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74ALVCH162835GRG4

74ALVCH162835GRG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP56_14X6.1MM

  • 描述:

    IC UNIV BUS DVR 18BIT 56TSSOP

  • 数据手册
  • 价格&库存
74ALVCH162835GRG4 数据手册
SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com FEATURES • • • • • • • Member of the Texas Instruments Widebus™ Family EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process Output Port Has Equivalent 26-Ω Series Resistors, So No External Resistors Are Required ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR, and the DGVR package is abbreviated to VR. DESCRIPTION This 18-bit universal bus driver is designed for 1.65-V to 3.6-V VCC operation. Data flow from A to Y is controlled by the output-enable (OE) input. The device operates in the transparent mode when the latch-enable (LE) input is high. When LE is low, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE is high, the outputs are in the high-impedance state. SCES121F – JULY 1997 – REVISED OCTOBER 2004 DGG, DGV, OR DL PACKAGE (TOP VIEW) NC NC Y1 GND Y2 Y3 VCC Y4 Y5 Y6 GND Y7 Y8 Y9 Y10 Y11 Y12 GND Y13 Y14 Y15 VCC Y16 Y17 GND Y18 OE LE 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 GND NC A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 CLK GND NC − No internal connection The output port includes equivalent 26-Ω series resistors to reduce overshoot and undershoot. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH162835 is characterized for operation from -40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997–2004, Texas Instruments Incorporated SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 FUNCTION TABLE INPUTS (1) OE LE CLK A OUTPUT Y H X X X Z L H X L L L H X H H L L ↑ L L L L ↑ H H L L L or H X Y0 (1) Output level before the indicated steady-state input conditions were established xxx xxx LOGIC SYMBOL(1) OE CLK LE 27 EN1 30 2C3 28 C3 G2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 3 5 1 1 3D 54 52 6 51 8 49 9 48 10 47 12 45 13 44 14 43 15 42 16 41 17 40 19 38 20 37 21 36 23 34 24 33 26 31 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 (1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 LOGIC DIAGRAM (POSITIVE LOGIC) OE CLK LE A1 27 30 28 54 1D 3 C1 Y1 CLK To 17 Other Channels ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 V IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through each VCC or GND θJA Tstg (1) (2) (3) (4) Package thermal impedance (4) Storage temperature range DGG package 81 DGV package 86 DL package 74 -65 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51. 3 SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 4 V 0 VCC V 0 VCC V VCC = 1.65 V -2 VCC = 2.3 V -6 VCC = 2.7 V -8 mA -12 VCC = 1.65 V 2 VCC = 2.3 V 6 VCC = 2.7 V 8 VCC = 3 V (1) V 0.35 × VCC VCC = 3 V IOL V 0.65 × VCC VCC = 1.65 V to 1.95 V VIL UNIT mA 12 -40 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA VOH 1.65 V to 3.6 V II(hold) MAX 1.2 IOH = -4 mA 2.3 V 1.9 2.3 V 1.7 3V 2.4 IOH = -8 mA 2.7 V 2 IOH = -12 mA 3V 2 IOL = 100 µA V 1.65 V to 3.6 V 0.2 IOL = 2 mA 1.65 V 0.45 IOL = 4 mA 2.3 V 0.4 2.3 V 0.55 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 ±5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 2 V UNIT VCC - 0.2 1.65 V IOL = 6 mA II MIN TYP (1) IOH = -2 mA IOH = -6 mA VOL VCC V µA µA VI = 0 to 3.6 V (2) 3.6 V ±500 IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA One input at VCC - 0.6 V, Other inputs at VCC or GND 750 µA ∆ICC Ci Co (1) (2) Control inputs Data inputs Outputs 3 V to 3.6 V VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3.5 6 7 pF pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. 5 SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) VCC = 1.8 V MIN MAX fclock tw tsu th (1) Setup time VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX 150 MIN 150 (1) 3.3 3.3 3.3 CLK high or low (1) 3.3 3.3 3.3 Data before CLK↑ (1) 2.2 2.1 1.7 CLK high (1) 1.9 1.6 1.5 CLK low (1) 1.3 1.1 1 (1) 0.6 0.6 0.7 (1) 1.4 1.7 1.4 Data after CLK↑ Data after LE↓ CLK high or low UNIT MAX 150 LE high Data before LE↓ Hold time MIN MAX (1) Clock frequency Pulse duration VCC = 2.5 V ± 0.2 V MHz ns ns ns This information was not available at the time of publication. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) FROM (INPUT) PARAMETER VCC = 1.8 V TO (OUTPUT) MIN (1) fmax tpd LE tdis OE MIN 150 150 MAX MIN UNIT MAX 150 MHz 5 5 1 4.2 (1) 1.3 5.9 5.8 1.3 5.1 (1) 1.4 6.3 6.1 1.4 5.4 Y (1) 1.4 6.3 6.5 1.1 5.5 ns Y (1) 1 4.7 4.9 1.3 4.5 ns Y OE MIN MAX 1 CLK ten VCC = 3.3 V ± 0.3 V VCC = 2.7 V (1) A (1) TYP VCC = 2.5 V ± 0.2 V ns This information was not available at the time of publication. SWITCHING CHARACTERISTICS from 0°C to 65°C, CL = 50 pF PARAMETER tpd FROM (INPUT) TO (OUTPUT) CLK Y VCC = 3.3 V ± 0.15 V UNIT MIN MAX 1.9 5 ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance (1) 6 TEST CONDITIONS Outputs enabled Outputs disabled CL = 0, This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 36 41 (1) 12.5 14 UNIT pF SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 PARAMETER MEASURE INFORMATION VCC = 1.8 V 2 × VCC S1 1 kΩ From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 1 kΩ S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 7 SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 PARAMETER MEASURE INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 Ω S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 8 SN74ALVCH162835 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES121F – JULY 1997 – REVISED OCTOBER 2004 PARAMETER MEASURE INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test GND CL = 50 pF (see Note A) TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 Ω tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input 1.5 V Input 1.5 V 1.5 V 0V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Output Control (low-level enabling) 1.5 V 1.5 V 0V tPLZ tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 3V 1.5 V VOL + 0.3 V VOL tPHZ tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) Output Waveform 2 S1 at GND (see Note B) 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 9 PACKAGE OPTION ADDENDUM www.ti.com 1-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 20 74ALVCH162835DLG4 ACTIVE SSOP DL 56 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (Requires Login) 74ALVCH162835GRE4 ACTIVE TSSOP DGG 56 TBD Call TI Call TI ACTIVE TSSOP DGG 56 TBD Call TI Call TI SN74ALVCH162835DGGR OBSOLETE TSSOP DGG 56 TBD Call TI Call TI SN74ALVCH162835DGVR OBSOLETE TVSOP DGV 56 TBD Call TI Call TI SN74ALVCH162835DL ACTIVE SSOP DL 56 SN74ALVCH162835GR ACTIVE TSSOP DGG 56 Green (RoHS & no Sb/Br) TBD Samples CU NIPDAU Level-1-260C-UNLIM 74ALVCH162835GRG4 20 (3) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 1-Aug-2011 Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. 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