BL-PDB-SRS-C10

AMERICAN BRIGHT OPTOELECTRONICS CORP. • Z-BEND DOMILED InGaN BL-PDx-xSx Series Feature: 1. High brightness surface mount LED. 2. Based on InGaN technology. 3. 120° viewing angle. 4. Small package outline (LxWxH) of 2.8 x 3.2 x 1.8 mm. 5. Qualified according to JEDEC moisture sensitivity Level 2. 6. Compatible to both IR reflow soldering and TTW soldering. • 7. RoHS compliance Package Dimension: Recommended Solder Pad V.2 Page: 1 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. • Z-BEND DOMILED InGaN BL-PDx-xSx Series Optical Characteristics: Chip Technology / Color InGaN / Blue, 470 nm Viewing angle 120 Luminous Intensity @ If = 20mA Iv ( mcd ) 45.0 … 112.5 45.0 56.0 71.5 90.0 … … … … 56.0 71.5 90.0 112.5 Part Number BL-PDB-CRS-C10 • • • • BIN P1 BIN P2 BIN Q1 BIN Q2 BL-PDB-SRS-C10 • • • • BIN Q1 BIN Q2 BIN R1 BIN R2 71.5 … 180.0 71.5 … 90.0 … 112.5 … 140.0 … 90.0 112.5 140.0 180.0 BL-PDB-URS-C10 • • BIN R1 BIN R2 BIN S1 112.5 … 224.0 112.5 … 140.0 140.0 … 180.0 180.0 … 224.0 • BL-PDC-CRS-C10 • • • • BIN R1 BIN R2 BIN S1 BIN S2 InGaN / Cyan, 505 nm 120 112.5 … 285.0 112.5 140.0 180.0 224.0 … … … … 140.0 180.0 224.0 285.0 BL-PDC-SRS-C10 • • • BIN S1 BIN S2 BIN T1 BIN T2 180.0 … 450.0 180.0 224.0 285.0 355.0 … … … … 224.0 285.0 355.0 450.0 • BL-PDT-CRS-C10 • • • • BIN R1 BIN R2 BIN S1 BIN S2 InGaN / True Green, 525 nm 120 112.5 … 285.0 112.5 140.0 180.0 224.0 … … … … 140.0 180.0 224.0 285.0 BL-PDT-SRS-C10 • • • • BIN S1 BIN S2 BIN T1 BIN T2 180.0 … 450.0 180.0 224.0 285.0 355.0 … … … … 224.0 285.0 355.0 450.0 BL-PDT-URS-C10 • • • BIN T1 BIN T2 BIN U1 BIN U2 285.0 … 715.0 285.0 355.0 450.0 560.0 … … … … 355.0 450.0 560.0 715.0 • V.2 Page: 2 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. Z-BEND DOMILED InGaN BL-PDx-xSx Series Part Number BL-PDW-CRD-C10 • • • • BIN R1 BIN R2 BIN S1 BIN S2 Chip Technology / Color InGaN / White Viewing angle 120 Luminous Intensity @ If = 20mA Iv ( mcd ) 112.5 … 285.0 112.5 140.0 180.0 224.0 … … … … 140.0 180.0 224.0 285.0 BL-PDW-SRD-C10 • • • • BIN S1 BIN S2 BIN T1 BIN T2 180.0 … 450.0 180.0 224.0 285.0 355.0 … … … … 224.0 285.0 355.0 450.0 BL-PDW-URD-C10 • • • • BIN T1 BIN T2 BIN U1 BIN U2 285.0 … 715.0 285.0 355.0 450.0 560.0 … … … … 355.0 450.0 560.0 715.0 BL-PDW-URD-C20 • • • BIN U1 BIN U2 BIN V1 450.0 … 900.0 450.0 … 560.0 560.0 … 715.0 715.0 … 900.0 NOTE: 1. Other luminous intensity groups are also available upon request. 2. Luminous intensity is measured with an accuracy of ±11%. 3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. 4. An optional Vf binning is also available upon request. Binning scheme is as per following table. V.2 Page: 3 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. • Z-BEND DOMILED InGaN BL-PDx-xSx Series Absolute Maximum Ratings: Maximum Value 20 200 5 125 -40 … +100 -40 … +100 85 Unit mA mA V °C °C °C mW Parameter DC forward current. Peak pulse current; (tp ≤ 10 µs, Duty cycle = 0.005) Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. Power dissipation ( at room temperature ) • Vf Binning: Vf Bin @ 20mA Standard 01 02 03 Forward voltage (V) 3.35 … 4.25 3.35 … 3.65 3.65 … 3.95 3.95 … 4.25 • Forward voltage, Vf is measured with an accuracy of ±0.1 V. Wavelength Grouping: Color BL-PDB; Blue Group Full W X Y Wavelength distribution (nm) 464 - 476 464 - 468 468 - 472 472 - 476 499 - 511 499 - 503 503 - 507 507 - 511 520 - 536 520 - 524 524 - 528 528 - 532 532 - 536 BL-PDC; Cyan Full W X Y BL-PDT; True Green Full W X Y Z Wavelength is measured with an accuracy of ±1 nm. V.2 Page: 4 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. Z-BEND DOMILED InGaN BL-PDx-xSx Series • BL-PDW: White Color Grouping W hite Bin Structure 0.43 0.42 0.41 0.40 0.39 0.38 E3 E1 0.37 0.36 0.35 0.34 0.33 0.32 E4 C3 E2 C1 C4 A3 0.31 0.30 0.29 0.28 0.27 0.26 0.25 0.24 0.27 C2 A1 A4 A2 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 Chromaticity coordinate groups are measured with an accuracy of ±0.01. Bin A1 A2 A3 A4 C1 C2 C3 C4 W 0.2900 0.2939 0.2900 0.2764 0.3025 0.3146 0.3025 0.2971 0.3150 0.3354 0.3150 0.3179 0.3275 0.3561 0.3275 0.3386 Bin E1 Cx Cy E2 Cx Cy E3 Cx Cy E4 Cx Cy X 0.3400 0.3768 0.3400 0.3593 0.3525 0.3975 0.3525 0.3800 Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy Cx Cy 0.2775 0.2732 0.2775 0.2557 0.2900 0.2939 0.2900 0.2764 0.3025 0.3146 0.3025 0.2971 0.3150 0.3354 0.3150 0.3179 0.2900 0.3114 0.2900 0.2939 0.3025 0.3321 0.3025 0.3146 0.3150 0.3529 0.3150 0.3354 0.3275 0.3736 0.3275 0.3561 0.2775 0.2907 0.2775 0.2732 0.2900 0.3114 0.2900 0.2939 0.3025 0.3321 0.3025 0.3146 0.3150 0.3529 0.3150 0.3354 0.3275 0.3561 0.3275 0.3386 0.3400 0.3768 0.3400 0.3593 0.3400 0.3943 0.3400 0.3768 0.3525 0.4150 0.3525 0.3975 0.3275 0.3736 0.3275 0.3561 0.3400 0.3943 0.3400 0.3768 V.2 Page: 5 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. Z-BEND DOMILED InGaN BL-PDx-xSx Series • Typical electro-optical characteristics curves: Fig. 2 Forward current vs. forward voltage. Forward Current (mA) vs. Forward Voltage 40 Fig. 1 Relative luminous intensity vs. forward current. Intensity vs. DC Forward Current Relative intensity. Normalized at 20 mA. 2.2 2 35 Forward Current (mA) 30 25 20 15 10 5 0 0 10 20 30 40 50 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 FORWARD CURRENT (mA) 1 1.5 2 2.5 3 3.5 4 4.5 5 Forward Voltage (V) Fig. 3 Radiation pattern. 30° 20° 10° 0° 1.0 Fig. 4 Maximum forward current vs. temperature. 25 40° 0.8 Forward Current, If 20 15 50° 0.6 10 60° 70° 80° 90° 0.4 5 0.2 0 10 20 30 40 50 60 70 80 90 100 0 Ambient Temperature Fig. 5 Relative Intensity vs. Wavelength Relative Spectral Emission 1.0 0.9 White 0.8 Fig. 6 Dominant Wavelength vs. Forward Current Dominant Wavelength vs. Forward Current 476 475 540 538 536 Dom. WL (nm) 474 473 472 471 470 469 468 Blue True Green 0.7 534 532 530 528 526 524 522 520 Relative Intensity Blue 0.6 0.5 True Green 0.4 0.3 0.2 0.1 0.0 400 450 500 550 600 650 700 750 800 0 5 10 15 20 25 30 Wavelength (nm) IF (mA) V.2 Page: 6 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. Z-BEND DOMILED InGaN BL-PDx-xSx Series Fig. 7 Recommended IR-reflow Soldering Profile. Classification Reflow Profile (JEDEC J-STD-020B) 275 250 235-240oC 10-30s Ramp-up 3 C/sec max. o 225 200 183 oC Temperature (oC) 175 60-150s 150 125 Ramp-down 6 C/sec max. Preheat 60-120s o 100 75 50 360s max 25 0 50 100 150 200 Time (sec) Fig. 8 Recommended TTW Soldering Profile. V.2 Page: 7 of 8 AMERICAN BRIGHT OPTOELECTRONICS CORP. Z-BEND DOMILED InGaN BL-PDx-xSx Series • Taping And Orientation. Reels come in quantity of 8000 units or 2000 units. Reel diameters are 330 mm and 180 mm respectively. V.2 Page: 8 of 8