BQ25895RTWR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents bq25895 SLUSC88 – MARCH 2015 bq25895 I2C Controlled Single Cell 5-A Fast Charger with MaxChargeTM for High Input Voltage and Adjustable Voltage 3.1A Boost Operation 1 Features • 1 • • • • • • • • • • • • 1 High Efficiency 5-A, 1.5-MHz Switch Mode Buck Charge – 93% Charge Efficiency at 2 A and 91% Charge Efficiency at 3 A Charge Current – Optimize for High Voltage Input (9 V / 12 V) – Low Power PFM mode for Light Load Operations Boost Mode Operation with Adjustable Output from 4.5 V to 5.5 V – Selectable 500-KHz / 1.5-MHz Boost Converter with up-to 3.1 A Output – 93% Boost Efficiency at 5 V at 1 A Output Integrated Control to Switch Between Charge and Boost Mode Single Input to Support USB Input and Adjustable High Voltage Adapters – Support 3.9-V to 14-V Input Voltage Range – Input Current Limit (100 mA to 3.25 A with 50mA resolution) to Support USB2.0, USB3.0 standard and High Voltage Adapters – Maximum Power Tracking by Input Voltage Limit up-to 14V for Wide Range of Adapters – Auto Detect USB SDP, CDP, DCP, and Nonstandard Adapters Input Current Optimizer (ICO) to Maximize Input Power without Overloading Adapters Resistance Compensation (IRCOMP) from Charger Output to Cell Terminal Highest Battery Discharge Efficiency with 11-mΩ Battery Discharge MOSFET up to 9 A Integrated ADC for System Monitor (Voltage, Temperature, Charge Current) Narrow VDC (NVDC) Power Path Management – Instant-on Works with No Battery or Deeply Discharged Battery – Ideal Diode Operation in Battery Supplement Mode BATFET Control to Support Ship Mode, Wake Up, and Full System Reset Flexible Autonomous and I2C Mode for Optimal System Performance High Integration includes all MOSFETs, Current Sensing and Loop Compensation 12-µA Low Battery Leakage Current to Support Ship Mode • • High Accuracy – ±0.5% Charge Voltage Regulation – ±5% Charge Current Regulation – ±7.5% Input Current Regulation Safety – Battery Temperature Sensing for Charge and Boost Mode – Thermal Regulation and Thermal Shutdown 2 Applications • • • Power Bank, Mobile Wi-Fi Hotspot Wireless Bluetooth Speaker Portable Internet Devices 3 Description The bq25895 is a highly-integrated 5-A switch-mode battery charge management and system power path management device for single cell Li-Ion and Lipolymer battery. The devices support high input voltage fast charging. The low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. The I2C Serial interface with charging and system settings makes the device a truly flexible solution. Device Information(1) PART NUMBER bq25895 PACKAGE BODY SIZE (NOM) WQFN (24) 4.00mm x 4.00mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic OTG 5V at 3.1A Phone PMID Input 3.9V±14V at 3A USB VBUS SYS 3.5V±4.5V SW SYS Ichg = 5A BAT I2C Bus Host QON bq25895 Host Control REGN Optional TS An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq25895 SLUSC88 – MARCH 2015 www.ti.com 4 Revision History 2 DATE REVISION NOTES March 2015 * Initial release. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: bq25895 bq25895 www.ti.com SLUSC88 – MARCH 2015 5 Device and Documentation Support 5.1 Trademarks All trademarks are the property of their respective owners. 5.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: bq25895 3 PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ25895RTWR ACTIVE WQFN RTW 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ25895 BQ25895RTWT ACTIVE WQFN RTW 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ25895 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Mar-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ25895RTWR WQFN RTW 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ25895RTWT WQFN RTW 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Mar-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25895RTWR WQFN RTW 24 3000 367.0 367.0 35.0 BQ25895RTWT WQFN RTW 24 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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