hrs -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 235℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 0/20 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 Note: 1.U means the upper limit of specified characteristics. S means initial value. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver1.0 Page 6 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time Soldering heat Max. 260 ℃ 120~150℃ 245 ± 5℃ within 5 sec. Temperature Preheat 120~180 sec. Time Ver.1.0 Page 7 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 1500 pcs (one taping reel) and a label is attached on each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location Ver1.0 Page 8 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1981 BL-HZD39T-TRB ● Application circuit: When using multiple LEDs,it is required to connect a current limiting resistor on each path the current flows to the LEDs. (ex-1) (ex-2) R R R Ver1.0 Page 9 of 9