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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
FEATURES
D Highly Integrated Solution With FET Pass
Transistor and Reverse-Blocking Schottky
and Thermal Protection
D Integrated Voltage and Current Regulation
With Programmable Charge Current
D High-Accuracy Voltage Regulation (±1%)
D Ideal for Low-Dropout Linear Charger
Designs for Single-Cell Li-Ion Packs With
Coke or Graphite Anodes
D Up to 1.2-A Continuous Charge Current
D Safety-Charge Timer During Preconditioning
and Fast Charge
D Integrated Cell Conditioning for Reviving
Deeply Discharged Cells and Minimizing Heat
Dissipation During Initial Stage of Charge
D Optional Temperature or Input-Power
Monitoring Before and During Charge
D Various Charge-Status Output Options for
Driving Single, Double, or Bicolor LEDs or
Host-Processor Interface
D Charge Termination by Minimum Current and
Time
D Low-Power Sleep Mode
D Packaging: 5 mm × 5 mm MLP or 20-Lead
TSSOP PowerPAD
APPLICATIONS
D
D
D
D
PDAs
Internet Appliances
MP3 Players
Digital Cameras
DESCRIPTION
The bq2400x series ICs are advanced Li-Ion linear
charge management devices for highly integrated and
space-limited applications. They combine highaccuracy current and voltage regulation; FET passtransistor and reverse-blocking Schottky; battery
conditioning, temperature, or input-power monitoring;
charge termination; charge-status indication; and
charge timer in a small package.
The bq2400x measures battery temperature using an
external thermistor. For safety reasons, the bq2400x
inhibits charge until the battery temperature is within the
user-defined thresholds. Alternatively, the user can
monitor the input voltage to qualify charge. The
bq2400x series then charge the battery in three phases:
preconditioning, constant current, and constant
voltage. If the battery voltage is below the internal
low-voltage threshold, the bq2400x uses low-current
precharge to condition the battery. A preconditioning
timer is provided for additional safety. Following preconditioning, the bq2400x applies a constant-charge
current to the battery. An external sense-resistor sets
the magnitude of the current. The constant-current
phase is maintained until the battery reaches the
charge-regulation voltage. The bq2400x then
transitions to the constant voltage phase. The user can
configure the device for cells with either coke or
graphite anodes. The accuracy of the voltage regulation
is better than ±1% over the operating junction
temperature and supply voltage range.
Charge is terminated by maximum time or minimum
taper current detection
The bq2400x automatically restarts the charge if the
battery voltage falls below an internal recharge
threshold.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
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Copyright 2002 − 2004, Texas Instruments Incorporated
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE
TJ
20-LEAD HTTSOP PowerPAD
(PWP)(1)
20-LEAD 5 mm × 5 mm MLP
(RGW)(2)
CHARGE STATUS
CONFIGURATION
bq24001PWP
bq24001RGW
Single LED
bq24002PWP
bq24002RGW
2 LEDs
−40°C
−40
C to 125
125°C
C
bq24003PWP
bq24003RGW
Single bicolor LED
(1) The PWP package is available taped and reeled. Add R suffix to device type (e.g. bq24001PWPR) to order. Quantities 2500 devices per reel.
(2) The RGW package is available taped and reeled. Add R suffix to device type (e.g. bq24001RGWR) to order. Quantities 3000 devices per reel.
PACKAGE DISSIPATION RATINGS
PACKAGE
ΘJA
ΘJC
TA ≤ 25°C
POWER RATING
PWP(1)
RGW(2)
30.88°C/W
1.19°C/W
3.238 W
DERATING FACTOR
ABOVE TA = 25°C
0.0324W/°C
31.41°C/W
1.25°C/W
3.183 W
0.0318W/°C
(1) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (6.5 × 3.4 mm), internal 1 oz power and
ground planes, 8 thermal via underneath the die connecting to ground plane.
(2) This data is based on using the JEDEC high-K board and topside traces, top and bottom thermal pad (3.25 × 3.25 mm), internal 1 oz power
and ground planes, 9 thermal via underneath the die connecting to ground plane.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
bq24001
bq24002
bq24003
Supply voltage (Vcc with respect to GND)
13.5 V
Input voltage (IN, ISNS, EN, APG/THERM/CR/STAT1/STAT2, VSENSE, TMR SEL, VSEL) (all with respect to GND)
13.5 V
Output current (OUT pins)
2A
Output sink/source current (STAT1 and STAT2)
10 mA
Operating free-air temperature range, TA
−40°C to 70°C
Storage temperature range, Tstg
−65°C to 150°C
Junction temperature range, TJ
−40°C to 125°C
Lead temperature (Soldering, 10 sec)
300°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
Supply voltage, VCC
4.5
10
V
Input voltage, VIN
4.5
10
V
1.2
A
−40
125
°C
Continuous output current
Operating junction temperature range, TJ
2
UNIT
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ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature supply and input voltages, and VI (VCC) ≥ VI (IN) ( unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC current
VCC current, standby mode
VCC > VCC_UVLO,
EN ≤ VIL(EN)
IN current, standby mode
EN ≤ VIL(EN)
MIN
TYP
EN ≤ VIH(EN)
MAX
1
VOUT = 4.3 V,
VOUT = 4.3 V,
mA
µA
1
10
Standby current (sum of currents into OUT VCC < VCC_UVLO,
and VSENSE pins)
EN 90%)
OFF
ON (LOW)
Sleep-mode
OFF
OFF
APG/Therm invalid
OFF
OFF
Thermal shutdown
OFF
Battery absent
OFF
OFF
OFF(1)
(1) If thermistor is used, then the Green LED is off.
Table 3. bq24003 (Single Bicolor LED)
LED1 (RED)
LED2
(GREEN)
APPARENT
COLOR
Precharge
ON (LOW)
OFF (HIGH)
RED
Fast charge
ON (LOW)
OFF (HIGH)
RED
FAULT
ON (LOW)
ON (LOW)
YELLOW
CHARGE STATE
Done (>90%)
OFF (HIGH)
ON (LOW)
GREEN
Sleep-mode
OFF (HIGH)
OFF (HIGH)
OFF
APG/Therm
invalid
OFF (HIGH)
OFF (HIGH)
OFF
Thermal
shutdown
OFF (HIGH)
OFF (HIGH)
OFF
Battery absent
OFF (HIGH)
OFF (HIGH)(1)
OFF(1)
(1) If thermistor is used, then the Green LED is off.
Thermal Shutdown
The bq2400x monitors the junction temperature TJ of the DIE and suspends charging if TJ exceeds 165°C. Charging
resumes when TJ falls below 155°C.
DETAILED DESCRIPTION
POWER FET
VOLTAGE SENSE
The integrated transistor is a P-channel MOSFET. The
power FET features a reverse-blocking Schottky diode,
which prevents current flow from OUT to IN.
To achieve maximum voltage regulation accuracy, the
bq2400x uses the feedback on the VSENSE pin.
Externally, this pin should be connected as close to the
battery cell terminals as possible. For additional safety, a
10kΩ internal pullup resistor is connected between the
VSENSE and OUT pins.
An internal thermal-sense circuit shuts off the power FET
when the junction temperature rises to approximately
165°C. Hysteresis is built into the thermal sense circuit.
After the device has cooled approximately 10°C, the
power FET turns back on. The power FET continues to
cycle off and on until the fault is removed.
CURRENT SENSE
The bq2400x regulates current by sensing, on the ISNS
pin, the voltage drop developed across an external sense
resistor. The sense resistor must be placed between the
supply voltage (Vcc) and the input of the IC (IN pins).
ENABLE (EN)
The logic EN input is used to enable or disable the IC. A
high-level signal on this pin enables the bq2400x. A
low-level signal disables the IC and places the device in a
low-power standby mode.
17
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SLUS462E − SEPTEMBER 2000 − REVISED NOVEMBER 2004
THERMAL INFORMATION
THERMALLY ENHANCED TSSOP-20
DIE
The thermally enhanced PWP package is based on the
20-pin TSSOP, but includes a thermal pad (see
Figure 20) to provide an effective thermal contact between
the IC and the PWB.
Traditionally, surface mount and power have been
mutually exclusive terms. A variety of scaled-down
TO220-type packages have leads formed as gull wings to
make them applicable for surface-mount applications.
These packages, however, suffer from several
shortcomings: they do not address the very low profile
requirements (