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BQ24610RGER

BQ24610RGER

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VQFN24_4X4MM_EP

  • 描述:

    独立1至6芯同步降压电池充电器控制器 VQFN24

  • 数据手册
  • 价格&库存
BQ24610RGER 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 bq2461x Stand-Alone Synchronous Switched-Mode Li-Ion or Li-Polymer Battery Charger With System Power Selector and Low Iq 1 Features • 1 • • • • • • • • • • • 600-kHz NMOS-NMOS Synchronous Buck Converter Stand-Alone Charger Support for Li-Ion or LiPolymer 5-V to 28-V VCC Input Operating Range and Supports 1- to 6-Battery Cells (bq24610) 5-V to 24-V VCC Input Operating Range and Supports 1- to 5-Battery Cells (bq24617) Up to 10-A Charge Current and Adapter Current High-Accuracy Voltage and Current Regulation – ±0.5% Charge Voltage Accuracy – ±3% Charge Current Accuracy – ±3% Adapter Current Accuracy Integration – Automatic System Power Selection From Adapter or Battery – Internal Loop Compensation and Soft Start – Dynamic Power Management Safety Protection – Input Overvoltage Protection – Battery Thermistor Sense Hot and Cold Charge Suspend – Battery Detection – Reverse Protection Input FET – Programmable Safety Timer – Charge Overcurrent Protection – Battery Short Protection – Battery Overvoltage Protection – Thermal Shutdown Status Outputs – Adapter Present • – Charger Operation Status Charge Enable Pin 6-V Gate Drive for Synchronous Buck Converter 30-ns Driver Dead-Time and 99.5% Maximum Effective Duty Cycle Energy Star Low Quiescent Current Iq – < 15-µA Off-State Battery Discharge Current – < 1.5-mA Off-State Input Quiescent Current 2 Applications • • • • • Netbooks, Mobile Internet Devices, and UltraMobile PCs Personal Digital Assistants (PDAs) Handheld Terminals Industrial and Medical Equipment Portable Equipment 3 Description The bq2461x is a highly integrated Li-ion or Lipolymer switched-mode battery charge controller. The device offers a constant-frequency synchronous switching PWM controller with high-accuracy charge current and voltage regulation, charge preconditioning, termination, adapter current regulation, and charge status monitoring. The bq2461x charges the battery in three phases: preconditioning, constant current, and constant voltage. Device Information(1) PART NUMBER bq24610 bq24617 PACKAGE VQFN (24) BODY SIZE (NOM) 4.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic ADAPTER SYSTEM ACP ACDRV ACN BATDRV HIDRV CE VREF VREF ADAPTER STAT1 STAT2 PG TS PH bq2461x ISET1 ISET2 ACSET LODRV Battery pack SRP SRN VFB TTC 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 8.1 8.2 8.3 8.4 8.5 8.6 9 1 1 1 2 3 3 4 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 6 Thermal Information .................................................. 6 Electrical Characteristics........................................... 7 Typical Characteristics ............................................ 11 Detailed Description ............................................ 14 9.1 Overview ................................................................. 14 9.2 Functional Block Diagram ....................................... 15 9.3 Feature Description................................................. 16 9.4 Device Functional Modes........................................ 25 10 Application and Implementation........................ 26 10.1 Application Information.......................................... 26 10.2 Typical Application ............................................... 26 11 Power Supply Recommendations ..................... 32 12 Layout................................................................... 32 12.1 Layout Guidelines ................................................. 32 12.2 Layout Example .................................................... 33 13 Device and Documentation Support ................. 34 13.1 13.2 13.3 13.4 13.5 Device Support...................................................... Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 34 34 34 34 34 14 Mechanical, Packaging, and Orderable Information ........................................................... 34 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (September 2013) to Revision C • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Changes from Revision A (October 2011) to Revision B • Page Page Changed Figure 14, pin VLTFH to: VLTF_HYS .......................................................................................................................... 20 Changes from Original (December 2009) to Revision A Page • Corrected equation for calculating RT2 ................................................................................................................................ 21 • Corrected equation for calculating ICOUT .............................................................................................................................. 28 2 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 5 Description (continued) Charge is terminated when the current reaches a minimum user-selectable level. A programmable charge timer provides a safety backup. The bq2461x automatically restarts the charge cycle if the battery voltage falls below an internal threshold, and enters a low quiescent current sleep mode when the input voltage falls below the battery voltage. 6 Device Comparison Table bq24600 bq24610 bq24616 bq24617 bq24618 bq24650 Li-Ion/Li-Polymer Li-Ion/Li-Polymer Li-Ion/Li-Polymer Li-Ion/Li-Polymer Li-Ion/Li-Polymer Li-Ion/Li-Polymer 1 to 6 1 to 6 1 to 6 1 to 5 1 to 6 1 to 6 2.1 to 26 2.1 to 26 2.1 to 26 2.1 to 22 2.1 to 26 2.1 to 26 5 to 28 5 to 28 5 to 28 5 to 24 4.7 to 28 5 to 28 Input overvoltage (V) 32 32 32 26 32 32 Maximum battery charging current (A) 10 10 10 10 10 10 1200 600 600 600 600 600 JEITA charging temperature profile No No Yes No No No DPM No IIN DPM IIN DPM IIN DPM IIN DPM VIN DPM Cell chemistry Number of cells in series (minimum to maximum, 4.2 V/cell) Charge voltage (minimum to maximum) (V) Input voltage range (minimum to maximum) (V) Switching frequency (kHz) Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 3 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 7 Pin Configuration and Functions PH LODRV 23 BTST BATDRV 24 HIDRV VCC RGE Package 24-Pin VQFN Top View 22 21 20 19 ACN 1 18 REGN ACP 2 17 GND 16 ACSET ACDRV 3 CE 4 15 ISET2 STAT1 5 14 SRP TS 6 10 PG STAT2 VREF 11 12 VFB 9 ISET1 8 TTC 13 SRN 7 Pin Functions PIN NAME DESCRIPTION NO. ACDRV 3 AC adapter to system MOSFET driver output. Connect through a 1-kΩ resistor to the gate of the ACFET P-channel power MOSFET and the reverse conduction blocking P-channel power MOSFET. The internal gate drive is asymmetrical, allowing a quick turnoff and slow turnon, in addition to the internal break-before-make logic with respect to BATDRV. If needed, an optional capacitor from gate to source of the ACFET is used to slow down the ON and OFF times. ACN 1 Adapter current-sense resistor, negative input. A 0.1-μF ceramic capacitor is placed from ACN to ACP to provide differential-mode filtering. An optional 0.1-μF ceramic capacitor is placed from the ACN pin to GND for commonmode filtering. ACP 2 Adapter current-sense resistor, positive input. A 0.1-μF ceramic capacitor is placed from ACN to ACP to provide differential-mode filtering. A 0.1-μF ceramic capacitor is placed from the ACP pin to GND for common-mode filtering. ACSET 16 Adapter current-set input. The voltage of the ACSET pin programs the input current regulation set point during Dynamic Power Management (DPM). BATDRV 23 Battery-to-system MOSFET driver output. Gate drive for the battery-to-system load BAT PMOS power FET to isolate the system from the battery to prevent current flow from the system to the battery, while allowing a low-impedance path from battery to system. Connect this pin through a 1-kΩ resistor to the gate of the input BAT P-channel MOSFET. Connect the source of the FET to the system-load voltage node. Connect the drain of the FET to the battery pack positive terminal. The internal gate drive is asymmetrical to allow a quick turnoff and slow turnon, in addition to the internal break-before-make logic with respect to ACDRV. If needed, an optional capacitor from gate to source of the BATFET is used to slow down the ON and OFF times. BTST 22 PWM high-side driver positive supply. Connect a 0.1-μF bootstrap capacitor from PH to BTST, and a bootstrap Schottky diode from REGN to BTST. CE 4 Charge enable active HIGH logic input. HI enables charge. LO disables charge. It has an internal 1-MΩ pulldown resistor. GND 17 Low-current sensitive analog and digital ground. On PCB layout, connect with the thermal pad underneath the IC. HIDRV 21 PWM high-side driver output. Connect to the gate of the high-side power MOSFET with a short trace. ISET1 11 Fast-charge current-set input. The voltage of the ISET1 pin programs the fast-charge current regulation set point. ISET2 15 Precharge and termination current set input. The voltage of the ISET2 pin programs the precharge current regulation set point and termination current trigger point. LODRV 19 PWM low-side driver output. Connect to the gate of the low-side power MOSFET with a short trace. PG 8 Open-drain power-good status output. Active LOW when IC has a valid VCC (not in UVLO or ACOV or SLEEP mode). Active HIGH when IC has an invalid VCC. PG can be used to drive an LED or communicate with a host processor. PH 20 PWM high-side driver negative supply. Connect to the phase-switching node (junction of the low-side power MOSFET drain, high-side power MOSFET source, and output inductor). REGN 18 PWM low-side driver positive 6-V supply output. Connect a 1-μF ceramic capacitor from REGN to the GND pin, close to the IC. Use for low-side driver and high-side driver bootstrap voltage by connecting a small-signal Schottky diode from REGN to BTST. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Pin Functions (continued) PIN NAME DESCRIPTION NO. SRN 13 Charge current-sense resistor, negative input. A 0.1-μF ceramic capacitor is placed from SRN to SRP to provide differential-mode filtering. An optional 0.1-μF ceramic capacitor is placed from the SRN pin to GND for commonmode filtering. SRP 14 Charge current sense resistor, positive input. A 0.1-μF ceramic capacitor is placed from SRN to SRP to provide differential-mode filtering. A 0.1-μF ceramic capacitor is placed from the SRP pin to GND for common-mode filtering. STAT1 5 Open-drain charge status pin to indicate various charger operation (see Table 2). STAT2 9 Open-drain charge status pin to indicate various charger operations (see Table 2). Thermal pad — Exposed pad beneath the IC. Always solder the thermal pad to the board, and have vias on the thermal pad plane star-connecting to GND and ground plane for high-current power converter. It also serves as a thermal pad to dissipate the heat. TS 6 Temperature qualification voltage input for battery pack negative temperature coefficient thermistor. Program the hot and cold temperature window with a resistor divider from VREF to TS to GND (see Figure 15). TTC 7 SafetyTimer and termination control. Connect a capacitor from this node to GND to set the timer. When this input is LOW, the timer and termination are disabled. When this input is HIGH, the timer is disabled but termination is allowed. VCC 24 IC power positive supply. Connect through a 10-Ω resistor to the common-source (diode-OR) point: source of highside P-channel MOSFET and source of reverse-blocking power P-channel MOSFET. Place a 1-μF ceramic capacitor from VCC to the GND pin close to the IC. VFB 12 Output voltage analog feedback adjustment. Connect the output of a resistive voltage divider from the battery terminals to this node to adjust the output battery regulation voltage. VREF 10 3.3-V regulated voltage output. Place a 1-μF ceramic capacitor from VREF to GND pin close to the IC. This voltage could be used for programming of voltage and current regulation and for programming the TS threshold. 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX –0.3 33 PH –2 36 VFB –0.3 16 REGN, LODRV, ACSET, TS, TTC –0.3 7 BTST, HIDRV with respect to GND –0.3 39 VREF, ISET1, ISET2 –0.3 3.6 –0.5 0.5 V Junction temperature –40 155 °C Tstg Storage temperature –55 155 °C VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG Voltage Maximum difference voltage TJ (1) (2) (3) ACP–ACN, SRP–SRN UNIT V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the data book for thermal limitations and considerations of packages. Must have a series resistor between battery pack to VFB if battery-pack voltage is expected to be greater than 16 V. Usually the resistor-divider top resistor takes care of this. Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 5 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 8.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions MIN –0.3 28 V bq24617: VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG –0.3 24 V –2 30 V PH Voltage VFB –0.3 14 V REGN, LODRV, ACSET, TS, TTC –0.3 6.5 V BTST, HIDRV with respect to GND –0.3 34 V ISET1, ISET2 –0.3 3.3 V 3.3 V –0.2 0.2 V 0 125 °C VREF Maximum difference voltage TJ MAX UNIT bq24610: VCC, ACP, ACN, SRP, SRN, BATDRV, ACDRV, CE, STAT1, STAT2, PG ACP–ACN, SRP–SRN Junction temperature 8.4 Thermal Information bq2461x THERMAL METRIC (1) RGE [VQFN] UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 43 °C/W RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance 54.3 °C/W 20 ψJT °C/W Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 19 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4 °C/W (1) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 8.5 Electrical Characteristics 5 V ≤ VVCC ≤ 28 V, 0°C < TJ < 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OPERATING CONDITIONS VVCC_OP VCC input voltage operating range(610) 5 28 VCC input voltage operating range(617) 5 24 V QUIESCENT CURRENTS IBAT Total battery discharge current (sum of currents into VCC, BTST, PH, ACP, ACN, SRP, SRN, VFB), VFB ≤ 2.1 V Battery discharge current (sum of currents into BTST, PH, SRP, SRN, VFB), VFB ≤ 2.1 V VVCC < VSRN, VVCC > VUVLO (SLEEP) 15 μA VVCC > VSRN, VVCC > VUVLO CE = LOW 5 VVCC > VSRN, VVCC > VVCCLOW CE = HIGH, charge done 5 VVCC > VSRN, VVCC > VUVLO CE = LOW (IC quiescent current) IAC 1 1.5 Adapter supply current (current into VVCC > VSRN, VVCC >VVCCLOW , CE = HIGH, VCC, ACP, ACN pin) charge done 2 5 VVCC > VSRN, VVCC >VVCCLOW , CE = HIGH, charging, Qg_total = 20 nC 25 mA CHARGE VOLTAGE REGULATION VFB Feedback regulation voltage 2.1 Charge voltage regulation accuracy IVFB Leakage current into VFB pin V TJ = 0°C to 85°C –0.5% 0.5% TJ = –40°C to 125°C –0.7% 0.7% VFB = 2.1 V 100 nA 2 V CURRENT REGULATION – FAST CHARGE VISET1 ISET1 voltage range VIREG_CHG SRP-SRN current-sense voltage range VIREG_CHG = VSRP – VSRN KISET1 Charge current set factor (amps of charge current per volt on ISET1 pin) RSENSE = 10 mΩ VIREG_CHG = 40 mV Charge current regulation accuracy IISET1 Leakage current into ISET1 pin 100 5 –3% mV A/V 3% VIREG_CHG = 20 mV –4% 4% VIREG_CHG = 5 mV –25% 25% VIREG_CHG = 1.5 mV (VSRN > 3.1 V) –40% 40% VISET1 = 2 V 100 nA 2 V CURRENT REGULATION – PRECHARGE VISET2 ISET2 voltage range KISET2 Precharge current set factor (amps of precharge current per volt on ISET2 pin) Precharge current regulation accuracy IISET2 Leakage current into ISET2 pin RSENSE = 10 mΩ 1 A/V VIREG_PRECH = 20 mV –4% 4% VIREG_PRECH = 5 mV –25% 25% VIREG_PRECH = 1.5 mV (VSRN < 3.1 V) –55% 55% VISET2 = 2 V 100 nA CHARGE TERMINATION KTERM Termination current set factor (amps of termination current per volt on ISET2 pin) RSENSE = 10 mΩ 1 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 A/V 7 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com Electrical Characteristics (continued) 5 V ≤ VVCC ≤ 28 V, 0°C < TJ < 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted) PARAMETER TEST CONDITIONS Termination current accuracy MIN TYP MAX VITERM = 20 mV –4% 4% VITERM = 5 mV –25% 25% VITERM = 1.5 mV –45% 45% Deglitch time for termination (both edge) 100 tQUAL Termination qualification time VBAT > VRECH and ICHG VACN-SRN_RISE 2 ms ACN to SRN falling deglitch VACN – VSRN < VACN-SRN_FALL 50 μs BAT LOWV COMPARATOR VLOWV Precharge to fast-charge transition (LOWV threshold) VLOWV_HYS LOWV hysteresis Measured on VFB pin, rising 1.534 1.55 1.566 V 100 mV LOWV rising deglitch VFB falling below VLOWV 25 ms LOWV falling deglitch VFB rising above VLOWV + VLOWV_HYS 25 ms RECHARGE COMPARATOR VRECHG 8 Recharge threshold (with-respectto VREG) Measured on VFB pin, falling Recharge rising deglitch VFB decreasing below VRECHG 10 ms Recharge falling deglitch VFB decreasing above VRECHG 10 ms Submit Documentation Feedback 35 50 65 mV Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Electrical Characteristics (continued) 5 V ≤ VVCC ≤ 28 V, 0°C < TJ < 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 32.96 V BAT OVERVOLTAGE COMPARATOR VOV_RISE Overvoltage rising threshold As percentage of VFB 104% VOV_FALL Overvoltage falling threshold As percentage of VFB 102% INPUT OVERVOLTAGE COMPARATOR (ACOV) VACOV AC overvoltage rising threshold on VCC (bq24610) VACOV_HYS AC overvoltage falling hysteresis (bq24610) VACOV AC overvoltage rising threshold on VCC (bq24617) VACOV_HYS AC overvoltage falling hysteresis(bq24617) 31.04 32 1 25.22 26 V 26.78 V 820 mV 1 ms AC overvoltage deglitch (both edge) Delay to changing the STAT pins AC overvoltage rising deglitch Delay to disable charge 1 ms AC overvoltage falling deglitch Delay to resume charge 20 ms Temperature increasing 145 °C 15 °C Thermal shutdown rising deglitch Temperature increasing 100 μs Thermal shutdown falling deglitch Temperature decreasing 10 ms THERMAL SHUTDOWN COMPARATOR TSHUT Thermal shutdown rising temperature TSHUT_HYS Thermal shutdown hysteresis THERMISTOR COMPARATOR VLTF Cold temperature rising threshold As Percentage to VVREF 72.5% 73.5% 74.5% VLTF_HYS Rising hysteresis As Percentage to VVREF 0.2% VHTF Hot temperature rising threshold As Percentage to VVREF 36.2% VTCO Cut-off temperature rising threshold As Percentage to VVREF 0.4% 0.6% 37% 37.8% 33.7% 34.4% 35.1% Deglitch time for temperature outof-range detection VTS > VLTF, or VTS < VTCO, or VTS < VHTF Deglitch time for temperature invalid-range detection VTS < VLTF – VLTF_HYS or VTS >VTCO, or VTS > VHTF 400 ms 20 ms 45.5 mV CHARGE OVERCURRENT COMPARATOR (CYCLE-BY-CYCLE) Current rising, in nonsynchronous mode, mesure on V(SRP-SRN), VSRP < 2 V Charge overcurrent falling threshold Current rising, as percentage of V(IREG_CHG), in synchronous mode, VSRP > 2.2 V 160% Charge overcurrent threshold floor Minimum OCP threshold in synchronous mode, measure on V(SRP-SRN), VSRP > 2.2 V 50 mV Charge overcurrent threshold ceiling Maximum OCP threshold in synchronous mode, measure on V(SRP-SRN), VSRP > 2.2 V 180 mV VOC CHARGE UNDERCURRENT COMPARATOR (CYCLE-BY-CYCLE) VISYNSET Charge undercurrent falling threshold Switch from SYNCH to NON-SYNCH, VSRP > 2.2 V 1 5 9 mV BATTERY SHORTED COMPARATOR (BATSHORT) VBATSHT BAT short falling threshold, forced nonsynchronous mode VBATSHT_HYS BAT short rising hysteresis VBATSHT_DEG Deglitch on both edge VSRP falling 2 200 mV 1 μs Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 V 9 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com Electrical Characteristics (continued) 5 V ≤ VVCC ≤ 28 V, 0°C < TJ < 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LOW CHARGE CURRENT COMPARATOR VLC Low charge current (average) falling threshold to force into nonsynchronous mode VLC_HYS Low charge current rising hysteresis VLC_DEG Deglitch on both edge Measure on V(SRP-SRN) 1.25 mV 1.25 mV 1 μs VREF REGULATOR VVREF_REG VREF regulator voltage VVCC > VUVLO, (0- to 35-mA load) IVREF_LIM VREF current limit VVREF = 0 V, VVCC > VUVLO 3.267 35 3.3 3.333 V mA REGN REGULATOR VREGN_REG REGN regulator voltage VVCC > 10 V, CE = HIGH, (0- to 40-mA load) 5.7 IREGN_LIM REGN current limit VREGN = 0 V, VVCC > VUVLO, CE = HIGH 40 6 6.3 V mA TTC INPUT AND SAFETY TIMER TPRECHG Precharge safety timer range (1) Precharge time before fault occurs TCHARGE Fast charge safety timer range, with +/– 10% accuracy (1) Tchg = CTTC × KTTC Fast charge timer accuracy (1) 0.01 μF ≤ CTTC ≤ 0.11 μF KTTC 1440 1800 1 –10% Timer multiplier 2160 s 10 h 10% 5.6 VTTC below this threshold disables the safety timer and termination TTC low threshold min/nF 0.4 TTC oscillator high threshold 1.5 TTC oscillator low threshold V 1 TTC source/sink current 45 50 V V 55 μA BATTERY SWITCH (BATFET) DRIVER RDS_BAT_OFF BATFET turnoff resistance VACN > 5 V 150 Ω RDS_BAT_ON BATFET turnon resistance VACN > 5 V 20 kΩ VBATDRV_REG BATFET drive voltage VBATDRV_REG = VACN – VBATDRV when VACN > 5 V and BATFET is on 7 V 4.2 AC SWITCH (ACFET) DRIVER RDS_AC_OFF ACFET turnoff resistance VVCC > 5 V 30 Ω RDS_AC_ON ACFET turnon resistance VVCC > 5 V 20 kΩ ACFET drive voltage VACDRV_REG = VVCC – VACDRV when VVCC > 5 V and ACFET is on 7 V VACDRV_REG 4.2 AC / BAT MOSFET DRIVERS TIMING Dead time when switching between AC and BAT Driver dead time μs 10 BATTERY DETECTION tWAKE Wake time Max time charge is enabled IWAKE Wake current RSENSE = 10 mΩ tDISCHARGE Discharge time Maximum time discharge current is applied IDISCHARGE IFAULT VWAKE Wake threshold (with-respect-to VREG) VDISCH Discharge threshold (1) 10 500 50 125 ms 200 mA 1 s Discharge current 8 mA Fault current after a timeout fault 2 mA Voltage on VFB to detect battery absent during wake 50 mV Voltage on VFB to detect battery absent during discharge 1.55 V Verified by design. Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Electrical Characteristics (continued) 5 V ≤ VVCC ≤ 28 V, 0°C < TJ < 125°C, typical values are at TA = 25°C, with respect to GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PWM HIGH-SIDE DRIVER (HIDRV) RDS_HI_ON High-side driver (HSD) turnon resistance VBTST – VPH = 5.5 V 3.3 6 Ω RDS_HI_OFF High-side driver turnoff resistance VBTST – VPH = 5.5 V 1 1.3 Ω VBTST_REFRESH Bootstrap refresh comparator threshold voltage VBTST – VPH when low side refresh pulse is requested 4 4.2 V PWM LOW-SIDE DRIVER (LODRV) RDS_LO_ON Low-side driver (LSD) turnon resistance RDS_LO_OFF Low-side driver turnoff resistance 4.1 7 Ω 1 1.4 Ω PWM DRIVERS TIMING Dead time when switching between LSD and HSD, no load at LSD and HSD Driver dead time 30 ns PWM OSCILLATOR VRAMP_HEIGHT PWM ramp height As percentage of VCC 7% PWM switching frequency (1) 510 600 690 kHz INTERNAL SOFT START (8 steps to regulation current ICHG) Soft-start steps Soft-start step time 8 step 1.6 ms 1.5 s CHARGER SECTION POWER-UP SEQUENCING Charge-enable delay after power up Delay from CE = 1 to charger is allowed to turn on LOGIC IO PIN CHARACTERISTICS (CE, STAT1, STAT2, PG) VIN_LO CE input low threshold voltage VIN_HI CE input high threshold voltage 0.8 V 6 μA 2.1 VBIAS_CE CE input bias current V = 3.3 V (CE has internal 1-MΩ pulldown resistor) VOUT_LO STAT1, STAT2, PG output-low saturation voltage Sink Current = 5 mA 0.5 V IOUT_HI Leakage current V = 32 V 1.2 µA 8.6 Typical Characteristics Table 1. Table of Graphs FIGURE REF REGN and PG Power Up (CE = 1) Figure 1 Charge Enable Figure 2 Current Soft Start (CE = 1) Figure 3 Charge Disable Figure 4 Continuous Conduction Mode Switching Waveforms Figure 5 Cycle-by-Cycle Synchronous to Nonsynchronous Figure 6 100% Duty and Refresh Pulse Figure 7 Transient System Load (DPM) Figure 8 Battery Insertion Figure 9 Battery-to-Ground Short Protection Figure 10 Battery-to-Ground Short Transition Figure 11 Efficiency vs Output Current Figure 12 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 11 bq24610, bq24617 www.ti.com 10 V/div 10 V/div SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 PH 2 A/div IBAT REGN 5 V/div CE 5 V/div 2 V/div VREF 5 V/div /PG 2 V/div VCC LODRV t − Time = 200 ms/div t − Time = 4 ms/div Figure 2. Charge Enable 10 V/div 10 V/div Figure 1. REF REGN and PG Power Up (CE = 1) CE 5 V/div 2 A/div IBAT PH 5 V/div 2 A/div 5 V/div LODRV 5 V/div PH LODRV IL CE t − Time = 2 μs/div t − Time = 4 ms/div Figure 4. Charge Disable 5 V/div PH HIDRV LODRV 1 A/div 5 V/div PH 2 A/div 5 V/div 20 V/div 20 V/div Figure 3. Current Soft Start (CE = 1) IL LODRV IL t − Time = 100 ns/div t − Time = 100 ns/div Figure 5. Continuous Conduction Mode Switching Waveforms 12 Figure 6. Cycle-by-Cycle Synchronous to Nonsynchronous Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 10 V/div 2 A/div www.ti.com 2 A/div IIN ISYS LODRV 2 A/div 0.5 A/div 5 V/div PH IL IBAT t − Time = 200 μs/div t − Time = 400 ns/div Figure 7. 100% Duty and Refresh Pulse 10 V/div 10 V/div Figure 8. Transient System Load (DPM) PH 2 A/div LODRV IL IL 20 V/div 2 A/div 5 V/div 5 V/div PH VBAT VBAT t − Time = 200 ms/div t − Time = 4 ms/div Figure 9. Battery Insertion Figure 10. Battery-to-GND Short Protection 10 V/div 98 96 94 Efficiency - % 92 LODRV 20 V/div 2 A/div 5 V/div PH 90 20 Vin, 4 cell 88 12 Vin, 2 cell 86 IL 20 Vin, 3 cell VBAT 84 12 Vin, 1 cell 82 t − Time = 10 μs/div 80 0 Figure 11. Battery-to-GND Short Transition 1 2 5 4 3 IBAT - Output Current - A 6 7 8 Figure 12. Efficiency vs Output Current Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 13 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 9 Detailed Description 9.1 Overview The bq2461x device is a stand-alone, integrated Li-ion or Li-polymer battery charger. The device employs a switched-mode synchronous buck PWM controller with constant switching frequency. The device controls external switches to prevent battery discharge back to the input, connect the adapter to the system, and connect the battery to the system using 6-V gate drives for better system efficiency. The bq2461x features Dynamic Power Management (DPM) which reduces battery charge current when the input power limit is reached to avoid overloading the AC adapter when supplying current to the system and the battery charger simultaneously. A highly accurate current-sense amplifier enables precise measurement of input current from the AC adapter to monitor the overall system power. The input current limit can be configured through the ACSET pin of the device. The bq2461x has a battery detect scheme that allows it to automatically detect the presence and absence of a battery. When the battery is detected, charging begins in one of three phases (depending upon battery voltage): precharge, constant current (fast-charge current regulation), and constant voltage (fast-charge voltage regulation). The device will terminate charging when the termination current threshold has been reached and will begin a recharge cycle when the battery voltage has dropped below the recharge threshold (VRECHG). Precharge, constant current, and termination current can be configured through the ISET1 and ISET2 pins, allowing for flexibility in battery charging profile. During charging, the integrated fault monitors of the device, such as battery overvoltage protection, battery short detection (VBATSHT), thermal shutdown (internal TSHUT and TS pin), safety timer expiration (TTC pin), and input voltage protection (VACOV), ensure battery safety. The bq2461x has three status pins (STAT1, STAT2, and PG) to indicate the charging status and input voltage (AC adapter) status. These pins can be used to drive LEDs or communicate with a host processor. Regulation Voltage VRECH Regulation Current Precharge Current Regulation Phase Fastcharge Current Regulation Phase Fastcharge Voltage Regulation Phase Termination Charge Current Charge Voltage VLOWV IPRECH and ITERM Precharge Time Fastcharge Safety Time Figure 13. Typical Charging Profile 14 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 9.2 Functional Block Diagram bq24610/17 VREF VCC-6 V ACN ACN-6 V ACN-6 V LDO INTERNAL REFERENCE VREF 3.3 V LDO VCC - SRN+100 mV + VCC - VUVLO + ACN + VCC VCC SLEEP UVLO VCC VCC-6 V LDO SLEEP SRN+200 mV UVLO ACN-SRN - ACDRV SYSTEM POWER SELECTOR LOGIC VCC-6V ACN ACOV CE BATDRV 1M ACN-6V + 20X - V(ACP-ACN) + COMP ERROR AMPLIFIER ACN ACSET + 1V + - 2.1 V + REGN 2 mA LODRV V(SRP-SRN) 160% X IBAT_REG - CHG_OCP GND TTC Safety Timer IC Tj + 145 degC - CHARGE FAULT STAT 1 STAT1 ISET1 IBAT_ REG ISET2 + LOWV 104% X VBAT_REG - - BAT + ISET2 6 V LDO REFRESH 4.2V FAULT + ISET1 CE + + - PH - PH VCC PWM CONTROL LOGIC BTST 20µA 8 mA SYNCH + 5 mV - - IBAT_ REG SRN CHARGE OR DISCHARGE + SRP-SRN - V(SRP-SRN) HIDRV BAT_OVP 20 µA + 20X - LEVEL SHIFTER PWM - VFB SRP BTST CE + ACP TSHUT STATE MACHINE LOGIC BAT_OVP STAT 2 STAT2 PG PG VFB + - 1.55V TTC - 0.4 V + VCC + DISABLE TMR/TERM BATTERY DETECTION LOGIC ACOV TTC TTC VREF DISCHARGE VACOV +- LTF + VFB - TS SUSPEND RCHRG HTF + + - 2.05 V +- RCHRG V(SRP - SRN) + ISET2 - TERM TERM TCO + - TERMINATE CHARGE Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 15 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 9.3 Feature Description 9.3.1 Battery Voltage Regulation The bq2461x uses a high-accuracy voltage bandgap and regulator for the high charging voltage accuracy. The charge voltage is programmed through a resistor divider from the battery to ground, with the midpoint tied to the VFB pin. The voltage at the VFB pin is regulated to 2.1 V, giving the following equation for the regulation voltage: é R2 ù V = 2.1 V ´ ê1+ ú, BAT ë R1 û where • R2 is connected from VFB to the battery and R1 is connected from VFB to GND. (1) 9.3.2 Battery Current Regulation The ISET1 input sets the maximum fast-charging current. Battery charge current is sensed by resistor RSR connected between SRP and SRN. The full-scale differential voltage between SRP and SRN is 100 mV. Thus, for a 10-mΩ sense resistor, the maximum charging current is 10 A. The equation for charge current is: VISET1 ICHARGE = 20 ´ RSR (2) VISET1, the input voltage range of ISET1, is from 0 V to 2 V. The SRP and SRN pins are used to sense voltage across RSR with default value of 10 mΩ. However, resistors of other values can also be used. A larger sense resistor gives a larger sense voltage and a higher regulation accuracy, but at the expense of higher conduction loss. 9.3.3 Input Adapter Current Regulation The total input from an AC adapter or other DC source is a function of the system supply current and the battery charging current. System current normally fluctuates as portions of the systems are powered up or down. Without DPM, the source must be able to supply the maximum system current and the maximum charger input current simultaneously. By using DPM, the battery charger reduces the charging current when the input current exceeds the input current limit set by ACSET. The current capability of the AC adapter can be lowered, reducing system cost. Similar to setting battery regulation current, adapter current is sensed by resistor RAC connected between ACP and ACN. Its maximum value is set by ACSET using Equation 3: VACSET IDPM = 20 ´ RAC (3) VACSET, the input voltage range of ACSET, is from 0 V to 2 V. The ACP and ACN pins are used to sense voltage across RAC with default value of 10 mΩ. However, resistors of other values can also be used. A larger the sense resistor gives a larger sense voltage and a higher regulation accuracy, but at the expense of higher conduction loss. 9.3.4 Precharge On power up, if the battery voltage is below the VLOWV threshold, the bq2461x applies the precharge current to the battery. This feature is intended to revive deeply discharged cells. If the VLOWV threshold is not reached within 30 minutes of initiating precharge, the charger turns off and a FAULT is indicated on the status pins. The precharge current is determined by the voltage, VISET2, on the ISET2 pin. VISET2 IPRECHARGE = 100 ´ R SR (4) 9.3.5 Charge Termination, Recharge, and Safety Timer The bq2461x monitors the charging current during the voltage regulation phase. When VTTC is valid, termination is detected while the voltage on the VFB pin is higher than the VRECH threshold AND the charge current is less than the ITERM threshold, as calculated in Equation 5: 16 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Feature Description (continued) ITERM = VISET2 100 ´ RSR (5) The input voltage of ISET2 is from 0 V to 2 V. The minimum precharge/termination current is clamped to be around 125 mA with default 10-mΩ sensing resistor. As a safety backup, the bq2461x also provides a programmable charge timer. The charge time is programmed by the capacitor connected between the TTC pin and GND, and is given by Equation 6 tCHARGE = CTTC ´ K TTC where • • A • • • CTTC (range from 0.01 µF to 0.11 µF to give 1- to 10-h safety time) is the capacitor connected from TTC pin to GND. KTTC is the constant multiplier (5.6 min/nF). (6) new charge cycle is initiated and safety timer is reset when one of the following conditions occurs: The battery voltage falls below the recharge threshold. A power-on-reset (POR) event occurs. CE is toggled. The TTC pin may be taken LOW to disable termination and to disable the safety timer. If TTC is pulled to VREF, the bq2461x continues to allow termination, but disables the safety timer. TTC taken low resets the safety timer. When ACOV, VCCLOWV, and SLEEP mode resume normal, the safety timer is reset. 9.3.6 Power Up The bq2461x uses a SLEEP comparator to determine the source of power on the VCC pin, because VCC can be supplied either from the battery or the adapter. If the VCC voltage is greater than the SRN voltage, bq2461x enables the ACFET and disables BATFET. If all other conditions are met for charging, the bq2461x then attempts to charge the battery (see Enable and Disable Charging). If the SRN voltage is greater than VCC, indicating that the battery is the power source, the bq2461x enables the BATFET and enters a low quiescent current ( VRECH Yes Disable 125-mA Charge No 0.5-s timer expired No Yes Battery Present, Begin Charge Battery Absent Figure 16. Battery Detection Flow Chart Once the device has powered up, an 8-mA discharge current is applied to the SRN terminal. If the battery voltage falls below the LOWV threshold within 1 second, the discharge source is turned off, and the charger is turned on at low charge current (125 mA). If the battery voltage rises above the recharge threshold within 500 ms, there is no battery present and the cycle restarts. If either the 500-ms or 1-second timer times out before its respective threshold is hit, a battery is detected and a charge cycle is initiated. Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 23 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com Battery not detected VREG VRECH (VWAKE) Battery inserted VLOWV Battery detected (VDISH) tLOWV_DEG tWAKE tRECH_DEG Figure 17. Battery Detect Timing Diagram Ensure that the total output capacitance at the battery node is not so large that the discharge current source cannot pull the voltage below the LOWV threshold during the 1-second discharge time. The maximum output capacitance can be calculated as follows: CMAX = IDISCH ´ tDISCH é R ù 0.5 ´ ê1+ 2 ú ë R1 û where • • • • CMAX is the maximum output capacitance. IDISCH is the discharge current. tDISCH is the discharge time. R2 and R1 are the voltage feedback resistors from the battery to the VFB pin. (10) The 0.5 factor is the difference between the RECHARGE and the LOWV thresholds at the VFB pin. Example For a 3-cell Li+ charger, with R2 = 500 kΩ, R1 = 100 kΩ (giving 12.6 V for voltage regulation), IDISCH = 8 mA, tDISCH = 1 second, 8mA ´ 1sec CMAX = = 2.7 mF é 500k ù 0.5 ´ ê1+ ú ë 100k û (11) Based on these calculations, no more than 2.7 mF should be allowed on the battery node for proper operation of the battery detection circuit. 24 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 9.4 Device Functional Modes Figure 18. Device Operation Flow Chart Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 25 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The bq2461x battery charger is ideal for high current charging (up to 10 A) and can charge battery packs consisting of single cells or multiple cells in series. The bq24610EVM evaluation module is a complete charge module for evaluating the bq2461x. The application curves were taken using the bq24610EVM. Refer to the EVM user's guide (SLUU396) for EVM information. 10.2 Typical Application Q1 (ACFET) SI7617DN R17 10Ω SYSTEM P ADAPTER- P R14 100 kW C16 2.2μF RAC 0.010 W Q2 (ACFET) SI7616DN C14 0.1 mF C15 0.1 µF C3 0.1 µF C2 0.1 µF ACN VCC BATDRV ACDRV R5 100 kW R18 1 kΩ R7 100 kW R6 10 kW R15 100 kW PH ISET2 BTST R8 22.1 kW VREF REGN bq24610 bq24617 C6 0.1 µF C5 1 µF LODRV C4 1 µF Q4 SIS412DN L1 D1 BAT54 D2 R12 10 kW D3 C12 C13 10 µF* 10 µF* Q5 SIS412DN SRP C11 0.1 µF R2 500 kΩ Cff 22 pF D4 R1 100 kW SRN STAT2 PG VREF 103AT PACK+ PACK- STAT1 ADAPTER + Pack Thermistor Sense VBAT 6.8 µH* C10 0.1 µF GND R9 9.31 kW RSR 0.010 W CE R11 10 kW R13 10 kW P Q3 (BATFET) SI7617DN R19 1 kΩ HIDRV ISET1 ACSET R4 32.4 kW C7 1µF ACP VREF R3 100 kW C9 10 μF C8 10 µF N R20 2Ω N ADAPTER+ VFB R16 100 W R10 430 kW C1 0.1 μF TS TTC PwrPad CTTC 0.056 μF VIN = 19 V, 3-cell, Iadapter_limit = 4 A, Icharge = 3 A, Ipre-charge = Iterm = 0.3 A, 5-hour saftey timer Figure 19. System Schematic 26 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Typical Application (continued) 10.2.1 Design Requirements For this design example, use the parameters listed in Table 3 as the input parameters. Table 3. Design Parameters DESIGN PARAMETER EXAMPLE VALUE AC adapter voltage (VIN) 19 V AC adapter current limit 4A Battery charge voltage (number of cells in series) Battery charge current (during constant current phase) Precharge and termination current Safety timer 12.6 V (3 cells) 3A 0.3 A 5 hours 10.2.2 Detailed Design Procedure 10.2.2.1 Inductor Selection The bq2461x has 600-kHz switching frequency to allow the use of small inductor and capacitor values. Inductor saturation current should be higher than the charging current (ICHG) plus half the ripple current (IRIPPLE): ISAT ³ ICHG + (1/2) IRIPPLE (12) The inductor ripple current depends on input voltage (VIN), duty cycle (D = VOUT/VIN), switching frequency (fs) and inductance (L): V ´ D ´ (1 - D) IRIPPLE = IN fS ´ L (13) The maximum inductor ripple current happens with D = 0.5 or close to 0.5. For example, the battery charging voltage range is from 9 V to 12.6 V for a 3-cell battery pack. For 20-V adapter voltage, 10-V battery voltage gives the maximum inductor ripple current. Another example is a 4-cell battery, the battery voltage range is from 12 V to 16.8 V, and 12-V battery voltage gives the maximum inductor ripple current. Usually inductor ripple is designed in the range of (20%–40%) maximum charging current as a trade-off between inductor size and efficiency for a practical design. The bq2461x has cycle-by-cycle charge undercurrent protection (UCP) by monitoring the charging-current sensing resistor to prevent negative inductor current. The typical UCP threshold is 5-mV falling edge corresponding to 0.5-A falling edge for a 10-mΩ charging-current sensing resistor. 10.2.2.2 Input Capacitor The input capacitor should have enough ripple current rating to absorb input switching ripple current. The worstcase RMS ripple current is half of the charging current when the duty cycle is 0.5. If the converter does not operate at 50% duty cycle, then the worst-case capacitor RMS current ICIN occurs where the duty cycle is closest to 50% and can be estimated by the following equation: ICIN = ICHG ´ D ´ (1 - D) (14) A low-ESR ceramic capacitor such as X7R or X5R is preferred for the input decoupling capacitor and should be placed to the drain of the high-side MOSFET and source of the low-side MOSFET as close as possible. The voltage rating of the capacitor must be higher than the normal input voltage level. A 25-V or higher-rating capacitor is preferred for 20-V input voltage. 10-µF to 20-µF capacitance is suggested for typical of 3-A to 4-A charging current. 10.2.2.3 Output Capacitor Output capacitor also should have enough ripple-current rating to absorb the output switching ripple current. The output capacitor RMS current ICOUT is given: Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 27 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 ICOUT = IRIPPLE 2 ´ 3 www.ti.com » 0.29 ´ IRIPPLE (15) The output capacitor voltage ripple can be calculated as follows: DVo = 1 8LCfs 2 æ V 2 ç VBAT - BAT ç VIN è ö ÷ ÷ ø (16) At a certain input/output voltage and switching frequency, the voltage ripple can be reduced by increasing the output filter LC. The bq2461x has an internal loop compensator. To get good loop stability, the resonant frequency of the output inductor and output capacitor should be designed between 12 kHz and 17 kHz. The preferred ceramic capacitor has a 25-V or higher rating, X7R or X5R for 4-cell application. 10.2.2.4 Power MOSFETs Selection Two external N-channel MOSFETs are used for a synchronous switching battery charger. The gate drivers are internally integrated into the IC with 6 V of gate drive voltage. 30-V or higher-voltage rating MOSFETs are preferred for 20-V input voltage and 40-V or higher-rating MOSFETs are preferred for 20-V to 28-V input voltage. Figure-of-merit (FOM) is usually used for selecting the proper MOSFET based on a tradeoff between the conduction loss and switching loss. For a top-side MOSFET, FOM is defined as the product of the MOSFET ONresistance, rDS(on), and the gate-to-drain charge, QGD. For a bottom-side MOSFET, FOM is defined as the product of the MOSFET ON-resistance, rDS(on), and the total gate charge, QG. FOM top = RDS(on) ´ QG D FOMbottom = RDS(on) ´ QG (17) The lower the FOM value, the lower the total power loss. Usually lower rDS(on) has higher cost with the same package size. The top-side MOSFET loss includes conduction loss and switching loss. It is a function of duty cycle (D = VOUT/VIN), charging current (ICHG), the MOSFET ON-resistance tDS(on)), input voltage (VIN), switching frequency (fS), turnon time (ton) and turnoff time (toff): 1 Ptop = D ´ ICHG2 ´ RDS(on) + ´ VIN ´ ICHG ´ (t on + t off ) ´ fS 2 (18) The first item represents the conduction loss. Usually MOSFET rDS(on) increases by 50% with 100ºC junction temperature rise. The second term represents the switching loss. The MOSFET turnon and turnoff times are given by: Q Q ton = SW , t off = SW Ion Ioff where • • • Qsw is the switching charge. Ion is the turnon gate-driving current. Ioff is the turnoff gate driving current. (19) If the switching charge is not given in the MOSFET data sheet, it can be estimated by gate-to-drain charge (QGD) and gate-to-source charge (QGS): 1 QSW = QGD + ´ QGS 2 (20) Total gate-driving current can be estimated by the REGN voltage (VREGN), MOSFET plateau voltage (Vplt), total turnon gate resistance (Ron), and turnoff gate resistance (Roff) of the gate driver: VREG N - Vplt Vplt Ion = , Ioff = Ron Roff (21) The conduction loss of the bottom-side MOSFET is calculated with the following equation when it operates in synchronous CCM: 28 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 Pbottom = (1 - D) ´ ICHG 2 ´ RDS(on) (22) If the SRP-SRN voltage decreases below 5 mV (the charger is also forced into nonsynchronous mode when the average SRP-SRN voltage is lower than 1.25 mV), the low-side FET is turned off for the remainder of the switching cycle to prevent negative inductor current. As a result, all the freewheeling current goes through the body diode of the bottom-side MOSFET. The maximum charging current in nonsynchronous mode can be up to 0.9 A (0.5 A typical) for a 10-mΩ charging-current sensing resistor, considering IC tolerance. Choose the bottom-side MOSFET with either an internal Schottky or body diode capable of carrying the maximum nonsynchronous-mode charging current. MOSFET gate-driver power loss contributes to the dominant losses on the controller IC when the buck converter is switching. Choosing the MOSFET with a small Qg_total reduces the IC power loss to avoid thermal shutdown. PICLoss_driver = VIN × Qg_total × fs where • Qg_total is the total gate charge for both upper and lower MOSFETs at 6-V VREGN. (23) 10.2.2.5 Input Filter Design During adapter hot plug-in, the parasitic inductance and input capacitor from the adapter cable form a secondorder system. The voltage spike at the VCC pin may be beyond the IC maximum voltage rating and damage the IC. The input filter must be carefully designed and tested to prevent an overvoltage event on the VCC pin. The ACP/ACN pins must be placed after the input ACFET in order to avoid overvoltage stress on these pins during hot plug-in. There are several methods for damping or limiting the overvoltage spike during adapter hot plug-in. An electrolytic capacitor with high ESR as an input capacitor can damp the overvoltage spike well below the IC maximum pin voltage rating. A high-current capability TVS Zener diode can also limit the overvoltage level to an IC safe level. However these two solutions may not have low cost or small size. A cost-effective and small size-solution is shown in Figure 20. The R1 and C1 are composed of a damping RC network to damp the hot plug-in oscillation. As a result, the overvoltage spike is limited to a safe level. D1 is used for reverse voltage protection for the VCC pin (it can be the body diode of input ACFET). C2 is VCC pin decoupling capacitor and it should be placed as close as possible to the VCC pin. R2 and C2 form a damping RC network to further protect the IC from high dv/dt and high-voltage spike. The C2 value should be less than the C1 value so R1 can be dominant over the ESR of C1 to get enough damping effect for hot plug-in. The R1 and R2 packages must be sized to handle in-rush current power loss according to resistor manufacturer’s datasheet. The filter component values always must be verified with the real application and minor adjustments may be needed to fit in the real application circuit. D1 Adapter connector R1 2W C1 2.2 mF (2010) R2 (1206) 4.7 -30W VCC pin C2 0.1-1 mF Figure 20. Input Filter 10.2.2.6 Inductor, Capacitor, and Sense Resistor Selection Guidelines The bq2461x provides internal loop compensation. With this scheme, best stability occurs when the LC resonant frequency, fo, is approximately 12 kHz to 17 kHz for bq2461x. Table 4 provides a summary of typical LC components for various charge currents: Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 29 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com Table 4. Typical Inductor, Capacitor, and Sense Resistor Values as a Function of Charge Current for bq2461x (600-kHz Switching Frequency) CHARGE CURRENT 2A 4A 6A 8A 10 A Output inductor LO 6.8 μH 6.8 μH 4.7 μH 3.3 μH 3.3 μH Output capacitor CO 20 μF 20 μF 30 μF 40 μF 40 μF Sense resistor 10 mΩ 10 mΩ 10 mΩ 10 mΩ 10 mΩ Table 5. Component List for Typical System Circuit of Figure 19 PART DESIGNATOR QTY DESCRIPTION Q1, Q2, Q3 3 P-channel MOSFET, –30 V, –35 A, PowerPAK 1212-8, Vishay-Siliconix, Si7617DN Q4, Q5 2 N-channel MOSFET, 30 V, 12 A, PowerPAK 1212-8, Vishay-Siliconix, Sis412DN D1 1 Diode, dual Schottky, 30 V, 200 mA, SOT23, Fairchild, BAT54C D2, D3, D4 3 LED diode, green, 2.1 V, 20 mA, LTST-C190GKT RAC, RSR 2 Sense resistor, 10 mΩ, 2010, Vishay-Dale, WSL2010R0100F L1 1 Inductor, 6.8 µH, 5.5A, Vishay-Dale IHLP2525CZ C8, C9, C12, C13 4 Capacitor, ceramic, 10 µF, 35 V, 20%, X7R C4, C5 2 Capacitor, ceramic, 1 µF, 16 V, 10%, X7R C1, C3, C6, C11 4 Capacitor, ceramic, 0.1 µF, 16 V, 10%, X7R C2, C10 2 Capacitor, ceramic, 0.1 µF, 50 V, 10%, X7R C7 1 Capacitor, ceramic, 1 µF, 50 V, 10%, X7R C14, C15 (Optional) 2 Capacitor, ceramic, 0.1 µF, 50 V, 10%, X7R C16 1 Capacitor, ceramic, 2.2 µF, 35 V, 10%, X7R Cff 1 Capacitor, ceramic, 22 pF, 25 V, 10%, X7R CTTC 1 Capacitor, ceramic, 0.056 µF, 16 V, 5%, X7R R1, R3, R5, R7 4 Resistor, chip, 100 kΩ, 1/16 W, 0.5% R2 1 Resistor, chip, 500 kΩ, 1/16 W, 0.5% R4 1 Resistor, chip, 32.4 kΩ, 1/16 W, 0.5% R6 1 Resistor, chip, 10 kΩ, 1/16 W, 0.5% R8 1 Resistor, chip, 22.1 kΩ, 1/16 W, 0.5% R9 1 Resistor, chip, 9.31 kΩ, 1/16 W, 1% R10 1 Resistor, chip, 430 kΩ, 1/16 W, 1% R11, R12, R13, R18, R19 5 Resistor, chip, 10 kΩ, 1/16 W, 5% R14, R15 (optional) 2 Resistor, chip, 100 kΩ, 1/16 W, 5% R16 1 Resistor, chip, 100 Ω, 1/16 W, 5% R17 1 Resistor, chip, 10 Ω, 1/4 W, 5% R20 1 Resistor, chip, 2 Ω, 1 W, 5% 30 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 10.2.3 Application Curves VIN: 19 V VBAT: 12 V ICHG = 4 A Figure 21. Continuous Conduction Mode Switching Waveform VIN: 19 V VBAT: 12 V Figure 22. Battery Charging Soft Start Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 31 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 11 Power Supply Recommendations For proper operation of bq2461x, VCC must be from 5 V to 28 V (bq24610) or 24 V (bq24617). To begin charging, VCC must be higher than SRN by at least 500 mV (otherwise, the device will be in sleep mode). TI recommends an input voltage of at least 1.5 V to 2 V higher than the battery voltage, taking into consideration the DC losses in the high-side FET (Rdson), inductor (DCR), and input sense resistor (between ACP and ACN), the body diode drop of RBFET between VCC and input power supply, and battery sense resistor (between SRP and SRN). Power limit for the input supply must be greater than the maximum power required by either the system load or for battery charging (the greater of the two). 12 Layout 12.1 Layout Guidelines The switching node rise and fall times should be minimized for minimum switching loss. Proper layout of the components to minimize high-frequency current-path loop (see Figure 23) is important to prevent electrical and magnetic field radiation and high-frequency resonant problems. Here is a PCB layout priority list for proper layout. Layout of the PCB according to this specific order is essential. 1. Place the input capacitor as close as possible to switching MOSFET supply and ground connections and use the shortest possible copper trace connection. These parts should be placed on the same layer of the PCB instead of on different layers and using vias to make this connection. 2. The IC should be placed close to the switching MOSFET gate terminals to keep the gate-drive signal traces short for a clean MOSFET drive. The IC can be placed on the other side of the PCB from the switching MOSFETs. 3. Place the inductor input terminal as close as possible to the switching MOSFET output terminal. Minimize the copper area of this trace to lower electrical and magnetic field radiation, but make the trace wide enough to carry the charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any other trace or plane. 4. The charging-current sensing resistor should be placed right next to the inductor output. Route the sense leads connected across the sensing resistor back to the IC in same layer, close to each other (minimize loop area) and do not route the sense leads through a high-current path (see Figure 24 for Kelvin connection for best current accuracy). Place the decoupling capacitor on these traces next to the IC. 5. Place the output capacitor next to the sensing resistor output and ground. 6. Output capacitor ground connections must be tied to the same copper that connects to the input capacitor ground before connecting to system ground. 7. Route the analog ground separately from the power ground and use a single ground connection to tie the charger power ground to the charger analog ground. Just beneath the IC, use the copper-pour for analog ground, but avoid power pins to reduce inductive and capacitive noise coupling. Connect analog ground to GND. Connect analog ground and power ground together using the thermal pad as the single ground connection point. Or use a 0-Ω resistor to tie analog ground to power ground (thermal pad should tie to analog ground in this case). A star connection under the thermal pad is highly recommended. 8. It is critical to solder the exposed thermal pad on the back side of the IC package to the PCB ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the other layers. 9. Place decoupling capacitors next to the IC pins and make trace connection as short as possible. 10. Size and number of all vias must be enough for a given current path. See the EVM design (SLUU396) for the recommended component placement with trace and via locations. For the QFN information, see SCBA017 and SLUA271. 32 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 bq24610, bq24617 www.ti.com SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 12.2 Layout Example SW L1 V BAT R1 High Frequency VIN BAT Current C1 Path PGND C2 C3 Figure 23. High-Frequency Current Path Current Direction R SNS Current Sensing Direction To SRP - SRN pin or ACP - ACN pin Figure 24. Sensing Resistor PCB Layout Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 33 bq24610, bq24617 SLUS892C – DECEMBER 2009 – REVISED APRIL 2015 www.ti.com 13 Device and Documentation Support 13.1 Device Support 13.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 6. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY bq24610 Click here Click here Click here Click here Click here bq24617 Click here Click here Click here Click here Click here 13.3 Trademarks All trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 34 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: bq24610 bq24617 PACKAGE OPTION ADDENDUM www.ti.com 18-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ24610RGER ACTIVE VQFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OAS BQ24610RGET ACTIVE VQFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OAS BQ24617RGER ACTIVE VQFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OFB BQ24617RGET ACTIVE VQFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OFB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Aug-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Apr-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ24610RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24610RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24610RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24610RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24617RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24617RGER VQFN RGE 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24617RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ24617RGET VQFN RGE 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Apr-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ24610RGER VQFN RGE 24 3000 367.0 367.0 35.0 BQ24610RGER VQFN RGE 24 3000 367.0 367.0 35.0 BQ24610RGET VQFN RGE 24 250 210.0 185.0 35.0 BQ24610RGET VQFN RGE 24 250 210.0 185.0 35.0 BQ24617RGER VQFN RGE 24 3000 367.0 367.0 35.0 BQ24617RGER VQFN RGE 24 3000 367.0 367.0 35.0 BQ24617RGET VQFN RGE 24 250 210.0 185.0 35.0 BQ24617RGET VQFN RGE 24 250 210.0 185.0 35.0 Pack Materials-Page 2 GENERIC PACKAGE VIEW RGE 24 VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD Images above are just a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4204104/H PACKAGE OUTLINE RGE0024B VQFN - 1 mm max height SCALE 3.000 PLASTIC QUAD FLATPACK - NO LEAD 4.1 3.9 A B 0.5 0.3 PIN 1 INDEX AREA 4.1 3.9 0.3 0.2 DETAIL OPTIONAL TERMINAL TYPICAL C 1 MAX SEATING PLANE 0.05 0.00 0.08 C 2X 2.5 (0.2) TYP 2.45 0.1 7 SEE TERMINAL DETAIL 12 EXPOSED THERMAL PAD 13 6 2X 2.5 SYMM 25 18 1 20X 0.5 24 PIN 1 ID (OPTIONAL) 0.3 0.2 0.1 C A B 0.05 24X 19 SYMM 24X 0.5 0.3 4219013/A 05/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RGE0024B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 2.45) SYMM 24 19 24X (0.6) 1 18 24X (0.25) (R0.05) TYP 25 SYMM (3.8) 20X (0.5) 13 6 ( 0.2) TYP VIA 12 7 (0.975) TYP (3.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL EXPOSED METAL SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK SOLDER MASK DEFINED SOLDER MASK DETAILS 4219013/A 05/2017 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN RGE0024B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 4X ( 1.08) (0.64) TYP 24 19 24X (0.6) 1 25 18 24X (0.25) (R0.05) TYP (0.64) TYP SYMM (3.8) 20X (0.5) 13 6 METAL TYP 12 7 SYMM (3.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 25 78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X 4219013/A 05/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated
BQ24610RGER 价格&库存

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BQ24610RGER
  •  国内价格 香港价格
  • 1+39.092451+4.84940
  • 10+28.6539710+3.55451
  • 25+26.0397825+3.23023
  • 100+23.16360100+2.87344
  • 250+21.79100250+2.70317
  • 500+20.96332500+2.60049
  • 1000+20.282101000+2.51599

库存:5750

BQ24610RGER
  •  国内价格
  • 1+3.75000
  • 10+3.45000
  • 30+3.39000
  • 100+3.21000

库存:259