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AMC7823IRTAR

AMC7823IRTAR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WQFN40_EP

  • 描述:

    Analog Monitor/Control Circuit 12 bit 200k SPI 40-PWQFN (4.15x4.15)

  • 数据手册
  • 价格&库存
AMC7823IRTAR 数据手册
AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 ANALOG MONITORING AND CONTROL CIRCUIT Check for Samples: AMC7823 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • • • • • • 12-Bit ADC (200kSPS): – Eight Analog Inputs – Input Range 0 to 2 × VREF Programmable VREF, 1.25V or 2.5V Eight 12-Bit DACs (2μs Settling Time) Four Analog Input Out-of-Range Alarms Six General-Purpose Digital I/O Internal Bandgap Reference On-Chip Temperature Sensor Precision Current Source SPI™ Interface, 3V or 5V Logic Compatible Single 3V to 5V Supply Power-Down Mode/Low Power Small Package (QFN-40, 6 x 6 mm) Communications Equipment Optical Networks Automatic Test Equipment Industrial Control and Monitor Medical Equipment DESCRIPTION The AMC7823 is a complete analog monitoring and control circuit that includes an 8-channel, 12-bit analog-to-digital converter (ADC), eight 12-bit digitalto-analog converters (DACs), four analog input out-ofrange alarms, and six GPIOs to monitor analog signals and control external devices. Also, the AMC7823 has an internal sensor to monitor chip temperature, and a precision current source to drive remote thermistors, or RTDs, to monitor remote temperatures. Range Threshold Sync. Load (Ext./Internal) Analog Input Signal Ground CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 Out-of-Range Alarm DAC 0_OUT DAC-0 ADC ADC Trigger (External / Internal) CH8 DAC 7_OUT DAC-7 Channel Select TEMP On-Chip Temperature Sensor Ext. Ref _ IN Reference Precision_Current Current_Setting Resistor Serial-Parallel Shift Reg BVDD DGND DVDD AVDD AGND GPIO-5 GPIO-4 GPIO-3 / ALR3 GPIO-0 / ALR0 DAV GALR RESET MISO SS MOSI SPI Interface SCLK ELDAC CONVERT (Ext. ADC Trigger) (Ext. DAC Sync Load) Registers and Control Logic 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Motorola, Inc. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2012, Texas Instruments Incorporated AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com DESCRIPTION (CONTINUED) The AMC7823 has an internal programmable reference (+2.5V or +1.25V), and an SPI serial interface. An external reference can be used as well. Typical power dissipation is 100mW. The analog input range is 0V to +5V, and the analog output range is 0V to +2.5V or 0V to +5V. The AMC7823 is ideal for multichannel applications where low power and small size are critical. The AMC7823 is available in a 40-lead QFN package and is fully specified over the –40°C to +85°C temperature range. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGELEAD (DESIGNATOR) SPECIFIED TEMPERATURE RANGE AMC7823 QFN-40 (RTA) –40°C to +85°C (1) PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY AMC7823 AMC7823IRTAT Tape and Reel, 250 AMC7823 AMC7823IRTAR Tape and Reel, 2000 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. AMC7823 UNIT AVDD, DVDD, BVDD to GND PARAMETER –0.3 to +6 V Digital input voltage to GND –0.3 to BVDD + 0.3 V Analog input voltage to GND –0.3 to AVDD + 0.3 V ±20 mA Input current, continuous Input current, momentary ±100 mA Operating temperature range –40 to +105 °C Storage temperature range –65 to +150 °C +150 °C Junction temperature range (TJ max) (TJ max – TA) / θJA W θJC 15 °C/W θJA 60 °C/W Power dissipation Thermal impedance (1) 2 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 ELECTRICAL CHARACTERISTICS: +5V At –40°C to +85°C, AVDD = 5V, DVDD = 5V, BVDD = 3V to 5V, using external 2.5V reference, unless otherwise noted. AMC7823 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ADC ANALOG INPUTS Input voltage range 0 2 × VREF V Input impedance 5 MΩ Input capacitance 15 pF Input leakage current ±1 μA ANALOG-TO-DIGITAL CONVERTER Resolution 12 No missing codes Integral linearity Differential linearity Bits –1.25 +1.25 LSB (1) –1 +1.25 LSB Offset error ±2 Offset error drift ±4 Offset error match 0.5 Gain error Gain error match 0.3 Noise 70 Power-supply rejection AVDD = 5V ±5% Sample rate (2) Total conversion time Bits 12 Scan Channels 0 through 7 LSB ppmFS/°C 1 LSB ±6 LSB 1 LSB μVRMS 70 dB 200 kHz 45 μs Total conversion time including temperature Scan Channels 0 through 8 56 μs Channel-to-channel isolation 0.5 LSB VIN = 5VPP at 10kHz DIGITAL-TO-ANALOG CONVERTER (3) Output voltage range Programmable Output current Refer to Typical Characteristics 0 2 × VREF ±1 Resolution Integral linearity (4) Monotonicity mA 12 Bits ±2 ±8 LSB ±0.2 ±1 LSB ±0.5 ±5 mV ±1 ±10 12 Differential linearity Offset error V Output range = 0 to VREF Output range = 0 to 2 × VREF Offset error drift Bits ±4 Gain error Output range = 0 to 2 × VREF Settling time Step between code 0x400 to 0xC00, to ±1LSB Code change glitch 1LSB change, in worst case Overshoot Step between code 0x400 to 0xC00 Crosstalk Step between code 0x400 to 0xC00 < 0.5 LSB Signal-to-noise ratio Sine wave (1kHz, 5VPP) generated by DAC, sampling at 400kSPS, RL = 10kΩ, CL = 100pF 74 dB Output buffer gain = 2 60 nV/√Hz Output buffer gain = 1 30 nV/√Hz Output noise voltage density (1) (2) (3) (4) ±0.3 mV ppmFS/°C ±1.0 %FS 2 μs 20 nV-s 200 mV LSB means least significant bit. Single-channel conversion only. Does not include control logic delay associated with ADC operation, such as from the trigger signal to the start of conversion. DAC is tested with load of 25kΩ in parallel with 100pF to ground. Measured from code 0x008 to 0xFFF. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 3 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com ELECTRICAL CHARACTERISTICS: +5V (continued) At –40°C to +85°C, AVDD = 5V, DVDD = 5V, BVDD = 3V to 5V, using external 2.5V reference, unless otherwise noted. AMC7823 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 10 mA 100.0 100.5 μA PRECISION CURRENT SOURCE Output current range 0.01 Output current accuracy Iout = 100μA 99.5 Output current drift Iout = 100μA 40 ppm/°C Output impedance Iout = 100μA 100 MΩ Compliance voltage of pin PRECISION_I_OUTPUT Iout = 10mA 4.25 V 60 dB 3 Power-supply rejection ratio VOLTAGE REFERENCE (VREF) Internal reference voltage (5) At +25°C Internal reference drift –40°C to +85°C 2.495 Output impedance of pin EXT_REF_IN as internal reference output Short-circuit current 2.505 ppm/°C 10 kΩ 1.20 Internal reference selected Internal reference de-selected External reference input capacitance V ±15 μA 250 External reference voltage External reference input resistance 2.50 2.55 V 10 kΩ 1 MΩ 5 pF TEMPERATURE SENSOR Temperature range Resolution –40 °C VREF = 2.5V +3.2 °C VREF = 1.25V +1.6 °C ±4 °C ±2.0 °C VREF = 2.5V Accuracy +85 VREF = 1.25V LEVEL OF PIN GALR AND DAV IOH = 0.7mA 2.4 BVDD V IOL = 180μA 0 0.4 V DIGITAL INPUT/OUTPUT, EXCEPT PIN GALR AND DAV VIH BVDD = 5V, IIH = 5μA 3.5 BVDD + 0.3 V VIL BVDD = 5V, IIL = –5μA 0 0.8 V VOH Logic level BVDD = 5V, IOH = –3mA 4 BVDD V VOL BVDD = 5V, IOL = 3mA 0 0.4 V VIH BVDD = 3V, IIH = 5μA 2.1 BVDD + 0.3 V VIL VOH Logic level VOL BVDD = 3V, IIL = –5μA BVDD = 3V, IOH = –3mA BVDD = 3V, IOL = 3mA Input capacitance (5) 4 0 0.6 V 2.4 BVDD V 0 0.4 V 5 pF Bit GREF in AMC Status/Configuration Register determines the internal reference voltage. The internal VREF = 2.5V when GREF = 1, and the internal VREF = 1.25V when GREF = 0 (see AMC Status/Configuration Register for details). Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 ELECTRICAL CHARACTERISTICS: +5V (continued) At –40°C to +85°C, AVDD = 5V, DVDD = 5V, BVDD = 3V to 5V, using external 2.5V reference, unless otherwise noted. AMC7823 PARAMETER TEST CONDITIONS MIN TYP MAX 2.7 5 UNIT POWER-SUPPLY REQUIREMENTS Powersupply voltage AVDD DVDD (6) BVDD (7) Quiescent current of AVDD 5.5 V 2.7 5.5 V 2.7 5.5 V In normal operation, precision current source = 0, no DAC load 15 All power-down 20 mA 1 Quiescent current of DVDD 0.3 Quiescent current of BVDD 0.1 mA mA Power dissipation 100 mW TEMPERATURE RANGE Specified performance –40 +85 °C Storage –65 +150 °C (6) (7) DVDD must equal AVDD. BVDD must not be greater than AVDD or DVDD. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 5 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com ELECTRICAL CHARACTERISTICS: +3V At –40°C to +85°C, AVDD, DVDD, BVDD = 3V, using external 1.25V reference, unless otherwise noted. AMC7823 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ADC ANALOG INPUTS Input voltage range 0 2 × VREF V Input impedance 5 MΩ Input capacitance 15 pF Input leakage current ±1 μA ANALOG-TO-DIGITAL CONVERTER Resolution 12 No missing codes 12 Integral linearity Differential linearity Bits –1.25 +1.25 LSB (1) –1 +1.25 LSB Offset error ±3 Offset error drift ±4 Offset error match 0.5 Gain error Gain error match 0.3 Noise 70 Power-supply rejection AVDD = 3V ±5% Sample rate (2) Total conversion time Bits Scan Channels 0 through 7 LSB ppmFS/°C 1 LSB ±12 LSB 1.5 LSB μVRMS 70 dB 200 kHz 47 μs Total conversion time including temperature Scan Channels 0 through 8 58 μs Channel-to-channel isolation 0.5 LSB VIN = 2.5VPP at 10kHz DIGITAL-TO-ANALOG CONVERTER (3) Output voltage range Programmable Output current Refer to Typical Characteristics 0 2 × VREF ±1 Resolution Integral linearity (4) Monotonicity Offset error mA 12 Bits ±2 ±8 LSB ±0.2 ±1 LSB ±0.5 ±5 mV ±1 ±10 12 Differential linearity Output range = 0 to VREF Output range = 0 to 2 x VREF Offset error drift V Bits ±4 Gain error Output range = 0 to 2 x VREF Settling time Step between code 0x400 to 0xC00, to ±1LSB Code change glitch 1LSB change, in worst case Overshoot Step between code 0x400 to 0xC00 Crosstalk Step between code 0x400 to 0xC00 [EA] ? No Yes Update ADC-n Data Register Auto-Mode, Internal Trigger only (4) Auto-Mode Yes Apply 2-ms Pulse (Low) to Pin DAV No (3) Direct-Mode Set DAVF bit; Drive DAV Pin Low ADC in idle Waiting new trigger (1) [SA] represents the first input channel, [EA] represents the last input channel. [ADR] represents the current input channel. [SA3:SA0] is the address of [SA]. [EA3:EA0] is the address of [EA]. (2) GALR pin goes high and bits ALR-n are cleared after new ADC Conversion trigger. (3) After reading the ADC Data Register, bit DAVF is cleared, and the DAV pin goes high. (4) In Auto-mode, bit DAVF is always cleared. Figure 45. ADC Operation Flow Chart Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 27 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com ON-CHIP TEMPERATURE SENSOR The AMC7823 has an integrated temperature sensor to measure the on-chip temperature. This measurement relies on the characteristics of a semiconductor p-n junction operating at a known current level. The forward voltage of the diode (VBE) depends on the current passing through it and the junction temperature. Diode Temperature Sensor SW2 I2 (10 mA) CH8 (TEMP) MUX Channel CH8 is dedicated to the on-chip temperature sensor. When CH8 is converted, the on-chip temperature measurement process is activated. Two measurements, and therefore two ADC conversions, are required to capture the temperature data. First, the diode is driven by current I1 (750μA) and the forward voltage VBE1 is measured. Next, the diode is driven by current I2 (10μA) and VBE2 is measured. The difference of these two voltages, ΔVBE, is stored in the ADC-8 Data Register as straight binary code. See Figure 46. ADC SW1 I1 (750 mA) NOTE: When CH8 is converted, two conversions are performed. During the first conversion, SW1 is turned on, SW2 is off, and the diode is driven by I1 (750μA). During the second conversion, SW2 is turned on, SW1 is off, and the diode is driven by I2 (10μA). Figure 46. Local Temperature Sensor Operation In direct-mode operation, the temperature can be measured by converting Channel CH8 only, or by converting several channels including Channel CH8. In auto-mode, the temperature must be measured by converting at least two channels including Channel CH8. The following equations illustrate the corresponding temperature calculation process: ΔVBE (mV) = decimal code (convert from ADC-8 Data Register binary code) × 1.22mV for VREF = 2.5V or ΔVBE (mV) = decimal code (convert from ADC-8 Data Register binary code) × 0.61mV for VREF = 1.25V. Temp (K) = 2.6 × ΔVBE (mV) or Temp (°C) = 2.6 × ΔVBE (mV) – 273K. The resolution of this calculation is 3.2°C/LSB when the reference voltage is 2.5V and 1.6°C/LSB for a reference voltage of 1.25V. The temperature sensor is powered by the reference. When the internal reference is used, a filter capacitor (for example, 10μF) from pin 21 (EXT_REF_IN) to AGND is recommended to improve temperature reading; refer to the Reference section for more information. 28 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 DAC OPERATION (see DAC-n Data Registers and DAC Configuration Register) AMC7823 has eight double-buffered DACs. The outputs of the DACs can be updated synchronously or individually (asynchronously). Figure 47 illustrates the generic DAC structure. Data to Host when Read Data from Host DAC-0 VOUT Range: 0 - VREF x Gain DAC-0 Latch DAC-0 Data VOUT0 Bit SLDA-n of DAC Configuration Register determines when DAC-n Latch is loaded with the value of DAC-n Data Register. SLDA-n = 1: Latch is loaded when Synchronous Loading signal occurs; synchronous loading SLDA-n = 0: Latch is loaded immediately after DAC-n Data register is written; asynchronous loading Bit PDAC-0 (Power-Down bit in Power-Down Register; see (1) ) 5 kW Gain = 2 if GDAC-0 = 1 Gain = 1 if GDAC-0 = 0 Bit GDAC-0 (DAC Configuration Register) DAC-7 DAC-7 Data BB00h Load DAC Register Bit PDAC-7 (Power-Down bit in Power-Down Register) Internal ILDAC Synchronous Loading Signal Bit GDAC−7 External ELDAC Loads all DAC-n latches when corresponding SLDA-n is set to ‘1’. Does not affect DAC-n when SLDA-n is cleared to ‘0’. (1) When PDAC-n = 0, DAC-n is in power-down mode; the output buffer of DAC-n connects to ground through a 5kΩ load. Figure 47. DAC Structure Double-Buffered Data Register All eight DAC data registers are double-buffered. Each DAC has an internal latch preceded by an input register. Data are initially written to an individual DAC-n Data register and then transferred to its corresponding DAC-n Latch. When the DAC-n Latch is updated, the output of DAC-n changes to the newly set value. When the host reads the register memory map location labeled DAC-n Data, the value held in the DAC-n Latch is returned (not the value held in the input DAC-n Data Register). Synchronous Load, Asynchronous Load, and Output Updating The DAC latches can be updated synchronously or asynchronously. The bit SLDA-n (Synchronous Load) of the DAC Configuration Register is used to specify the DAC updating mode. Asynchronous mode is active when SLDA-n is cleared to '0'. Immediately after writing to the DAC-n Data Register, its data are transferred to the corresponding DAC-n Latch Register, and the output of DAC-n changes accordingly. Synchronous mode is selected when the bit SLDA-n is set to '1'. The value of the DAC-n Data Register is transferred to the DAC-n Latch only after an active DAC synchronous loading signal occurs, which immediately updates the DAC-n output. Under synchronous loading operation, writing data into a DAC-n Data Register changes only the value in that register, but not the content of DAC-n Latch nor the output of DAC-n, until the synchronous load signal occurs. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 29 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com The DAC synchronous load signal can be the rising edge of the external signal ELDAC, or the internal signal ILDAC. Write BB00h into the Load DAC Register to generate ILDAC. When the DAC synchronous load signal occurs, all DACs with the bit SLDA-n set to '1' are updated simultaneously with the value of the corresponding DAC-n Data register. By setting the bit SLDA-n properly, several DACs can be updated at the same time. For example, to update DAC0 and DAC1 synchronously, the host sets the bits SLDA-0 and SLDA-1 to '1' first, then writes the proper values into the DAC-0 Data and DAC-1 Data registers, respectively. After this presetting, the host activates ELDAC (or ILDAC) to load DAC0 and DAC1 simultaneously. The outputs of DAC0 and DAC1 change at the same time. Table 5 summarizes methods to update the output of DAC-n. Table 5. DAC-n Output Update Summary BIT SLDA-n WRITING LOAD DAC REGISTER EXTERNAL ELDAC SIGNAL 0 Don't care Don't care OPERATION Update DAC-n individually. DAC-n Latch and DAC-n Output are immediately updated after writing to DAC-n Data Register 1 Write 0xBB00 0 Simultaneously update all DAC by internal trigger . Writing 0xBB00 generates internal load DAC trigger signal ILDAC, which causes DAC-n Latches and DAC-n Outputs to be updated with the contents of corresponding DAC-n Data Register. 1 No Rising edge Simultaneously update all DACs by external trigger ELDAC. Rising edge of ELDAC causes DAC-n Latches and DAC-n Outputs to be updated with the contents of corresponding DAC-n Data Register. Full-Scale Output Range The full-scale output range of each DAC is set by the product of the value of the reference voltage times the gain of the DAC output buffer, VREF × Gain. The bit GDAC-n (Gain of DAC-n output buffer) of the DAC Configuration Register sets the gain of the individual DAC-n output buffer. The gain is unity (1) when GDAC-n is cleared to '0', and is 2 when GDAC-n is set to '1'. The value of VREF may be controlled by bits SREF and GREF in the AMC Status/Configuration Register and by the choice of internal or external reference. For a similar description, see the Full-Scale Range of Analog Input in the ADC Operation section. Full-scale output range of each DAC is limited by the analog power supply because the DAC output buffer cannot exceed AVDD. Table 6 shows how to configure the DAC output range. Table 6. Configuration of DAC Output Range OUTPUT RANGE 30 SREF GREF GDAC-n REFERENCE AVDD = 3V AVDD = 5V 0 0 0 Internal 1.25V 0V to 1.25V 0V to 1.25V 0 0 1 Internal 1.25V 0V to 2.5V 0V to 2.5V 0 1 0 Internal 2.5V 0V to 2.5V 0V to 2.5V 0 1 1 Internal 2.5V Saturated at 3V 0V to 5V 1 Don't care 0 External VREF 0V to External VREF, External VREF ≤ AVDD 0V to External VREF, External VREF ≤ AVDD 1 Don't care 1 External VREF 0V to External VREF × 2 2 × External VREF ≤ AVDD 0V to External VREF × 2 2 × External VREF ≤ AVDD Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 After power-on or reset, all DAC-n Data Registers and all DAC-n Latches are cleared to '0'. This clearing process results in all DAC outputs at 0V, gain of unity, and a full-scale output range preset to either 1.25V or equal to the external reference (if it is applied) because bits SREF and GREF are also cleared to '0'. Zero Code Output Value Each DAC buffer is clamped to prevent the output from going to 0V. Thus, when the input code is 000h, the output is typically 15mV to 20mV. This output keeps the closed-loop DAC output buffer in an active, stable operating regime, allowing it to immediately respond to an input that produces an output typically greater than 20mV. Near-zero-volt output for a particular DAC-n may be achieved by clearing bit PDAC-n to '0' in the PowerDown register. POWER-DOWN MODE The AMC7823 is implemented with power-down mode. Bits in the Power-Down Register control power applied to the ADC, each DAC output buffer, the output amplifier of the precision current source, and the reference buffer. The reference buffer drives all the DAC resistor strings and supplies reference voltage to the precision current source. After power-on reset or any forced hardware or software reset, the Power-Down Register is cleared, and all these specified components are in power-down mode. In power-down mode, most of the linear circuitry is shut down. The ADC halts conversions, output current of the precision current source drops to zero, and each external DAC output pin is switched from the DAC output buffer to analog ground through an internal 5kΩ resistor. The internal reference and the internal oscillator remain powered to facilitate rapid recovery from power-down mode. None of the bits in the Power-Down Register affect the digital logic. All digital signals (such as the SPI interface, RESET, ELDAC, ALR, and all GPIOs) still work normally in any power-down condition. In power-down mode, the host can read registers to get information, or write to registers to change settings. No write operation can start the ADC (if the ADC is in power-down), or change the DAC output (if the DAC is in power-down), but write operations can update register values. The new register values are effective immediately upon exiting the powerdown mode. In this way, the host can preset DACs and the ADC before a wake-up call. The contents of all Page 1 addresses (see Table 2) do not change when entering or exiting power-down mode. The contents of the ADC registers and the alarm information in the ALR and GPIO Registers of Page 0 do not change when entering or exiting power-down mode if the ADC is in direct mode before powering down. To avoid losing ADC register content and alarm information in the ALR and GPIO Registers while the ADC is powered down, do not issue a convert command during power-down mode. General-purpose I/O data are not affected. For details, see the sections on the ALR Register and the GPIO Register. For power-down mode details, see the Power-Down Register section. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 31 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com REFERENCE The AMC7823 requires a reference voltage to drive the ADC, the DACs, and the precision current source. It can accommodate the application of an external reference voltage, or it can supply reference from an internal bandgap voltage circuit as shown in Figure 48. Pin 21, EXT_REF_IN, is common to either source. An internal 10kΩ resistor connects the internal reference source to pin 21. This pin provides a point for noise filtering by placing a capacitor, if desired, from the pin to analog ground. The time constant of this filter is [ (10kΩ) × (CFILTER) ]. The resistor also allows an external reference applied to pin 21 to override the internal reference, provided it can drive the 10kΩ load. The filter capacitor can be 10μF when the internal reference is selected. When using an external reference, it is recommended to use a buffered reference (such as the REF5025). C Filter 21 1.25 V 10 kW Bandgap Reference A1 2.5 V Bit GREF = 0 Bit SREF = 1 (Refer to diagram of Current Source, Figure 49) To DACs Buffer and Controller A2 To Precision Current Source To ADC Figure 48. Reference Logic bits SREF and GREF of the AMC Status/Configuration Register specify operation of the internal reference and also should be considered when applying an external reference, as explained below. These bits also provide information to the precision current source and are used in configuring that source (refer to the Precision Current Source section for details). When SREF is cleared to '0' (the default or power-on reset condition), the internal reference is selected and connected to pin 21 by the 10kΩ resistor. When SREF is set to '1', the internal reference is de-selected and disconnected from pin 21. Pin 21 then floats unless an external reference is applied. The bit GREF selects one of two pre-set values for the internal reference voltage. When GREF is cleared to '0', the internal reference voltage is +1.25V. When GREF is set to '1', the internal reference voltage is +2.5V. It is recommended to always set SREF to '1' when using an external source; otherwise, the external reference must sink or source a current of value equal to the difference in the reference voltages divided by 10kΩ. For example, if SREF and GREF are both cleared to '0' and a 2.5V external reference is applied, the AMC7823 must unnecessarily sink 125μA. 32 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 PRECISION CURRENT SOURCE The AMC7823 provides the user with a precision current source for driving an external component such as a thermistor. Output current from pin 5 is set by the value of the resistor (RSET) connected from pin 4 to the analog supply voltage. This resistor should be close to the AMC7823 to minimize any voltage drop from the analog supply to the resistor. Internal closed-loop circuitry impresses a fixed voltage across the set resistor by means of an operational amplifier and a PMOS-follower output driver. Current through the set resistor supplies the follower. The follower driver supplies this current to the external load connected from PRECISION_I_OUTPUT (pin 5) to ground. This circuit architecture maintains high output impedance and provides wide output voltage compliance. See Figure 49. +5 V VSET RSET ISET_RESISTOR AVDD Reference Int. / Ext. GREF SREF PREFB Buffer and Control Circuit VSET PTS AGND PRECISION_I_OUTPUT Load AMC7823 IO Figure 49. Diagram of Current Source In addition to the external setting resistor RSET, four logic bits—PTS and PREFB in the Power-Down Register and SREF and GREF in the AMC Status/Configuration Register—are used to configure the current source as well. Table 7 describes how to configure the current source. The bit PTS is the current source power-down bit. When PTS is cleared to '0', the current source is in powerdown mode, and the output current is zero. When PTS is set to '1' and PREFB is set to '1', the current source is in normal operation. Bit SREF is the reference source selection bit. When SREF is cleared, the internal reference is selected. When SREF is set to '1', the internal reference is de-selected. Set SREF = '1' when an external reference is applied. GREF is the internal reference gain bit. PREFB is the Reference Buffer Amplifier Power-Down bit. Both bits provide information to the current source circuit, and affect the current source configuration. If the internal reference is used, and no external reference is applied to pin 21, the output current is 0.5V/RSET (VSET = 0.5V) or zero, depending on bits PREFB and GREF, as shown in Table 7. For a precise calculation, measure the voltage across the set resistor (VSET) and divide it by the precise value of RSET. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 33 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com Table 7. Precision Current Source Configuration (1) (2) SREF PTS PREFB GREF IO 0 0 Don't care Don't care 0 0 1 0 1 0 1 Don't care 0 0.5V/RSET (1) 0 1 1 1 0.5V/RSET (1) 1 0 Don't care Don't care 1 (2) 0 0 1 1 0 1 1 Don't care 0 (2) Equation 1 0 1 1 1 1 (2) Equation 1 VSET = 0.5V. Make GREF = 1 for 2.5V external reference; make GREF = 0 for 1.25V external reference. When an external reference is used, select a reference value (VREF) close to either 1.25V or 2.5V, and write bit GREF low ('0') for a 1.25V reference, or write it high ('1') for a 2.5V reference. These settings make a better match to the applied external reference value. The output current can be calculated by Equation 1: (VREF 0.4) V I OUTPUT + SET + RSET (1)GREF) RSET (1) The applied external reference voltage may deviate from the recommended values, but it is important to limit the maximum voltage applied to the set resistor to approximately 0.5V. Voltages greater than 0.5V across the set resistor reduce the specified compliance of the current source to the load. DIGITAL I/O (See the AMC Status/Configuration Register) The AMC7823 has four special function pins: DAV, GALR, ELDAC, and CONVERT. It also has six general I/O pins (GPIO-n). The GPIO-n pins are used as general digital I/O or analog input out-of-range indicators. The pin DAV is an output pin that indicates the completion of ADC conversions. Bit DAVF of the AMC Status/Configuration Register determines the status of the DAV pin. In direct-mode, after the selected group of input channels has been converted and the ADC has been halted, bit DAVF is set to '1' and pin DAV is driven to logic low (active). In auto-mode, each time the group of input channels has been sequentially converted, a 2μs pulse (low) appears on the DAV pin after the last channel of the group is converted. This conversion sequence is repeated and the pulse is repeated. The GALR pin is an output pin that indicates whether any of the first four analog inputs being converted are outof-range. Bits ALR-n of the ALR Register determine the status of GALR pin. GALR is low (or active) if any one of the bits ALR-n is set to '1'. GALR is high (inactive) if and only if all bits are cleared to '0'. See Figure 50. DAV Pin in Direct Mode Bit DAVF of AMC Status / Configuration Register DAV Pin DAV Pin in Auto Mode [EA3:EA0] is Converted 2ms Pulse Generator Bit ALR-0 Bit ALR-1 Bit ALR-2 Bit ALR-3 DAV Pin GALR Pin Figure 50. DAV Pin and GALR Pin The CONVERT pin is an input pin for the external ADC trigger signal. When bit ECNVT of the AMC Status/Configuration Register is set to '1', the AMC7823 works in external trigger mode. The rising edge of CONVERT starts the ADC conversion. 34 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 The ELDAC pin is an input pin for the external DAC synchronous load signal. The rising edge of ELDAC updates all DAC-n simultaneously that have the corresponding bit SLDA-n set to '1'. The AMC7823 has six GPIO pins, GPIO-n (n = 0, 1, 2, 3, 4, 5). Pins GPIO-4 and GPIO-5 are dedicated to general bidirectional digital I/O signals. The remaining pins (n = 0, 1, 2, 3) are dual-purpose pins, and can be programmed as either bidirectional GPIO or ALR (out-of-range alarm) indicators. Figure 51 shows the pin structure of GPIO-4 and GPIO-5. See Figure 52 for the pin structure of GPIO-n (n = 0, 1, 2 and 3). The bit IOMOD-n (n = 0, 1, 2, 3) in the GPIO register defines the function of these dual-purpose GPIO-n pins (see Table 8). When the corresponding IOMOD-n bit is cleared to '0', GPIO-n pins are configured as out-of-range indicators (denoted ALR-0, ALR-1, ALR-2, and ALR-3) for the first four analog inputs being converted. As an outof-range indicator, the ALR-n pin is an output whose status is determined by bits ALR-0, ALR-1, ALR-2, and ALR-3 of the ALR Register. When ALR-n is set to '1', the ALR-n pin is low. When ALR-n is cleared to '0', the ALR-n pin is in high impedance status. When IOMOD-n is set to '1', the GPIO-n pin works as a general, bidirectional digital I/O pin. Table 8. GPIO Function IOMOD-n PIN NAME 1 0 GPIO-0 GPIO ALR-0 GPIO-1 GPIO ALR-1 GPIO-2 GPIO ALR-2 GPIO-3 GPIO ALR-3 When the GPIO-n pin works as general, bidirectional digital I/O, it can receive an input or produce an output. (See Figure 51 and Figure 52.) When acting as output, its status is determined by the corresponding bit IOST-n (I/O Status) of the GPIO Register. The output is high impedance when bit IOST-n is set to '1' and is logic low when bit IOST-n is cleared to '0'. An external pull-up resistor is required when using GPIO-n as output. When GPIO-n acts as input, the digital value on the pin is acquired by reading the bit IOST-n. After power-on reset or any forced hardware or software reset, all IOMOD-n and IOST-n bits are set to '1', and all GPIO pins work as general I/O pins in high impedance status. See the GPIO Register for more detail. GPIO-n ENABLE IOST-n (when writing IOST-n) IOST-n (when reading IOST-n) Figure 51. Pin Structure of GPIO-4 and GPIO-5 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 35 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com Bit ALR-n of ALR Register Bit IOMOD-n in GPIO Register Bit IOST-n in GPIO Register GPIO-n ENABLE IOMOD-n = 0, ALR-n Pin IOMOD-n = 1, Digital I/O Pin Bit IOST-n (when reading) Figure 52. Pin Structure of GPIO-0, GPIO-1, GPIO-2, and GPIO-3 ANALOG INPUT OUT-OF-RANGE ALARM (See ADC Operation) The AMC7823 provides out-of-range detection for the first four analog inputs of the group of inputs specified by the starting and ending addresses [SA3:SA0] and [EA3:EA0], respectively. Figure 53 describes the analog out-ofrange logic. Alarm bits ALR-n in the ALR Register are set to '1' to flag an out-of-range condition. If the nth analog input is out of the preset range, then bit ALR-n is set to '1'. The nth alarm bit does not necessarily correspond to input channel address n, however. For example, if [SA3:SA0] and [EA3:EA0] of the ADC Control Register are 0x04 and 0x07, respectively, then the channel address of the first analog input is [0x04] and the corresponding alarm bit is ALR-0. The address of the fourth input channel is [0x07] and its corresponding alarm bit is ALR-3. Only the first four analog inputs can be implemented with out-of-range detection. In this example, the addresses of the first four inputs implemented with out-of-range detection are [0x04], [0x05], [0x06], and [0x07], respectively. However, if [SA3:SA0] is equal to [0x00] and [EA3:EA0] is equal to [0x07], then the addresses of the first four are [0x00], [0x01], [0x02] and [0x03]. Threshold-Hi-n Register (Upper Bound) − + nth Analog Input Threshold-Low-n Register (Lower Bound) ALR-0 ALR-1 ALR-2 ALR-3 Bit ALR-n of ALR Register − + ALR-n is always ‘0’ when Threshold-Low-n is equal to 0 and Threshold-Hi-n is equal to full-scale of input GALR Pin NOTE: Threshold-Hi-n must not be smaller than Threshold-Low-n. Otherwise, ALR-n is always '1'. Figure 53. Analog Out-of-Range Alarm Logic 36 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 The value in the Threshold-Hi-n Register defines the upper bound threshold of the nth analog input, while the value in Threshold-Low-n defines the lower bound. These two bounds specify a window for the out-of-range detection. The out-of-range condition occurs when the input is set outside the window defined by these boundaries. To implement single upper-bound threshold detection, the host processor can set the upper bound to the desired value and the lower bound to zero. For lower-bound detection, the host can set the lower bound to the desired value and the upper bound to the full-scale input. To deactivate the alarm function (ALR-n always '0'), set the threshold registers to their default values as specified in Table 2. Note: The value of Threshold-Hi-n must not be less than the value of Threshold-Low-n; otherwise, ALR-n is always set to '1' and the alarm indicator is always active. If any out-of-range alarm occurs, the Global Alarm pin (GALR, pin 1) goes logic low. This function provides an interrupt to the host so that it may query the ALR Register (alarm register) to determine which channels are outof-range. The general-purpose I/O pins, GPIO-0, GPIO-1, GPIO-2 and GPIO-3, are dual-purpose and can be configured as individual out-of-range alarm indicators denoted as ALR-0, ALR-1, ALR-2 and ALR-3 as discussed previously. Each ALR-n pin displays the logical complement of of each corresponding ALR-n bit. For example, when an alarm condition occurs, bit ALR-n is set to '1' and pin ALR-n goes logic low. For each GPIO-n pin configured as an alarm, its corresponding IOST-n bit in the GPIO Register displays the complement of bit ALR-n. For example, when bit ALR-n is set to '1', bit IOST-n is cleared to '0'. (Note that pins GPIO-4 and GPIO-5 are not dual-purpose, and are general digital I/O pins only.) CLEARING ALARM INDICATORS In summary, the alarm condition would have pin GALR (pin 1) and one or more pins ALR-n at logic low, one or more bits IOST-n cleared to '0', and one or more bits ALR-n set to '1'. All of these remain in alarm status until the alarm-causing conditions are removed and a new conversion is completed. When the ADC is operating in automode, the alarm indicators are displayed after the first 2μs pulse on pin DAV following detection of one or more of the first four input channels out-of-range. The selected group of input channels is converted repeatedly and the alarm indicators remain constant until the offending inputs are corrected or until the threshold window levels are adjusted. When the alarm-causing conditions are removed, the alarm indicators are cleared after the first 2μs pulse on DAV following removal. When the ADC is operating in direct-mode, the alarm indicators are displayed after the first data valid signal (DAV, pin 2, at logic low) following an out-of-range condition. The alarm indicators remain constant until either the inputs are corrected or the threshold windows adjusted, and another convert command is issued and completed. In either operating mode, the alarm indicators may be cleared if a new conversion command is issued identifying a subset of input channels not containing the channel or channels out of range. The alarm indicators may also be cleared by a general hardware or software reset, or a power-on reset. POWER-ON RESET AND POWER-SUPPLY SEQUENCE After power-on or reset, all registers are reset to the default values (see Table 2). In order for the device to work properly, BVDD must not be applied before DVDD and AVDD are applied, and DVDD must not be applied before AVDD is applied. All three supplies must power up before the external reference voltage (if any) is applied. Additionally, because the DAC input shift register is not reset during a power-on reset (or during a hardware reset or software reset), the SS pin must not be unintentionally asserted during power-up of the device. It is recommended that the SS pin be connected to BVDD through a pull-up resistor to avoid improper power-up. Likewise, the state of the ELDAC pin must be maintained at ground potential during power-up. To ensure that the ESD protection circuitry of this device is not activated, all other digital pins must remain at ground potential until BVDD is applied. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 37 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com REGISTERS This section describes each of the registers shown in the memory map of Table 2. The registers are named descriptively, according to their respective functions. NOTE: After power-on or reset, all ADC channels, all DACs, and the precision current source are in a powereddown state. The user must write the Power-Down Register properly in order to activate the desired components. For details, see the Power-Down Register section. AMC Status/Configuration Register (Read/Write; see Figure 50, DAV Pin and GALR Pin) Bit 15 MSB X Bit 14 RSTC Bit 13 DAVF Bit 12 0 Bit 11 X Bit 10 X Bit 9 X Bit 8 X Bit 7 SREF Bit 6 GREF Bit 5 ECNVT Bit 4 X Bit 3 X Bit 2 X Bit 1 X Bit 0 LSB X X : Don't Care RSTC RESET Complete Bit. This bit is set to '1' on power-up or reset. This bit can be cleared by writing '0' to this location. The host cannot set this bit to '1'. This bit allows the host to determine if the part has been configured after power-up, or if a reset has occurred to the AMC7823 without knowledge of the host. DAVF ADC Data Available Flag. For direct-mode only. Always cleared (set to '0') in auto-mode (see ADC Control Register). DAVF = 1: The ADC conversions are complete and new data are available. DAVF = 0: The ADC conversion is in progress (data is not ready) or the ADC is in Auto-Mode. In direct-mode, bit DAVF sets the pin DAV. DAV goes low when DAVF = 1, and goes high when DAVF = 0. In auto-mode, DAVF is always cleared to '0'. However, a 2μs pulse (active low) appears on the DAV pin when the input with ending address [EA3:EA0] is converted. DAVF is cleared to '0' in one of three ways: (1) reading the ADC Data Register; (2) starting a new ADC conversion; or (3) writing '0' to this bit. Bit 12 Read-only. Always '0'. SREF Select Reference bit. SREF = 0 (default condition): The internal reference is selected as the chip reference. It is connected to pin 21, EXT_REF_IN, by a 10kΩ resistor. SREF = 1: The internal reference is de-selected and disconnected from pin 21 (EXT_REF_IN). Pin 21 floats unless an external reference is applied. Always set SREF bit to '1' when an external reference is applied; otherwise, the external reference must sink or source current. The current value is the voltage difference between the external and internal reference divided by a 10kΩ resistance. SREF also provides information to the precision current source and is used to configure that source (see the Precision Current Source section for details). After power-on or reset, SREF is cleared to '0'. GREF Gain of the internal reference voltage (VREF). This bit selects one of two preset values for the internal reference voltage, but has no effect on the external reference. GREF also provides information to the precision current source and is used to configure that source (see the Precision Current Source section for details). GREF = 0: The internal reference voltage is +1.25V. GREF = 1: The internal reference voltage is +2.5V. 38 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 When an external reference is used and SREF is set to '1', GREF has no impact on the reference. However, if SREF is cleared to '0', a 10kΩ resistor is connected between pin 21, EXT_REF_IN, and one of the two internal reference values dictated by the value of GREF. In this case, the external reference must be able to drive the 10kΩ load. The full-scale range of the ADC input is equal to 2 x VREF. To avoid ADC input saturation, GREF must be cleared to '0' when AVDD is less than +5V and the internal reference is used. After power-on or reset, GREF is cleared to '0'. Table 9 specifies the ADC input range as a function of bits GREF and SREF. Table 9. Reference and ADC Input Range Configuration BIT GREF BIT SREF 0 0 Internal reference, 1.25V 1 0 Internal reference, 2.5V, AVDD = 5V only Don't care 1 External reference VREF. 2 × VREF must not be greater than AVDD. Set SREF = '1' when applying external reference. ECNVT REFERENCE ADC INPUT RANGE 0 to 2.5V 0 to 5V 0 to 2 × VREF Enable CONVERT (external conversion trigger). This bit specifies the ADC trigger mode. When ECNVT = '1', CONVERT is enabled. The ADC is in external trigger mode. The low-to-high transition of the external trigger signal CONVERT triggers the ADC conversions. A write command to the ADC Control Register does not initiate conversion, but rather specifies the group of inputs to convert. After triggered by CONVERT, the AMC7823 sequentially accesses each analog input one time. The bits [SA3:SA0] of the ADC Control Register comprise the channel address of the first analog input accessed; [EA3:EA0] is the last analog input accessed. When the conversion finishes, the ADC is idle and waits for a new CONVERT or a new command. With an external trigger, the ADC always works in direct-mode (see the ADC Control Register section). When ECNVT = '0', CONVERT is disabled. The internal ADC trigger is used. A write command to the ADC Control Register generates the internal trigger and initiates ADC conversion. With an internal trigger, the ADC can work in either direct-mode or auto-mode (see the ADC Operation and ADC Control Register sections). Table 10 summarizes the ADC conversion mode configuration. After power-on or reset, DAVF, SREF, GREF, and ECNVT are cleared to '0'; RSTC is set to '1'. Table 10. ADC Conversion Mode Configuration ECNVT of AMC STATUS/ CONFIGURATION REGISTER CMODE of ADC CONTROL REGISTER ADC CONVERSION MODE 1 – External Trigger, Direct-Mode 0 0 Internal Trigger, Direct-Mode 0 1 Internal Trigger, Auto-Mode Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 39 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com DAC Configuration Register (Read/Write) Bit 15 MSB Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 SLDA7 SLDA6 SLDA5 SLDA4 SLDA3 SLDA2 SLDA1 SLDA0 GDAC 7 SLDA-n Bit 6 GDAC 6 Bit 5 GDAC 5 Bit 4 GDAC 4 Bit 3 GDAC 3 Bit 2 GDAC 2 Bit 1 GDAC 1 Bit 0 LSB GDAC 0 DAC Synchronous Load Enable bit. SLDA-n = '1': Synchronous Load enabled. When the synchronous load DAC signal occurs, DAC-n Latch is loaded with the value of the corresponding DAC-n Data Register, and the output of DACn is updated immediately. This load signal can be the rising edge of the external signal ELDAC or the internal load signal ILDAC. Writing the data word 0xBB00 into the LOAD DAC Register generates ILDAC. A write command to the DAC-n Data Register updates that register only, and does not change the DAC-n output. SLDA-n = '0': Asynchronous Load enabled. A write command to the DAC-n Data Register immediately updates DAC-n Latch and the output of DAC-n. The synchronous load DAC signal (ILDAC or ELDAC) does not affect DAC-n. GDAC-n DAC-n Output Buffer Amplifier Gain bit. GDAC-n = '1': The gain of the DAC-n output buffer amplifier is equal to 2. GDAC-n = '0': The gain of the DAC-n output buffer amplifier is equal to 1. The combination of the bit GDAC-n and the reference voltage (internal or external) sets the full-scale range of each DAC-n. Table 11 describes the full-scale DAC output range as a function of bits SREF, GREF and GDAC-n. Table 11. Full-Scale DAC Output Range OUTPUT RANGE SREF GREF GDAC-n REFERENCE AVDD = 3V AVDD = 5V 0 0 0 Internal 1.25V 0V to 1.25V 0V to 1.25V 0 0 1 Internal 1.25V 0V to 2.50V 0V to 2.50V 0 1 0 Internal 2.5V 0V to 2.50V 0V to 2.50V 0 1 1 Internal 2.5V Saturated at 3V 0V to 5.00V 1 Don't care 0 External VREF 0V to External VREF, External VREF ≤ AVDD 0V to External VREF, External VREF ≤ AVDD 1 Don't care 1 External VREF 0V to External VREF × 2 2 × External VREF ≤ AVDD 0V to External VREF × 2 2 × External VREF ≤ AVDD When an external reference is applied, the full-scale output range of DAC-n is equal to VREF for GDAC = '0', and equal to 2 x VREF for GDAC-n = '1'. To avoid saturation, the full-scale output range of DAC-n must not be greater than AVDD. After power-on or reset, all bits are cleared to '0'. Load DAC Register (Read/Write) Bit 15 MSB 1 Bit 14 0 Bit 13 1 Bit 12 1 Bit 11 1 Bit 10 0 Bit 9 1 Bit 8 1 Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 LSB 0 The data word 0xBB00 (shown above) written into the LOAD DAC Register generates ILDAC, the internal load DAC signal. ILDAC and the external ELDAC signal work in a similar manner. ILDAC shifts data from the DAC-n Data register to the DAC-n Latch and updates the output for all DAC-n with the corresponding SLDA-n bit set to '1'. Other codes written to this register do not generate ILDAC and have no impact on any DAC-n. The LOAD DAC Register is cleared after ILDAC is generated. The register is also cleared after power-on or reset. 40 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 ADC Control Register (Read/Write; see ADC Operation and AMC Status/Configuration Register) This register specifies the ADC conversion mode and identifies the analog inputs to be converted. A write command to this register initiates conversion when the internal ADC trigger is selected (bit ECNVT = '0' in the AMC Status/Configuration Register). However, when the external trigger is selected (bit ECNVT = '1'), a write command to this register does not start the conversion, but it does identify the analog inputs to be converted. Internal trigger mode may employ either direct- or auto-mode conversion. Bit 15 MSB CMOD E Bit 14 X Bit 13 X Bit 12 X Bit 11 SA3 Bit 10 SA2 Bit 9 SA1 Bit 8 SA0 Bit 7 EA3 Bit 6 EA2 Bit 5 EA1 Bit 4 EA0 Bit 3 X Bit 2 X Bit 1 X Bit 0 LSB X X : Don't Care CMODE ADC Conversion Mode bit. This bit selects between the two operating conversion modes (direct or auto) when the Internal trigger is active. This bit is always cleared to '0' (direct-mode) when an external trigger is active. CMODE = '0': Direct-mode. The analog inputs from [SA3:SA0] to [EA3:EA0] are converted sequentially (see Table 12) one time, [SA3:SA0] first and [EA3;EA0] last. When one set of conversions is complete, the ADC is idle and waits for a new trigger. The external trigger is restricted to this mode of operation only. CMODE = '1': Auto-mode. The analog inputs from [SA3:SA0] to [EA3:EA0] are converted sequentially (see Table 12) and repeatedly, [SA3:SA0] first and [EA3;EA0] last. When one set of conversions is complete, the ADC multiplexer returns to the starting address [SA3:SA0] and repeats the process. Repetitive conversions continue until auto-mode is halted by rewriting the ADC Control Register to direct-mode, or until the external trigger is enabled. Auto-mode works only for the internal trigger. SA3–SA0 The channel address of the first analog input to be converted (see Table 12). EA3–EA0 The channel address of the last analog input to be converted (see Table 12). The number of channels selected for conversion may range from one to eight. Channels in the selected range [SA3:SA0] to [EA3:EA0] are addressed sequentially according to the map shown in Table 12. The starting address [SA3:SA0] must not be greater than the ending address [EA:3:EA0]. When the internal trigger is selected, the staring address must be '0000' (that is, CH-0); otherwise, the ADC conversion may not be correct. Table 13 shows the allowed range of analog input channels for each ADC conversion mode. After power-on or reset, the ADC Control Register is cleared (0x0000). Channel CH8 is used for chip temperature measurement via the on-chip temperature sensor. It is not for external analog input (see the On-chip Temperature Sensor section for details). Table 12. Analog Input Channel Address Map SA3/EA3 SA2/EA2 SA1/EA1 SA0/EA0 ANALOG INPUT 0 0 0 0 CH0 0 0 0 1 CH1 0 0 1 0 CH2 0 0 1 1 CH3 0 1 0 0 CH4 0 1 0 1 CH5 0 1 1 0 CH6 0 1 1 1 CH7 1 0 0 0 CH8 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 41 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com Table 13. Analog Input Channel Range STARTING CHANNEL [SA3:SA0] ENDING CHANNEL [EA3:EA0] External trigger, direct mode Any one of CH0 to CH8 Any one from CH0 to CH8, but not less than [SA3:SA0] 0 Internal trigger, direct mode CH0 only. SA3:SA0 = '0000' Any one 1 Internal trigger, auto mode CH0 only. SA3:SA0 = '0000' Any one ECNVT CMODE ADC MODE 1 0 0 ADC Data-n Registers (n = 0, 1, 2, 3, 4, 5, 6, 7, 8) (Read-Only) Nine ADC Data registers are available. The ADC Data-n Registers store the conversion results of the corresponding analog channel-n. The ADC-8 Data Register is used for the on-chip temperature sensor. The other registers are for external analog inputs. All ADC Data-n registers are formatted in the manner shown here. Bit 15 MSB ICH3 Bit 14 ICH2 Bit 13 ICH1 Bit 12 ICH0 Bit 11 ADC1 1 Bit 10 ADC1 0 Bit 9 ADC9 Bit 8 ADC8 Bit 7 ADC7 Bit 6 ADC6 Bit 5 ADC5 Bit 4 ADC4 Bit 3 ADC3 Bit 2 ADC2 Bit 1 ADC1 Bit 0 LSB ADC0 ADC11–ADC0 Value of the conversion result. The data are updated when the conversion of the input [EA3:EA0] finishes; see the ADC Operation section for details. ICH3–ICH0 Analog Input Channel number After power-on or reset, all bits are cleared to '0'. All ADC Data-n Registers are read-only. Writing to the ADC Data-n registers does not cause any change. Table 14 summarizes the ADC Data-n Registers. Table 14. ADC Data-n Registers 42 ICH3 ICH2 ICH1 ICH0 ANALOG INPUT 0 0 0 0 CH0 0 0 0 1 CH1 0 0 1 0 CH2 0 0 1 1 CH3 0 1 0 0 CH4 0 1 0 1 CH5 0 1 1 0 CH6 0 1 1 1 CH7 1 0 0 0 CH8 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 DAC-n Data Registers (n = 0, 1, 2, 3, 4, 5, 6, 7) (see the DAC Operation section) This register is the input Data Register for DAC-n that buffers the DAC-n Latch Register. The DAC-n output is updated only when Latch is loaded. Under an asynchronous load (bit SLDA-n = '0' in the DAC Configuration Register), the value of the DAC-n Data Register is transferred into the Latch immediately after Data Register is written. If a synchronous load is specified (SLDA-n = '1'), then the DAC-n Latch is loaded with the value of the DAC-n Data Register only after a synchronous load signal occurs. This signal can be either the internal ILDAC or the rising edge of an external ELDAC (see DAC Operation and DAC Configuration Register discussions). Bit 15 MSB X Bit 14 OCH2 Bit 13 OCH1 Bit 12 OCH0 Bit 11 DAC1 1 Bit 10 DAC1 0 Bit 9 DAC9 Bit 8 DAC8 Bit 7 DAC7 Bit 6 DAC6 Bit 5 DAC5 Bit 4 DAC4 Bit 3 DAC3 Bit 2 DAC2 Bit 1 DAC1 Bit 0 LSB DAC0 X : Don't Care DAC11–DAC0 (WRITE/READ) In a write operation, these data bits are written into the DAC Data-n Register. However, in a read operation, the data bits are returned from the DAC-n Latch, not from the DAC-n Data Register. OCH2–OCH0 DAC Address. Read-only. Writing these bits does not cause any change. The registers are cleared to '0' after power-on or reset. Table 15 summarizes the DAC-n Data Registers. Table 15. DAC-n Data Registers OCH2 OCH1 OCH0 ANALOG OUTPUT 0 0 0 DAC0 0 0 1 DAC1 0 1 0 DAC2 0 1 1 DAC3 1 0 0 DAC4 1 0 1 DAC5 1 1 0 DAC6 1 1 1 DAC7 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 43 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com ALR Register (see Figure 53) Bit 15 MSB X Bit 14 X Bit 13 X Bit 12 X Bit 11 ALR-3 Bit 10 ALR-2 Bit 9 ALR-1 Bit 8 ALR-0 Bit 7 X Bit 6 X Bit 5 X Bit 4 X Bit 3 0 Bit 2 0 Bit 1 0 Bit 0 LSB 0 X : Don't Care The first four analog inputs in the group defined by bits [SA3:SA0] and [EA3:EA0] in the ADC Control Register are implemented with out-of-range detection. [Bit 3:Bit 0] Must be '0' to ensure correct operation of alarm detection. ALR-n (READ-ONLY) nth analog input out-of-range status flag. These bits are read-only. Writing ALR-n bits has no effect. ALR-n = '1' when the nth analog input is out-of-range. ALR-n = '0' when the nth analog input is not out-of-range. ALR-n is always '0' when following conditions hold: the value of Threshold-Low-n Register is equal to '0', and the Threshold-Hi-n Register is equal to the full-scale value of the input. NOTE: To avoid loss of alarm data during power-down of the ADC, change to direct conversion mode (see ADC Control Register) before power-down and do not issue a convert command while the ADC is powered down. After power-on or reset, all bits in ALR Register are cleared to '0'. Reading the register does not clear any bits. GPIO Register (Read/Write; see the Digital I/O section) The AMC7823 has six general-purpose I/O (GPIO) pins to communicate with external devices. Pins GPIO-4 and GPIO-5 are dedicated to general bidirectional, digital I/O signals. The remaining pins (n = 0, 1, 2, 3) are dualpurpose and can be programmed as either GPIO pins or ALR (out-of-range) indicators. This register defines the status of all GPIO pins and the functions of pins GPIO-0, GPIO-1, GPIO-2 and GPIO-3. The register is formatted as shown here. Bit 15 MSB 1 Bit 14 1 Bit 13 1 Bit 12 1 Bit 11 IOMO D3 Bit 10 IOMO D2 Bit 9 IOMO D1 Bit 8 IOMO D0 Bit 7 1 Bit 6 1 Bit 5 IOST5 Bit 4 IOST4 Bit 3 IOST3 Bit 2 IOST2 Bit 1 IOST1 Bit 0 LSB IOST0 IOMOD-n Function mode definition bit for pins GPIO-0, GPIO-1, GPIO-2, and GPIO-3 (see Table 8 and Figure 52) IOMOD-n = 0 Analog input out-of-range detection mode. In this mode, GPIO-n (n = 0, 1, 2, 3) work as analog input out-of-range indicators, denoted as output pins ALR-n. The status of each pin ALR-n is set by bit ALR-n of the ALR Register. The ALR-n pin is low when the corresponding ALR-n bit is '1', and is high-impedance when ALR-n is '0'. IOMOD-n = 1 GPIO mode. In this mode, pin GPIO-n works as general digital I/O (bidirectional). When the pin is output, the status is determined by the corresponding bit IOST-n; it is highimpedance for IOST-n = 1, and logic low for IOST-n = 0. When the pin is input, reading this bit acquires the digital logic value present at the pin. GPIO data are preserved during all power-down conditions. IOST-n I/O STATUS bit of the GPIO-n pin. If the GPIO-n pin works as a general-purpose I/O, this bit indicates the actual logic value present at the pin when reading the bit. It also sets the state of the corresponding GPIO-n pin (high-impedance for IOST-n = 1, logic low for IOST-n = 0) when writing to the bit. An external pull-up resistor is required when using pin GPIO-n as an output. If the GPIO-n pin works as an analog input out-of-range indicator, then bit IOST-n is a complement of the corresponding bit ALR-n in the ALR Register. Writing the IOST-n bit does not cause any change. Note that only GPIO-0, GPIO-1, GPIO-2, and GPIO-3 can be configured as out-of-range indicators. 44 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 To avoid loss of alarm information in bits IOST-n during power-down of the ADC, change to direct conversion mode (see ADC Control Register) before power-down and do not issue a convert command while the ADC is powered down. NOTE: When GPIO-n works as a general-purpose I/O pin, bit IOST-n does not change during the power-down procedure. After power-on or reset, all bits in the GPIO Register are set to '1'. All GPIO pins are configured as general I/O pins and are in high-impedance state. THRESHOLD REGISTERS Threshold-Hi-n and Threshold-Low-n (n = 0, 1, 2, 3) define the upper bound and lower bound of the nth analog input range. (See Table 2.) This window determines whether the nth input is out-of-range. When the input is outside the window, the corresponding bit ALR-n in the ALR Register is set to '1'. For normal operation, the value of Threshold-Hi-n must be greater than the value of Threshold-Low-n; otherwise, ALR-n is always set to '1' and an alarm is indicated. Threshold-Hi-n Registers (n = 0, 1, 2, 3) (Read/Write) Bit 15 MSB 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 11 THRH 11 Bit 10 THRH 10 Bit 9 THRH 9 Bit 8 THRH 8 Bit 7 THRH 7 Bit 6 THRH 6 Bit 5 THRH 5 Bit 4 THRH 4 Bit 3 THRH 3 Bit 2 THRH 2 Bit 1 THRH 1 Bit 0 LSB THRH 0 Bits [15:12] (READONLY) '0' when read back. Writing these bits causes no change. THRH11–THRH0 Data bits of the upper bound threshold of the nth analog input. All bits are set to '1' after power-on or reset. Threshold-Low-n Registers (n = 0, 1, 2, 3) (Read/Write) Bit 15 MSB 0 Bit 14 0 Bit 13 0 Bit 12 0 Bit 0 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB THRL1 THRL1 THRL9 THRL8 THRL7 THRL6 THRL5 THRL4 THRL3 THRL2 THRL1 THRL0 1 0 Bits [15:12] (READONLY) Always '0' when read back. Writing these bits causes no change. THRL11–THRL0 Data bits of the lower bound threshold of the nth analog input. This register is cleared to '0' after power-on or reset. RESET REGISTER (Read/Write) The AMC7823 has a special RESET Register that performs the software equivalent function of the device RESET pin. To invoke a system reset, write the data word 0xBB3X to this register. Only the upper 12 bits are significant; the lowest four bits are Don’t Care. Bit 15 MSB 1 Bit 14 0 Bit 13 1 Bit 12 1 Bit 11 1 Bit 10 0 Bit 9 1 Bit 8 1 Bit 7 0 Bit 6 0 Bit 5 1 Bit 4 1 Bit 3 X Bit 2 X Bit 1 X Bit 0 LSB X X : Don't Care Any other value written to this register has no effect. After power-on or reset, this register is cleared to all zeros. Therefore, the value 0x0000 is always read back from this register. Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 45 AMC7823 SLAS453F – APRIL 2005 – REVISED MARCH 2012 www.ti.com POWER-DOWN REGISTER (Read/Write) NOTE: After power-on or reset, all bits in the Power-Down Register are cleared to '0', and all the components controlled by this register are in the powered-down or Off state. To avoid loss of alarm data during power-down of the ADC, change the ADC conversion to direct mode (see ADC Control Register) before power-down and do not issue a convert command while the ADC is powered down. The Power-Down Register must be set properly before operating the ADC, DAC, precision current source, and reference of this device. It is recommended that the Power-Down Register be programmed after all other registers have been initialized. The Power-Down Register allows the host to manage power dissipation of the AMC7823. When not required, the ADC, the precision current source, the reference buffer amplifier or any of the DACs may be put in power-down mode to reduce current drain from the supply. Bits in the Power-Down Register control this power-down function. Bit 15 MSB PAD C Bit 14 PDAC7 Bit 13 PDAC 6 Bit 12 PDAC 5 Bit 11 PDAC4 Bit 10 PDAC 3 Bit 9 PDAC2 Bit 8 PDAC1 Bit 7 PDAC0 Bit 6 PTS Bit 5 PREFB Bit 4 X Bit 3 X Bit 2 X Bit 1 X Bit 0 LSB X X : Don't Care PADC ADC power-down control bit. PADC = '0': The ADC is in power-down mode and ADC conversion is halted. PADC = '1': The ADC is in normal operating mode. PDAC-n (n = 0, 1, 2, 3, 4, 5, 6, 7) DAC-n output buffer amplifier power-down control bit. PDAC-n = '0': DAC-n output buffer amplifier is in power-down mode. The output pin of DAC-n is internally switched from the buffer output to analog ground through an internal 5kΩ resistor. Each DAC output buffer may be independently powered down. (See the DAC Operation section for details.) PDAC-n = '1' and PREFB = '1': DAC-n is in normal operating mode. PTS Precision current source power-down control bit. PTS = '0': Precision current source is in power-down mode and the current output is zero. PTS = '1': Precision current source is in normal operating mode (see the Precision Current Source section for details). PREFB Reference buffer amplifier power-down control bit. This bit controls the power-down condition of the amplifier that supplies a buffered reference voltage to all DAC-n resistor strings and to the precision current source. This bit also provides configuration information to the precision current source (see the Precision Current Source Configuration table, Table 7). PREFB = '0': Reference buffer amplifier is in power-down mode. All DACs are inoperative. The precision current source may be used only if GREF = '0' (see the Precision Current Source Configuration table, Table 7). PREFB = '1': Reference buffer amplifier is powered on. This mode is required for any DAC-n operation. The precision current source may be used with either value of GREF. 46 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 AMC7823 www.ti.com SLAS453F – APRIL 2005 – REVISED MARCH 2012 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (January 2010) to Revision F Page • Changed Level of Pin GALR and DAV, IOH = 0.7mA parameter minimum and maximum specifications in +5V Electrical Characteristics table .............................................................................................................................................. 4 • Corrected typo in Digital Input/output, Except Pin GALR and DAV, VOL Logic level (BVDD = 5V) parameter test condition in +5V Electrical Characteristics table ................................................................................................................... 4 • Changed Digital Input/output, Except Pin GALR and DAV, VOL Logic level (BVDD = 3V) parameter symbol in +5V Electrical Characteristics table .............................................................................................................................................. 4 Changes from Revision D (August 2008) to Revision E • Page Deleted lead temperature (soldering) rows from Absolute Maximum Ratings table ............................................................ 2 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Link(s): AMC7823 47 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) AMC7823IRTAR ACTIVE WQFN RTA 40 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 AMC7823 Samples AMC7823IRTAT ACTIVE WQFN RTA 40 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 AMC7823 Samples AMC7823IRTATG4 ACTIVE WQFN RTA 40 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 AMC7823 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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