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User’s Guide
BQ25306 (BMS005) Evaluation Module
ABSTRACT
This user's guide provides detailed testing instructions for the BQ25306 evaluation module (EVM). Also included
are descriptions of the necessary equipment, equipment setup, procedures, the printed-circuit board layouts,
schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM, BQ25306EVM, BMS005, BMS005-004 and the term
evaluation module are synonymous with the BQ25306 evaluation module, unless otherwise noted.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Features............................................................................................................................................................................. 2
1.2 I/O Descriptions..................................................................................................................................................................2
2 Test Setup and Results.......................................................................................................................................................... 3
2.1 Equipment.......................................................................................................................................................................... 3
2.2 Equipment Setup................................................................................................................................................................3
2.3 Test Procedure................................................................................................................................................................... 4
3 PCB Layout Guideline............................................................................................................................................................ 5
4 Board Layout, Schematic, and Bill of Materials...................................................................................................................6
4.1 Board Layout......................................................................................................................................................................6
4.2 Schematic.......................................................................................................................................................................... 9
4.3 Bill of Materials.................................................................................................................................................................10
5 Revision History................................................................................................................................................................... 13
List of Figures
Figure 2-1. Original Test Setup for BMS005-004.........................................................................................................................3
Figure 2-2. BQ25306EVM 1-Cell Efficiency.................................................................................................................................5
Figure 2-3. BQ25306EVM 2-Cell Efficiency.................................................................................................................................5
Figure 4-1. Top Overlay............................................................................................................................................................... 6
Figure 4-2. Top Solder................................................................................................................................................................. 6
Figure 4-3. Top Layer...................................................................................................................................................................7
Figure 4-4. Bottom Layer............................................................................................................................................................. 7
Figure 4-5. Bottom Solder............................................................................................................................................................7
Figure 4-6. Bottom Overlay..........................................................................................................................................................8
Figure 4-7. BQ25306 Schematic................................................................................................................................................. 9
List of Tables
Table 1-1. Device Data Sheets.................................................................................................................................................... 2
Table 1-2. EVM I/O Connections................................................................................................................................................. 2
Table 1-3. EVM Jumper and Shunt Installation............................................................................................................................2
Table 2-1. Precharge Current Measurement............................................................................................................................... 4
Table 2-2. Fast Charge Current Measurement............................................................................................................................ 4
Table 4-1. BQ25306 Bill of Materials......................................................................................................................................... 10
Trademarks
All trademarks are the property of their respective owners.
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Introduction
1 Introduction
The BQ25306EVM is an evaluation kit for the BQ25306 integrated battery charge management IC.
1.1 Features
For detailed features and operation, refer to Table 1-1 for a list of devices and their data sheets.
Table 1-1. Device Data Sheets
Device
Data Sheet
BQ25306
SLUSDC7
EVM Label
Variant
BQ25306EVM
BMS005-004
The BMS005 evaluation module (EVM) is a complete charger module for evaluating an integrated, standalone,
synchronous buck battery charger using any of the devices listed above.
1.2 I/O Descriptions
Table 1-2 lists the input and output connections available on this EVM and their respective descriptions.
Table 1-2. EVM I/O Connections
Jack
Description
J1(1) –GND
Ground
J1(2) –EXT_TS
Connect to thermistor of external battery
J1(3) – BATTERY
Positive rail of the charger battery input, connected to the positive
terminal of the external battery
J2(1) –GND
Ground
J2(2) –VIN
Positive rail of the charger input voltage
Table 1-3 lists the jumper and shunt installations available on this EVM and their respective descriptions.
Table 1-3. EVM Jumper and Shunt Installation
Jack
Description
BQ25306 Setting
SH-JP1
EN pull-up rail selection.
JP1 2-3 Installed
1-2 pulls EN up to external VDD (EN_CTRL either REGN or external voltage source depending on
JP3 configuration.)
2-3 pulls EN down to GND.
SH-JP2
POL pull-up rail selection.
1-2 POL pull down to GND.
Shunt Not Installed
SH-JP3
EN external VDD rail selection (EN_CTRL)
1-2 pulls EN_CTRL to external voltage supply connected to JP3-1
2-3 pulls EN_CTRL to REGN
Shunt Not Installed
SH-JP4
Set charge regulation voltage of BQ25306 to 4.2V
Installed
SH-JP5
Set charge regulation voltage of BQ25306 to 8.4V
Shunt Not Installed
SH-JP6
VSET Short to GND.
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP7
VSET Resistor pull down to GND of 10.2kΩ
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP8
VSET Resistor pull down to GND of 51.1kΩ
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP9
ICHG Resistor pull down to GND with 40.2kΩ to set charge current to 1A.
Populate both SH-JP9 and SH-JP10 to program 3A charge current.
Installed
SH-JP10
ICHG Resistor pull down to GND with 20kΩ to set charge current to 2A.
Populate both SH-JP9 and SH-JP10 to program 3A charge current.
Shunt Not Installed
For recommended operating conditions, refer to data sheet of the respective battery charger IC shown in Table
1-1.
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Test Setup and Results
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2 Test Setup and Results
2.1 Equipment
This section includes a list of supplies required to perform tests on this EVM.
1. Power Supply #1 (PS1): A power supply capable of supplying 5 V at 3 A is required. While this part can
handle larger voltage and current, it is not necessary for this procedure.
Power Supply #2 (PS2): A power supply capable of supplying 5 V at 1 A is required.
2. Loads: Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V): A "Kepco" Load, BOP, 20-5M, DC 0 to ±20
V, 0 to ±5 A (or higher)
Alternative Option: A 0–20V/0–5 A, > 30-W DC electronic load set in a constant voltage loading mode
3. Meters: (4x) "Fluke 75" multimeters, (equivalent or better).
4. No software is required to test this part.
2.2 Equipment Setup
1.
2.
3.
4.
5.
6.
Review EVM connections in Table 1-2.
Set PS1 for 5-V DC, 2-A current limit and then turn off the supply.
Set PS2 for 3-V DC, 2-A current limit and then turn off the supply.
Connect the output of PS1 to J2 (VBUS and PGND) as shown in Figure 2-1.
Connect a voltage meter across TP4 (VBUS) and TP9 (PGND), or across J2.
Turn on Load #1, set to constant voltage mode, and output to 2.5-V. Disable Load. Connect Load to J1-3
(BAT ) and J1-1 (PGND) as shown in Figure 2-1.
7. Connect one voltage meter across TP5 (BAT) and TP11 (PGND), or across J1-3 and J1-1 as shown in Figure
2-1.
8. Connect one voltage meter across TP2 (PMID) and TP10 (PGND)
9. Connect the output of PS2 to TP7 (TS) and TP12 (PGND) as shown in Figure 2-1
10.Install shunts as shown in Table 1-3.
GND
-
+
-
Load #1
V
V
Power Supply
#1
+
GND
V
GND
- +
Power Supply
#2
Figure 2-1. Original Test Setup for BMS005-004
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Test Setup and Results
2.3 Test Procedure
2.3.1 Initial Settings
Use the following steps for enable the EVM test setup:
Make sure Section 2.1 steps have been followed. Turn on PS1
• Measure → VPMID (PMID-TP2 and PGND-TP10) = 5.00V ± 0.3V
• Completely disconnect PS1 from J2 if different voltage value is seen on PMID
Note
Completely disconnect Load #1 from BATTERY connections if different value is seen.
2.3.2 Precharge Mode Verification
Enable Load #1 and take measurements as follows
1. Measure → VBAT (BAT-TP5 and PGND-TP11) = 2.5V ± 0.1V
2. Observe → STAT LED (D2) on
3. Measure → IBAT for respective battery charger IC from Table 2-1
Table 2-1. Precharge Current Measurement
BQ25306EVM
IBAT
100mA ± 50mA
2.3.3 Fast Charge Mode Verification
1. Change Load #1 to 3.8V and take measurements as follows:
a. Measure → VBAT (BAT-TP5 and PGND-TP11) = 3.8V ± 0.1V
b. Observe → STAT LED (D2) on
c. Measure → IBAT for respective battery charger IC from Table 2-2
Table 2-2. Fast Charge Current Measurement
BQ25306EVM
IBAT
1000mA ± 100mA
2.3.4 Battery Temperature Monitoring Verification
1. Connect PS2 across TS-TP7 and PGND-TP12. Turn on PS2 and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 3V ± 0.1V
b. Observe → STAT LED (D2) on
c. Measure → IBAT for respective battery charger IC from Table 2-2
2. Change PS2 to 4V and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 4V ± 0.1V
b. Observe → STAT LED (D2) blinking at 1Hz to indicate a fault
c. Measure → IBAT = 0A ± 10mA
d. Battery charger is operating in COLD
i. For more information on TS threshold refer to Table 1-1
3. Change PS2 to 1V and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 1V ± 0.1V
b. Observe → STAT LED (D2) blinking at 1Hz to indicate a fault
c. Measure → IBAT = 0A ± 10mA
d. Battery charger is operating in HOT
i. For more information on TS threshold refer to Table 1-1
2.3.5 Evaluation Results
This section contains efficiency data for BQ25306 at both 1-cell and 2-cell Li-ion battery configuration,
specifically on the BQ25306EVM.
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100
Charge Efficiency (%)
95
90
85
VBUS = 5V
VBUS = 9V
VBUS = 12V
VBUS = 15V
80
75
0.3
0.6
0.9
1.2
1.5
1.8
2.1
Charge Current (A)
2.4
2.7
3
Char
Figure 2-2. BQ25306EVM 1-Cell Efficiency
Charge Efficiency (%)
100
95
90
85
VBUS = 10V
VBUS = 12V
VBUS = 15V
80
0.3
0.6
0.9
1.2
1.5
1.8
2.1
Charge Current (A)
2.4
2.7
3
Char
Figure 2-3. BQ25306EVM 2-Cell Efficiency
2.3.6 Helpful Tips
1. BQ25306EVM is configured by default to operate with TS in normal range. If external thermistor is available,
connect external thermistor at J1(2)-EXT_TS and J1(1)-PGND, and remove R14.
2. The leads and cables to the various power supplies, batteries and loads have resistance. The current meters
also have series resistance. The charger dynamically reduces charge current depending on the voltage
sensed at its VBUS pin (using the VINDPM feature), BAT pin (as part of normal termination), and TS pin
(through its battery temperature monitoring feature via battery thermistor). Therefore, voltmeters must be
used to measure the voltage as close to the IC pins as possible instead of relying on the digital readouts of
the power supply.
3. When using a source meter that can source and sink current as your battery simulator, TI highly recommends
adding a large (1000+ μF) capacitor at the EVM BATTERY and GND connectors in order to prevent
oscillations at the BAT pin due to mismatched impedances of the charger output and source meter input
within their respective regulation loop bandwidths. Configuring the source meter for 4-wire sensing eliminates
the need for a separate voltmeter to measure the voltage at the BAT pin.
When using 4-wire sensing, always ensure that the sensing leads are connected in order to prevent
accidental overvoltage by the power leads.
3 PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the components
minimizing high-frequency current path loop is important to prevent electrical and magnetic field radiation and
high-frequency resonant problems. This PCB layout priority list must be followed in the order presented for
proper layout:
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Board Layout, Schematic, and Bill of Materials
1. Place the input capacitor as close as possible to the PMID pin and GND pin connections and use the shortest
copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this trace to
lower electrical and magnetic field radiation but make the trace wide enough to carry the charging current. Do
not use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any
other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a short
copper trace connection or GND plane.
4. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
5. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC connecting to the ground plane on the other
layers.
6. The via size and number should be enough for a given current path.
7. For more layout guidelines and recommendations refer to the datasheet of the respective battery charger IC
8. See the EVM design for the recommended component placement with trace and via locations. For the QFN
information, refer to Quad Flatpack No-Lead Logic Packages Application Report and QFN and SON PCB
Attachment Application Report.
4 Board Layout, Schematic, and Bill of Materials
4.1 Board Layout
The board layout is shown in Figure 4-1 to Figure 4-6.
Figure 4-1. Top Overlay
Figure 4-2. Top Solder
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Figure 4-3. Top Layer
Figure 4-4. Bottom Layer
Figure 4-5. Bottom Solder
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Figure 4-6. Bottom Overlay
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Board Layout, Schematic, and Bill of Materials
4.2 Schematic
The BQ25306 schematic is shown in Figure 4-7.
C1
GND
510pF
D1
30V
REGN
PMID
VBUS
BTST
R1
1.00
SW
BAT
TP1
J1
L1
SW
BAT
3
2
1
U1
VBUS
2
1
1
TP2
J2
PMID
16
TP3
REGN
C6
C7
2.2uF
2.2uF
C8
C9
C10
10µF
10µF
0.01uF
ICHG
ICHG
C11
STAT
STAT
SW
SW
PMID
BTST
BAT
2
REGN
4
ICHG
6
EN
VBUS
3
VSET_FB
VSET_FB 9
FB
7
FB_GND
8
TS
10uF
FB_GND
11
12
17
GND
GND
JP1
EN_CTRL
GND
GND
POL
JP2
1
2
3
EN
GND
10uF
BAT
BQ25306RTER
GND
C4
0.1uF
C5
5
GND
GND
PAD
C3
0.047uF
0
10
TS
STAT
2.2uF
R2
15
POL
EN
C2
13
14
EXT_TS
1
2
POL
GND
JP3
GND
EN_CTRL
GND
4.20VBAT
1
2
3
REGN
BAT
ICHG
VSET_FB
JP4
1
2
R3
10.2k
JP6
1
2
JP9
R8
0
1
2
R4
51.1k
JP7
1
2
JP5
1
2
C12
REGN
470pF
JP8
1
2
R5
562k
REGN
R6
1.33M
R7
5.23k
JP10
1
2
VSET_FB
R11
20.0k
TS
R9
2.20k
R12
200k
EXT_TS
R13
30.9k
1
R10
40.2k
2
FB_GND
D2
LED
Green
R14
10.2k
STAT
GND
GND
GND
TP4
TP5
5010
TP6
5014
TP7
5012
5012
TP8
5012
TP9
5019
TP10
5011
TP11
5019
TP12
5011
VSET_FB
VBUS
BAT
STAT
TS
GND
Figure 4-7. BQ25306 Schematic
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4.3 Bill of Materials
The BQ25306 BOM is listed in Table 4-1.
Table 4-1. BQ25306 Bill of Materials
Designator
Quantity
!PCB1
1
C2
1
C5
Value
Package
Reference
Description
Part Number
Manufacturer
Printed Circuit Board
BMS005
0.047µF
CAP, CERM, 0.047 µF, 25 V, ±10%,
0402
X7R, 0402
GRM155R71E473K
MuRata
A88D
1
10µF
CAP, CERM, 10 µF, 16 V, ±20%,
X7R, 0805
0805
EMK212BB7106M
G-T
C6
1
2.2µF
CAP, CERM, 2.2 µF, 35 V, ±10%,
X5R, 0603
0603
GRM188R6YA225K
MuRata
A12D
C8
1
10µF
CAP, CERM, 10 µF, 25 V, ±10%,
X5R, 0805
0805
CC0805KKX5R8BB
Yageo
106
C11
1
2.2µF
CAP, CERM, 2.2 µF, 16 V, ±10%,
X5R, 0402
0402
GRM155R61C225K
MuRata
E11D
C12
1
470pF
CAP, CERM, 470 pF, 50 V, ±10%,
X7R, AEC-Q200 Grade 1, 0402
0402
GCM155R71H471K
MuRata
A37D
D2
1
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190GKT
Lite-On
75x250 mil
SJ5382
3M
Taiyo Yuden
H1, H2, H3, H4
4
J1
1
Terminal Block Receptacle, 3x1,
3.81mm, R/A, TH
Term Block, 3 pos
1727023
Phoenix Contact
J2
1
Conn Term Block, 2POS, 3.81mm,
TH
2POS Terminal
Block
1727010
Phoenix Contact
JP1, JP3
2
Header, 100mil, 3x1, Tin, TH
Header, 3 PIN,
100mil, Tin
PEC03SAAN
Sullins Connector
Solutions
JP2, JP4, JP5,
JP9, JP10
5
Header, 100mil, 2x1, Tin, TH
Header, 2 PIN,
100mil, Tin
PEC02SAAN
Sullins Connector
Solutions
L1
1
SMD power inductor, 2.2uH, 35mΩ
DCR
SMT_4MM_4MM
MAPM0420LA2R2
M-LF
Microgate
LBL1
1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per
roll
PCB Label 0.650 x
THT-14-423-10
0.200 inch
Brady
R2
1
0
RES, 0, 5%, 0.063 W, 0402
0402
RC0402JR-070RL
Yageo America
R5
1
562k
RES, 562 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW0402562KF
KED
Vishay-Dale
R6
1
1.33M
RES, 1.33 M, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW04021M33F
KED
Vishay-Dale
R7
1
5.23k
RES, 5.23 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW04025K23F
KED
Vishay-Dale
10
BQ25306 (BMS005) Evaluation Module
Alternate
Manufacturer(1)
Any
Bumpon, Hemisphere, 0.25 X
0.075, Clear
2.2uH
Alternate Part
Number(1)
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Table 4-1. BQ25306 Bill of Materials (continued)
Value
Package
Reference
Designator
Quantity
Description
Part Number
R9
1
2.20k
RES, 2.20 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW04022K20F
KED
Vishay-Dale
R10
1
40.2k
RES, 40.2 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040240K2F
KED
Vishay-Dale
R11
1
20.0k
RES, 20.0 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040220K0F
KED
Vishay-Dale
R12
1
200k
RES, 200 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW0402200KF
KED
Vishay-Dale
R13
1
30.9k
RES, 30.9 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040230K9F
KED
Vishay-Dale
R14
1
10.2k
RES, 10.2 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040210K2F
KED
Vishay-Dale
SH-JP1, SHJP4, SH-JP9
3
1x2
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
Samtec
TP1, TP6,
TP7, TP8
4
Test Point, Multipurpose, White, TH
White Multipurpose
5012
Testpoint
Keystone
TP2, TP4
2
Test Point, Multipurpose, Red, TH
Red Multipurpose
Testpoint
5010
Keystone
TP3
1
Test Point, Multipurpose, Orange,
TH
Orange
Multipurpose
Testpoint
5013
Keystone
TP5
1
Yellow
Test Point, Multipurpose, Yellow, TH Multipurpose
Testpoint
5014
Keystone
TP9, TP11
2
Test Point, Miniature, SMT
Test Point,
Miniature, SMT
5019
Keystone
TP10, TP12
2
Test Point, Multipurpose, Black, TH
Black Multipurpose
5011
Testpoint
Keystone
U1
1
Standalone 14V/2.0A Dual Cell
Battery Charger, RTE0016C
(WQFN-16)
RTE0016C
BQ25306RTER
Texas Instruments
C1
0
510pF
CAP, CERM, 510 pF, 25 V, ±5%,
C0G/NP0, 0402
0402
GRM1555C1E511J
MuRata
A01D
C3
0
0.1µF
CAP, CERM, 0.1 µF, 50 V, ±10%,
X7R, 0402
0402
C1005X7R1H104K
TDK
050BB
C4
0
10µF
CAP, CERM, 10 µF, 16 V, ±20%,
X7R, 0805
0805
EMK212BB7106M
G-T
C7
0
2.2µF
CAP, CERM, 2.2 µF, 35 V, ±10%,
X5R, 0603
0603
GRM188R6YA225K
MuRata
A12D
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Alternate Part
Number(1)
Alternate
Manufacturer(1)
969102-0000-DA
3M
BQ25306RTET
Texas Instruments
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Table 4-1. BQ25306 Bill of Materials (continued)
Quantity
C9
0
10µF
CAP, CERM, 10 µF, 25 V, ±10%,
X5R, 0805
0805
CC0805KKX5R8BB
Yageo
106
C10
0
0.01µF
CAP, CERM, 0.01 µF, 50 V, ±10%,
C0G/NP0, 0402
0402
GCM155R71H103K
MuRata
A55D
D1
0
30V
Diode, Schottky, 30 V, 1 A,
SOD-123
SOD-123
B130LAW-7-F
Diodes Inc.
FID1, FID2,
FID3, FID4,
FID5, FID6
0
Fiducial mark. There is nothing to
buy or mount.
N/A
N/A
N/A
JP6, JP7, JP8
0
Header, 100mil, 2x1, Tin, TH
Header, 2 PIN,
100mil, Tin
PEC02SAAN
Sullins Connector
Solutions
R1
0
1.00
RES, 1.00, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW04021R00F
KED
Vishay-Dale
R3
0
10.2k
RES, 10.2 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040210K2F
KED
Vishay-Dale
R4
0
51.1k
RES, 51.1 k, 1%, 0.063 W, AECQ200 Grade 0, 0402
0402
CRCW040251K1F
KED
Vishay-Dale
R8
0
0
RES, 0, 5%, 0.063 W, 0402
0402
RC0402JR-070RL
Yageo America
SH-JP2, SHJP3, SH-JP5,
SH-JP6, SHJP7, SH-JP8,
SH-JP10
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
Samtec
(1)
12
Value
Package
Reference
Designator
Description
Part Number
Manufacturer
Alternate Part
Number(1)
969102-0000-DA
Alternate
Manufacturer(1)
3M
Unless otherwise noted in the Alternate PartNumber and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
BQ25306 (BMS005) Evaluation Module
SLUUC50A – MARCH 2020 – REVISED DECEMBER 2020
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BQ25306 (BMS005) Evaluation Module
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