74CBTLV16212GRG4

        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 D Member of the Texas Instruments D D D D D D DGG, DGV, OR DL PACKAGE (TOP VIEW) Widebus Family 4-Ω Switch Connection Between Two Ports Rail-to-Rail Switching on Data I/O Ports Ioff Supports Partial-Power-Down Mode Operation Break-Before-Make Feature Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) S0 1A1 1A2 2A1 2A2 3A1 3A2 GND 4A1 4A2 5A1 5A2 6A1 6A2 7A1 7A2 VCC 8A1 GND 8A2 9A1 9A2 10A1 10A2 11A1 11A2 12A1 12A2 description/ordering information The SN74CBTLV16212 provides 24 bits of high-speed bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The device operates as a 24-bit bus switch or a 12-bit bus exchanger, which provides data exchanging between the four signal ports via the data-select (S0, S1, S2) terminals. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 S1 S2 1B1 1B2 2B1 2B2 3B1 GND 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 GND 8B2 9B1 9B2 10B1 10B2 11B1 11B2 12B1 12B2 The SN74CBTLV16212 is specified by the break-before-make feature to have no through current when switching between B ports. ORDERING INFORMATION TOP-SIDE MARKING Tube SN74CBTLV16212DL Tape and reel SN74CBTLV16212DLR TSSOP − DGG Tape and reel SN74CBTLV16212GR TVSOP − DGV Tape and reel SN74CBTLV16212VR SSOP − DL −40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA CBTLV16212 CBTLV16212 CN212 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright  2003, Texas Instruments Incorporated     !"# $ %&'# "$  (&)*%"# +"#', +&%#$ %! # $('%%"#$ (' #-' #'!$  '."$ $#&!'#$ $#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1  "** (""!'#'$, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 
        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 FUNCTION TABLE INPUTS 2 INPUTS/OUTPUTS S2 S1 S0 L L L L L H L FUNCTION A1 A2 L Z Z Disconnect H B1 Z A1 port = B1 port B2 Z A1 port = B2 port L H H Z B1 A2 port = B1 port H L L Z B2 A2 port = B2 port H L H Z Z Disconnect H H L B1 B2 A1 port = B1 port A2 port = B2 port H H H B2 B1 A1 port = B2 port A2 port = B1 port POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 logic diagram (positive logic) 2 1A1 54 1B1 SW SW SW 3 53 SW 1A2 12A1 27 1B2 30 SW 12B1 SW SW 28 29 SW 12A2 12B2 1 S0 56 S1 55 S2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 
        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 simplified schematic, each FET switch A B (OE) absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VIL Low-level control input voltage VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V MIN MAX 2.3 3.6 UNIT V 1.7 V 2 0.7 0.8 V TA Operating free-air temperature −40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 
        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT −1.2 V VIK II VCC = 3 V, VCC = 3.6 V, II = −18 mA VI = VCC or GND Ioff ICC VCC = 0, VCC = 3.6 V, VI or VO = 0 to 3.6 V IO = 0, VCC = 3.6 V, VI = 3 V or 0 One input at 3 V, VO = 3 V or 0, S1, S2, and S3 = GND VI = 0 II = 64 mA II = 24 mA 5 VCC = 2.3 V, TYP at VCC = 2.5 V 5 8 VI = 1.7 V, II = 15 mA 27 40 5 7 VI = 0 II = 64 mA II = 24 mA 5 7 ∆ICC‡ Control inputs Ci Control inputs Cio(OFF) ron§ VCC = 3 V VI = VCC or GND Other inputs at VCC or GND ±1 µA 10 µA 10 µA 300 µA 5 pF 8 pF 8 Ω VI = 2.4 V, II = 15 mA 10 15 † All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND. § Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) tpd¶ A or B B or A tpd S B or A 3 11.1 ten S A or B 3 10.9 PARAMETER MIN MAX VCC = 3.3 V ± 0.3 V MIN 0.15 UNIT MAX 0.25 ns 3 8.8 ns 3 8.6 ns tdis S A or B 1 8.7 2 8.8 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 
        

 SCDS044I − DECEMBER 1997 − REVISED OCTOBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC RL From Output Under Test S1 Open GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND RL LOAD CIRCUIT VCC CL RL V∆ 2.5 V ±0.2 V 3.3 V ±0.3 V 30 pF 50 pF 500 Ω 500 Ω 0.15 V 0.3 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input VCC/2 th VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input VCC/2 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 Output Waveform 2 S1 at GND (see Note B) VCC/2 0V t Output PZL Waveform 1 S1 at 2 × VCC (see Note B) tPLH tPHL VCC Output Control tPLZ VCC VCC/2 VOL + V∆ VOL tPHZ tPZH VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) SN74CBTLV16212DL ACTIVE SSOP DL 56 20 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBTLV16212 Samples SN74CBTLV16212DLR ACTIVE SSOP DL 56 1000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBTLV16212 Samples SN74CBTLV16212GR ACTIVE TSSOP DGG 56 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CBTLV16212 Samples SN74CBTLV16212VR ACTIVE TVSOP DGV 56 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CN212 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of