ADS54J40
ADS54J40
SBAS714C – MAY 2015 – REVISED DECEMBER
2020
SBAS714C – MAY 2015 – REVISED DECEMBER 2020
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ADS54J40 Dual-Channel, 14-Bit, 1.0-GSPS Analog-to-Digital Converter
1 Features
3 Description
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The ADS54J40 is a low-power, wide-bandwidth, 14bit,
1.0-GSPS,
dual-channel,
analog-to-digital
converter (ADC). Designed for high signal-to-noise
ratio (SNR), the device delivers a noise floor of –158
dBFS/Hz for applications aiming for highest dynamic
range over a wide instantaneous bandwidth. The
device supports the JESD204B serial interface with
data rates up to 10.0 Gbps, supporting two or four
lanes per ADC. The buffered analog input provides
uniform input impedance across a wide frequency
range and minimizes sample-and-hold glitch energy.
Each ADC channel optionally can be connected to a
wideband digital down-converter (DDC) block. The
ADS54J40 provides excellent spurious-free dynamic
range (SFDR) over a large input frequency range with
very low power consumption.
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14-bit resolution, dual-channel, 1-GSPS ADC
Noise floor: –158 dBFS/Hz
Spectral performance (fIN = 170 MHz at –1 dBFS):
– SNR: 69.0 dBFS
– NSD: –155.9 dBFS/Hz
– SFDR: 86 dBc (Including Interleaving Tones)
– SFDR: 89 dBc (Except HD2, HD3, and
interleaving tones)
Spectral performance (fIN = 350 MHz at –1 dBFS):
– SNR: 66.3 dBFS
– NSD: –153.3 dBFS/Hz
– SFDR: 75 dBc
– SFDR: 85 dBc (except HD2, HD3, and
interleaving tones)
Channel isolation: 100 dBc at fIN = 170 MHz
Input full-scale: 1.9 VPP
Input bandwidth (3 dB): 1.2 GHz
On-chip dither
Integrated wideband DDC block
JESD204B interface with subclass 1 support:
– 2 lanes per ADC at 10.0 Gbps
– 4 lanes per ADC at 5.0 Gbps
– Support for multi-chip synchronization
Power dissipation: 1.35 W/ch at 1 GSPS
Package: 72-pin VQFNP (10 mm × 10 mm)
The JESD204B interface reduces the number of
interface lines, allowing high system integration
density. An internal phase-locked loop (PLL) multiplies
the ADC sampling clock to derive the bit clock that is
used to serialize the 14-bit data from each channel.
Device Information
ADS54J40
(1)
VQFNP (72)
BODY SIZE (NOM)
10.00 mm × 10.00 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
spacer
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0
-20
Amplitude (dBFS)
Radar and antenna arrays
Broadband wireless
Cable CMTS, DOCSIS 3.1 receivers
Communications test equipment
Microwave receivers
Software Defined Radio (SDR)
Digitizers
Medical imaging and diagnostics
PACKAGE(1)
PART NUMBER
-40
-60
-80
-100
-120
0
100
200
300
Input Frequency (MHz)
400
500
D003
(SNR = 69 dBFS; SFDR = 86 dBc; fIN = 170 MHz, IL spur = 84
dBc; non HD2, HD3 spur = 89 dBc)
FFT for 170-MHz Input Signal
An©IMPORTANT
NOTICEIncorporated
at the end of this data sheet addresses availability, warranty, changes, use in
safety-critical
applications,
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SBAS714C – MAY 2015 – REVISED DECEMBER 2020
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 ADS54J40 Comparison................................................... 5
6 Pin Configuration and Functions...................................5
7 Specifications.................................................................. 8
7.1 Absolute Maximum Ratings........................................ 8
7.2 ESD Ratings............................................................... 8
7.3 Recommended Operating Conditions.........................9
7.4 Thermal Information....................................................9
7.5 Electrical Characteristics...........................................10
7.6 AC Characteristics.................................................... 11
7.7 Digital Characteristics............................................... 14
7.8 Timing Requirements................................................ 15
7.9 Typical Characteristics.............................................. 17
8 Detailed Description......................................................27
8.1 Overview................................................................... 27
8.2 Functional Block Diagram......................................... 27
8.3 Feature Description...................................................28
8.4 Device Functional Modes..........................................36
8.5 Register Maps...........................................................48
9 Application Information Disclaimer............................. 85
9.1 Application Information............................................. 85
9.2 Typical Application.................................................. 103
10 Power Supply Recommendations............................106
10.1 Power Sequencing and Initialization..................... 106
11 Layout......................................................................... 107
11.1 Layout Guidelines................................................. 107
11.2 Layout Example.................................................... 107
12 Device and Documentation Support........................108
12.1 Documentation Support........................................ 108
12.2 Receiving Notification of Documentation Updates108
12.3 Support Resources............................................... 108
12.4 Trademarks........................................................... 108
12.5 Electrostatic Discharge Caution............................108
12.6 Glossary................................................................108
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (January 2017) to Revision C (December 2020)
Page
• Added text '(Including Interleaving Tones)' to Features bullet............................................................................ 1
• Added ADS54J40 Comparison section, moved Device Comparison Table to this section.................................5
• Changed the description of SYSREFM, SYSREFP, and PDN pins in Pin Functions table ............................... 5
• Changed fIN = 470 MHz test conditions and typical values across parameters in AC Characteristics table.... 11
• Added fIN = 720 MHz test conditions across parameters in AC Characteristics table...................................... 11
• Changed ENOB unit from dBFS to Bits in AC Characteristics table................................................................. 11
• Changed typical values of SFDR_IL parameter ...............................................................................................11
• Changed first IMD3 typical value from –85 dBFS to –89 dBFS ....................................................................... 11
• Changed first footnote in Timing Characteristics table..................................................................................... 15
• Changed typical value of FOVR latency from 18 + 4 ns to 18 ......................................................................... 15
• Changed tPD parameter name to tPDI in Timing Characteristics table.............................................................. 15
• Changed FFT for 470-MHz Input Signal at –3 dBFS figure, title, and conditions............................................. 17
• Added FFT for 720-MHz Input Signal at –6 dBFS figure.................................................................................. 17
• Changed Spurious-Free Dynamic Range vs Input Frequency figure............................................................... 17
• Changed IL Spur vs Input Frequency figure..................................................................................................... 17
• Changed 16-bit to 14-bit in first sentence of Overview section.........................................................................27
• Added DDC Block section ............................................................................................................................... 30
• Changed Table 8-6 .......................................................................................................................................... 36
• Added last sentence to Step 4 in Serial Register Readout: Analog Bank section............................................ 39
• Added last sentence to Step 4 in Serial Register Readout: JESD Bank section.............................................. 40
• Added SDOUT Timing Diagram figure............................................................................................................. 40
• Changed the JESD204B Test Patterns section ............................................................................................... 43
• Changed Serial Interface Registers diagram....................................................................................................48
• Added register addresses 1 and 2 to GENERAL REGISTERS in Register Map section ................................ 48
• Changed the name of JESD ANALOG PAGE (6A00h) to JESD ANALOG PAGE (JESD BANK PAGE
SEL=6A00h) in Register Map table ................................................................................................................. 48
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SBAS714C – MAY 2015 – REVISED DECEMBER 2020
Changed bit 1, register 12 of JESD ANALOG PAGE (6A00h) from 0 to ALWAYS WRITE 1 .......................... 48
Added OFFSET READ Page and OFFSET LOAD Page registers to Register Map table .............................. 48
Added ADS54J40 Access Type Codes table....................................................................................................52
Deleted legends from bit registers in Register Descriptions section.................................................................53
Added register 1h and 2h to Register Descriptions section .............................................................................53
Added text '6100h = OFFSET READ or LOAD Page' to the JESD BANK PAGE SEL[7:0] bit description.......53
Changed description of Registers 3h and 4h (address = 3h and 4h)in General Registers Page. ................... 54
Changed description of bit 0 in Register 4Fh (address = 4Fh), Master Page (080h)....................................... 58
Changed Register 53H .................................................................................................................................... 59
Changed Register 54H .................................................................................................................................... 59
Changed Register 55H .................................................................................................................................... 60
Added Register 40h ......................................................................................................................................... 62
Changed Register 4Eh .................................................................................................................................... 67
Changed Register 52h .....................................................................................................................................67
Added Register 68h ......................................................................................................................................... 68
Changed the Register ABh description.............................................................................................................69
Changed bit 1 from 0 to ALWAYS WRITE 1 in Register 12h (address = 12h), JESD Analog Page (6A00h)... 76
Changed Register 1Ah .................................................................................................................................... 79
Added Offset Read Page Register and Offset Load Page Register sections to Register Descriptions section...
81
Changed Register 075h, 077h, 079h, 7Bh (address = 075h, 077h, 079h, 7Bh ............................................... 82
Changed Register 00h, 04h, 08h, 0Ch ............................................................................................................ 83
Changed Register 01h, 05h, 09h, 0Dh ............................................................................................................ 83
Added Register 78h ......................................................................................................................................... 84
Added DC Offset Correction Block in the ADS54J40 section...........................................................................89
Added Idle Channel Histogram section............................................................................................................ 93
Added the Interleaving (IL) Mismatch Compensation section.......................................................................... 94
Changed the description in Transformer-Coupled Circuits section.................................................................104
Changed the Layout Guidelines .................................................................................................................... 107
Changes from Revision A (October 2015) to Revision B (January 2017)
Page
• Added the Device Comparison Table ................................................................................................................ 5
• Added CDM row to ESD Ratings table............................................................................................................... 8
• Changed the minimum value for the input clock frequency in the Recommended Operating Conditions table ..
9
• Changed Sample Timing, Aperture jitter parameter typical specification in Timing Characteristics section.....15
• Added the FOVR latency parameter to the Timing Characteristics table......................................................... 15
• Changed Overview section ..............................................................................................................................27
• Changed Functional Block Diagram section: changed Control and SPI block and added dashed outline to
FOVR traces..................................................................................................................................................... 27
• Changed SYSREF Signal section: changed Table 8-4 and added last paragraph...........................................34
• Added SYSREF Not Present (Subclass 0, 2) section.......................................................................................34
• Changed the number of clock cycles in the Fast OVR section.........................................................................35
• Deleted Lane Enable with Decimation subsection ...........................................................................................45
• Added the Program Summary of DDC Modes and JESD Link Configuration table..........................................45
• Added Figure 8-27 to Register Maps section................................................................................................... 48
• Changed the Register Map ..............................................................................................................................48
• Deleted register 39h, 3Ah, and 56h ................................................................................................................. 48
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Added Table 8-63 .............................................................................................................................................71
Changed Power Supply Recommendations section ......................................................................................106
Added the Power Sequencing and Initialization section................................................................................. 106
Added the Receiving Notification of Documentation Updates section............................................................108
Changes from Revision * (May 2015) to Revision A (October 2015)
Page
• Released to production ......................................................................................................................................1
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5 ADS54J40 Comparison
Table 5-1 lists companion devices to the ADS54J40 .(TBD: Why has it been shifted to this place? )
Table 5-1. Device Comparison Table
PART NUMBER
SPEED GRADE (MSPS)
RESOLUTION (Bits)
CHANNEL
ADS54J20
1000
12
2
ADS54J42
625
14
2
ADS54J40
1000
14
2
ADS54J60
1000
16
2
ADS54J66
500
14
4
ADS54J69
500
16
2
DB2P
DB2M
IOVDD
DB1P
DB1M
DGND
DB0P
DB0M
IOVDD
SYNC
DA0M
DA0P
DGND
DA1M
DA1P
IOVDD
DA2M
DA2P
6 Pin Configuration and Functions
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
DB3M
1
54
DA3M
DB3P
2
53
DA3P
DGND
3
52
DGND
IOVDD
4
51
IOVDD
SDIN
5
50
PDN
SCLK
6
49
RES
SEN
7
48
RESET
DVDD
8
47
DVDD
AVDD
9
46
AVDD
AVDD3V
10
45
AVDD3V
SDOUT
11
44
AVDD
AVDD
12
43
AVDD
INBP
13
42
INAP
INBM
14
41
INAM
AVDD
15
40
AVDD
AVDD3V
16
39
AVDD3V
AVDD
17
38
AVDD
AGND
18
37
AGND
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
NC
NC
NC
VCM
AGND
AVDD3V
AVDD
AGND
CLKINP
CLKINM
AGND
AVDD
AVDD3V
AGND
SYSREFP
SYSREFM
AVDD
AGND
GND Pad
(Back Side)
Figure 6-1. RMP Package, 72-Pin VQFNP, Top View
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Table 6-1. Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
CLOCK, SYSREF
CLKINM
28
I
Negative differential clock input for the ADC.
CLKINP
27
I
Positive differential clock input for the ADC.
SYSREFM
34
I
Negative external SYSREF input. Connect this pin to GND if not used.
SYSREFP
33
I
Positive external SYSREF input. Connect this pin to 1.8 V if not used.
PDN
50
I/O
RESET
48
I
CONTROL, SERIAL
Power down, active low pin. Can be configured via an SPI register setting.
Can be configured to fast overrange output for channel A through the SPI. This pin
has an internal 20kΩ pulldown resistor.
Hardware reset; active high. This pin has an internal 20-kΩ pulldown resistor.
SCLK
6
I
Serial interface clock input
SDIN
5
I
Serial interface data input
SDOUT
11
O
Serial interface data output.
Can be configured to fast overrange output for channel B through the SPI.
SEN
7
I
Serial interface enable
O
JESD204B serial data negative outputs for channel A
O
JESD204B serial data positive outputs for channel A
O
JESD204B serial data negative outputs for channel B
O
JESD204B serial data positive outputs for channel B
DATA INTERFACE
DA0M
62
DA1M
59
DA2M
56
DA3M
54
DA0P
61
DA1P
58
DA2P
55
DA3P
53
DB0M
65
DB1M
68
DB2M
71
DB3M
1
DB0P
66
DB1P
69
DB2P
72
DB3P
2
SYNC
63
I
Synchronization input for the JESD204B port
INAM
41
I
Differential analog negative input for channel A
INAP
42
I
Differential analog positive input for channel A
INBM
14
I
Differential analog negative input for channel B
INBP
13
I
Differential analog positive input for channel B
VCM
22
O
Common-mode voltage, 2.1 V.
Note that analog inputs are internally biased to this pin through 600 Ω (effective), no
external connection from the VCM pin to the INxP or INxM pin is required.
AGND
18, 23, 26, 29, 32, 36, 37
I
Analog ground
AVDD
9, 12, 15, 17, 25, 30, 35, 38,
40, 43, 44, 46
I
Analog 1.9-V power supply
10, 16, 24, 31, 39, 45
I
Analog 3.0-V power supply for the analog buffer
INPUT, COMMON MODE
POWER SUPPLY
AVDD3V
6
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Table 6-1. Pin Functions (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
DGND
3, 52, 60, 67
I
Digital ground
DVDD
8, 47
I
Digital 1.9-V power supply
IOVDD
4, 51, 57, 64, 70
I
Digital 1.15-V power supply for the JESD204B transmitter
19-21
—
49
I
NC, RES
NC
RES
Unused pins, do not connect
Reserved pin. Connect to DGND.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage range
MIN
MAX
AVDD3V
–0.3
3.6
AVDD
–0.3
2.1
DVDD
–0.3
2.1
IOVDD
–0.2
1.4
–0.3
0.3
Voltage between AGND and DGND
Voltage applied to input pins
V
V
INAP, INBP, INAM, INBM
–0.3
3
CLKINP, CLKINM
–0.3
AVDD + 0.3
SYSREFP, SYSREFM
–0.3
AVDD + 0.3
SCLK, SEN, SDIN, RESET, SYNC, PDN
–0.2
2.1
–65
150
Storage temperature, Tstg
(1)
UNIT
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
8
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V HBM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(2) (3)
MIN
AVDD3V
Supply voltage range
2.85
3
3.6
1.8
1.9
2.0
DVDD
1.7
1.9
2.0
IOVDD
1.1
1.15
1.2
1.9
Input common-mode voltage
amplitude(4) (5)
Input clock frequency, device clock frequency
Input clock amplitude differential
(VCLKP – VCLKM)
Sine wave, ac-coupled
LVPECL, ac-coupled
1.5
0.8
1.6
LVDS, ac-coupled
Input device clock duty cycle
Temperature
(1)
(2)
(3)
(4)
(5)
(6)
50%
–40
VPP
55%
85
105(1)
Operating junction, TJ
MHz
0.7
45%
Operating free-air, TA
MHz
1000
0.75
V
V
400
250(6)
UNIT
VPP
2
Maximum analog input frequency for 1.9-VPP input
Clock inputs
MAX
AVDD
Differential input voltage range
Analog inputs
NOM
125
°C
Prolonged use above the nominal junction temperature can increase the device failure-in-time (FIT) rate.
SYSREF must be applied for the device to initialize; see the SYSREF Signal section for details.
After power-up, always use a hardware reset to reset the device for the first time; see Table 9-1 for details.
Operating 0.5 dB below the maximum-supported amplitude is recommended to accommodate gain mismatch in interleaving ADCs.
At high frequencies, the maximum supported input amplitude reduces; see Figure 7-37 for details.
See Table 8-10.
7.4 Thermal Information
ADS54J40
THERMAL METRIC(1)
RMP (VQFNP)
UNIT
72 PINS
RθJA
Junction-to-ambient thermal resistance
22.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
5.1
°C/W
RθJB
Junction-to-board thermal resistance
2.4
°C/W
ψJT
Junction-to-top characterization parameter
0.1
°C/W
ψJB
Junction-to-board characterization parameter
2.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
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7.5 Electrical Characteristics
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1 GSPS,
50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital
gain (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1000
MSPS
GENERAL
ADC sampling rate
250
Resolution
14
Bits
POWER SUPPLIES
AVDD3V
3.0-V analog supply
2.85
3.0
3.6
V
AVDD
1.9-V analog supply
1.8
1.9
2.0
V
DVDD
1.9-V digital supply
1.7
1.9
2.0
V
IOVDD
1.15-V SERDES supply
1.1
1.15
1.2
V
IAVDD3V
3.0-V analog supply current
VIN = full-scale on both channels
334
360
mA
IAVDD
1.9-V analog supply current
VIN = full-scale on both channels
359
510
mA
IDVDD
1.9-V digital supply current
Eight lanes active (LMFS = 8224)
197
260
mA
IIOVDD
1.15-V SERDES supply current
Eight lanes active (LMFS = 8224)
566
920
mA
Pdis
Total power dissipation
Eight lanes active (LMFS = 8224)
2.71
3.1
IDVDD
1.9-V digital supply current
Four lanes active (LMFS = 4244)
211
mA
W
IIOVDD
1.15-V SERDES supply current
Four lanes active (LMFS = 4244)
618
mA
Pdis
Total power dissipation
Four lanes active (LMFS = 4244)
2.80
W
IDVDD
1.9-V digital supply current
Four lanes active (LMFS = 4222),
2X decimation
197
mA
IIOVDD
1.15-V SERDES supply current
Four lanes active (LMFS = 4222),
2X decimation
593
mA
Pdis
Total power dissipation
Four lanes active (LMFS = 4222),
2X decimation
2.74
W
IDVDD
1.9-V digital supply current
Two lanes active (LMFS = 2221),
4X decimation
176
mA
IIOVDD
1.15-V SERDES supply current
Two lanes active (LMFS = 2221),
4X decimation
562
mA
Pdis (1)
Total power dissipation
Two lanes active (LMFS = 2221),
4X decimation
2.66
W
Global power-down power dissipation
139
315
mW
ANALOG INPUTS (INAP, INAM, INBP, INBM)
Differential input full-scale voltage
1.9
VPP
VIC
Common-mode input voltage
2.0
V
RIN
Differential input resistance
At 170-MHz input frequency
0.6
kΩ
CIN
Differential input capacitance
At 170-MHz input frequency
4.7
pF
Analog input bandwidth (3 dB)
50-Ω source driving ADC inputs
terminated with 50 Ω
1.2
GHz
1.15
V
CLOCK INPUT (CLKINP, CLKINM)
Internal clock biasing
(1)
10
CLKINP and CLKINM are
connected to internal biasing
voltage through 400 Ω
See the Power-down Mode section for details.
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7.6 AC Characteristics
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1 GSPS,
50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital
gain (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Signal-to-noise ratio
fIN = 100 MHz, AIN = –1 dBFS
69.5
66.2
68.4
fIN = 270 MHz, AIN = –1 dBFS
67.9
fIN = 300 MHz, AIN = –1 dBFS
67.5
fIN = 370 MHz, AIN = –1 dBFS
66.5
fIN = 470 MHz, AIN = –3 dBFS
66.5
fIN = 720 MHz, AIN = –6 dBFS
64.9
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
63.3
Noise spectral density
SINAD
Signal-to-noise and distortion ratio
156.5
153.2
155.4
fIN = 270 MHz, AIN = –1 dBFS
154.9
fIN = 300 MHz, AIN = –1 dBFS
154.5
fIN = 370 MHz, AIN = –1 dBFS
153.5
fIN = 470 MHz, AIN = –3 dBFS
153.5
fIN = 720 MHz, AIN = –6 dBFS
151.9
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
150.3
fIN = 10 MHz, AIN = –1 dBFS
69.6
fIN = 100 MHz, AIN = –1 dBFS
69.3
65.2
68.3
fIN = 270 MHz, AIN = –1 dBFS
67.6
fIN = 300 MHz, AIN = –1 dBFS
67
fIN = 370 MHz, AIN = –1 dBFS
65.5
fIN = 470 MHz, AIN = –3 dBFS
65.7
fIN = 720 MHz, AIN = –6 dBFS
64.1
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
63.2
fIN = 170 MHz, AIN = –1 dBFS
Spurious free dynamic range
(excluding IL spurs
dBFS/Hz
68.8
fIN = 230 MHz, AIN = –1 dBFS
fIN = 100 MHz, AIN = –1 dBFS
SFDR
155.9
fIN = 230 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
dBFS
156.7
fIN = 100 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
UNIT
68.9
fIN = 230 MHz, AIN = –1 dBFS
fIN = 10 MHz, AIN = -1 dBFS
NSD
MAX
69.7
fIN = 170 MHz, AIN = –1 dBFS
SNR
MIN TYP
fIN = 10 MHz, AIN = –1 dBFS
dBFS
83
76
86
fIN = 230 MHz, AIN = –1 dBFS
85
fIN = 270 MHz, AIN = –1 dBFS
81
fIN = 300 MHz, AIN = –1 dBFS
78
fIN = 370 MHz, AIN = –1 dBFS
73
fIN = 470 MHz, AIN = –3 dBFS
71
fIN = 720 MHz, AIN = –6 dBFS
67
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
71
dBc
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7.6 AC Characteristics (continued)
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1 GSPS,
50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital
gain (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Second-order harmonic distortion
fIN = 10 MHz, AIN = –1 dBFS
85
90
76
85
fIN = 270 MHz, AIN = –1 dBFS
81
fIN = 300 MHz, AIN = –1 dBFS
81
fIN = 370 MHz, AIN = –1 dBFS
76
fIN = 470 MHz, AIN = –3 dBFS
71
fIN = 720 MHz, AIN = –6 dBFS
67
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
71
fIN = 10 MHz, AIN = –1 dBFS
85
fIN = 170 MHz, AIN = –1 dBFS
Third-order harmonic distortio
Spurious-free dynamic range
(excluding HD2, HD3, and IL spur)
fIN = 270 MHz, AIN = –1 dBFS
81
fIN = 300 MHz, AIN = –1 dBFS
78
fIN = 370 MHz, AIN = –1 dBFS
73
fIN = 470 MHz, AIN = –3 dBFS
71
fIN = 720 MHz, AIN = –6 dBFS
74
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
83
fIN = 10 MHz, AIN = –1 dBFS
94
12
Effective number of bits
93
95
fIN = 270 MHz, AIN = –1 dBFS
95
fIN = 300 MHz, AIN = –1 dBFS
91
fIN = 370 MHz, AIN = –1 dBFS
85
fIN = 470 MHz, AIN = –3 dBFS
89
fIN = 720 MHz, AIN = –6 dBFS
89
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
93
fIN = 10 MHz, AIN = –1 dBFS
11.3
fIN = 100 MHz, AIN = –1 dBFS
11.2
10.5
dBFS
11.1
fIN = 230 MHz, AIN = –1 dBFS
11.1
fIN = 270 MHz, AIN = –1 dBFS
10.9
fIN = 300 MHz, AIN = –1 dBFS
10.8
fIN = 370 MHz, AIN = –1 dBFS
10.6
fIN = 470 MHz, AIN = –3 dBFS
10.6
fIN = 720 MHz, AIN = –6 dBFS
10.4
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
10.2
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dBc
97
79
fIN = 230 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
ENOB
86
87
fIN = 100 MHz, AIN = –1 dBFS
Non
HD2, HD3
dBc
83
76
fIN = 230 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
UNIT
92
fIN = 230 MHz, AIN = –1 dBFS
fIN = 100 MHz, AIN = –1 dBFS
HD3
MAX
fIN = 100 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
HD2
MIN TYP
Bits
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7.6 AC Characteristics (continued)
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1 GSPS,
50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital
gain (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Total harmonic distortion
fIN = 10 MHz, AIN = –1 dBFS
82
80
73
82
fIN = 270 MHz, AIN = –1 dBFS
78
fIN = 300 MHz, AIN = –1 dBFS
75
fIN = 370 MHz, AIN = –1 dBFS
70
fIN = 470 MHz, AIN = –3 dBFS
70
fIN = 720 MHz, AIN = –6 dBFS
66
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
70
fIN = 10 MHz, AIN = –1 dBFS
85
fIN = 170 MHz, AIN = –1 dBFS
IMD3
Crosstalk
83
82
fIN = 270 MHz, AIN = –1 dBFS
81
fIN = 300 MHz, AIN = –1 dBFS
81
fIN = 370 MHz, AIN = –1 dBFS
77
fIN = 470 MHz, AIN = –3 dBFS
78
fIN = 720 MHz, AIN = –6 dBFS
78
fIN = 720 MHz, AIN = –6 dBFS,
gain = 5 dB
74
fIN1 = 185 MHz, fIN2 = 190 MHz,
AIN = –7 dBFS
–89
Two-tone, third-order intermodulation fIN1 = 365 MHz, fIN2 = 370 MHz,
AIN = –7 dBFS
distortion
–79
fIN1 = 465 MHz, fIN2 = 470 MHz,
AIN = –7 dBFS
–75
Full-scale, 170-MHz signal on
aggressor; idle channel is victim
100
Isolation between channel A and B
dBc
84
69
fIN = 230 MHz, AIN = –1 dBFS
Interleaving spur
UNIT
83
fIN = 230 MHz, AIN = –1 dBFS
fIN = 100 MHz, AIN = –1 dBFS
SFDR_IL
MAX
fIN = 100 MHz, AIN = –1 dBFS
fIN = 170 MHz, AIN = –1 dBFS
THD
MIN TYP
dBc
dBFS
dB
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7.7 Digital Characteristics
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1 GSPS,
50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input, and 0-dB digital
gain (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
0.8
TYP
MAX
UNITS
DIGITAL INPUTS (RESET, SCLK, SEN, SDIN, SYNC, PDN)(1)
VIH
High-level input voltage
All digital inputs support 1.2-V and 1.8-V logic levels
VIL
Low-level input voltage
All digital inputs support 1.2-V and 1.8-V logic levels
IIH
High-level input current
IIL
Low-level input current
V
0.4
SEN
0
RESET, SCLK, SDIN, PDN, SYNC
50
SEN
50
RESET, SCLK, SDIN, PDN, SYNC
V
µA
µA
0
DIGITAL INPUTS (SYSREFP, SYSREFM)
VD
Differential input voltage
V(CM_DIG)
Common-mode voltage for SYSREF
0.35
0.45
1.4
1.3
V
V
DIGITAL OUTPUTS (SDOUT, PDN(3))
VOH
High-level output voltage
VOL
Low-level output voltage
DVDD – 0.1
DVDD
V
0.1
V
DIGITAL OUTPUTS (JESD204B Interface: DxP, DxM)(2)
VOD
Output differential voltage
VOC
Output common-mode voltage
Transmitter short-circuit current
zos
(2)
(3)
14
Transmitter pins shorted to any voltage between –
0.25 V and 1.45 V
Single-ended output impedance
Output capacitance
(1)
With default swing setting
Output capacitance inside the device,
from either output to ground
700
mVPP
450
mV
–100
100
mA
50
Ω
2
pF
The RESET, SCLK, SDIN, and PDN pins have a 20-kΩ (typical) internal pulldown resistor to ground, and the SEN pin has a 20-kΩ
(typical) pullup resistor to IOVDD.
100-Ω differential termination.
When functioning as an OVR pin for channel B.
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7.8 Timing Requirements
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 1.0
GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input,
unless otherwise noted.
MIN
TYP
MAX
UNITS
SAMPLE TIMING (TBD are any of these Switching Characteristics?TBD: No)
Aperture delay
0.75
Aperture delay matching between two channels on the same device
1.6
±70
Aperture delay matching between two devices at the same temperature and supply voltage
ns
ps
±270
ps
120
fS rms
150
µs
134
Input clock
cycles
OVR latency: ADC sample to OVR bit
62
Input clock
cycles
FOVR latency: ADC sample to FOVR signal on pin
18
Input clock
cycles
4
ns
Aperture jitter
WAKE-UP TIMING
Wake-up time to valid data after coming out of global power-down
LATENCY (1)
Data latency: ADC sample to digital output
tPDI
Propagation delay: logic gates and output buffers delay (does not change with fS)
SYSREF TIMING
tSU_SYSREF Setup time for SYSREF, referenced to the input clock falling edge
300
tH_SYSREF
100
Hold time for SYSREF, referenced to the input clock falling edge
900
ps
ps
JESD OUTPUT INTERFACE TIMING CHARACTERISTICS
Unit interval
100
400
ps
Serial output data rate
2.5
10
Gbps
Total jitter for BER of 1E-15 and lane rate = 10 Gbps
26
Random jitter for BER of 1E-15 and lane rate = 10 Gbps
tR, tF
(1)
0.75
ps
ps rms
Deterministic jitter for BER of 1E-15 and lane rate = 10 Gbps
12
ps, pk-pk
Data rise time, data fall time: rise and fall times are measured from 20% to 80%,
differential output waveform, 2.5 Gbps ≤ bit rate ≤ 10 Gbps
35
ps
Overall latency = latency + tPDI.
Sample N
ts_min
ts_max
CLKIN
1.0 GSPS
SYSREF
Figure 7-1. SYSREF Timing
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N+1
N+2
N
N+3
Sample
tPD
Data Latency: 134 Clock Cycles
CLKINM
CLKINP
DA0P, DA0M,
DB0P, DB0M
D
20
Sample N-1
DA1P, DA1M,
DB1P, DB1M
D
11
D
20
Sample N
D
10
Sample N-1
D
20
Sample N+1
D
1
Sample N
D
11
D
10
Sample N+2
D
1
Sample N+1
D
10
Sample N+2
Figure 7-2. Sample Timing Requirements
16
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7.9 Typical Characteristics
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to T MAX = 85°C, ADC sampling rate
= 1.0 GSPS, 50% clock duty cycle, AVDD3V = 3.0 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS
differential input, unless otherwise noted.
-40
-60
-80
-100
-60
-80
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
100
D001
SNR = 69.7 dBFS; SFDR = 85 dBc; IL spur = 86 dBc; non
HD2, HD3 spur = 89 dBc
200
300
Input Frequency (MHz)
400
500
D002
SNR = 69.2 dBFS; SFDR = 86 dBc; IL spur = 85 dBc; non
HD2, HD3 spur = 94 dBc
Figure 7-3. FFT for 10-MHz Input Signal
Figure 7-4. FFT for 140-MHz Input Signal
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
-40
-40
-60
-80
-100
-40
-60
-80
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
D003
100
200
300
Input Frequency (MHz)
400
500
D004
SNR = 68.9 dBFS; SFDR = 86 dBc; IL spur = 84 dBc; non
HD2, HD3 spur = 89 dBc
SNR = 68.1 dBFS; SFDR = 84 dBc; IL spur = 86 dBc; non
HD2, HD3 spur = 86 dBc
Figure 7-5. FFT for 170-MHz Input Signal
Figure 7-6. FFT for 230-MHz Input Signal
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0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
SBAS714C – MAY 2015 – REVISED DECEMBER 2020
-40
-60
-80
-100
-60
-80
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
100
D005
200
300
Input Frequency (MHz)
400
500
D006
SNR = 66.2 dBFS; SFDR = 72 dBc; IL spur = 84 dBc; non
HD2, HD3 spur = 78 dBc
Figure 7-7. FFT for 300-MHz Input Signal
Figure 7-8. FFT for 370-MHz Input Signal
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
SNR = 67.4 dBFS; SFDR = 77 dBc; IL spur = 83 dBc; non
HD2, HD3 spur = 85 dBc
-40
-60
-80
-40
-60
-80
-100
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
0
500
100
D007
200
300
Input Frequency (MHz)
400
500
D070
SNR = 65.3 dBFS; SFDR = 71 dBc; IL spur = 83 dBc; non
HD2, HD3 spur = 89 dBFS
Figure 7-9. FFT for 470-MHz Input Signal at –3
dBFS
Figure 7-10. FFT for 720-MHz Input Signal at –6
dBFS
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
SNR = 66.5 dBFS; SFDR = 73 dBc; IL spur = 81 dBc; non
HD2, HD3 spur = 88 dBc
-40
-60
-80
-100
-40
-60
-80
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
D008
fIN1 = 185 MHz, fIN2 = 190 MHz, each tone at –7 dBFS, IMD3 =
85 dBFS
Figure 7-11. FFT for Two-Tone Input Signal (–7
dBFS)
18
-40
100
200
300
Input Frequency (MHz)
400
500
D009
fIN1 = 185 MHz, fIN2 = 190 MHz, each tone at –36 dBFS, IMD3
= 103 dBFS
Figure 7-12. FFT for Two-Tone Input Signal (–36
dBFS)
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0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
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-40
-60
-80
-100
-80
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
100
D010
fIN1 = 370 MHz, fIN2 = 365 MHz, each tone at –7 dBFS, IMD3 =
80 dBFS
Figure 7-13. FFT for Two-Tone Input Signal (–7
dBFS)
0
-20
-20
-60
-80
400
500
D011
Figure 7-14. FFT for Two-Tone Input Signal (–36
dBFS)
0
-40
200
300
Input Frequency (MHz)
fIN1 = 370 MHz, fIN2 = 365 MHz, each tone at –36 dBFS, IMD3
= 109 dBFS
Amplitude (dBFS)
Amplitude (dBFS)
-60
-100
-120
-100
-40
-60
-80
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
Figure 7-15. FFT for Two-Tone Input Signal (–7
dBFS)
200
300
Input Frequency (MHz)
400
500
D013
fIN1 = 470 MHz, fIN2 = 465 MHz, each tone at –36 dBFS, IMD3
= 109.2 dBFS
Figure 7-16. FFT for Two-Tone Input Signal (–36
dBFS)
-82
-76
-86
-80
-84
IMD (dBFS)
-90
-94
-98
-102
-88
-92
-96
-100
-106
-110
-35
100
D012
fIN1 = 470 MHz, fIN2 = 465 MHz, each tone at –7 dBFS, IMD3 =
74.9 dBFS
IMD (dBFS)
-40
-104
-31
-27
-23
-19
-15
Each Tone Amplitude (dBFS)
-11
-7
-108
-35
D014
fIN1 = 185 MHz, fIN2 = 190 MHz
-31
-27
-23
-19
-15
Each Tone Amplitude (dBFS)
-11
-7
D015
fIN1 = 365 MHz, fIN2 = 370 MHz
Figure 7-17. Intermodulation Distortion vs Input
Tone Amplitude
Figure 7-18. Intermodulation Distortion vs Input
Tone Amplitude
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90
-70
AIN = -6 dBFS
Ain = -3 dBFS
AIN = -1 dBFS
-74
85
-78
SFDR (dBc)
IMD (dBFS)
-82
-86
-90
-94
80
75
70
-98
65
-102
-106
-35
-31
-27
-23
-19
-15
Each Tone Amplitude (dBFS)
-11
60
-7
0
100
200
300
400
500
Input Frequency (MHz)
D016
fIN1 = 465 MHz, fIN2 = 470 MHz
Figure 7-19. Intermodulation Distortion vs Input
Tone Amplitude
90
60
52
78
48
74
44
AIN = -6 dBFS
AIN = -3 dBFS
AIN = -1 dBFS
70
SNR (dBFS)
82
D017
71
IL Disable, IL Spur (dBc)
IL Enable, IL Spur (dBc)
56
700
Figure 7-20. Spurious-Free Dynamic Range vs
Input Frequency
IL Enable
IL Disable
86
600
69
68
67
66
70
0
40
40
80 120 160 200 240 280 320 360 400 440 480
Input Frequency (MHz)
D500
65
0
Figure 7-21. IL Spur vs Input Frequency
AVDD = 1.95 V
AVDD = 2 V
70
90
69.5
88
69
68.5
700
D042
84
82
67.5
80
10
35
Temperature (°C)
60
85
AVDD = 1.95 V
AVDD = 2 V
86
68
-15
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
92
SFDR (dBc)
SNR (dBFS)
600
94
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
70.5
78
-40
D020
fIN = 170 MHz
-15
10
35
Temperature (°C)
60
85
D021
fIN = 170 MHz
Figure 7-23. Signal-to-Noise Ratio vs AVDD Supply
and Temperature
20
200
300
400
500
Input Frequency (MHz)
Figure 7-22. Signal-to-Noise Ratio vs Input
Frequency
71
67
-40
100
Figure 7-24. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature
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79
72
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
71
AVDD = 1.95 V
AVDD = 2 V
AVDD = 1.8 V
AVDD = 1.85 V
AVDD = 1.9 V
78
AVDD = 1.95 V
AVDD = 2 V
69
SFDR (dBc)
SNR (dBFS)
70
68
67
77
76
75
66
74
65
64
-40
-15
10
35
Temperature (°C)
60
85
73
-40
-15
D022
fIN = 350 MHz
D023
92
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
DVDD = 1.9 V
DVDD = 1.95 V
DVDD = 2 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
90
SFDR (dBc)
70.2
SNR (dBFS)
85
Figure 7-26. Spurious-Free Dynamic Range vs
AVDD Supply and Temperature
71
69.4
68.6
67.8
DVDD = 1.9 V
DVDD = 1.95 V
DVDD = 2 V
88
86
84
-15
10
35
Temperature (°C)
60
82
-40
85
-15
D024
fIN = 170 MHz
10
35
Temperature (°C)
60
85
D025
fIN = 170 MHz
Figure 7-27. Signal-to-Noise Ratio vs DVDD Supply
and Temperature
Figure 7-28. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature
70
82
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
69
DVDD = 1.9 V
DVDD = 1.95 V
DVDD = 2 V
DVDD = 1.75 V
DVDD = 1.8 V
DVDD = 1.85 V
80
68
SFDR (dBc)
SNR (dBFS)
60
fIN = 350 MHz
Figure 7-25. Signal-to-Noise Ratio vs AVDD Supply
and Temperature
67
-40
10
35
Temperature (°C)
67
DVDD = 1.9 V
DVDD = 1.95 V
DVDD = 2 V
78
76
66
74
65
64
-40
-15
10
35
Temperature (°C)
60
85
72
-40
D026
fIN = 350 MHz
-15
10
35
Temperature (°C)
60
85
D027
fIN = 350 MHz
Figure 7-29. Signal-to-Noise Ratio vs DVDD Supply
and Temperature
Figure 7-30. Spurious-Free Dynamic Range vs
DVDD Supply and Temperature
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71
94
AVDD3V = 2.85 V
AVDD3V = 3 V
AVDD3V = 3.1 V
AVDD3V = 3.2 V
AVDD3V = 2.85 V
AVDD3V = 3 V
AVDD3V = 3.1 V
AVDD3V = 3.2 V
92
90
70
SFDR (dBc)
SNR (dBFS)
70.5
AVDD3V = 3.3 V
AVDD3V = 3.4 V
AVDD3V = 3.5 V
AVDD3V = 3.6 V
69.5
69
88
86
84
68.5
82
68
-40
-15
10
35
Temperature (°C)
60
80
-40
85
-15
10
35
Temperature (°C)
D028
fIN = 170 MHz
60
85
D029
fIN = 170 MHz
Figure 7-31. Signal-to-Noise Ratio vs AVDD3V
Supply and Temperature
Figure 7-32. Spurious-Free Dynamic Range vs
AVDD3V Supply and Temperature
71
82
AVDD3V = 2.85 V
AVDD3V = 3 V
AVDD3V = 3.1 V
AVDD3V = 3.2 V
70
AVDD3V = 3.3 V
AVDD3V = 3.4 V
AVDD3V = 3.5 V
AVDD3V = 3.6 V
AVDD3V = 2.85 V
AVDD3V = 3 V
AVDD3V = 3.1 V
AVDD3V = 3.2 V
80
SFDR (dBc)
69
SNR (dBFS)
AVDD3V = 3.3 V
AVDD3V = 3.4 V
AVDD3V = 3.5 V
AVDD3V = 3.6 V
68
67
AVDD3V = 3.3 V
AVDD3V = 3.4 V
AVDD3V = 3.5 V
AVDD3V = 3.6 V
78
76
66
74
65
64
-40
-15
10
35
Temperature (°C)
60
72
-40
85
-15
fIN = 350 MHz
85
D031
Figure 7-34. Spurious-Free Dynamic Range vs
AVDD3V Supply and Temperature
110
79
Gain = 0 dB
Gain = 2 dB
Gain = 4 dB
76
Gain = 6 dB
Gain = 8 dB
Gain = 10 dB
Gain = 12 dB
Gain = 0 dB
Gain = 2 dB
Gain = 4 dB
105
100
73
70
SFDR (dBc)
SNR (dBFS)
60
fIN = 350 MHz
Figure 7-33. Signal-to-Noise Ratio vs AVDD3V
Supply and Temperature
67
64
Gain = 6 dB
Gain = 8 dB
Gain = 10 dB
Gain = 12 dB
95
90
85
80
61
75
58
70
55
65
0
80
160
240
320
Input Frequency (MHz)
400
480
0
D053
Figure 7-35. Signal-to-Noise Ratio vs Gain and
Input Frequency
22
10
35
Temperature (°C)
D030
80
160
240
320
Input Frequency (MHz)
400
480
D054
Figure 7-36. Spurious-Free Dynamic Range vs
Gain and Input Frequency
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Fundamental Amplitude (dBFS)
2
75
0
SNR (dBFS)
-2
-4
73
200
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS) 160
71
120
69
80
67
40
-6
-8
-10
0
100
200
300 400 500 600 700
Input Frequency (MHz)
800
65
-70
900 1000
SFDR (dBc,dBFS)
SBAS714C – MAY 2015 – REVISED DECEMBER 2020
0
-60
-50
D046
Figure 7-37. Maximum Supported Amplitude vs
Frequency
-40
-30
Amplitude (dBFS)
-20
-10
0
D032
fIN = 170 MHz
Figure 7-38. Performance vs Input Amplitude
120
69.5
90
68
60
66.5
30
0
-60
-50
-40
-30
Amplitude (dBFS)
-20
-10
74
100
72
90
70
80
68
70
66
0.2
0
D033
fIN = 350 MHz
75
Figure 7-40. Performance vs Sampling Clock
Amplitude
125
73
100
72
100
69
75
66
50
63
25
0
2.2
SNR (dBFS)
SNR
SFDR
SFDR (dBc)
SNR (dBFS)
SNR
SFDR
0.6
1
1.4
1.8
Differential Clock Amplitude (Vpp)
D034
fIN = 170 MHz
Figure 7-39. Performance vs Input Amplitude
60
0.2
60
2.2
0.6
1
1.4
1.8
Differential Clock Amplitude (Vpp)
72
95
71
90
70
85
69
80
68
30
35
D035
fIN = 350 MHz
40
45
50
55
60
Input Clock Duty Cycle (%)
65
SFDR (dBc)
65
-70
110
SNR
SFDR
SFDR (dBc)
71
76
SNR (dBFS)
72.5
180
SNR (dBFS)
SFDR (dBc)
SFDR (dBFS) 150
SFDR (dBc,dBFS)
SNR (dBFS)
74
75
70
D036
fIN = 170 MHz
Figure 7-41. Performance vs Sampling Clock
Amplitude
Figure 7-42. Performance vs Input Clock Duty
Cycle
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72
71
88
SNR
SFDR 84
70
80
69
76
68
72
67
68
66
64
-10
PSRR with 25-mVpp Signal on AVDD
PSRR with 50-mVpp Signal on AVDD3V
-15
PSRR (dB)
-25
SFDR (dBc)
SNR (dBFS)
-20
-30
-35
-40
-45
-50
65
30
35
40
45
50
55
60
Input Clock Duty Cycle (%)
65
60
70
-55
-60
0
50
D037
100
150
200
250
Frequency of Signal on Supply (MHz)
fIN = 350 MHz
Figure 7-44. Power-Supply Rejection Ratio vs Test
Signal Frequency
0
-20
-20
-25
-30
-40
CMRR (dB)
Amplitude (dBFS)
D038
fIN = 170 MHz
Figure 7-43. Performance vs Input Clock Duty
Cycle
-60
-80
-35
-40
-45
-100
-50
-120
-55
0
100
200
300
Input Frequency (MHz)
400
500
0
D039
50
100
150
200
250
Frequency of Input Common-Mode Signal (MHz)
fIN = 170 MHz , AIN = –1 dBFS, SINAD = 65.7 dBFS, SFDR =
79 dBc, fPSRR = 5 MHz, APSRR = 25 mVPP, amplitude of fIN –
fPSRR = –74 dBFS, amplitude of fIN + fPSRR = –76 dBFS
Figure 7-45. Power-Supply Rejection Ratio FFT for
Test Signals on the AVDD Supply
4
-20
3.5
-60
-80
D040
Figure 7-46. Common-Mode Rejection Ratio vs
Test Signal Frequency
0
-40
300
fIN = 170 MHz
Power Consumption (W)
Amplitude (dBFS)
300
3
2.5
2
1.5
-100
-120
0
100
200
300
Input Frequency (MHz)
400
500
1
500
D041
fIN = 170.1 MHz , AIN = –1 dBFS, fCMRR = 5 MHz, ACMRR = 50
mVPP, SINAD = 67.3 dBFS, SFDR = 85 dBc, amplitude of fIN ±
fCMRR= –80 dBFS
550
600
650 700 750 800 850
Sampling Speed (MSPS)
900
950 1000
D042
Figure 7-48. Power Consumption vs Sampling
Speed
Figure 7-47. Common-Mode Rejection Ratio FFT
24
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I DVDD (mA)
I AVDD (mA)
I IOVDD (mA)
700
I AVDD3 (mA)
Total Power (W)
2.78
0
2.76
-20
2.74
500
2.72
400
2.7
300
2.68
200
2.66
-100
2.64
85
-120
100
-40
-15
10
35
Temperature (°C)
60
Amplitude (dBFS)
600
Total Power (W)
IAVDD,IDVDD,IAVDD3,IIOVDD (mA)
800
-40
-60
-80
0
25
D045
Figure 7-49. Power vs Temperature
50
75
Input Frequency (MHz)
100
125
D047
SNR = 73.1 dBFS, SFDR = 88.6 dBc
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
Figure 7-50. FFT for 60-MHz Input Signal in
Decimate-by-4 Mode
-40
-60
-80
-40
-60
-80
-100
-100
-120
-120
0
25
50
75
Input Frequency (MHz)
100
0
125
50
75
Input Frequency (MHz)
100
125
D049
SNR = 71.1 dBFS, SFDR = 86 dBc
SNR = 72.5 dBFS, SFDR = 87 dBc
Figure 7-51. FFT for 170-MHz Input Signal in
Decimate-by-4 Mode
Figure 7-52. FFT for 300-MHz Input Signal in
Decimate-by-4 Mode
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
25
D048
-40
-60
-80
-100
-40
-60
-80
-100
-120
-120
0
25
50
75
Input Frequency (MHz)
100
125
0
50
D050
SNR = 68.7 dBFS, SFDR = 83 dBc
100
150
Input Frequency (MHz)
200
250
D051
SNR = 70.5 dBFS, SFDR = 86 dBc
Figure 7-53. FFT for 450-MHz Input Signal in
Decimate-by-4 Mode
Figure 7-54. FFT for 170-MHz Input Signal in
Decimate-by-2 Mode
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0
Amplitude (dBFS)
-20
-40
-60
-80
-100
-120
0
50
100
150
Input Frequency (MHz)
200
250
D052
SNR = 67.6 dBFS, SFDR = 80 dBc
Figure 7-55. FFT for 350-MHz Input Signal in Decimate-by-2 Mode
26
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8 Detailed Description
8.1 Overview
The ADS54J40 is a low-power, wide-bandwidth, 14-bit, 1.0-GSPS, dual-channel, analog-to-digital converter
(ADC). The ADS54J40 employs four interleaving ADCs for each channel to achieve a noise floor of –
159 dBFS/Hz. The ADS54J40 uses TI's proprietary interleaving and dither algorithms to achieve a clean
spectrum with a high spurious-free dynamic range (SFDR). The device also offers various programmable
decimation filtering options for systems requiring higher signal-to-noise ratio (SNR) and SFDR over a wide range
of frequencies.
Analog input buffers isolate the ADC driver from glitch energy generated from sampling process, thereby simplify
the driving network on-board. The JESD204B interface reduces the number of interface lines with two-lane and
four-lane options, allowing a high system integration density. The JESD204B interface operates in subclass 1,
enabling multi-chip synchronization with the SYSREF input.
8.2 Functional Block Diagram
ADC
ADC
ADC
INAP, INAM
ADC
Interleaving
Correction
DA2P, DA2M,
DA3P, DA3M
PLL:
x20
x40
Divide-by4
CLKINP,
CLKINM
SYSREFP,
SYSREFM
Buffer
ADC
ADC
ADC
ADC
INBP, INBM
DA0P, DA0M,
DA1P, DA1M
DDC Block:
2x, 4x Decimation
Mixer: fS / 16, fS / 4
Digital Block
DDC Block:
2X, 4X Decimation
Mixer: fS / 16, fS / 4
Digital Block
Interleaving
Correction
JESD204B
Interface
Buffer
SYNC
DB0P, DB0M,
DB1P, DB1M
DB2P, DB2M,
DB3P, DB3M
FOVR
SCLK
SEN
SDIN
RESET
PDN
Control and SPI
Common
Mode
SDOUT
VCM
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8.3 Feature Description
8.3.1 Analog Inputs
The ADS54J40 analog signal inputs are designed to be driven differentially. The analog input pins have internal
analog buffers that drive the sampling circuit. As a result of the analog buffer, the input pins present a high
impedance input across a very wide frequency range to the external driving source that enables great flexibility
in the external analog filter design as well as excellent 50-Ω matching for RF applications. The buffer also helps
isolate the external driving circuit from the internal switching currents of the sampling circuit, resulting in a more
constant SFDR performance across input frequencies.
The common-mode voltage of the signal inputs is internally biased to VCM using 600-Ω resistors, allowing for
ac-coupling of the input drive network. Each input pin (INP, INM) must swing symmetrically between (VCM +
0.475 V) and (VCM – 0.475 V), resulting in a 1.9-VPP (default) differential input swing. The input sampling circuit
has a 3-dB bandwidth that extends up to 1.2 GHz. An equivalent analog input network diagram is shown in
Figure 8-1.
0.77 :
2 nH
0.6 :
500 fF
150 fF
150 fF
1:
200 fF
3.3 :
3 pF
375 fF
INP
40 :
0.77 :
1:
150 fF
200 fF
3.3 :
600 :
3 pF
375 fF
VCM
40 :
600 :
0.77 :
150 fF
2 nH
0.6 :
500 fF
150 fF
1:
200 fF
3.3 :
3 pF
375 fF
INM
40 :
0.77 :
1:
150 fF
200 fF
3.3 :
3 pF
375 fF
40 :
Figure 8-1. Analog Input Network
28
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The input bandwidth shown in Figure 8-2 is measured with respect to a 50-Ω differential input termination at the
ADC input pins. Figure x shows the signal processing done inside the DDC block of the ADS54J40.
Output Power/Input Power (dB)
0
-3
-6
-9
-12
-15
-18
0
200
400
600 800 1000 1200 1400 1600 1800 2000
Input Frequency (MHz)
D056
Figure 8-2. Transfer Function vs Frequency
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8.3.2 DDC Block
The ADS54J40 has an optional DDC block that can be enabled via an SPI register write. Each ADC channel is
followed by a DDC block consisting of three different decimate-by-2 and decimate-by-4 finite impulse response
(FIR) half-band filter options. The different decimation filter options can be selected through SPI
programming.Figure 8-3 shows the signal processing done inside the DDC block of the ADS54J40
Default 14-Bit Data (At 1 GSPS)
Decimate-by-2 Data (At 500 MSPS)
LPF
2
BPF
4
Decimate-by-4 Data (At 250 MSPS)
Interleaving
Engine,
Ch X
Digital
Features
1 GSPS Data,
x(n)
To JESD
Encoder
4
LPF
Decimate-by-4, I-Data (At 250 MSPS)
cos(2 n Œ fmix / fS)(1)
sin(2 n Œ fmix / fS)(1)
LPF
Decimate-by-4 Q-Data (At 250 MSPS)
4
Mode Selection Using DECFIL
MODE[3:0] Register Bits
A. In IQ decimate-by-4 mode, the mixer frequency is fixed at fmix = fS / 4. For fS = 1 GSPS and fmix = 250 MHz.
Figure 8-3. DDC Block
30
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8.3.2.1 Decimate-by-2 Filter
This decimation filter has 41 taps. The stop-band attenuation is approximately 90 dB and the pass-band flatness
is ±0.05 dB. Table 8-1 shows corner frequencies for low-pass and high-pass filter options.
Table 8-1. Corner Frequencies for the Decimate-by-2 Filter
CORNERS (dB)
LOW PASS
HIGH PASS
–0.1
0.202 × fS
0.298 × fS
–0.5
0.210 × fS
0.290 × fS
–1
0.215 × fS
0.285 × fS
–3
0.227 × fS
0.273 × fS
Figure 8-4 and Figure 8-5 show the frequency response of decimate-by-2 filter from dc to fS / 2.
0.5
5
0
-20
Magnitude (dB)
Magnitude (dB)
-0.5
-45
-70
-1
-1.5
-2
-95
-2.5
-120
-3
0
0.05
0.1
0.15 0.2 0.25 0.3 0.35
Frequency Response
0.4
0.45
0.5
0
D013
Figure 8-4. Decimate-by-2 Filter Response
0.05
0.1
0.15
Frequency Response
0.2
0.25
D014
Figure 8-5. Decimate-by-2 Filter Response
(Zoomed)
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8.3.2.2 Decimate-by-4 Filter Using a Digital Mixer
This band-pass decimation filter consists of a digital mixer and three concatenated FIR filters with a combined
latency of approximately 28 output clock cycles. The alias band attenuation is approximately
55 dB and the pass-band flatness is ±0.1 dB. By default after reset, the band-pass filter is centered at fS / 16.
Using the SPI, the center frequency can be programmed at N × fS / 16 (where N = 1, 3, 5, or 7). Table 8-2 shows
corner frequencies for two extreme options.
Table 8-2. Corner frequencies for the Decimate-by-4 Filter
CORNERS (dB)
CORNER FREQUENCY AT LOWER SIDE
(Center Frequency fS / 16)
CORNER FREQUENCY AT HIGHER SIDE
(Center Frequency fS / 16)
–0.1
0.011 × fS
0.114 × fS
–0.5
0.010 × fS
0.116 × fS
–1
0.008 × fS
0.117 × fS
–3
0.006 × fS
0.120 × fS
Figure 8-6 and Figure 8-7 show the frequency response of the decimate-by-4 filter for center frequencies fS / 16
and 3 × fS / 16 (N = 1 and N = 3, respectively).
0.2
10
0.1
0
0
-0.1
-20
Magnitude (dB)
Magnitude (dB)
-10
-30
-40
-50
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-60
-0.8
-70
-0.9
-80
-1
0
0.05
0.1
0.15 0.2 0.25 0.3 0.35
Frequency Response
0.4
0.45
0.5
Figure 8-6. Decimate-by-4 Filter Response
32
0
D015
0.05
0.1
0.15
Frequency Response
0.2
0.25
D016
Figure 8-7. Decimate-by-4 Filter Response
(Zoomed)
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8.3.2.3 Decimate-by-4 Filter with IQ Outputs
In this configuration, the DDC block includes a fixed digital fS / 4 mixer. Thus, the IQ pass band is approximately
±110 MHz, centered at fS / 4. This decimation filter has 41 taps with a latency of approximately ten output clock
cycles. The stop-band attenuation is approximately 90 dB and the pass-band flatness is ±0.05 dB. Table 8-3
shows the corner frequencies for a low-pass, decimate-by-4 IQ filter.
Table 8-3. Corner Frequencies for a Decimate-by-4 IQ Output Filter
CORNERS (dB)
LOW PASS
–0.1
0.107 × fS
–0.5
0.112 × fS
–1
0.115 × fS
–3
0.120 × fS
Figure 8-8 and Figure 8-9 show the frequency response of a decimate-by-4 IQ output filter from dc to fS / 2.
0.5
5
0
-20
Magnitude (dB)
Magnitude (dB)
-0.5
-45
-70
-1
-1.5
-2
-95
-2.5
-120
-3
0
0.05
0.1
0.15 0.2 0.25 0.3 0.35
Frequency Response
0.4
0.45
0.5
0
D011
Figure 8-8. Decimate-by-4 IQ Output Filter
Response
0.025
0.05
0.075
Frequency Response
0.1
0.125
D012
Figure 8-9. Decimate-by-4 IQ Output Filter
Response (Zoomed)
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8.3.3 SYSREF Signal
The SYSREF signal is a periodic signal that is sampled by the ADS54J40 device clock and used to align the
boundary of the local multi-frame clock inside the data converter. SYSREF is required to be a sub-harmonic of
the local multiframe clock (LMFC) internal timing. To meet this requirement, the timing of SYSREF is dependent
on the device clock frequency and the LMFC frequency, as determined by the selected DDC decimation and
frames per multi-frame settings. The SYSREF signal is recommended to be a low-frequency signal in the range
of 1 MHz to 5 MHz to reduce coupling to the signal path both on the printed circuit board (PCB) as well as
internal in the device.
The external SYSREF signal must be a sub-harmonic of the internal LMFC clock, as shown in Equation 1 and
Table 8-4.
SYSREF = LMFC / 2N
(1)
where
•
N = 0, 1, 2, and so forth.
Table 8-4. Local Multi-Frame Clock Frequency
(1)
(2)
LMFS CONFIGURATION
DECIMATION
LMFC CLOCK(1) (2)
4211
—
fS / K
4244
—
(fS / 4) / K
8224
—
(fS / 4) / K
4222
2X
(fS / 4) / K
2242
2X
(fS / 4) / K
2221
4X
(fS / 4) / K
2441
4X (IQ)
(fS / 4) / K
4421
4X (IQ)
(fS / 4) / K
1241
4X
(fS / 4) / K
K = Number of frames per multi frame (JESD digital page 6900h, address 06h, bits 4-0).
fS = sampling (device) clock frequency.
For example, if LMFS = 8224 then the programmed value of K is 9 (the actual value is 9 + 1 = 10 because the
actual value for K = the value set in the SPI register +1). If the device clock frequency is fS = 1000 MSPS, then
the local multi-frame clock frequency becomes (1000 / 4) / 10 = 25 MHz. The SYSREF signal frequency can be
chosen as the LMFC frequency / 8 = 3.125 MHz.
8.3.3.1 SYSREF Not Present (Subclass 0, 2)
A SYSREF pulse is required by the ADS54J40 to reset internal counters. If SYSREF is not present, as can be
the case in subclass 0 or 2, this pulse can be done by doing the following register writes shown in Table 8-5.
Table 8-5. Internally Pulsing SYSREF Twice Using Register Writes
34
ADDRESS (Hex)
DATA (Hex)
COMMENT
0-011h
80h
Set the master page
0-054h
80h
Enable manual SYSREF
0-053h
01h
Set SYSREF high
0-053h
00h
Set SYSREF low
0-053h
01h
Set SYSREF high
0-053h
00h
Set SYSREF low
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8.3.4 Overrange Indication
The ADS54J40 provides a fast overrange indication that can be presented in the digital output data stream via
SPI configuration. Alternatively, if not used, the SDOUT (pin 11) and PDN (pin 50) pins can be configured
through the SPI to output the fast OVR indicator.
JESD 8b/10b encoder receives 16-bit data that is formed by 14-bit ADC data padded with two 0s as LSBs. When
the FOVR indication is embedded in the output data stream, it replaces the LSB of the 16-bit data stream going
to the 8b/10b encoder, as shown in Figure 8-10.
16-Bit Data Output (14-Bit ADC Data Padded with Two 0s)
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0,
OVR
16-Bit Data Going to the 8b, 10b Encoder
Figure 8-10. Overrange Indication in a Data Stream
8.3.4.1 Fast OVR
The fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and is presented
after only 18 clock cycles + tPD (tPD of the gates and buffers is approximately 4 ns), thus enabling a quicker
reaction to an overrange event.
The input voltage level that the overload is detected at is referred to as the threshold. The threshold is
programmable using the FOVR THRESHOLD bits, as shown in Figure 8-11. The FOVR is triggered 18 clock
cycles + tPD (tPD of the gates and buffers is approximately 4 ns) after the overload condition occurs.
0
FOVR Threshold (dBFS)
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
32
64
96
128
160
192
Threshold Decimal Value
224
255
D055
Figure 8-11. Programming Fast OVR Thresholds
The input voltage level that the fast OVR is triggered at is defined by Equation 2:
Full-Scale × [Decimal Value of the FOVR Threshold Bits] / 255)
(2)
The default threshold is E3h (227d), corresponding to a threshold of –1 dBFS.
In terms of full-scale input, the fast OVR threshold can be calculated as Equation 3:
20log (FOVR Threshold / 255)
(3)
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8.4 Device Functional Modes
8.4.1 Power-Down Mode
The ADS54J40 provides a highly-configurable power-down mode. Power-down can be enabled using the PDN
pin or SPI register writes.
A power-down mask can be configured that allows a trade-off between wake-up time and power consumption in
power-down mode. Two independent power-down masks can be configured: MASK 1 and MASK 2, as shown in
Table 8-6. See the master page registers in Register Maps for further details.
Table 8-6. Register Address for Power-Down Modes
REGISTER
ADDRESS
REGISTER DATA
COMMENT
A[7:0] (Hex)
7
6
5
4
3
2
0
0
1
0
MASTER PAGE (80h)
20
21
23
24
26
MASK 1
MASK 2
CONFIG
55
PDN ADC CHA
PDN BUFFER CHB
PDN ADC CHB
PDN BUFFER CHA
PDN ADC CHA
PDN BUFFER CHB
PDN BUFFER CHA
GLOBAL PDN
OVERRIDE
PDN PIN
PDN MASK
SEL
0
0
0
0
0
PDN ADC CHB
0
0
0
0
0
0
0
0
0
PDN MASK
0
0
0
0
To save power, the device can be put in complete power-down by using the GLOBAL PDN register bit. However,
when JESD must remain linked up when putting the device in power-down, the ADC and analog buffer can be
powered down by using the PDN ADC CHx and PDN BUFFER CHx register bits after enabling the PDN MASK
register bit. The PDN MASK SEL register bit can be used to select between MASK 1 or MASK 2. Table 8-7
shows power consumption for different combinations of the GLOBAL PDN, PDN ADC CHx, and PDN BUFF CHx
register bits.
Table 8-7. Power Consumption in Different Power-Down Settings
REGISTER BIT
COMMENT
IAVDD3V
(mA)
IAVDD (mA)
IDVDD (mA)
TOTAL
IIOVDD (mA) POWER (W)
Default
After reset, with a full-scale input signal
to both channels
336
358
198
533
2.68
GBL PDN = 1
The device is in complete power-down
state
2
6
22
199
0.29
GBL PDN = 0,
PDN ADC CHx = 1
(x = A or B)
The ADC of one channel is powered
down
274
223
135
512
2.09
GBL PDN = 0,
PDN BUFF CHx = 1
(x = A or B)
The input buffer of one channel is
powered down
262
352
194
545
2.45
GBL PDN = 0,
PDN ADC CHx = 1, PDN
BUFF CHx = 1
(x = A or B)
The ADC and input buffer of one
channel is powered down
198
222
132
508
1.85
GBL PDN = 0,
PDN ADC CHx = 1, PDN
BUFF CHx = 1
(x = A and B)
The ADC and input buffer of both
channels are powered down
60
85
66
484
1.02
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8.4.2 Device Configuration
The ADS54J40 can be configured by using a serial programming interface, as described in the Serial Interface
section. In addition, the device has one dedicated parallel pin (PDN) for controlling the power-down mode.
The ADS54J40 supports a 24-bit (16-bit address, 8-bit data) SPI operation and uses paging (see the Register
Maps section) to access all register bits.
8.4.2.1 Serial Interface
The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial
interface enable), SCLK (serial interface clock), and SDIN (serial interface data) pins, as shown in Figure 8-12.
Legends used in Figure 8-12 are explained in Table 8-8. Serially shifting bits into the device is enabled when
SEN is low. Serial data on SDIN are latched at every SCLK rising edge when SEN is active (low). The interface
can function with SCLK frequencies from 2 MHz down to very low speeds (of a few Hertz) and also with a
non-50% SCLK duty cycle.
Register Address[11:0]
SDIN
R/W
M
P
CH
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0]
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
tDH
tSCLK
tDSU
SCLK
tSLOADS
tSLOADH
SEN
RESET
Figure 8-12. SPI Timing Diagram
Table 8-8. SPI Timing Diagram Legend
SPI BITS
DESCRIPTION
BIT SETTINGS
Read/write bit
0 = SPI write
1 = SPI read back
M
SPI bank access
0 = Analog SPI bank (master and ADC pages)
1 = JESD SPI bank (main digital, JESD analog, and
JESD digital pages)
P
JESD page selection bit
0 = Page access
1 = Register access
SPI access for a specific channel of the JESD SPI
bank
0 = Channel A
1 = Channel B
By default, both channels are being addressed.
A[11:0]
SPI address bits
—
D[7:0]
SPI data bits
—
R/W
CH
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Table 8-9 shows the timing requirements for the serial interface signals in Figure 8-12.
Table 8-9. SPI Timing Requirements
MIN
TYP
MAX
UNIT
2
MHz
fSCLK
SCLK frequency (equal to 1 / tSCLK)
> dc
tSLOADS
SEN to SCLK setup time
100
ns
tSLOADH
SCLK to SEN hold time
100
ns
tDSU
SDIN setup time
100
ns
tDH
SDIN hold time
100
ns
8.4.2.2 Serial Register Write: Analog Bank
The analog SPI bank contains of two pages (the master and ADC page). The internal register of the ADS54J40
analog SPI bank can be programmed by:
1. Driving the SEN pin low.
2. Initiating a serial interface cycle specifying the page address of the register whose content must be written.
• Master page: write address 0011h with 80h.
• ADC page: write address 0011h with 0Fh.
3. Writing the register content as shown in Figure 8-13. When a page is selected, multiple writes into the same
page can be done.
SDIN
0
0
0
0
R/W
M
P
CH
Register Address[11:0]
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0]
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SEN
RESET
Figure 8-13. Serial Register Write Timing Diagram
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8.4.2.3 Serial Register Readout: Analog Bank
The content from one of the two analog banks can be read out by:
1. Driving the SEN pin low.
2. Selecting the page address of the register whose content must be read.
• Master page: write address 0011h with 80h.
• ADC page: write address 0011h with 0Fh.
3. Setting the R/W bit to 1 and writing the address to be read back.
4. Reading back the register content on the SDOUT pin, as shown in Figure 8-14. When a page is selected,
multiple read backs from the same page can be done. SDOUT comes out at the SCLK falling edge with an
approximate delay (tSD_DELAY) of 68 ns; see Figure 8-18.
SDIN
1
0
0
0
R/W
M
P
CH
Register Address[11:0]
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0] = XX
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SEN
RESET
SDOUT
SDOUT[7:0]
Figure 8-14. Serial Register Read Timing Diagram
8.4.2.4 JESD Bank SPI Page Selection
The JESD SPI bank contains four pages (main digital, JESD digital, and JESD analog pages). The individual
pages can be selected by:
1. Driving the SEN pin low.
2. Setting the M bit to 1 and specifying the page with two register writes. Note that the P bit must be set to 0, as
shown in Figure 8-15.
• Write address 4003h with 00h (LSB byte of the page address).
• Write address 4004h with the MSB byte of the page address.
– For the main digital page: write address 4004h with 68h.
– For the JESD digital page: write address 4004h with 69h.
– For the JESD analog page: write address 4004h with 6Ah.
SDIN
0
1
0
0
R/W
M
P
CH
Register Address[11:0]
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0]
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SEN
RESET
Figure 8-15. SPI Page Selection
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8.4.2.5 Serial Register Write: JESD Bank
The ADS54J40 is a dual-channel device and the JESD204B portion is configured individually for each channel
by using the CH bit. Note that the P bit must be set to 1 for register writes.
1. Drive the SEN pin low.
2. Select the JESD bank page. Note that the M bit = 1 and the P bit = 0.
• Write address 4003h with 00h.
• Write address 4005h with 01h to enable separate control for both channels.
– For the main digital page: write address 4004h with 68h.
– For the JESD digital page: write address 4004h with 69h.
– For the JESD analog page: write address 4004h with 6Ah.
3. Set the M and P bits to 1, select channel A (CH = 0) or channel B (CH = 1), and write the register content as
shown in Figure 8-16. When a page is selected, multiple writes into the same page can be done.
SDIN
0
1
1
0
R/W
M
P
CH
Register Address[11:0]
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0]
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SEN
RESET
Figure 8-16. JESD Serial Register Write Timing Diagram
8.4.2.5.1 Individual Channel Programming
By default, register writes are applied to both channels. To enable individual channel writes, write address 4005h
with 01h (default is 00h).
8.4.2.6 Serial Register Readout: JESD Bank
The content from one of the pages of the JESD bank can be read out by:
1. Driving the SEN pin low.
2. Selecting the JESD bank page. Note that the M bit = 1 and the P bit = 0.
• Write address 4003h with 00h.
• Write address 4005h with 01h to enable separate control for both channels.
– For the main digital page: write address 4004h with 68h.
– For the JESD digital page: write address 4004h with 69h.
– For the JESD analog page: write address 4004h with 6Ah.
3. Setting the R/W, M, and P bits to 1, selecting channel A or channel B, and writing the address to be read
back.
4. Reading back the register content on the SDOUT pin; see Figure 8-17. When a page is selected, multiple
read backs from the same page can be done. SDOUT comes out at the SCLK falling edge with an
approximate delay (tSD_DELAY) of 68 ns; see Figure 8-18.
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1
1
1
0
R/W
M
P
CH
Register Address[11:0]
A11
A10
A9
A8
A7
A6
A5
A4
Register Data[7:0] = XX
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
SCLK
SEN
RESET
SDOUT
SDOUT[7:0]
Figure 8-17. JESD Serial Register Read Timing Diagram
SCLK
tSD_DELAY
SDOUT
Figure 8-18. SDOUT Timing Diagram
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8.4.3 JESD204B Interface
The ADS54J40 supports device subclass 1 with a maximum output data rate of 10.0 Gbps for each serial
transmitter.
An external SYSREF signal is used to align all internal clock phases and the local multi-frame clock to a specific
sampling clock edge, allowing synchronization of multiple devices in a system and minimizing timing and
alignment uncertainty. The SYNC input is used to control the JESD204B SERDES blocks.
Depending on the ADC output data rate, the JESD204B output interface can be operated with either two or four
lanes per single ADC, as shown in Figure 8-19. The JESD204B setup and configuration of the frame assembly
parameters is controlled through the SPI interface.
SYSREF
SYNC
INA
JESD204B
JESD204B
DA[3:0]
INB
JESD204B
JESD204B
DB[3:0]
Sample Clock
Figure 8-19. ADS54J40 Block Diagram
The JESD204B transmitter block shown in Figure 8-20 consists of the transport layer, the data scrambler, and
the link layer. The transport layer maps the ADC output data into the selected JESD204B frame data format. The
link layer performs the 8b/10b data encoding as well as the synchronization and initial lane alignment using the
SYNC input signal. Optionally, data from the transport layer can be scrambled.
JESD204B Block
Transport Layer
Link Layer
8b, 10b
Encoding
Frame Data
Mapping
Scrambler
1 + x14 + x15
D[3:0]
Comma Characters,
Initial Lane Alignment
SYNC
Figure 8-20. JESD204B Transmitter Block
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8.4.3.1 JESD204B Initial Lane Alignment (ILA)
The initial lane alignment process is started when the receiving device de-asserts the SYNC signal, as shown in
Figure 8-21. When a logic low is detected on the SYNC input pin, the ADS54J40 starts transmitting comma
(K28.5) characters to establish a code group synchronization.
When synchronization is complete, the receiving device asserts the SYNC signal and the ADS54J40 starts the
initial lane alignment sequence with the next local multi-frame clock boundary. The ADS54J40 transmits four
multi-frames, each containing K frames (K is SPI programmable). Each of the multi-frames contains the frame
start and end symbols and the second multi-frame also contains the JESD204 link configuration data.
SYSREF
LMFC Clock
LMFC Boundary
Multi
Frame
SYNC
Transmit Data
xxx
K28.5
Code Group
Synchronization
K28.5
ILA
Initial Lane
Alignment
ILA
DATA
DATA
Data Transmission
Figure 8-21. Lane Alignment Sequence
8.4.3.2 JESD204B Test Patterns
There are three different test patterns available in the transport layer of the JESD204B interface. The ADS54J40
supports a clock output-encoded test pattern, and a 12-octet RPAT. These test patterns can be enabled via an
SPI register write and are located in the JESD digital page of the JESD bank.
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8.4.3.3 JESD204B Frame
The JESD204B standard defines the following parameters:
•
•
•
•
L is the number of lanes per link.
M is the number of converters per device.
F is the number of octets per frame clock period, per lane.
S is the number of samples per frame per converter.
Table 8-10 lists the available JESD204B formats and valid ranges for the ADS54J40 when the decimation filter is
not used. The ranges are limited by the SERDES lane rate and the maximum ADC sample frequency.
Note
16-bit data going to JESD 8b/10b encoder is formed by padding two 0s as LSBs into the 14-bit ADC
data.
Table 8-10. Default Interface Rates
MINIMUM RATES
MAXIMUM RATES
L
M
F
S
DECIMATION
SAMPLING RATE
(MSPS)
SERDES BIT
RATE (Gbps)
SAMPLING RATE
(MSPS)
SERDES BIT
RATE (Gbps)
4
2
1
1
Not used
250
2.5
1000
10.0
4
2
4
4
Not used
250
2.5
1000
10.0
8
2
2
4
Not used
500
2.5
1000
5.0
Note
In the LMFS = 8224 row of Table 8-10, the sample order in lane DA2 and DA3 are swapped.
The detailed frame assembly is shown in Table 8-11.
Table 8-11. Default Frame Assembly
PIN
LMFS = 4211
LMFS = 4244
LMFS = 8224
DA0
A3[7:0]
DA1
A0[7:0]
A2[15:8]
A2[7:0]
A3[15:8]
A3[7:0]
A2[15:8]
A2[7:0]
DA2
A0[15:8]
A0[15:8]
A0[7:0]
A1[15:8]
A1[7:0]
A0[15:8]
A0[7:0]
DA3
A1[15:8]
A1[7:0]
DB0
B3[15:8]
B3[7:0]
DB1
B0[7:0]
B2[15:8]
B2[7:0]
B3[15:8]
B3[7:0]
B2[15:8]
B2[7:0]
DB2
B0[15:8]
B0[15:8]
B0[7:0]
B1[15:8]
B1[7:0]
B0[15:8]
B0[7:0]
B1[15:8]
B1[7:0]
DB3
44
A3[15:8]
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8.4.3.4 JESD204B Frame Assembly with Decimation
Table 8-12 lists the available JESD204B formats and valid ranges for the ADS54J40 when enabling the
decimation filter. The ranges are limited by the SERDES line rate and the maximum ADC sample frequency.
Table 8-13 lists the detailed frame assembly with different decimation options.
Table 8-12. Interface Rates with Decimation Filter
MINIMUM RATES
MAXIMUM RATES
DEVICE
CLOCK
FREQUENCY
(MSPS)
OUTPUT
SAMPLE RATE
(MSPS)
SERDES BIT
RATE (Gbps)
DEVICE
CLOCK
FREQUENCY
(MSPS)
OUTPUT
SERDES BIT
SAMPLE RATE
RATE (Gbps)
(MSPS)
L
M
F
S
DECIMATION
4
4
2
1
4X (IQ)
500
125
2.5
1000
250
4
2
2
2
2X
500
250
2.5
1000
500
5.0
2
2
4
2
2X
300
150
3
1000
500
10.0
2
2
2
1
4X
500
125
2.5
1000
250
5.0
2
4
4
1
4X (IQ)
300
75
3
1000
250
10.0
1
2
4
1
4X
300
75
3
1000
250
10.0
5.0
Table 8-13. Frame Assembly with Decimation Filter
PIN
LMFS = 4222, 2X
DECIMATION
DA0
A1
[15:8]
A1
[7:0]
DA1
A0
[15:8]
A0
[7:0]
DB0
B1
[15:8]
B1
[7:0]
DB1
B0
[15:8]
B0
[7:0]
LMFS = 2242, 2X
DECIMATION
A0
[15:8]
A0
[7:0]
A1
[15:8]
A1
[7:0]
LMFS = 2221, 4X
DECIMATION
A0
[15:8]
A0
[7:0]
LMFS = 2441, 4X
DECIMATION (IQ)
AI0
[15:8]
AI0
[7:0]
AQ0 AQ0
[15:8] [7:0]
LMFS = 4421, 4X
DECIMATION (IQ)
AQ0
[15:8]
AQ0
[7:0]
AI0
[15:8]
AI0
[7:0]
BQ0
[15:8]
BQ0
[7:0]
BI0
[15:8]
BI0
[7:0]
LMFS = 1241, 4X
DECIMATION
A0
[15:8]
A0
[7:0]
B0
[15:8]
B0
[7:0]
DA2
DA3
B0
[15:8]
B0
[7:0]
B1
[15:8]
B1
[7:0]
B0
[15:8]
B0
[7:0]
BI0
[15:8]
BI0
[7:0]
BQ0 BQ0
[15:8] [7:0]
DB2
DB3
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Table 8-14. Program Summary of DDC Modes and JESD Link Configuration
LMFS
OPTIONS
DDC MODES PROGRAMMING
L M F S
DEC
DECIMATI
MODE EN,
ON
DECFIL
OPTIONS
EN(1)
4 2 1 1
No
decimation
4 2 4 4
JESD LINK (LMFS) PROGRAMMING
DA_BUS_ DB_BUS_ BUS_REO BUS_REO
LANE
REORDER REORDER
RDER
RDER
SHARE(6)
(7)
(8)
EN1(9)
EN2(10)
DECFIL
MODE[3:0](2)
JESD
FILTER(3)
JESD
MODE(4)
JESD PLL
MODE(5)
00
00
000
100
10
0
00h
00h
0
0
No
decimation
00
00
000
010
10
0
00h
00h
0
0
8 2 2 4
No
decimation
(default
after reset)
00
00
000
001
00
0
00h
00h
0
0
4 4 2 1
4X (IQ)
11
0011 (LPF with
fS / 4 mixer)
111
001
00
0
0Ah
0Ah
1
1
4 2 2 2
2X
11
0010 (LPF) or
0110 (HPF)
110
001
00
0
0Ah
0Ah
1
1
2 2 4 2
2X
11
0010 (LPF) or
0110 (HPF)
110
010
10
0
0Ah
0Ah
1
1
100
001
00
0
0Ah
0Ah
1
1
2 2 2 1
4X
11
0000, 0100,
1000, or 1100 (all
BPFs with
different center
frequencies).
2 4 4 1
4X (IQ)
11
0011 (LPF with
an fS / 4 mixer)
111
010
10
0
0Ah
0Ah
1
1
11
0000, 0100,
1000, or 1100 (all
BPFs with
different center
frequencies)
100
010
10
1
0Ah
0Ah
1
1
1 2 4 1
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
4X
The DEC MODE EN and DECFIL EN register bits are located in the main digital page, register 04Dh (bit 3) and register 041h (bit 4).
The DECFIL MODE[3:0] register bits are located in the main digital page, register 041h (bits 5 and 2-0).
The JESD FILTER register bits are located in the JESD digital page, register 001h (bits 5-3).
The JESD MODE register bits are located in the JESD digital page, register 001h (bits 2:0).
The JESD PLL MODE register bits are located in the JESD analog page, register 016h (bits 1-0).
The LANE SHARE register bit is located in the JESD digital page, register 016h (bit 4).
The DA_BUS_REORDER register bits are located in the JESD digital page, register 031h (bits 7-0).
The DB_BUS_REORDER register bits are located in the JESD digital page, register 032h (bits 7-0).
The BUS_REORDER EN1 register bit is located in the main digital page, register 052h (bit 7).
The BUS_REORDER EN2 register bit is located in the main digital page, register 072h (bit 3).
8.4.3.4.1 JESD Transmitter Interface
Each of the 10-Gbps SERDES JESD transmitter outputs requires ac coupling between the transmitter and
receiver. The differential pair must be terminated with 100-Ω resistors as close to the receiving device as
possible to avoid unwanted reflections and signal degradation, as shown in Figure 8-22.
0.1 PF
DA[3:0]P,
DB[3:0]P
R t = ZO
Transmission Line, Zo
VCM
Receiver
R t = ZO
DA[3:0]M,
DB[3:0]M
0.1 PF
Figure 8-22. Output Connection to Receiver
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8.4.3.4.2 Eye Diagrams
Figure 8-23 to Figure 8-26 show the serial output eye diagrams of the ADS54J40 at 5.0 Gbps and 10 Gbps with
default and increased output voltage swing against the JESD204B mask.
Figure 8-23. Eye at 5-Gbps Bit Rate with Default
Output Swing
Figure 8-24. Eye at 5-Gbps Bit Rate with Increased
Output Swing
Figure 8-25. Eye at 10-Gbps Bit Rate with Default
Output Swing
Figure 8-26. Eye at 10-Gbps Bit Rate with
Increased Output Swing
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8.5 Register Maps
Figure 8-27 shows a conceptual diagram of the serial registers.
Initiate an SPI Cycle
R/W, M, P, CH, Bits Decoder
M=0
Analog Bank
General Register
(Address 00h,
Keep M = 0, P = 0)
Analog Bank Page Selection
(Address 011h, Keep M = 0, P = 0)
Value 80h
Addr 20h
Keep
M = 0, P = 0
Addr 59h
JESD Bank
JESD Bank Page Selection
(Address 003h and Address 004h,
Keep M = 1, P = 0)
General Register
(Address 005h,
Keep M = 1, P = 0)
Value 6800h
Value 0Fh
Addr 0h
Addr 5Fh
Master Page
(PDN, OVR,
DC Coupling)
M=1
Unused Registers
(Address 01h, Address 02h.
Keep M = 1, P = 0)
Value 6900h
Main
Digital Page
ADC Page
(Fast OVR)
Addr F7h
Keep M = 1,
P=1
(JESD
Configuration)
Addr 32h
Value 6100h
Keep M = 1,
P=1
JESD Bank Page Selection1
(Address 001h and Address 002h,
Keep M = 1, P = 0)
JESD
Analog Page
(PLL Configuration,
Output Swing,
Pre-Emphasis)
JESD
Digital Page
(Nyquist Zone,
Gain,
OVR, Filter)
Keep
M = 0, P = 0
Value 6A00h
Addr 12h
Addr 0h
Addr 1Bh
Value 0500h
Value 0000h
Addr 68h
Addr 00h
Offset Read Page
(Freeze, Bypass
and read internal
estimate of DC
Offset correction
block)
Keep M = 1,
P=1
Addr 7Bh
Keep M = 1,
P=1
R/W=0/1(1)
Offset Load Page
(Load external
estimate into DC
Offset correction
block)
Keep M = 1,
P=1
Addr 0Dh
Figure 8-27. Serial Interface Registers
The ADS54J40 contains two main SPI banks. The analog SPI bank gives access to the ADC analog blocks and the digital SPI bank controls the
interleaving engine and anything related to the JESD204B serial interface. The analog SPI bank is divided into two pages (master and ADC) and the
digital SPI bank is divided into three pages (main digital, JESD digital, and JESD analog). Table 8-15 lists a register map for the ADS54J40.
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Table 8-15. Register Map
REGISTER
ADDRESS
REGISTER DATA(1)
A[11:0] (Hex)
7
6
5
RESET
0
0
4
3
2
1
0
0
0
0
0
RESET
0
0
DISABLE
BROADCAST
0
0
GENERAL REGISTERS
0
1
JESD BANK PAGE SEL1[7:0]
2
JESD BANK PAGE SEL1[15:8]
3
JESD BANK PAGE SEL[7:0]
4
JESD BANK PAGE SEL[15:8]
5
0
0
0
0
11
0
ANALOG BANK PAGE SEL
MASTER PAGE (80h)
20
PDN ADC CHA
21
PDN ADC CHB
PDN BUFFER CHB
PDN BUFFER CHA
23
0
0
PDN ADC CHA
24
PDN ADC CHB
PDN BUFFER CHB
PDN BUFFER CHA
0
0
0
0
26
GLOBAL PDN
OVERRIDE PDN
PIN
PDN MASK SEL
0
0
0
0
0
4F
0
0
0
0
0
0
0
EN INPUT DC
COUPLING
53
0
0
0
0
0
0
EN SYSREF DC
COUPLING
SET SYSREF
54
ENABLE MANUAL
SYSREF
0
MASK SYSREF
MASK SYSREF
0
0
0
0
55
0
0
0
PDN MASK
0
0
0
0
59
FOVR CHB
0
ALWAYS WRITE 1
0
0
0
0
0
0
0
PULSE RESET
ADC PAGE (0Fh)
5F
FOVR THRESHOLD PROG
MAIN DIGITAL PAGE (6800h)
0
0
0
0
0
40
0
IL ENGINE MODE
41
0
0
DECFIL MODE[3]
DECFIL EN
0
DECFIL MODE[2:0]
42
0
0
0
0
0
NYQUIST ZONE
43
0
0
0
0
0
0
0
FORMAT SEL
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Table 8-15. Register Map (continued)
REGISTER
ADDRESS
REGISTER DATA(1)
A[11:0] (Hex)
7
44
0
6
5
4
4B
0
0
FORMAT EN
0
4D
0
0
0
4E
CTRL NYQUIST
0
52
BUS_
REORDER EN1
0
3
2
1
0
0
CTRL IL ENGINE
MODE
0
0
0
DEC MODE EN
0
0
CTRL FREEZE IL
ENGINE
IMPROVE IL PERF
0
0
0
0
0
0
0
0
0
0
DIG GAIN EN
DIGITAL GAIN
68
0
FREEZE IL
ENGINE
0
72
0
0
0
0
BUS_
REORDER EN2
0
0
0
0
AB
0
0
0
0
0
0
AD
0
0
0
0
0
0
LSB SEL EN
F7
0
0
0
0
0
0
0
DIG RESET
0
TESTMODE EN
FLIP ADC DATA
LANE ALIGN
FRAME ALIGN
TX LINK DIS
LSB SELECT
JESD DIGITAL PAGE (6900h)
0
CTRL K
0
1
SYNC REG
SYNC REG EN
JESD FILTER
LINK LAYER TESTMODE
LINK LAYER RPAT
2
3
FORCE LMFC
COUNT
5
SCRAMBLE EN
JESD MODE
LMFC MASK
RESET
0
0
LMFC COUNT INIT
0
0
0
RELEASE ILANE SEQ
0
0
0
0
0
6
0
0
0
7
0
0
0
0
SUBCLASS
FRAMES PER MULTI FRAME (K)
0
0
0
16
ALWAYS WRITE 1
0
0
LANE SHARE
0
0
0
0
31
DA_BUS_REORDER[7:0]
32
DB_BUS_REORDER[7:0]
JESD ANALOG PAGE (JESD BANK PAGE SEL = 6A00h)
50
12
SEL EMP LANE 1
ALWAYS WRITE 1
0
13
SEL EMP LANE 0
0
0
14
SEL EMP LANE 2
0
0
15
SEL EMP LANE 3
0
0
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Table 8-15. Register Map (continued)
REGISTER
ADDRESS
REGISTER DATA(1)
A[11:0] (Hex)
7
6
5
4
3
2
16
0
0
0
0
0
0
17
0
PLL RESET
LANE PDN 1
0
LANE PDN 0
0
0
0
1A
0
0
0
0
0
0
FOVR CHA
0
0
FOVR CHA EN
0
0
0
1B
JESD SWING
1
0
JESD PLL MODE
OFFSET READ PAGE (JESD BANK PAGE SEL = 6100h, JESD BANK PAGE SEL1 = 0000h)
68
FREEZE CORR
DC OFFSET
CORR BW
69
0
0
74
75
0
0
0
0
BYPASS CORR
ALWAYS WRITE 1
0
0
0
0
0
0
EXT CORR EN
0
0
0
ADC0_CORR_INT_EST[10:8]
0
0
0
ADC1_CORR_INT_EST[10:8]
0
ADC2_CORR_INT_EST[10:8]
0
ADC3_CORR_INT_EST[10:8]
0
ADC0_CORR_INT_EST[10:8]
0
ADC1_CORR_INT_EST[10:8]
0
ADC2_CORR_INT_EST[10:8]
ADC2_CORR_INT_EST[7:0]
0
0
0
0
7A
7B
DC OFFSET
CORR BW
ADC1_CORR_INT_EST[7:0]
78
79
DC OFFSET
CORR BW
ADC0_CORR_INT_EST[7:0]
76
77
DC OFFSET
CORR BW
0
0
ADC3_CORR_INT_EST[7:0]
0
0
OFFSET LOAD PAGE (JESD BANK PAGE SEL = 6100h, JESD BANK PAGE SEL1 = 0500h)
00
01
ADC0_LOAD_INT_EST[7:0]
0
0
04
05
0
0
08
09
0
0
0
ADC2_LOAD_INT_EST[7:0]
0
0
0C
(1)
0
ADC1_LOAD_INT_EST[7:0]
0
0
ADC3_LOAD_INT_EST[7:0]
0D
0
0
0
0
0
ADC3_CORR_INT_EST[10:8]
78h
0
0
0
0
0
IL ENGINE FREEZE SECONDARY CONTROL
X = Don't care
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8.5.1 Example Register Writes
This section provides three different example register writes. Table 8-16 describes a global power-down register
write, Table 8-17 describes the register writes when the default lane setting (eight active lanes per device) is
changed to four active lanes (LMFS = 4211), and Table 8-18 describes the register writes for 2X decimation with
four active lanes (LMFS = 4222).
Table 8-16. Global Power Down
ADDRESS (Hex)
DATA (Hex)
0-011h
80h
Set the master page
COMMENT
0-026h
C0h
Set the global power-down
Table 8-17. Two Lanes per Channel Mode (LMFS = 4211)
ADDRESS (Hex)
DATA (Hex)
COMMENT
4-004h
69h
Select the JESD digital page
4-003h
00h
Select the JESD digital page
6-001h
02h
Select the digital to 40X mode
4-004h
6Ah
Select the JESD analog page
6-016h
02h
Set the SERDES PLL to 40X mode
Table 8-18. 2X Decimation (LPF for Both Channels) with Four Active Lanes (LMFS = 4222)
ADDRESS (Hex)
DATA (Hex)
4-004h
68h
Select the main digital page (6800h)
COMMENT
4-003h
00h
Select the main digital page (6800h)
6-041h
12h
Set decimate-by-2 (low-pass filter)
6-04Dh
08h
Enable decimation filter control
6-072h
08h
BUS_REORDER EN2
6-052h
80h
BUS_REORDER EN1
6-000h
01h
6-000h
00h
4-004h
69h
Select the JESD digital page (6900h)
4-003h
00h
Select the JESD digital page (6900h)
6-031h
0Ah
Output bus reorder for channel A
6-032h
0Ah
Output bus reorder for channel B
6-001h
31h
Program the JESD MODE and JESD FILTER register bits for LMFS = 4222.
Pulse the PULSE RESET bit (so that register writes to the main digital page go into effect).
Table 8-19 lists the access codes for the ADS54J40 registers.
Table 8-19. ADS54J40 Access Type Codes
Access Type
Code
Description
R
R
Read
R-W
R/W
Read or write
W
W
Write
-n
52
Value after reset or the default
value
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8.5.2 Register Descriptions
8.5.2.1 General Registers
8.5.2.1.1 Register 0h (address = 0h)
Figure 8-22. Register 0h
7
6
5
4
3
2
1
0
RESET
0
0
0
0
0
0
RESET
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-20. Register 0h Field Descriptions
Bit
7
6-1
0
Field
Type
Reset
Description
RESET
W
0h
0 = Normal operation
1 = Internal software reset, clears back to 0
0
W
0h
Must write 0
RESET
W
0h
0 = Normal operation
1 = Internal software reset, clears back to 0
8.5.2.1.2 Register 1h (address = 1h)
Figure 8-23. Register 1h
7
6
5
4
3
2
1
0
JESD BANK PAGE SEL1[7:0]
R/W-0h
Table 8-21. Register 1h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
JESD BANK PAGE SEL1[7:0]
R/W
0h
Program these bits to access the desired page in the JESD
bank.
0000h = OFFSET READ Page
0500h = OFFSET LOAD Page
8.5.2.1.3 Register 2h (address = 2h)
Figure 8-24. Register 2h
7
6
5
4
3
2
1
0
JESD BANK PAGE SEL1[15:8]
R/W-0h
Table 8-22. Register 2h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
JESD BANK PAGE SEL1[15:8]
R/W
0h
Program these bits to access the desired page in the JESD
bank.
0000h = OFFSET READ Page
0500h = OFFSET LOAD Page
8.5.2.1.4 Register 3h (address = 3h)
Figure 8-25. Register 3h
7
6
5
4
3
2
1
0
JESD BANK PAGE SEL[7:0]
R/W-0h
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Table 8-23. Register 3h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
JESD BANK PAGE SEL[7:0]
R/W
0h
Program these bits to access the desired page in the JESD
bank.
6800h = Main digital page selected
6900h = JESD digital page selected
6A00h = JESD analog page selected
6100h = OFFSET READ or LOAD Page
8.5.2.1.5 Register 4h (address = 4h)
Figure 8-26. Register 4h
7
6
5
4
3
2
1
0
JESD BANK PAGE SEL[15:8]
R/W-0h
Table 8-24. Register 4h Field Descriptions
54
Bit
Field
Type
Reset
Description
7-0
JESD BANK PAGE SEL[15:8]
R/W
0h
Program these bits to access the desired page in the JESD
bank.
6800h = Main digital page selected
6900h = JESD digital page selected
6A00h = JESD analog page selected
6100h = OFFSET READ or LOAD Page
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8.5.2.1.6 Register 5h (address = 5h)
Figure 8-27. Register 5h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
DISABLE BROADCAST
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-25. Register 5h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
DISABLE BROADCAST
R/W
0h
0 = Normal operation. Channel A and B are programmed as a pair.
1 = Channel A and B can be individually programmed based on the
CH bit.
0
8.5.2.1.7 Register 11h (address = 11h)
Figure 8-28. Register 11h
7
6
5
4
3
2
1
0
ANALOG PAGE SELECTION
R/W-0h
Table 8-26. Register 11h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
ANALOG BANK PAGE SEL
R/W
0h
Program these bits to access the desired page in the analog bank.
Master page = 80h
ADC page = 0Fh
8.5.2.2 Master Page (080h) Registers
8.5.2.2.1 Register 20h (address = 20h), Master Page (080h)
Figure 8-29. Register 20h
7
6
5
4
3
2
1
PDN ADC CHA
PDN ADC CHB
R/W-0h
R/W-0h
0
Table 8-27. Registers 20h Field Descriptions
Bit
Field
Type
Reset
Description
There are two power-down masks that are controlled through
the PDN mask register bit in address 55h. The power-down
mask 1 or mask 2 are selected via register bit 5 in address 26h.
Power-down mask 1: addresses 20h and 21h.
Power-down mask 2: addresses 23h and 24h.
0Fh = Power-down CHB only.
F0h = Power-down CHA only.
FFh = Power-down both.
7-4
PDN ADC CHA
R/W
0h
3-0
PDN ADC CHB
R/W
0h
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8.5.2.2.2 Register 21h (address = 21h), Master Page (080h)
Figure 8-30. Register 21h
7
6
5
4
3
2
1
0
PDN BUFFER CHB
PDN BUFFER CHA
0
0
0
0
R/W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-28. Register 21h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
PDN BUFFER CHB
R/W
0h
5-4
PDN BUFFER CHA
R/W
0h
There are two power-down masks that are controlled through
the PDN mask register bit in address 55h. The power-down
mask 1 or mask 2 are selected via register address 26h, bit 5.
Power-down mask 1: addresses 20h and 21h.
Power-down mask 2: addresses 23h and 24h.
There are two buffers per channel. One buffer drives two ADC
cores.
PDN BUFFER CHx:
00 = Both buffers of a channel are active.
11 = Both buffers are powered down.
01–10 = Do not use.
3-0
0
W
0h
Must write 0.
8.5.2.2.3 Register 23h (address = 23h), Master Page (080h)
Figure 8-31. Register 23h
7
6
5
4
3
2
1
PDN ADC CHA
PDN ADC CHB
R/W-0h
R/W-0h
0
Table 8-29. Register 23h Field Descriptions
56
Bit
Field
7-4
PDN ADC CHA
3-0
PDN ADC CHB
Type
Reset
Description
R/W
0h
R/W
0h
There are two power-down masks that are controlled through
the PDN mask register bit in address 55h. The power-down
mask 1 or mask 2 are selected via register address 26h, bit 5.
Power-down mask 1: addresses 20h and 21h.
Power-down mask 2: addresses 23h and 24h.
0Fh = Power-down CHB only.
F0h = Power-down CHA only.
FFh = Power-down both.
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8.5.2.2.4 Register 24h (address = 24h), Master Page (080h)
Figure 8-32. Register 24h
7
6
5
4
3
2
1
0
PDN BUFFER CHB
PDN BUFFER CHA
0
0
0
0
R/W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-30. Register 24h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
PDN BUFFER CHB
R/W
0h
5-4
PDN BUFFER CHA
R/W
0h
There are two power-down masks that are controlled through
the PDN mask register bit in address 55h. The power-down
mask 1 or mask 2 are selected via register address 26h, bit 5.
Power-down mask 1: addresses 20h and 21h.
Power-down mask 2: addresses 23h and 24h.
Power-down mask 2: addresses 23h and 24h.
There are two buffers per channel. One buffer drives two ADC
cores.
PDN BUFFER CHx:
00 = Both buffers of a channel are active.
11 = Both buffers are powered down.
01–10 = Do not use.
3-0
0
W
0h
Must write 0.
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8.5.2.2.5 Register 26h (address = 26h), Master Page (080h)
Table 8-31. Register 26h
7
6
5
4
3
2
1
0
GLOBAL PDN
OVERRIDE
PDN PIN
PDN MASK
SEL
0
0
0
0
0
R/W-0h
R/W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-32. Register 26h Field Descriptions
Bit
Field
Type
Reset
Description
7
GLOBAL PDN
R/W
0h
Bit 6 (OVERRIDE PDN PIN) must be set before this bit can be
programmed.
0 = Normal operation
1 = Global power-down through the SPI
6
OVERRIDE PDN PIN
R/W
0h
This bit ignores the power-down pin control.
0 = Normal operation
1 = Ignores inputs on the power-down pin
5
PDN MASK SEL
R/W
0h
This bit selects power-down mask 1 or mask 2.
0 = Power-down mask 1
1 = Power-down mask 2
0
W
0h
Must write 0
4-0
8.5.2.2.6 Register 4Fh (address = 4Fh), Master Page (080h)
Table 8-33. Register 4Fh
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
EN INPUT DC COUPLING
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-34. Register 4Fh Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
EN INPUT DC COUPLING
R/W
0h
The device has an internal biassing resistor of 600 Ω from VCM
to the INP and INM pins. A small common-mode current flows
through these resistors causing approximately a 100-mV drop.
To compenste for the drop, the device raises the VCM voltage
by 100-mV by default. This compensation is particularly helpful
in AC-coupling applications where the common-mode voltage on
the INP and INM pins is established by internal biasing resistors.
In DC-coupling applications, because the common-mode
voltage is established by an external circuit, there is no need to
raise VCM by 100-mV.
0 = Device raises VCM voltage by 100 mV, useful in ACcoupling applications
1 = Device does not raise the VCM voltage, useful in DCcoupling applications.
0
58
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8.5.2.2.7 Register 53h (address = 53h), Master Page (080h)
Table 8-35. Register 53h
7
6
5
4
3
2
1
0
SET SYSREF
R/W-0h
0
0
0
0
0
0
EN SYSREF
DC COUPLING
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-36. Register 53h Field Descriptions
Bit
Field
Type
Reset
Description
7:2
0
W
0h
Must write 0
1
EN SYSREF DC COUPLING
R/W
0h
This bit enables a higher common-mode voltage input on the
SYSREF signal (up to 1.6 V).
0 = Normal operation
1 = Enables a higher SYSREF common-mode voltage support
0
MANUAL SYSREF
R/W
0h
The device has a feature to apply the SYSREF signal manually
through the serial interface instead of the SYSREFP, SYSREFM
pins. This application can be done by first setting the ENABLE
MANUAL SYSREF register bit, then using the MANUAL
SYSREF bit to set the SYSREF signal high or low.0 = Set
SYSREF low
1 = Set SYSREF high
8.5.2.2.8 Register 54h (address = 54h), Master Page (080h)
Figure 8-33. Register 54h
7
6
ENABLE
MANUAL
SYSREF
0
R/W-0h
W-0h
5
4
MASK SYSREF MASK SYSREF
W-0h
R/W-0h
3
2
1
0
0
0
0
0
W-0h
W-0h
W-0h
W-0h
Table 8-37. Register 54h Field Descriptions
Bit
Field
Type
Reset
Description
7
ENABLE MANUAL SYSREF
R/W
0h
This bit enables manual SYSREF
6
0
W
0h
Must write 0
5-4
MASK SYSREF
R/W
0h
00 = Normal operation
11 = The SYSREF signal is ignored by the device irrespective of
how the signal was applied (through a pin or manually by the
serial interface)
01 and 10 = Not applicable
3-0
0
W
0h
Must write 0
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8.5.2.2.9 Register 55h (address = 55h), Master Page (080h)
Table 8-38. Register 55h
7
6
5
4
3
2
1
0
0
0
0
PDN MASK
0
0
0
0
W-0h
W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-39. Register 55h Field Descriptions
Bit
Field
Type
Reset
Description
7-5
0
W
0h
Must write 0
PDN MASK
R/W
0h
This bit enables power-down via a register bit.
0 = Normal operation
1 = Power-down is enabled by powering down the internal
blocks as specified in the selected power-down mask
0
W
0h
Must write 0
4
3-0
60
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8.5.2.2.10 Register 59h (address = 59h), Master Page (080h)
Figure 8-34. Register 59h
7
6
5
4
3
2
1
0
FOVR CHB
0
ALWAYS WRITE 1
0
0
0
0
0
W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-40. Register 59h Field Descriptions
Bit
Field
Type
Reset
Description
7
FOVR CHB
W
0h
This bit outputs the FOVR signal for channel B on the SDOUT
pin.
0 = Normal operation
1 = The FOVR signal is available on the SDOUT pin
6
0
W
0h
Must write 0
5
ALWAYS WRITE 1
R/W
0h
Must write 1
0
W
0h
Must write 0
4-0
8.5.2.3 ADC Page (0Fh) Register
8.5.2.3.1 Register 5F (addresses = 5F), ADC Page (0Fh)
Figure 8-35. Register 5F
7
6
5
4
3
2
1
0
FOVR THRESHOLD PROG
R/W-E3h
Table 8-41. Register 5F Field Descriptions
Bit
Field
Type
Reset
Description
7-0
FOVR THRESHOLD PROG
R/W
E3h
Program the fast OVR thresholds together for channel A and B,
as described in the Overrange Indication section.
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8.5.2.4 Main Digital Page (6800h) Registers
8.5.2.4.1 Register 0h (address = 0h), Main Digital Page (6800h)
Table 8-42. Register 0h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
PULSE RESET
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-43. Register 0h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
PULSE RESET
R/W
0h
This bit must be pulsed after power-up or after configuring
registers in the main digital page of the JESD bank. Any register
bits in the main digital page (6800h) take effect only after this bit
is pulsed; see the Start-Up Sequence section for the correct
sequence.
0 = Normal operation
0 → 1 → 0 = This bit is pulsed
0
8.5.2.4.2 Register 40h (address = 40h), Main Digital Page (6800h)
Table 8-44. Register 40h
7
6
5
4
3
2
1
0
IL ENGINE MODE
W-0h
Table 8-45. Register 40h Field Descriptions
62
Bit
Field
Type
Reset
Description
7-0
IL ENGINE MODE
W
0h
Specifies the Interleaving Engine Mode
0 = Interleaving Engine is enabled
8 = Interleaving Engine is disabled
Other Values = Reserved
Note that for this register setting to take effect, CTRL IL ENGINE
field should be set to 1
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8.5.2.4.3 Register 41h (address = 41h), Main Digital Page (6800h)
Figure 8-36. Register 41h
7
6
5
4
3
0
0
DECFIL MODE[3]
DECFIL EN
0
2
DECFIL MODE[2:0]
1
W-0h
W-0h
R/W-0h
R/W-0h
W-0h
R/W-0h
0
Table 8-46. Register 41h Field Descriptions
Bit
Field
Type
Reset
Description
7-6
0
W
0h
Must write 0
5
DECFIL MODE[3]
R/W
0h
This bit selects the decimation filter mode. Table 8-47 lists the bit settings.
The decimation filter control (DEC MODE EN, register 4Dh, bit 3) and
decimation filter enable (DECFIL EN, register 41h, bit 4) must be enabled.
4
DECFIL EN
R/W
0h
This bit enables the digital decimation filter.
0 = Normal operation, full rate output
1 = Digital decimation enabled
3
0
W
0h
Must write 0
DECFIL MODE[2:0]
R/W
0h
These bits select the decimation filter mode. Table 8-47 lists the bit settings.
The decimation filter control (DEC MODE EN, register 4Dh, bit 3) and
decimation filter enable (DECFIL EN, register 41h, bit 4) must be enabled.
2-0
Table 8-47. DECFIL MODE Bit Settings
BITS (5, 2-0)
FILTER MODE
DECIMATION
0000
Band-pass filter centered on 3 × fS / 16
4X
0100
Band-pass filter centered on 5 × fS / 16
4X
1000
Band-pass filter centered on 1 × fS / 16
4X
1100
Band-pass filter centered on 7 × fS / 16
4X
0010
Low-pass filter
2X
0110
High-pass filter
2X
0011
Low-pass filter with fS /4 mixer
4X (IQ)
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8.5.2.4.4 Register 42h (address = 42h), Main Digital Page (6800h)
Table 8-48. Register 42h
7
6
5
4
3
0
0
0
0
0
2
NYQUIST ZONE
1
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
0
Table 8-49. Register 42h Field Descriptions
Bit
Field
Type
Reset
Description
7-3
0
W
0h
Must write 0
2-0
NYQUIST ZONE
R/W
0h
The Nyquist zone must be selected for proper interleaving
correction. The CONTROL NYQUIST register bit (register 4Eh,
bit 7) must be enabled to use these bits.
000 = 1st Nyquist zone (0 MHz to 500 MHz)
001 = 2nd Nyquist zone (500 MHz to 1000 MHz)
010 = 3rd Nyquist zone (1000 MHz to 1500 MHz)
All others = Not used
8.5.2.4.5 Register 43h (address = 43h), Main Digital Page (6800h)
Figure 8-37. Register 43h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
FORMAT SEL
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-50. Register 43h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
FORMAT SEL
R/W
0h
This bit changes the output format. Set the FORMAT EN bit to
enable control using this bit.
0 = Twos complement
1 = Offset binary
0
8.5.2.4.6 Register 44h (address = 44h), Main Digital Page (6800h)
Figure 8-38. Register 44h
7
6
5
4
3
0
DIGITAL GAIN
R/W-0h
R/W-0h
2
1
0
Table 8-51. Register 44h Field Descriptions
Bit
7
6-0
64
Field
Type
Reset
Description
0
R/W
0h
Must write 0
DIGITAL GAIN
R/W
0h
These bits set the digital gain setting. The DIG GAIN EN register
bit (register 52h, bit 0) must be enabled to use these bits.
Gain in dB = 20log (digital gain / 32)
7Fh = 127 equals a digital gain of 9.5 dB
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8.5.2.4.7 Register 4Bh (address = 4Bh), Main Digital Page (6800h)
Figure 8-39. Register 4Bh
7
6
5
4
3
2
1
0
0
0
FORMAT EN
0
0
CTRL IL
ENGINE MODE
0
0
W-0h
W-0h
R/W-0h
W-0h
W-0h
R/W-0h
W-0h
W-0h
Table 8-52. Register 4Bh Field Descriptions
Bit
Field
Type
Reset
Description
7-6
0
W
0h
Must write 0
FORMAT EN
R/W
0h
This bit enables control for data format selection using the
FORMAT SEL register bit.
0 = Default, output is in twos complement format
1 = Output is in offset binary format after the FORMAT SEL bit is
set
0
W
oh
Must write 0
CTRL IL ENGINE MODE
R/W
0h
This bit enables control of interleaving engine mode selection
using the IL ENGINE Mode register field.
0 = Default. IL Engine Mode (IL Engine enabled)
1 = IL Engine Mode is determined from IL ENGINE MODE field
setting.
0
W
0h
Must write 0
5
4-3
2
1-0
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8.5.2.4.8 Register 4Dh (address = 4Dh), Main Digital Page (6800h)
Figure 8-40. Register 4Dh
7
6
0
0
W-0h
W-0h
5
4
0
W-0h
3
2
1
0
0
DEC MOD EN
0
0
CTRL FREEZE
IL ENGINE
W-0h
R/W-0h
W-0h
W-0h
R/W-0h
Table 8-53. Register 4Dh Field Descriptions
Bit
Field
Type
Reset
Description
7-4
0
W
0h
Must write 0
DEC MOD EN
R/W
0h
This bit enables control of decimation filter mode through the
DECFIL MODE[3:0] register bits.
0 = Default
1 = Decimation mode control is enabled
3
2-1
0
66
0
W
0h
Must write 0
CTRL FREEZE IL ENGINE
R/W
0h
This bit enables control of interleaving engine freeze/unfreeze
state using the FREEZE IL ENGINE register field.
0 = IL Engine continues in its current state (either frozen or
unfrozen).
1 = IL Engine state enters a frozen or unfrozen state base on
FREEZE IL ENGINE register field setting.
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8.5.2.4.9 Register 4Eh (address = 4Eh), Main Digital Page (6800h)
Figure 8-41. Register 4Eh
7
6
5
4
3
2
1
0
CTRL NYQUIST
0
IMPROVE IL
PERF
0
0
0
0
0
R/W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-54. Register 4Eh Field Descriptions
Bit
Field
Type
Reset
Description
7
CTRL NYQUIST
R/W
0h
This bit enables selecting the Nyquist zone using register 42h,
bits 2-0.
0 = Selection disabled
1 = Selection enabled
6
0
W
0h
Must write 0
5
IMPROVE IL PERF
R/W
0h
Improves interleaving performance. Effective only for input
frequencies that are within +/- fs / 64 band centered at n * fs / 8
(n = 1, 2, 3 or 4). For example, at a 1-Gsps sampling rate, this
bit may improve IL performance when the input frequencies fall
within +/- 15.625 MHz band located at 125 MHz, 250 MHz, 375
MHz and 500 MHz.
0 = Default
1 = Improves IL performance for certain input frequenies
0
W
0h
Must write 0
6-0
8.5.2.4.10 Register 52h (address = 52h), Main Digital Page (6800h)
Figure 8-42. Register 52h
7
6
5
4
3
2
1
0
BUS_REORD
ER_EN1
0
0
0
0
0
0
DIG GAIN EN
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-55. Register 52h Field Descriptions
Bit
7
6-1
0
Field
Type
Reset
Description
BUS_REORDER_EN1
R/W
0h
Must write 1 in DDC mode only
0
W
0h
Must write 0
DIG GAIN EN
R/W
0h
Enables selecting the digital gain for register 44h.
0 = Digital gain disabled
1 = Digital gain enabled
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8.5.2.4.11 Register 68h (address = 68h), Main Digital Page (6800h)
Figure 8-43. Register 68h
7
6
5
4
3
2
1
0
0
FREEZE IL ENGINE
0
W-0h
W-0h
W-0h
Table 8-56. Register 68h Field Descriptions
Bit
Field
Type
Reset
Description
7-3
0
W
0h
Must write 0
FREEZE IL ENGINE
W
0h
IL Engine Freeze/Unfreeze Configuration.
0 = IL Engine is unfrozen (i.e. Interleaving Mismatch estimation
is resumed)
1 = IL Engine is frozen (i.e. Interleaving Mismatch estimation is
frozen, correction continues with estimates computed prior to
freeze)
Note 1. Value specified here takes effect when CTRL FREEZE IL
ENGINE is 1.
2. For IL Engine to be frozen, register field IL ENGINE
FREEZE SECONDARY CONTROL should be set to 0
3. Unlike other register fields in the Main Digital Page,
FREEZE IL ENGINE does not need a PULSE RESET to
take effect. FREEZE IL ENGINE can be asserted/deasserted at any time and the setting takes effect immediatel
2
.
1-0
0
W
0h
Must write 0
8.5.2.4.12 Register 72h (address = 72h), Main Digital Page (6800h)
Figure 8-44. Register 72h
7
6
5
4
3
2
1
0
0
0
0
0
BUS_REORDER_EN2
0
0
0
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
Table 8-57. Register 72h Field Descriptions
Bit
Field
7-4
0
W
0h
Must write 0
BUS_REORDER_EN2
R/W
0h
Must write a 1 in DDC mode only
0
W
0h
Must write 0
3
2-0
68
Type
Reset
Description
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8.5.2.4.13 Register ABh (address = ABh), Main Digital Page (6800h)
Figure 8-45. Register ABh
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
LSB SEL EN
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-58. Register ABh Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
LSB SEL EN
R/W
0h
Enable control for the LSB SELECT register bit.
0 = Default
1 = LSB of the 16-bit data (14-bit ADC data padded with two 0s
as the LSBs) can be programmed as fast OVR using the LSB
SELECT register bit.
0
8.5.2.4.14 Register ADh (address = ADh), Main Digital Page (6800h)
Figure 8-46. Register ADh
7
6
5
4
3
2
0
0
0
0
0
0
1
LSB SELECT
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-59. Register ADh Field Descriptions
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
1-0
LSB SELECT
R/W
0h
These bits enable the output of the FOVR flag instead of the
output data LSB. Ensure that LSB SEL EN register bit is set to
1.
00 = Output is 16-bit data (14-bit ADC data padded with two 0s
as LSBs)
11 = LSB of 16-bit output data is replaced by the FOVR
information for each channel.
8.5.2.4.15 Register F7h (address = F7h), Main Digital Page (6800h)
Figure 8-47. Register F7h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
DIG RESET
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-60. Register F7h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
DIG RESET
W
0h
This bit is the self-clearing reset for the digital block and does
not include interleaving correction.
0 = Normal operation
1 = Digital reset
0
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8.5.2.5 JESD Digital Page (6900h) Registers
8.5.2.5.1 Register 0h (address = 0h), JESD Digital Page (6900h)
Figure 8-48. Register 0h
7
6
5
CTRL K
0
0
R/W-0h
W-0h
W-0h
4
3
2
1
0
TESTMODE EN
FLIP ADC
DATA
LANE ALIGN
FRAME ALIGN
TX LINK DIS
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
Table 8-61. Register 0h Field Descriptions
Bit
Field
Type
Reset
Description
CTRL K
R/W
0h
Thib bit is the enable bit for a number of frames per multi frame.
0 = Default is five frames per multi frame
1 = Frames per multi frame can be set in register 06h
0
W
0h
Must write 0
4
TESTMODE EN
R/W
0h
This bit generates the long transport layer test pattern mode, as
per section 5.1.6.3 of the JESD204B specification.
0 = Test mode disabled
1 = Test mode enabled
3
FLIP ADC DATA
R/W
0h
0 = Normal operation
1 = Output data order is reversed: MSB to LSB.
2
LANE ALIGN
R/W
0h
This bit inserts the lane alignment character (K28.3) for the
receiver to align to lane boundary, as per section 5.3.3.5 of the
JESD204B specification.
0 = Normal operation
1 = Inserts lane alignment characters
1
FRAME ALIGN
R/W
0h
This bit inserts the lane alignment character (K28.7) for the
receiver to align to lane boundary, as per section 5.3.3.5 of the
JESD204B specification.
0 = Normal operation
1 = Inserts frame alignment characters
0
TX LINK DIS
R/W
0h
This bit disables sending the initial link alignment (ILA)
sequence when SYNC is de-asserted.
0 = Normal operation
1 = ILA disabled
7
6-5
70
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8.5.2.5.2 Register 1h (address = 1h), JESD Digital Page (6900h)
Figure 8-49. Register 1h
7
6
5
SYNC REG
SYNC REG EN
JESD FILTER
4
3
2
JESD MODE
1
R/W-0h
R/W-0h
R/W-0h
R/W-01h
0
Table 8-62. Register 1h Field Descriptions
Bit
Field
Type
Reset
Description
7
SYNC REG
R/W
0h
This bit is the register control for the sync request.
0 = Normal operation
1 = ADC output data are replaced with K28.5 characters; the
SYNC REG EN register bit must also be set to 1
6
SYNC REG EN
R/W
0h
This bit enables register control for the sync request.
0 = Use the SYNC pin for sync requests
1 = Use the SYNC REG register bit for sync requests
5-3
JESD FILTER
R/W
0h
These bits and the JESD MODE bits set the correct LMFS
configuration for the JESD interface. The JESD FILTER setting
must match the configuration in the decimation filter page.
000 = Filter bypass mode
See Table 8-63 for valid combinations for register bits JESD
FILTER along with JESD MODE.
2-0
JESD MODE
R/W
01h
These bits select the number of serial JESD output lanes per ADC.
The JESD PLL MODE register bit located in the JESD analog page
must also be set accordingly.
001 = Default after reset(Eight active lanes)
See Table 8-63 for valid combinations for register bits JESD
FILTER along with JESD MODE.
Table 8-63. Valid Combinations for JESD FILTER and JESD MODE Bits
NUMBER OF ACTIVE LANES
PER DEVICE
REGISTER BIT JESD FILTER
REGISTER BIT JESD MODE
DECIMATION FACTOR
000
100
No decimation
Four lanes are active
000
010
No decimation
Four lanes are active
000
001
No decimation
(default after reset)
Eight lanes are active
111
001
4X (IQ)
Four lanes are active
110
001
2X
Four lanes are active
110
010
2X
Two lanes are active
100
001
4X
Two lanes are active
111
010
4X (IQ)
Two lanes are active
100
010
4X
One lane is active
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8.5.2.5.3 Register 2h (address = 2h), JESD Digital Page (6900h)
Figure 8-50. Register 2h
7
6
5
4
3
2
1
0
LINK LAYER TESTMODE
LINK LAYER RPAT
LMFC MASK RESET
0
0
0
R/W-0h
R/W-0h
R/W-0h
W-0h
W-0h
W-0h
Table 8-64. Register 2h Field Descriptions
Bit
Field
Type
Reset
Description
7-5
LINK LAYER TESTMODE
R/W
0h
These bits generate a pattern as per section 5.3.3.8.2 of the
JESD204B document.
000 = Normal ADC data
001 = D21.5 (high-frequency jitter pattern)
010 = K28.5 (mixed-frequency jitter pattern)
011 = Repeat initial lane alignment (generates a K28.5 character
and continuously repeats lane alignment sequences)
100 = 12-octet RPAT jitter pattern
All others = Not used
4
LINK LAYER RPAT
R/W
0h
This bit changes the running disparity in the modified RPAT pattern
test mode (only when the link layer test mode = 100).
0 = Normal operation
1 = Changes disparity
3
LMFC MASK RESET
R/W
0h
This bit masks the LMFC reset coming to the digital block.
0 = LMFC reset is not masked
1 = Ignore the LMFC reset request
0
W
0h
Must write 0
2-0
72
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8.5.2.5.4 Register 3h (address = 3h), JESD Digital Page (6900h)
Figure 8-51. Register 3h
7
6
5
4
3
2
1
0
FORCE LMFC COUNT
LMFC COUNT INIT
RELEASE ILANE SEQ
R/W-0h
R/W-0h
R/W-0h
Table 8-65. Register 3h Field Descriptions
Bit
Field
Type
Reset
Description
FORCE LMFC COUNT
R/W
0h
This bit forces the LMFC count.
0 = Normal operation
1 = Enables using a different starting value for the LMFC
counter
6-2
LMFC COUNT INIT
R/W
0h
When SYSREF transmits to the digital block, the LMFC count
resets to 0 and K28.5 stops transmitting when the LMFC count
reaches 31. The initial value that the LMFC count resets to can
be set using LMFC COUNT INIT. In this manner, the receiver
can be synchronized early because it receives the LANE
ALIGNMENT SEQUENCE early. The FORCE LMFC COUNT
register bit must be enabled.
1-0
RELEASE ILANE SEQ
R/W
0h
These bits delay the generation of the lane alignment sequence
by 0, 1, 2, or 3 multi frames after the code group
synchronization.
00 = 0
01 = 1
10 = 2
11 = 3
7
8.5.2.5.5 Register 5h (address = 5h), JESD Digital Page (6900h)
Figure 8-52. Register 5h
7
6
5
4
3
2
1
0
SCRAMBLE EN
0
0
0
0
0
0
0
R/W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-66. Register 5h Field Descriptions
Bit
7
6-0
Field
Type
Reset
Description
SCRAMBLE EN
R/W
0h
This bit is the scramble enable bit in the JESD204B interface.
0 = Scrambling disabled
1 = Scrambling enabled
0
W
0h
Must write 0
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8.5.2.5.6 Register 6h (address = 6h), JESD Digital Page (6900h)
Figure 8-53. Register 6h
7
6
5
0
0
0
4
3
FRAMES PER MULTI FRAME (K)
2
1
W-0h
W-0h
W-0h
R/W-8h
0
Table 8-67. Register 6h Field Descriptions
Bit
Field
Type
Reset
Description
7-5
0
W
0h
Must write 0
4-0
FRAMES PER MULTI FRAME (K)
R/W
8h
These bits set the number of multi frames.
Actual K is the value in hex + 1 (that is, 0Fh is K = 16).
8.5.2.5.7 Register 7h (address = 7h), JESD Digital Page (6900h)
Figure 8-54. Register 7h
7
6
5
4
3
2
1
0
0
0
0
0
SUBCLASS
0
0
0
W-0h
W-0h
W-0h
W-0h
R/W-1h
W-0h
W-0h
W-0h
Table 8-68. Register 7h Field Descriptions
Bit
Field
Type
Reset
Description
7-4
0
W
0h
Must write 0
SUBCLASS
R/W
1h
This bit sets the JESD204B subclass.
000 = Subclass 0 is backward compatible with JESD204A
001 = Subclass 1 deterministic latency using the SYSREF signal
0
W
0h
Must write 0
3
2-0
8.5.2.5.8 Register 16h (address = 16h), JESD Digital Page (6900h)
Figure 8-55. Register 16h
7
6
5
4
3
2
1
0
1
0
0
LANE SHARE
0
0
0
0
W-1h
W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
W-0h
Table 8-69. Register 16h Field Descriptions
Bit
Field
Type
Reset
Description
7
1
W
1h
Must write 1
6-5
0
W
0h
Must write 0
LANE SHARE
R/W
0h
When using decimate-by-4, the data of both channels are output
over one lane (LMFS = 1241).
0 = Normal operation (each channel uses one lane)
1 = Lane sharing is enabled, both channels share one lane
(LMFS = 1241)
0
W
0h
Must write 0
4
3-0
74
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8.5.2.5.9 Register 31h (address = 31h), JESD Digital Page (6900h)
Figure 8-56. Register 31h
7
6
5
4
3
2
1
0
DA_BUS_REORDER[7:0]
R/W-0h
Table 8-70. Register 31h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DA_BUS_REORDER[7:0]
R/W
0h
Use these bits to program output connections between data
streams and output lanes in decimate-by-2 and decimate-by-4
mode. Table 8-14 lists the supported combinations of these bits.
8.5.2.5.10 Register 32h (address = 32h), JESD Digital Page (6900h)
Figure 8-57. Register 32h
7
6
5
4
3
2
1
0
DB_BUS_REORDER[7:0]
R/W-0h
Table 8-71. Register 32h Field Descriptions
Bit
Field
Type
Reset
Description
7-0
DB_BUS_REORDER[7:0]
R/W
0h
Use these bits to program output connections between data
streams and output lanes in decimate-by-2 and decimate-by-4
mode. Table 8-14 lists the supported combinations of these bits.
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8.5.2.6 JESD Analog Page (6A00h) Registers
8.5.2.6.1 Register 12h (address = 12h), JESD Analog Page (6A00h)
TBD I separated this register since it is now different from the rest
Figure 8-58. Register 12h
7
6
5
4
3
2
1
0
SEL EMP LANE 1
ALWAYS
WRITE 1
0
R/W-0h
W-0h
W-0h
Table 8-72. Register 12h Field Descriptions
76
Bit
Field
Type
Reset
Description
7-2
SEL EMP LANE 1, 0, 2, or 3
R/W
0h
These bits select the amount of de-emphasis for the JESD
output transmitter. The de-emphasis value in dB is measured as
the ratio between the peak value after the signal transition to the
settled value of the voltage in one bit period.
000000 = 0 dB
000001 = –1 dB
000011 = –2 dB
000111 = –4.1 dB
001111 = –6.2 dB
011111 = –8.2 dB
111111 = –11.5 dB
1
ALWAYS WRITE 1
W
0h
1 = Always write 1
0
0
W
0h
0 = Must write 0
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8.5.2.6.2 Registers 13h-15h (addresses = 13h-5h), JESD Analog Page (6A00h)
Figure 8-59. Register 13h
7
6
5
1
0
SEL EMP LANE 0
4
3
2
0
0
R/W-0h
W-0h
W-0h
Figure 8-60. Register 14h
7
6
5
1
0
SEL EMP LANE 2
4
3
2
0
0
R/W-0h
W-0h
W-0h
1
0
Figure 8-61. Register 15h
7
6
5
4
3
2
SEL EMP LANE 3
0
0
R/W-0h
W-0h
W-0h
Table 8-73. Registers 13h-15h Field Descriptions
Bit
Field
7-2
1-0
Type
Reset
Description
SEL EMP LANE x (where x = 1, 0, 2, R/W
or 3)
0h
These bits select the amount of de-emphasis for the JESD
output transmitter. The de-emphasis value in dB is measured as
the ratio between the peak value after the signal transition to the
settled value of the voltage in one bit period.
000000 = 0 dB
000001 = –1 dB
000011 = –2 dB
000111 = –4.1 dB
001111 = –6.2 dB
011111 = –8.2 dB
111111 = –11.5 dB
0
0h
Must write 0
W
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8.5.2.6.3 Register 16h (address = 16h), JESD Analog Page (6A00h)
Figure 8-62. Register 16h
7
6
5
4
3
2
1
0
0
0
0
0
0
JESD PLL MODE
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-74. Register 16h Field Descriptions
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
1-0
JESD PLL MODE
R/W
0h
These bits select the JESD PLL multiplication factor and must
match the JESD MODE setting.
00 = 20X mode, four lanes per ADC
01 = Not used
10 = 40X mode, two lanes per ADC
11 = Not used
Table 8-14 lists a programming summary of the DDC modes and
JESD link configuration.
8.5.2.6.4 Register 17h (address = 17h), JESD Analog Page (6A00h)
Figure 8-63. Register 17h
7
6
5
4
3
0
PLL RESET
W-0h
R/W-0h
2
1
0
LANE PDN 1
0
LANE PDN 0
0
0
0
R/W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
Table 8-75. Register 17h Field Descriptions
Bit
Field
Type
Reset
Description
7
0
W
0h
Must write 0
6
PLL RESET
R/W
0h
Pulse this bit after powering up the device; see Table 9-1.
0 = Default
0 → 1 → 0 = The PLL RESET bit is pulsed.
5
LANE PDN 1
R/W
0h
This bit powers down unused SERDES lanes DA0, DA3, DB0,
and DB3 in certain LMFS settings (applicable for LMFS = 4244,
2242, 2441, 4211, and 2221). Powering down unused lanes puts
the SERDES buffers in tri-state moe and saves approximately
15-mA current on the IOVDD supply. This bit must be used with
LANE PDN 0 to take effect.
0 = Default
1 = DA0, DB0, DA3 and DB3 are powered down4
4
0
W
0h
Must write 0
3
LANE PDN 0
R/W
0h
This bit powers down unused SERDES lanes DA0, DA3, DB0,
and DB3 in certain LMFS settings (applicable for LMFS = 4244,
2242, 2441, 4211, and 2221). Powering down unused lanes puts
the SERDES buffers in tri-state moe and saves approximately
15-mA current on the IOVDD supply.This bit must be used with
LANE PDN 1 to take effect.
0 = Dafult
1 = DA0, DB0, DA3 and DB3 are powered down4
0
W
0h
Must write 0
2-0
78
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8.5.2.6.5 Register 1Ah (address = 1Ah), JESD Analog Page (6A00h)
Figure 8-64. Register 1Ah
7
6
5
4
3
2
1
0
0
0
0
0
0
0
FOVR CHA
0
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
W-0h
Table 8-76. Register 1Ah Field Descriptions
Bit
Field
Type
Reset
Description
7-2
0
W
0h
Must write 0
1
FOVR CHA
R/W
0h
This bit outputs the FOVR signal for channel A on the PDN pin.
FOVR CHA EN (register 1Bh, bit 3) must be enabled for this bit
to function.
0 = Normal operation
1 = The FOVR signal of channel A is available on the PDN pin
0
0
W
0h
Must write 0
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8.5.2.6.6 Register 1Bh (address = 1Bh), JESD Analog Page (6A00h)
Figure 8-65. Register 1Bh
7
6
5
4
3
2
1
0
JESD SWING
0
FOVR CHA EN
0
0
0
R/W-0h
W-0h
R/W-0h
W-0h
W-0h
W-0h
Table 8-77. Register 1Bh Field Descriptions
Bit
Field
Type
Reset
Description
7-5
JESD SWING
R/W
0h
These bits select the output amplitude VOD (mVPP) of the JESD
transmitter (for all lanes).
0 = 860 mVPP
1 = 810 mVPP
2 = 770 mVPP
3 = 745 mVPP
4 = 960 mVPP
5 = 930 mVPP
6 = 905 mVPP
7 = 880 mVPP
4
0
W
0h
Must write 0
3
FOVR CHA EN
R/W
0h
This bit enables overwrites of the PDN pin with the FOVR signal
from channel A.
0 = Normal operation
1 = PDN is overwritten
0
R/W
0h
Must write 0
2-0
80
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8.5.2.7 Offset Read Page (JESD BANK PAGE SEL = 6100h, JESD BANK PAGE SEL1 = 0000h) Registers
8.5.2.7.1 Register 068h (address = 068h), Offset Read Page
Figure 8-66. Register 068h
7
6
5
4
3
2
1
0
FREEZE CORR
DC OFFSET
CORR BW
DC OFFSET
CORR BW
DC OFFSET
CORR BW
DC OFFSET
CORR BW
BYPASS CORR
ALWAYS
WRITE 1
0
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
R/W-0h
W-0h
Table 8-78. Register 068h Field Descriptions
Bit
7
Field
Type
Reset
Description
FREEZE CORR
R/W
0h
Offset correction block is enabled by default. Set this bit to freeze the block.
0 = Default after reset
1 = Offset correction block is frozen
See the DC Offset Correction Block in the ADS54J40ADS54J40W section for details.
R/W
0h
These bits allow the user to program the 3-dB bandwidth of the notch filter centered
around k x fs4/ 4 (k = 0, 1, 2). The notch filter is a first-order digital filter with 3-dB
bandwidth:
3-dB bandwidth normalized to fs
0 = 2.99479E-07
1 = 1.4974E-07
2 = 7.48698E-08
3 = 3.74349E-08
4 = 1.87174E-08
5 = 9.35872E-09
6 = 4.67936E-09
7 = 2.33968E-09
8 = 1.16984E-09
9 = 5.8492E-10
10 = 2.9246E-10
11 = 1.4623E-10
For example, at fs = 1 GSPS,if DC OFFSET CORR BW is set to 1, the notch filter has
a 3-dB bandwidth of 149.74 Hz.
DC OFFSET CORR BW
6-3
2
BYPASS CORR
R/W
0h
0 = Default after reset
1 = Offset correction block is bypassed
See the DC Offset Correction Block in the ADS54J40ADS54J40W section for details.
1
ALWAYS WRITE 1
R/W
0h
Always write 1
0
0
W
0h
Must write 0
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8.5.2.7.2 Register 069h (address = 069h), Offset Read Page
Figure 8-67. Register 069h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
EXT CORR EN
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
Table 8-79. Register 069h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
0h
Enables loading of external estimate into offset correction block.
0 = Default after reset (device uses internal estimate for offset
correction)
1 = External estimate can be loaded by using the
ADCx_LOAD_EXT_EST register bits
See the DC Offset Correction Block in the
ADS54J40ADS54J40W section for details.
0
EXT CORR EN
R/W
8.5.2.7.3 Registers 074h, 076h, 078h, 7Ah (address = 074h, 076h, 078h, 7Ah), Offset Read Page
Figure 8-68. Registers 074h, 076h, 078h, 7Ah
7
6
1
0
ADCx_CORR_INT_EST[5:0]
5
4
3
2
X
X
R/W-0h
n/a
n/a
Table 8-80. Registers 074h, 076h, 078h, 7Ah Field Descriptions
Bit
Field
Type
Reset
Description
7-2
ADCx_CORR_INT_EST[5:0]
R/W
0h
Internal estimate for all four interleaving ADC cores of the dc
offset corrector block can be read from these bits.
Keep the R/W bit set to 1 when reading from these registers.
See the DC Offset Correction Block in the
ADS54J40ADS54J40W section for details.
1-0
X
n/a
n/a
Don't care
8.5.2.7.4 Registers 075h, 077h, 079h, 7Bh (address = 075h, 077h, 079h, 7Bh), Offset Read Page
Figure 8-69. Registers 075h, 077h, 079h, 7Bh
7
6
5
4
3
0
0
0
0
0
2
ADCx_CORR_INT_EST[8:6]
1
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
0
Table 8-81. Registers 075h, 077h, 079h, 7Bh Field Descriptions
Bit
Field
Type
Reset
Description
7-3
0
W
0h
Must write 0
0h
Internal estimate for all four interleaving ADC cores of the dc
offset corrector block can be read from these bits.
Keep the R/W bit set to 1 when reading from these registers.
See the DC Offset Correction Block in the
ADS54J40ADS54J40W section for details.
2-0
82
ADCx_CORR_INT_EST[8:6]
R/W
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8.5.2.8 Offset Load Page (JESD BANK PAGE SEL= 6100h, JESD BANK PAGE SEL1 = 0500h) Registers
8.5.2.8.1 Registers 00h, 04h, 08h, 0Ch (address = 00h, 04h, 08h, 0Ch), Offset Load Page
Figure 8-70. Registers 00h, 04h, 08h, 0Ch
7
6
1
0
ADCx_LOAD_EXT_EST[5:0]
5
4
3
2
X
X
R/W-0h
n/a
n/a
Table 8-82. Registers 00h, 04h, 08h, 0Ch Field Descriptions
Bit
Field
Type
Reset
Description
5-0
ADCx_LOAD_EXT_EST[5:0]
R/W
0h
External estimate can be loaded into the dc offset corrector
blocks for all four interleaving ADC cores.
See the DC Offset Correction Block in the
ADS54J40ADS54J40W section for details.
1-0
X
n/a
n/a
Don't care
8.5.2.8.2 Registers 01h, 05h, 09h, 0Dh (address = 01h, 05h, 09h, 0Dh), Offset Load Page
Figure 8-71. Registers 01h, 05h, 09h, 0Dh
7
6
5
4
3
2
1
0
0
0
0
0
ADCx_LOAD_EXT_EST[8:6]
W-0h
W-0h
W-0h
W-0h
W-0h
R/W-0h
0
Table 8-83. Registers 01h, 05h, 09h, 0Dh Field Descriptions
Bit
Field
Type
Reset
Description
7-3
0
W
0h
Must write 0
0h
External estimate can be loaded into the dc offset corrector
blocks for all four interleaving ADC cores.
See the DC Offset Correction Block in the
ADS54J40ADS54J40W section for details.
2-0
ADCx_CORR_INT_EST[8:6]
R/W
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8.5.2.8.3 Registers 78h (address = 78h), Offset Load Page
Figure 8-72. Registers 078h
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
IL ENGINE FREEZE
SECONDARY CONTROL
W
W
W
W
W
W
W
R/W
Table 8-84. Registers 078h Field Descriptions
Bit
Field
Type
Reset
Description
7-1
0
W
0h
Must write 0
IL ENGINE FREEZE SECONDARY
CONTROL
R/W
0h
Whenever IL ENGINE freeze is required, this bit needs to be set
to 0.
0
84
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9 Application Information Disclaimer
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
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9.1.1 Start-Up Sequence
The steps described in Table 9-1 are recommended as the power-up sequence with the ADS54J40 in 20X mode (LMFS = 8224).
Table 9-1. Initialization Sequence
STEP
1
SEQUENCE
Power-up the device
PAGE BEING
PROGRAMMED
DESCRIPTION
Bring up IOVDD to 1.15 V before applying power to DVDD. Bring up
DVDD to 1.9 V, AVDD to 1.9 V, and AVDD3V to 3.0 V.
COMMENT
—
See the Power Sequencing and Initialization section for power sequence
requirements.
—
A hardware reset clears all registers to their default values.
Hardware reset
Apply a hardware reset by pulsing pin 48 (low → high → low).
Register writes are equivalent to a hardware reset.
Write address 0-000h with 81h.
2
Reset the device
General register
Write address 4-001h with 00h and address 4-002h with 00h.
Unused page
Write address 4-003h with 00h and address 4-004h with 68h.
—
Write address 6-0F7h with 01h for channel A.
Write address 6-000h with 01h, then address 6-000h with 00h.
3
Performance modes
Reset registers in the ADC and master pages of the analog bank.
This bit is a self-clearing bit.
Clear any unwanted content from the unused pages of the JESD bank.
Select the main digital page of the JESD bank.
Use the DIG RESET register bit to reset all pages in the JESD bank.
Main digital page
This bit is a self-clearing bit.
(JESD bank)
Pulse the PULSE RESET register bit for channel A.
Write address 0-011h with 80h.
—
Write address 0-059h with 20h.
Master page
(analog bank)
Select the master page of the analog bank.
Set the ALWAYS WRITE 1 bit.
Default register writes for DDC modes and JESD link configuration (LMFS 8224).
Write address 4-003h with 00h and address 4-004h with 69h.
Write address 6-000h with 80h.
JESD link is configured with LMFS = 8224 by default with no decimation.
Write address 4-003h with 00h and address 4-004h with 6Ah.
4
Program desired registers for
decimation options and
JESD link configuration
JESD link is configured with LMFS = 8224 by default with no decimation.
Write address 6-017h with 40h.
—
JESD
digital page
(JESD bank)
—
JESD
analog page
(JESD bank)
Write address 6-017h with 00h.
JESD link is configured with LMFS = 8224 by default with no decimation.
Write address 6-000h with 01h and address 6-000h with 00h.
5
86
Set the CTRL K bit for both channels by programming K according to the
SYSREF signal later on in the sequence.
See Table 8-14 for configuring the JESD digital page registers for the desired
LMFS and programming appropriate DDC mode.
Select the JESD analog page.
See Table 8-14 for configuring the JESD analog page registers for the desired
LMFS and programming appropriate DDC mode.
PLL reset.
PLL reset clear.
Write address 4-003h with 00h and address 4-004h with 68h.
Set the value of K and the
SYSREF signal frequency
accordingly
Select the JESD digital page.
Write address 4-003h with 00h and address 4-004h with 69h.
Write address 6-006h with XXh (choose the value of K).
—
Select the main digital page.
See Table 8-14 for configuring the main digital page registers for the desired
Main digital page LMFS and programming appropriate DDC mode.
(JESD bank)
Pulse the PULSE RESET register bit. All settings programmed in the main
digital page take effect only after this bit is pulsed.
—
JESD
digital page
(JESD bank)
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Select the JESD digital page.
See the SYSREF Signal section to choose the correct frequency for SYSREF.
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Table 9-1. Initialization Sequence (continued)
STEP
SEQUENCE
DESCRIPTION
PAGE BEING
PROGRAMMED
Pull the SYNCB pin (pin 63) low.
6
JESD lane alignment
Pull the SYNCB pin high.
COMMENT
Transmit K28.5 characters.
—
After the receiver is synchronized, initiate an ILA phase and subsequent
transmissions of ADC data.
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9.1.2 Hardware Reset
Figure 9-1 and Table 9-2 show the timing for a hardware reset.
Power Supplies
t1
RESET
t2
t3
SEN
Figure 9-1. Hardware Reset Timing Diagram
Table 9-2. Timing Requirements
MIN
t1
Power-on delay: delay from power-up to an active high RESET pulse
t2
Reset pulse duration: active high RESET pulse duration
t3
Register write delay: delay from RESET disable to SEN active
TYP
MAX
UNIT
1
ms
10
ns
100
ns
9.1.3 SNR and Clock Jitter
The signal-to-noise ratio (SNR) of the ADC is limited by three different factors: quantization noise, thermal noise,
and jitter, as shown in Equation 4. The quantization noise is typically not noticeable in pipeline converters and is
86 dBFS for a 14-bit ADC. The thermal noise limits SNR at low input frequencies and the clock jitter sets SNR
for higher input frequencies.
(4)
The SNR limitation resulting from sample clock jitter can be calculated by Equation 5:
(5)
The total clock jitter (TJitter) has two components: the internal aperture jitter (130 fs) is set by the noise of the
clock input buffer and the external clock jitter. TJitter can be calculated by Equation 6:
(6)
External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as bandpass filters at the clock input. A faster clock slew rate also improves the ADC aperture jitter.
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The ADS54J40 has a thermal noise of approximately 71.1 dBFS and an internal aperture jitter of 120 fS. SNR,
depending on the amount of external jitter for different input frequencies, is shown in Figure 9-2.
75
35 fS
50 fS
100 fS
SNR (dBFS)
73
150 fS
200 fS
71
69
67
65
10
100
Input Frequency (MHz)
D052
Figure 9-2. SNR versus Input Frequency and External Clock Jitter
9.1.4 DC Offset Correction Block in the ADS54J40
The ADS54J40 employs eight dc offset correction blocks (four per channel, one per interleaving core). Figure
9-3 shows a dc correction block diagram.
Input data, x(n)
(250 MSPS data from each interleaving core)
0
Output data, y(n)
at 250 MSPS
1
+
±
+
DC Corrected data
ALWAYS WRITE 1
(Reg 68h, bit 1)
0
DC Correction
Engine
BYPASS CORR
1
FREEZE CORR
ADCx_LOAD_EXT_EST[8:0]
Internal Estimate
Read back path
ADCx_CORR_INT_EST[8:0]
EXT CORR EN
Figure 9-3. DC Offset Correction Block Diagram
The purpose of the dc offset correction block is to correct the dc offset of interleaving cores that mainly arise the
from amplifier in the first pipeline stage. Any mismatch in dc offset among interleaving cores results in spurs at
fS / 4 and fS / 2. The dc offset correction blocks estimate and correct the dc offset of the individual core, to an
ideal mid-code value, and thereby remove the effect of offset mismatch.
The dc offset correction block can correct the dc offset of individual core up to ±1024 codes.
In applications involving dc-coupling between the ADC and the driver, the dc offset correction block can either be
bypassed or frozen because the block cannot distinguish the external dc signal from the internal dc offset. Figure
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9-4 shows that when bypassed, the internal dc mismatch appears at dc, and the f S / 4 and fS / 2 frequency points
and can be as big as –40 dBFS.
0
Amplitude (dBFS)
-20
-40
-60
-80
-100
-120
0
100
200
300
Frequency (MHz)
400
500
D001
Figure 9-4. FFT After Bypassing the DC Offset Correction Block
9.1.4.1 Freezing the DC Offset Correction Block
After the device is powered up, the dc offset correction block estimates the internal dc offset with the idle
channel input before the block is frozen. When frozen, the correction block holds the last estimated value that
belongs to the internal dc offset. After the correction block is frozen, an external signal can be applied.
9.1.4.2 Effect of Temperature
The internal dc offset of the individual cores changes with temperature, resulting in fS / 4 and fS / 2 spurs
appearing again in the spectrum at a different temperature.
Figure 9-5 shows the variation of the fS / 4 spur over temperature for a typical device.
-40
fs/4 Spur (dBFS)
-50
-60
-70
-80
-90
-40
-15
10
35
Temperature (°C)
60
85
D068
The offset correction block was frozen at room temperature, then the temperature was varied from –40°C to +85°C.
Figure 9-5. Variation of the fS / 4 Spur Over Temperature
Although some systems can accept such a variation in the fS / 4 and fS / 2 spurs across temperature, other
systems may require the internal dc offset profile to be calibrated with temperature. To achieve the calibration of
internal dc offset, the device provides an option to read the internal estimate values from the correction block for
each of the interleaving cores and also to load the values back to the correction block. For calibration, after
power up, a temperature sweep can be performed with the idle channel input and the internal dc offset can be
read back using the ADCx_CORR_INT_EST register bits for salient temperature points. Then during operation,
when the temperature changes, corresponding estimates can be externally loaded to the correction block using
the ADCx_LOAD_EXT_EST register bits.
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The dc offset corrector block is enabled by default. For a given channel, the device can disable and freeze the
block, read the block estimate, and load the external estimate.
Table 9-3 lists an example of the required SPI writes for reading an internal estimate of the dc offset correction
block, and then loading the estimate back to the corrector.
Table 9-3. Format (16-Bit Address, 8-Bit Data)
STEP
ADDRESS
(Hex)(1)
DATA (Hex)
4-005
01
4-004
61
4-003
00
4-002
00
4-001
00
E-074
xx
COMMENT
This setting disables broadcast mode (channel A and B can be individually
programmed)
Select the offset read page (61000000h)
Data from offset read page can be read as below (keep the R/W bit = 1)
Reading an internal
estimate from both
channels
Reading the internal estimate [5:0] for core 0, channel A on the SDOUT pin
E-075
xx
Reading the internal estimate [8:6] for core 0, channel A on the SDOUT pin
E-076
xx
Reading the internal estimate [5:0] for core 1, channel A on the SDOUT pin
E-077
xx
Reading the internal estimate [8:6] for core 1, channel A on the SDOUT pin
E-078
xx
Reading the internal estimate [5:0] for core 2, channel A on the SDOUT pin
E-079
xx
Reading the internal estimate [8:6] for core 2, channel A on the SDOUT pin
E-07A
xx
Reading the internal estimate [5:0] for core 3, channel A on the SDOUT pin
E-07B
xx
Reading the internal estimate [8:6] for core 3, channel A on the SDOUT pin
F-074
xx
Reading the internal estimate [5:0] for core 0, channel B on the SDOUT pin
F-075
xx
Reading the internal estimate [8:6] for core 0, channel B on the SDOUT pin
F-076
xx
Reading the internal estimate [5:0] for core 1, channel B on the SDOUT pin
F-077
xx
Reading the internal estimate [8:6] for core 1, channel B on the SDOUT pin
F-078
xx
Reading the internal estimate [5:0] for core 2, channel B on the SDOUT pin
F-079
xx
Reading the internal estimate [8:6] for core 2, channel B on the SDOUT pin
F-07A
xx
Reading the internal estimate [5:0] for core 3, channel B on the SDOUT pin
F-07B
xx
Reading the internal estimate [8:6] for core 3, channel B on the SDOUT pin
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Table 9-3. Format (16-Bit Address, 8-Bit Data) (continued)
STEP
Loading an external
estimate to both
channels
(1)
92
ADDRESS
(Hex)(1)
DATA (Hex)
6-069
01
Enables the external correction bit located in the offset read page for channel A
7-069
01
Enables the external correction bit located in the offset read page for channel B
4-004
61
4-003
00
4-002
05
4-001
00
COMMENT
Change the page to the offset load page (61000500h)
6-000
xx
Loading the external estimate [5:0] for core 0, channel A through SPI writes
6-001
xx
Loading the external estimate [8:6] for core 0, channel A through SPI writes
6-004
xx
Loading the external estimate [5:0] for core 1, channel A through SPI writes
6-005
xx
Loading the external estimate [8:6] for core 1, channel A through SPI writes
6-008
xx
Loading the external estimate [5:0] for core 2, channel A through SPI writes
6-009
xx
Loading the external estimate [8:6] for core 2, channel A through SPI writes
6-00C
xx
Loading the external estimate [5:0] for core 3, channel A through SPI writes
6-00D
xx
Loading the external estimate [8:6] for core 3, channel A through SPI writes
7-000
xx
Loading the external estimate [5:0] for core 0, channel B through SPI writes
7-001
xx
Loading the external estimate [8:6] for core 0, channel B through SPI writes
7-004
xx
Loading the external estimate [5:0] for core 1, channel B through SPI writes
7-005
xx
Loading the external estimate [8:6] for core 1, channel B through SPI writes
7-008
xx
Loading the external estimate [5:0] for core 2, channel B through SPI writes
7-009
xx
Loading the external estimate [8:6] for core 2, channel B through SPI writes
7-00C
xx
Loading the external estimate [5:0] for core 3, channel B through SPI writes
7-00D
xx
Loading the external estimate [8:6] for core 3, channel B through SPI writes
The address field is represented in four hex bits in a-bcd format, where a contains information about the R/W, M, P, and CH bits, and
bcd contains the actual address of the register.
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9.1.5 Idle Channel Histogram
7000
2800
6000
2400
5000
2000
Code Occurrence
Code Occurrence
Figure 9-6 shows a histogram of output codes for when no signal is applied at the analog inputs of the
ADS54J40 . Figure 9-7 shows that when the dc offset correction block of the device is bypassed, the output code
histogram becomes multi-modal with as many as four peaks because the ADS54J40 is a 4-way interleaved ADC
with each ADC core having a different internal dc offset.
4000
3000
2000
1000
0
8184
1600
1200
800
400
D060
0
8080 8100 8120 8140 8160 8180 8200 8220 8240 8260 8280
Output Code
D061
Figure 9-6. Idle Channel Histogram (No Signal at
Analog Inputs, DC Offset Correction is On)
Figure 9-7. Idle Channel Histogram (No Signal at
Analog Inputs, DC Offset Correction is Off)
8187
8190
8193
8196
Output Code
8199
8202
Figure 9-8 shows that when the dc offset correction block is frozen (instead of bypassed), the output code
histogram improves (compared to when bypassed). However, when the temperature changes, the dc offset
difference among interleaving cores may increase resulting in increased spacing between peaks in the
histogram.
8000
7000
Code Occurrence
6000
5000
4000
3000
2000
1000
0
8180 8182 8184 8186 8188 8190 8192 8194 8196 8198 8200
Output Code
D062
D107
Figure 9-8. Idle Channel Histogram (No Signal at Analog Inputs, DC Offset Correction is Frozen)
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9.1.6 Interleaving (IL) Mismatch Compensation
9.1.6.1 Introduction
The ADC in ADS54J40 is an interleaved ADC, which is realized by interleaving the outputs of 4 component
ADCs running at one-fourth of the final rate. Gain/timing mismatches between the 4 component ADCs give rise
to images in the spectrum, located at Fin + kFs/4, k = 1,2,3, where Fin is the input frequency and Fs is the
overall ADC sampling frequency. Note that the frequencies Fin + kFs/4 will alias and fall within [-Fs/2,Fs/2] when
the ADC out is observed. The Interleaving (IL) mismatch corrector module in ADS54J40 compensates for these
images.
Input Analog Signal
IL Mismatch Corrector
ADC
Digital Data To
DDC/Output
Digital Correction
Parameters
IL Mismatch Parameters
Estimator
Analog Correction Parameters
Figure 9-9. Block diagram of Interleaving mismatch Compensation
9.1.6.2 Features
1. IL mismatch correction has 2 components – Analog Correction component and Digital Correction component.
The correction parameters are provided by the ‘IL Mismatch Parameters Estimator’ block shown in Fig 1.
2. Tracking of IL mismatch parameters happens continuously in the background, based on incoming data
(except under certain specific conditions listed in item 5).
3. IL mismatch estimation uses Nyquist band information programmed by the user, for proper estimation from
the input signals. Note that for higher Nyquist signals, the IL spurs are at Fin_alias + kFs/4 (k = 1,2,3) where
Fin_alias is the aliased input frequency between [-Fs/2,Fs/2]. This effectively gives the location of IL spurs at
the ADC output.
a. Any change in Nyquist band should be succeeded by a “pulse reset”. A pulse reset signal resets the
internal IL mismatch estimation and correction and the JESD link. However; all other registers written into
the IL engine or the status of the rest of the system is unaffected by a pulse reset. The IL mismatch
parameters would be reestimated for the new Nyquist band after a pulse reset
b. In typical use cases, signals would be present only within one Nyquist band. However, if there are signals
across multiple Nyquist bands (for eg the desired bands in multiple Nyquist bands may not alias after
sampling enabling them to be separated later), it is possible that IL performance may be degraded. So it is
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advisable to disable IL engine to get raw IL performance. The typical raw IL performance is shown in
Figure 9-10.
Typical raw IL Performance
90
60
86
56
82
52
78
48
74
44
70
0
40
IL Disable, IL Spur (dBc)
IL Enable, IL Spur (dBc)
IL Enable
IL Disable
40
80 120 160 200 240 280 320 360 400 440 480
Input Frequency (MHz)
D500
Figure 9-10. Typical raw IL Performance
4. IL image performance starts to degrade gracefully for signal frequency components > 0.9 x Fs/2, for 1st
Nyquist signals, as digital correction cannot accurately correct for signals very close to Nyquist band edge .
a. For signals in higher Nyquist bands, the performance degrades gracefully for aliased frequency
components 0.9Fs/2
5. IL correction accuracy will continue to be maintained unless any of the following conditions are hit:
a. Persistent Signal absence: The IL estimator works on the input signals to estimate and track IL mismatch
parameters over time. So if no input signal is present, then IL mismatch estimation is not possible. See
item 5f for further details.
No Estimation
Signal not present
OFF
Time
b. Persistent very weak signal only: As IL estimator works on input signals, it needs reasonable-powered
signals present for some continuous period of time to get IL estimates properly. The signal power in
atleast one frequency band of width Fs/256 has to be > -35 dBFs for proper IL estimation. Further such
signal needs to be present in chunks of atleast 100 µs for an integrated ON period of at least 10 ms over a
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total time of 100 ms for proper IL estimation. See item 5f for further details.
Estimation Valid
Signal ON time >
10ms
Signal OFF time
ON
OFF
0 ms
100 ms
Time
No Estimation
Signal ON time <
10ms
Signal OFF time
ON
OFF
0 ms
100 ms
Time
Estimation Valid
Integrated Signal ON time > 10ms, with individual ON times > 100us
ON
OFF
ON
OFF
ON
OFF
0 ms
ON
OFF
ON
OFF
ON
OFF
ON
OFF
100 ms
Time
No Estimation
Integrated Signal ON time > 10ms, BUT individual ON times < 100us
O OF
N F
O OF
N F
O OF
N F
0 ms
O OF
N F
O OF
N F
O OF
N F
O OF
N F
O OF
N F
O OF
N F
O OF
N F
Time
O OF
N F
O OF
N F
O OF
N F
O OF
N F
100 ms
c. Consistent Signal saturation: Whenever signal is saturated, signal gets distorted and IL estimation is no
longer possible. IL estimation is possible if signal amplitude is < -0.5 dBFs for more than 100 µs in one
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chunk and such chunks make up atleast 10 ms in a 100 ms window. See item 5f for further details.
No Estimation
Signal not saturated for >
10ms
Signal Saturated
Normal
Sat
0 ms
100 ms
Time
No Estimation
Signal not saturated for <
10ms
Signal Saturated
Normal
Sat
0 ms
100 ms
Time
Estimation Valid
Non-saturated(normal) time blocks > 100us with total normal block time > 10ms
Nor
mal
Nor
mal
Sat
Sat
Nor
mal
Nor
mal
Sat
0 ms
Nor
mal
Sat
Sat
Nor
mal
Nor
mal
Sat
Nor
mal
Sat
100 ms
Time
No Estimation
Non-saturated(normal) time blocks < 100us with total normal block time > 10ms
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
No
rm
al
Sat
0 ms
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100 ms
Time
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d. Signal presence in a very small band only around kfs/8: If input signal is present only within 5e-7 x Fs of
kFs/8 (k = 0,1,2,3), then no IL estimation is possible as the IL signal and IL image are not separable. See
No Estimation
Signal only
around kfs/8
+/-500Hz around fs/4
Fs/4
Fs/2 = 512 MHz
item 5f for further details.
e. Presence of high power signal component in the IL image band: In some cases, the signal component
(such as Sig1) may be present in the IL image band of other components of the signal (such as Sig0).
This signal component in IL image band (Sig1) acts as an interferer for IL estimation of the first component
(Sig0). If the ratio of the power of the signal component causing IL mismatch (power of Sig0) to the power
of the signal component in the IL image band (power of Sig1) is less than 25 dB, then IL estimation cannot
be done for that signal component (Sig0). See item 5f for further details
No Estimation
Estimation Valid
Sig0
Pwr_diff_dB <
25 dB
Sig0
Pwr_diff_dB >
25 dB
Sig1
IL image
Sig1
IL image
IL image
of Sig1
IL image of
Sig0
IL image of
Sig0
IL image of
Sig1
Frequency
Frequency
f. In the normal course of operation, old IL mismatch estimates are retained and used for correction even if
there are no current IL mismatch estimates due to any of the conditions listed in 5a – 5e. This enables
good performance when any of the conditions in 5a-5e are present for a short duration. However if any of
the conditions that prevent estimation listed in 5a – 5e persist for a large time (>40s), then the estimated
digital IL mismatch parameters are reset and the digital IL mismatch parameters are re-estimated when
the conditions for estimation becomes favorable again.
• If the user knows apriori that such a condition will occur and would like the old IL correction to be
retained, then a good option is to freeze the IL engine as in item 6. This freeze stops the IL engine and
so the old IL estimates are not discarded.
Digital IL mismatch estimates
are reset
IL mismatch estimates not available continuously for a long period
No Estimation
No Estimation
No Estimation
««.
No Estimation
No Estimation
No Estimation
40s
0
Time
98
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g. Signal and IL image overlap: If signal component is present around kfs/8 (k = 0,1,2,3), then the IL image
band will also overlap with the signal making it difficult to estimate IL mismatch parameters. Overlap of
signal and IL image bands around kfs/8 should be < Fs/256 MHz for 90% of the time for proper IL
estimation. Note that if this condition cannot be ensured, then IL performance will be degraded. If this
condition is violated in a known period, then the user can freeze IL engine when this condition occurs as
described in section 6. Otherwise, user has to switch to options in items 6 or 7 to avoid performance
Estimation Valid
Nonoverlap
> 4 MHz
No Estimation
Nonoverlap
< 4 MHz
IL image
kfs/8, k=1/
Frequency
IL
image
kfs/8, k=1/
Frequency
2/3
2/3
degradation
6. Freezing the IL Engine: If the user knows apriori that any of the conditions in item 5f occurs and would like
the old IL correction to be retained, then a good option is to freeze the IL engine. Or, if the user knows that
condition in 5g is violated at a known time, then also freezing the IL engine is a good option. Once IL engine
is frozen, all past IL estimates/correction are retained and no updates are done to the IL estimates. Once the
conditions described above are no longer present, then the IL engine can be unfrozen. The IL engine then
starts updating the estimates as though the entire period for which it was frozen did not exist at all.
Table 9-4. IL Freeze
SPI Address
SPI Data
Comments
0x4005
0x1
Enable per channel writes
0x4004
0x68
Page Select
0x4003
0x00
Page Select
0x4002
0x00
Page Select
0x4001
0x00
Page Select
0x604D
0x01
Validity for IL Freeze/Unfreeze for
CHA
0x704D
0x01
Validity for IL Freeze/Unfreeze for
CHB
0x6068
0x04
Freeze IL Engine for CHA
0x7068
0x04
Freeze IL Engine for CHB
0x4004
0x61
Page Select
0x4003
0x00
Page Select
0x4002
0x05
Page Select
0x4001
0x00
Page Select
0x6078
0x00
IL Engine Freeze Secondary
Control for CHA
0x7078
0x00
IL Engine Freeze Secondary
Control for CHB
0x4004
0x68
Page Select
0x4003
0x00
Page Select
0x4002
0x00
Page Select
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Table 9-4. IL Freeze (continued)
SPI Address
SPI Data
Comments
0x4001
0x00
Page Select
Table 9-5. IL Unfreeze
SPI Address
SPI Data
Comments
0x4005
0x00
Enable per channel writes
0x4004
0x68
Page Select
0x4003
0x00
Page Select
0x4002
0x00
Page Select
0x4001
0x00
Page Select
0x604D
0x01
Validity for IL Freeze/Unfreeze for
CHA
0x704D
0x01
Validity for IL Freeze/Unfreeze for
CHB
0x6068
0x00
Unfreeze IL Engine for CHA
0x7068
0x00
Unfreeze IL Engine for CHB
7. In case the limitations in items 5 cannot be worked around in the user system and the limitations are
permanent (eg a system where the entire band from [0,fs/2) is nearly fully occupied or signals present around
kfs/8 with overlap < Fs/256), then there are 2 options
a. Power up/Temp based IL calibration - Do calibration using a single tone (single tone frequency in
[0.77fs/2, 0.9 x fs/2], single tone power in [-0.5, -25] dBFs), either one-time or whenever temperature
changes by more than a desired threshold, and then freeze IL estimation module. During calibration, the
normal input should be bypassed and the calibration signal should be input to ADS54J40 for 100 ms for
high power signals (≥ - 3 dBFs) and 500 ms for lower powered signals. Once the calibration time is
complete, IL estimation should be frozen and normal signal may be input to ADS54J40. To determine the
temperature change for which calibration needs to be done, the user can refer to typical variation of IL
spur with temperature, under freeze conditions, as shown in Figure 9-11 .
Power Up Device
Load Default Config
Freeze IL Calibration
Provide calib signal: Single
tone @ Fin in [0.77fs/2,0.9fs/
2]. Power in [-0.5,-25] dBFS
Wait for calibration to
complete: 100ms for high
powers (>=-3dBFs) and
500ms for lower powers
Connect Regular Input Signal
Flowchart For Powerup IL calibration
Figure 9-11. Flowchart for Powerup IL Calibratuion
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Replace regular input signal with
calibration signal: Single tone @
Fin in [0.77fs/2,0.9fs/2]. Power in
[-0.5,-25] dBFS
Freeze IL Calibration
Unfreeze IL Calibration
Wait for calibration to complete:
100ms for high powers (>=3dBFs) and 500ms for lower
powers
Connect Regular Input Signal
Flowchart For IL Calibration whenever temperature changes
significantly
Figure 9-12. Flow chart for intermittent IL calibration
b. Disable IL correction – IL performance would be limited to raw IL performance as shown in figure in the
data sheet. Note that the disable IL correction sequence includes “pulse reset”. A pulse reset signal resets
the internal IL mismatch estimation and correction and the JESD link. Therefore, in case IL correction
disable is desired, it is preferable to insert this sequence within the device bring up sequence, just before
the final pulse reset is issued.
Table 9-6. IL Disable
SPI Address
SPI Data
Comments
0x4005
0x0
Enable single channel writes
0x4004
0x68
Selecting page
0x4003
0x00
Selecting page
0x4002
0x00
Selecting page
0x4001
0x00
Selecting page
0x604B
0x04
Validity for IL Correction Disable
for CHA
0x704B
0x04
Validity for IL Correction Disable
for CHB
0x6040
0x08
Disable IL Correction for CHA
0x7040
0x08
Disable IL Correction for CHB
0x6000
0x01
Pulse reset assert
0x6000
0x00
Pulse reset de-assert
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9.1.6.3 Temperature variation
IL mismatch parameters estimator tracks IL mismatch variations across temperature and gives good
performance under normal conditions. However if IL mismatch estimation is frozen, the residual IL mismatch
seen would vary with temperature as shown in Figure 9-13. To reduce the residual IL mismatch below this level,
customer may put the system in calibration mode whenever significant temperature change is detected or based
on a certain time lapse from the last calibration.
-50
Interleaving Spur (dVFS)
-55
-60
-65
-70
-75
-80
-85
-90
fIN+3fS/4
fIN+fS/2
fIN+fS/4
-95
-100
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Temperature (C)
D501
Figure 9-13. Residual IL Spur for signal at 400 Mhz vs Temperature after freezing IL calibration at 25°C
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9.2 Typical Application
The ADS54J40 is designed for wideband receiver applications demanding excellent dynamic range over a large
input frequency range. A typical schematic for an ac-coupled receiver is shown in Figure 9-14.
DVDD
10 k
5:
50 :
Driver
0.1 PF
0.1 PF
50 :
2 pF
SPI Master
5:
GND
GND
0.1 PF
GND
0.1 PF
IOVDD
0.1 PF
100 :
SYSREFM
AVDD
AVDD
AGND
3
DB3M
SYSREFP
4
DB3P
AGND
5
DGND
0.1 PF
GND
6
IOVDD
AVDD3V
7
SDIN
AVDD3V
8
SCLK
Low-Jitter Clock
Generator
AVDD
9
SEN
AGND
GND
0.1 PF
DVDD
CLKINM
10
AVDD
CLKINP
11
AVDD3V
AGND
12
SDOUT
AVDD
AVDD
0.1 PF
GND
13
AVDD
10 nF
AVDD3V
14
INBP
AGND
GND
0.1 PF
AVDD3V
15
INBM
0.1 PF
16
AVDD
VCM
DVDD
AVDD3V
NC
NC
AVDD
AGND
NC
17
10nF
AVDD
AVDD3V
18
GND
0.1 PF
AVDD3V
AVDD
2
100-: Differential
1
10 nF
19
72
20
71
21
70
22
69
23
68
24
67
25
66
26
65
27
64
GND Pad
(Back Side)
28
63
29
62
30
61
31
60
32
59
33
58
34
57
35
56
36
55
DB2P
DB2M
IOVDD
IOVDD
10 nF
DB1P
10 nF
GND
DB1M
DGND
DB0P
10 nF
GND
DB0M
IOVDD
IOVDD
0.1 PF
SYNC
GND
DA0M
FPGA
DA0P
DGND
DA1M
10 nF
GND
DA1P
IOVDD
IOVDD
10 nF
10 nF
DA2M
GND
DA2P
GND
37
38
39
40
42
43
44
45
46
47
49
51
52
53
10 nF
54
DA3M
DA3P
DGND
IOVDD
PDN
RES
RESET
AVDD3V
GND
50
100-: Differential
10 nF
DVDD
AVDD
AVDD
48
DVDD
AVDD
AVDD3V
AVDD
AVDD
INAP
INAM
AVDD
AVDD3V
AVDD
AGND
AVDD3V
41
0.1 PF
GND
0.1 PF
GND
0.1 PF
IOVDD
GND
5:
50 :
Driver
0.1 PF
0.1 PF
50 :
GND
2 pF
5:
NOTE: GND = AGND and DGND connected in the PCB layout.
Figure 9-14. AC-Coupled Receiver
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9.2.1 Design Requirements
9.2.1.1 Transformer-Coupled Circuits
Transformer-Coupled Circuits
Typical applications involving transformer-coupled circuits are discussed in this section. To achieve good phase
and amplitude balances at the ADC input, surface-mount transformers can be used (for example transformers
such as ADT1-1WT or WBC1-1 can be used for frequencies up to 300 MHz and TC1-1-13M+ for higher
frequencies) to achieve good phase and amplitude balances at the ADC inputs. When designing dc-driving
circuits, the ADC input impedance must be considered. Figure 9-15 and Figure 9-16 show the impedance (ZIN =
RIN || CIN) across the ADC input pins.
5
Differential Input Capacitance (pF)
Differential Input Resistance (k:)
1.4
1.2
1
0.8
0.6
0.4
0.2
4.75
4.5
4.25
4
3.75
3.5
3.25
3
2.75
2.5
2.25
0
0
100
200
300
400 500 600 700
Frequency (MHz)
800
0
900 1000
D103
100
200
300
400 500 600 700
Frequency (MHz)
800
900 1000
D102
Figure 9-16. CIN vs Input Frequency
Figure 9-15. RIN vs Input Frequency
By using the simple drive circuit of Figure 9-17, uniform performance can be obtained over a wide frequency
range. The buffers present at the analog inputs of the device help isolate the external drive source from the
switching currents of the sampling circuit.
0.1 F
T1
T2
0.1 F
5
CHx_INP
25
0.1 F
RIN
0.1 F
1:1
CIN
25
5
CHx_INM
1:1
Device
Figure 9-17. Input Drive Circuit
9.2.2 Detailed Design Procedure
For optimum performance, the analog inputs must be driven differentially. This architecture improves commonmode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input
pin is recommended to damp out ringing caused by package parasitics, as shown in Figure 9-17.
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9.2.3 Application Curves
0
0
-20
-20
Amplitude (dBFS)
Amplitude (dBFS)
Figure 9-18 and Figure 9-19 show the typical performance at 170 MHz and 230 MHz, respectively.
-40
-60
-80
-40
-60
-80
-100
-100
-120
-120
0
100
200
300
Input Frequency (MHz)
400
500
0
D003
SNR = 68.9 dBFS; SFDR = 86 dBc; IL spur = 84 dBc; non
HD2, HD3 spur = 89 dBc
Figure 9-18. FFT for 170-MHz Input Signal
100
200
300
Input Frequency (MHz)
400
500
D004
SNR = 68.1 dBFS; SFDR = 84 dBc; IL spur = 86 dBc; non
HD2, HD3 spur = 86 dBc
Figure 9-19. FFT for 230-MHz Input Signal
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10 Power Supply Recommendations
The device requires a 1.15-V nominal supply for IOVDD, a 1.9-V nominal supply for DVDD, a 1.9-V nominal
supply for AVDD, and a 3.0-V nominal supply for AVDD3V. For detailed information regarding the operating
voltage minimum and maximum specifications of different supplies, see the Recommended Operating
Conditions table.
10.1 Power Sequencing and Initialization
Figure 10-1 shows the suggested power-up sequencing for the device. Note that the 1.15-V IOVDD supply must
rise before the 1.9-V DVDD supply. If the 1.9-V DVDD supply rises before the 1.15-V IOVDD supply, then the
internal default register settings may not load properly. The other supplies (the 3-V AVDD3V and the 1.9-V
AVDD), can come up in any order during the power sequence. The power supplies can ramp up at any rate and
there is no hard requirement for the time delay between IOVDD ramp up to DVDD ramp-up (can be in orders of
microseconds but is recommend to be a few milliseconds).
IOVDD = 1.15 V
DVDD = 1.9 V
AVDD = 1.9 V
AVDD = 3 V
Figure 10-1. Power Sequencing for the ADS54Jxx Family of Devices
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11 Layout
11.1 Layout Guidelines
The device evaluation module (EVM) layout can be used as a reference layout to obtain the best performance. A
layout diagram of the EVM top layer is provided in Figure 11-1. The ADS54J40 EVM User's Guide, SLAU652,
provides a complete layout of the EVM. Some important points to remember during board layout are:
•
•
•
•
•
Analog inputs are located on opposite sides of the device pinout to ensure minimum crosstalk on the package
level. To minimize crosstalk onboard, the analog inputs must exit the pinout in opposite directions, as
illustrated in the reference layout of Figure 11-1 as much as possible.
In the device pinout, the sampling clock is located on a side perpendicular to the analog inputs in order to
minimize coupling between them. This configuration is also maintained on the reference layout of Figure 11-1
as much as possible.
Keep digital outputs away from the analog inputs. When these digital outputs exit the pinout, the digital output
traces must not be kept parallel to the analog input traces because this configuration can result in coupling
from the digital outputs to the analog inputs and degrade performance. All digital output traces to the receiver
[such as a field-programmable gate arrays (FPGAs) or an application-specific integrated circuits (ASICs)]
must be matched in length to avoid skew among outputs.
At each power-supply pin (AVDD, DVDD, or AVDDD3V), keep a 0.1-µF decoupling capacitor close to the
device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF
capacitors can be kept close to the supply source.
The PDN and SDOUT traces must be routed away from the analog input traces. When the PDN and SDOUT
pins are programmed to carry OVR information, the proximity of these pins to the analog traces may result in
degradation of the ADC performance because of coupling. For best performance, the PDN and SDOUT
traces must not overlap or cross the path of the analog input traces even if routed on different layers of the
PCB.
11.2 Layout Example
Figure 11-1. ADS54J40 EVM Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• ADS54J20 Dual-Channel, 12-Bit, 1.0-GSPS, Analog-to-Digital Converter
• ADS54J42 Dual-Channel, 14-Bit, 625-MSPS, Analog-to-Digital Converter
• ADS54J60 Dual-Channel, 16-Bit, 1.0-GSPS Analog-to-Digital Converter
• ADS54J66 Quad-Channel, 14-Bit, 500-MSPS ADC with Integrated DDC
• ADS54J69 Dual-Channel, 16-Bit, 500-MSPS, Analog-to-Digital Converter
• ADS54J40EVM User's Guide
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
ADS54J40IRMP
ACTIVE
VQFN
RMP
72
168
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ54J40
ADS54J40IRMPT
ACTIVE
VQFN
RMP
72
250
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
AZ54J40
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of