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BQ27510DRZR-G3

BQ27510DRZR-G3

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VSON12_4X2.5MM_EP

  • 描述:

    系统侧阻抗轨迹™ 带蓄电池直接连接的燃油表

  • 数据手册
  • 价格&库存
BQ27510DRZR-G3 数据手册
Product Folder Order Now Support & Community Tools & Software Technical Documents BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 BQ27510-G3 System-Side Impedance Track™ Fuel Gauge With Direct Battery Connection 1 Features 2 Applications • • • • • • • 1 • • • Single-series cell li-ion battery fuel gauge resides on system board – Integrated 2.5-VDC LDO – External low-value 10-mΩ sense resistor Patented Impedance Track™ technology – Adjusts for battery aging, self-discharge, temperature, and rate changes – Reports remaining capacity, state-of-Charge (SOC), and time-to-empty – Optional smoothing filter – Battery state-of-health (aging) estimation – Supports embedded or removable packs with up to 32-Ah capacity – Accommodates pack swapping with 2 separate battery profiles Microcontroller Peripheral Supports: – 400-kHz I2C serial interface – 32 bytes of scratch-pad FLASH NVM – Battery low digital output warning – Configurable SOC interrupts – External thermistor, internal sensor, or hostreported temperature options Small 12-pin 2.50 mm × 4.00 mm SON package Smartphones, Feature Phones, and Tablets Wearables Building Automation Portable Medical/Industrial Handsets Portable Audio Gaming 3 Description The Texas Instruments BQ27510-G3 system-side LiIon battery fuel gauge is a microcontroller peripheral that provides fuel gauging for single-cell Li-Ion battery packs. The device requires little system microcontroller firmware development. The BQ27510G3 resides on the system’s main board and manages an embedded battery (non-removable) or a removable battery pack. The BQ27510-G3 uses the patented Impedance Track™ algorithm for fuel gauging, and provides information, such as remaining battery capacity (mAh), state-of-charge (%), run-time to empty (min.), battery voltage (mV), temperature (°C) and state-ofhealth (%). Battery fuel gauging with the BQ27510-G3 requires only PACK+ (P+), PACK– (P–), and optional Thermistor (T) connections to a removable battery pack or embedded battery circuit. Device Information(1) PART NUMBER BQ27510-G3 FIRMWARE VERSION PACKAGE SON (12) 4.00 (0X0400) (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Host System Single-Cell Li-ion Battery Pack VCC REG25 Power Management Controller 2 IC LDO REGIN PACK+ GPOUT Voltage Sense DATA Temp Sense PROTECTION IC T bq27510-G3 PACK- FETs CHG DSG Current Sense 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 3 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics .......................................... Data Flash Memory Characteristics.......................... 400-kHz I2C-Compatible Interface Communication Timing Requirements................................................. 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements................................................. 6.9 Typical Characteristics .............................................. 7 6 6 7 Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 9 7.3 Feature Description................................................. 10 7.4 Device Functional Modes........................................ 10 7.5 Programming........................................................... 13 8 Application and Implementation ........................ 17 8.1 Application Information............................................ 17 8.2 Typical Application ................................................. 17 9 Power Supply Recommendations...................... 20 9.1 Power Supply Decoupling ....................................... 20 10 Layout................................................................... 21 10.1 Layout Guidelines ................................................. 21 10.2 Layout Example .................................................... 21 11 Device and Documentation Support ................. 22 11.1 Documentation Support ........................................ 22 11.2 Receiving Notification of Documentation Updates .................................................................................22 11.3 Support Resources ............................................... 22 11.4 Trademarks ........................................................... 22 11.5 Electrostatic Discharge Caution ............................ 22 11.6 Glossary ................................................................ 22 12 Mechanical, Packaging, and Orderable Information ........................................................... 22 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (November 2015) to Revision B Page • Changed Table 2 ................................................................................................................................................................. 13 • Changed I2C Command Waiting Time ................................................................................................................................ 15 Changes from Original (March 2013) to Revision A • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 5 Pin Configuration and Functions DRZ Package 12-Pin SON Top View BI/TOUT 1 12 GPOUT REG25 2 11 SCL REGIN 3 10 SDA BAT 4 9 TS Vcc 5 8 SRN Vss 6 7 SRP Pin Functions PIN NAME NO. TYPE (1) DESCRIPTION Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Open-drain I/O. Use with pull-up resistor >1MΩ (1.8 MΩ typical). BI/TOUT 1 I/O REG25 2 P 2.5-V output voltage of the internal integrated LDO REGIN 3 P Regulator input. Decouple with 0.1-μF ceramic capacitor to Vss BAT 4 I Cell voltage measurement input. ADC input Vcc 5 P Processor power input. Decouple with 0.1-μF ceramic capacitor minimum Vss 6 P Device ground SRP 7 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor. SRN 8 IA Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor. TS 9 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input SDA 10 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical). SCL 11 I Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pull-up resistor (typical). GPOUT 12 O General Purpose open-drain output. May be configured as Battery Low, Battery Good, or to perform interrupt functionality. (1) I/O = Digital input/output; IA = Analog input; P = Power connection. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VREGIN Regulator input voltage –0.3 24 V VCC Supply voltage –0.3 2.75 V VIOD Open-drain I/O pins (SDA, SCL, GPOUT) –0.3 6 V VBAT BAT input pin –0.3 6 V VI Input voltage to all other pins (TS, SRP, SRN, BI/TOUT) –0.3 VCC + 0.3 V TF Functional temperature –40 100 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 3 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 6.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) V(ESD) Electrostatic discharge All pins except pin 4 ±2000 Pin 4 ±1500 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) (1) (2) UNIT V ±250 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA = 25°C, VCC = 2.5 V (unless otherwise noted) MIN Supply voltage VREGIN No operating restrictions CREG25 External REG25 capacitor tPUCD Power Up Communication Delay NOM MAX 2.7 5.5 No FLASH writes 2.45 2.7 CREG25 0.47 UNIT V µF 250 ms 103 μA Normal operating mode current Fuel gauge in NORMAL mode ILOAD > Sleep Current Low-power operating mode current Fuel gauge in SLEEP mode ILOAD < Sleep Current 18 μA Low-power operating mode current Fuel gauge in SLEEP+ mode ILOAD < Sleep Current 60 μA Hibernate operating mode current Fuel gauge in HIBERNATE mode ILOAD < Hibernate Current 4 μA VOL Output voltage low (SDA, GPOUT, BI/TOUT) IOL = 0.5 mA VOH(PP) Output high voltage (GPOUT) IOH = –1 mA VCC–0.5 VOH(OD) Output high voltage (SDA, SCL, BI/TOUT) External pull-up resistor connected to Vcc VCC–0.5 ICC ISLP ISLP+ IHIB Input voltage low (SDA, SCL) VIL Input voltage low (BI/TOUT) BAT INSERT CHECK MODE active Input voltage high (SDA, SCL) VIH(OD) Input voltage high (BI/TOUT) BAT INSERT CHECK MODE active 0.4 V V V –0.3 0.6 –0.3 0.6 1.2 6 1.2 6 V V VA1 Input voltage range (TS) VSS–0.125 2 V VA2 Input voltage range (BAT) VSS–0.125 5 V VA3 Input voltage range (SRP, SRN) VSS–0.125 tPUCD Power-up communication delay TA Operating free-air temperature 0.125 250 –40 V ms 85 °C 6.4 Thermal Information BQ27510-G3 THERMAL METRIC (1) DRZ (SON) UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 64.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 59.8 °C/W RθJB Junction-to-board thermal resistance 52.7 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 28.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 6.5 Electrical Characteristics TA = 25°C, CREG = 0.47 μF, VREGIN = 3.6 V (unless otherwise noted) PARAMETER 2.5-V LDO TEST CONDITION MIN NOM MAX 2.5 2.6 VREG25 Regulator output voltage 2.7 V ≤ VREGIN ≤ 5.5 V, IOUT ≤ 16mA TA = –40°C to 85°C 2.4 2.45 V ≤ VREGIN < 2.7 V (low battery), IOUT ≤ 3mA TA = –40°C to 85°C 2.4 2.7 V, IOUT ≤ 16 mA TA = –40°C to 85°C 280 Regulator dropout voltage ΔVREGTEMP Regulator output change with temperature VREGIN = 3.6 V, IOUT = 16 mA ΔVREGLINE Line regulation 2.7 V ≤ VREGIN ≤ 5.5 V, IOUT = 16 mA 11 25 Load regulation 0.2 mA ≤ IO UT ≤ 3 mA, VREGIN = 2.45 V 34 40 3 mA ≤ IOUT ≤ 16 mA, VREGIN = 2.7 V 31 ΔVREGLOAD (2) Short circuit current limit 2.45 V, IOUT ≤ 3 mA VREG25 = 0 V V V VDO ISHORT UNIT (1) mV 50 TA = –40°C to 85°C 0.3% TA = –40°C to 85°C mV mV 250 mA POWER-ON RESET VIT+ Positive-going battery voltage input at VCC TA = –40°C to 85°C 2.05 2.20 2.31 V VHYS Power-on reset hysteresis TA = –40°C to 85°C 45 115 185 mV INTERNAL TEMPERATURE SENSOR CHARACTERISTICS GTEMP Temperature sensor voltage TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical gain values at TA = 25°C and VCC = 2.5 V –2 mV/°C INTERNAL CLOCK OSCILLATORS fOSC fLOSC High Frequency Oscillator TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V 8.389 MHz Low Frequency Oscillator TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V 32.768 kHz INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS Input voltage range, V(SRN) and V(SRP) VSR = V(SRN) – V(SRP) Conversion time Single conversion Resolution TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V Input offset TA = 25°C and VCC = 2.5 V Integral nonlinearity error TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V ZSR_IN Effective input resistance (2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V ISR_LKG Input leakage current (2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V VSR_IN tSR_CONV VSR_OS INL TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V –0.125 TA = 25°C and VCC = 2.5 V 0.125 1 14 s 15 10 ±0.007 % V bits µV ±0.034 % 2.5 FSR MΩ 0.3 µA ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS VADC_IN Input voltage range TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V tADC_CONV Conversion time TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V Resolution TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V VADC_OS Input offset TA = 25°C and VCC = 2.5 V ZADC1 Effective input resistance (TS) (2) TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V 8 MΩ Effective input resistance (BAT) (2) BQ27510-G3 not measuring cell TA = –40°C to voltage 85°C, 2.4 V < VCC < 2.6 V 8 MΩ ZADC2 BQ27510-G3 measuring cell voltage (1) (2) –0.2 1 14 ms 15 bits 1 TA = 25°C and VCC = 2.5 V V 125 100 mV kΩ LDO output current, IOUT, is the sum of internal and external load currents. Assured by design. Not production tested. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 5 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com Electrical Characteristics (continued) TA = 25°C, CREG = 0.47 μF, VREGIN = 3.6 V (unless otherwise noted) PARAMETER IADC_LKG Input leakage current TEST CONDITION (2) MIN NOM TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V MAX 0.3 UNIT µA 6.6 Data Flash Memory Characteristics TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS Data retention (1) tDR TYP MAX 10 Flash programming write-cycles (1) Word programming time ICCPROG) Flash-write supply current (1) UNIT Years 20,000 Cycles (1) tWORDPROG) (1) MIN 5 2 ms 10 mA Assured by design. Not production tested. 6.7 400-kHz I2C-Compatible Interface Communication Timing Requirements TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tr SCL/SDA rise time 300 ns tf SCL/SDA fall time 300 ns tw(H) SCL pulse width (high) 600 ns tw(L) SCL pulse width (low) 1.3 μs tsu(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tsu(DAT) Data setup time 100 ns th(DAT) Data hold time tsu(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency 0 ns 600 ns 66 μs 400 kHz MAX UNIT 6.8 100-kHz I2C-Compatible Interface Communication Timing Requirements TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted) PARAMETER tr SCL/SDA rise time tf SCL/SDA fall time tw(H) SCL pulse width (high) tw(L) TEST CONDITIONS MIN TYP 1 300 µs ns 4 µs SCL pulse width (low) 4.7 μs tsu(STA) Setup for repeated start 4.7 µs td(STA) Start to first falling edge of SCL 4 µs tsu(DAT) Data setup time 250 ns th(DAT) Data hold time tsu(STOP) Setup time for stop tBUF Bus free time between stop and start fSCL Clock frequency tBUSERR Bus error timeout 6 Receive mode 0 Transmit mode 300 Submit Documentation Feedback ns 4 µs 4.7 μs 10 100 kHz 17.3 21.2 s Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagram 2.58 32.8 2.56 32.75 2.54 32.7 L F O (kH Z ) R E G 2 5 O u tp u t (V ) 6.9 Typical Characteristics 2.52 2.5 2.48 32.6 32.55 2.46 2.44 -40 32.65 32.5 I OUT = 16 mA, REGIN = 5 V I OUT = 3 mA, REGIN = 2.7 V -20 0 20 40 Temperature (qC) 60 80 32.45 -40 100 -20 0 20 40 Temperature (qC) D001 Figure 2. REG25 vs. Temperature 60 80 100 D002 Figure 3. Low Frequency Oscillator vs. Temperature 8.4 8.395 H F O (M H Z ) 8.39 8.385 8.38 8.375 8.37 8.365 -40 -20 0 20 40 Temperature (qC) 60 80 100 D003 Figure 4. High Frequency Oscillator vs. Temperature Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 7 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 7 Detailed Description 7.1 Overview The BQ27510-G3 fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as time-to-empty (TTE) and state-of-charge (SOC) as well as SOC interrupt signal to the host. Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command(), read and write information contained within the device control and status registers, as well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, system manufacture, or end-equipment operation. Cell information is stored in the device in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the fuel gauge companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known. The key to the fuel gauge high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery. The fuel gauge measures charge and discharge activity by monitoring the voltage across a small-value series sense resistor (5 mΩ to 20 mΩ, typical) located between the system VSS and the battery PACK– terminal. When a cell is attached to the device, cell impedance is learned, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10.0 kΩ ±1%. B25/85 = 3435 kΩ ± 1% (such as Semitec NTC 103AT). Alternatively, the fuel gauge can also be configured to use its internal temperature sensor or receive temperature data from the host processor. When an external thermistor is used, a 18.2-kΩ pull-up resistor between BI/TOUT and TS pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality. To minimize power consumption, the fuel gauge has several power modes: NORMAL, SLEEP, HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. For complete operational details, refer to the BQ27510-G3 Technical Reference Manual, BQ27510-G3 SystemSide Impedance Track™ Fuel Gauge With Integrated LDO, SLUUA97. Table 1. Formatting Conventions Used in This Document INFORMATION TYPE FORMATTING CONVENTION EXAMPLE Commands Italics with parentheses and no breaking spaces RemainingCapacity() command NVM Data Italics, bold, and breaking spaces Design Capacity data Register bits and flags Brackets and italics [TDA] bit NVM Data bits Brackets, italics, and bold [LED1] bit Modes and states ALL CAPITALS UNSEALED mode 8 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 7.2 Functional Block Diagram REGIN LDO POR REG25 2.5 V VCC HFO BAT CC HFO SRN LFO HFO/128 4R HFO/128 SRP MUX ADC R Wake Comparator TS Internal Temp Sensor BI/TOUT HFO/4 SDA GPOUT 22 I2C Slave Engine Instruction ROM 22 CPU VSS SCL I/O Controller Instruction FLASH 8 Wake and Watchdog Timer GP Timer and PWM Data SRAM 8 Data FLASH Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 9 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 7.3 Feature Description The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge monitors charge and discharge activity by sensing the voltage across a small-value (5 mΩ to 20 mΩ typical) resistor between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery, the battery’s SOC is adjusted during battery charge or discharge. The total battery capacity is found by comparing states of charge before and after applying the load with the amount of charge passed. When an application load is applied, the impedance of the cell is measured by comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load. Measurements of OCV and charge integration determine chemical state of charge and chemical capacity (Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the battery impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature. FullChargeCapacity() is reported as capacity available from a fully charged battery under the present load and temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and FullChargeCapacity() respectively. The fuel gauge has two flags accessed by the Flags() function that warns when the battery’s SOC has fallen to critical levels. When StateOfCharge() falls below the first capacity threshold, specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once StateOfCharge() rises above SOC1 Clear Threshold. The fuel gauge’s GPOUT pin puts out 3 pulses 10ms wide and in 10ms intervals whenever the SOC1 flag is set. This flag is enabled when RMC_IND bit in Operation Configuration B is set. This behavior also applies to the [SOCF] (State of Charge Final) flag. When Voltage() falls below the system shut down threshold voltage, SysDown Set Volt Threshold, the [SYSDOWN] flag is set, serving as a final warning to shut down the system. The GPOUT also signals. When Voltage() rises above SysDown Clear Voltage and the [SYSDOWN] flag has already been set, the [SYSDOWN] flag is cleared. The GPOUT also signals such change. All units are in mV. Additional details are found in the BQ27510-G3 Technical Reference Manual, BQ27510-G3 System-Side Impedance Track™ Fuel Gauge With Integrated LDO, SLUUA97. 7.4 Device Functional Modes 7.4.1 Power Modes The fuel gauge has different power modes: BAT INSERT CHECK, NORMAL, SNOOZE, SLEEP, and HIBERNATE. In NORMAL mode, the fuel gauge is fully powered and can execute any allowable task. In SNOOZE mode, both low-frequency and high-frequency oscillators are active. Although the SNOOZE mode has higher current consumption than the SLEEP mode, it is also a reduced-power mode. In SLEEP mode, the fuel gauge turns off the high-frequency oscillator and exists in a reduced-power state, periodically taking measurements and performing calculations. In HIBERNATE mode, the fuel gauge is in a low-power state, but can be woken up by communication or certain IO activity. Finally, the BAT INSERT CHECK mode is a powered up, but low-power halted, state, where the fuel gauge resides when no battery is inserted into the system. Figure 5 and Figure 6 show the relationship between these modes. 10 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 Device Functional Modes (continued) POR Exit From HIBERNATE Battery Removed bq27510 clears CONTROL_STATUS [HIBERNATE] = 0 Recommend Host also set CONTROL_STATUS [HEBERNATE] = 0 Exit From SLEEP Flags [BAT_DET] = 0 BAT INSERT CHECK Exit From HIBERNATE Communication Activity AND Comm address is for bq27510 Check for battery insertion from HALT state. No gauging Entry To NORMAL Flags [BAT_DET] = 1 Flags [BAT_DET] = 0 Exit From NORMAL Flags [BAT_DET] = 0 NORMAL Fuel gauging and data updated every second. HIBERNATE Wakeup From HIBERNATE Communication Activity AND Comm address is not for bq27510 Disable all bq27510 subcircuits except GPIO Negate BAT_GD Exit From WAIT_HIBERNATE Host must set CONTROL_STATUS [HIBERNATE] = 0 AND VCELL < Hibernate Voltage To SLEEP WAIT_HIBERNATE Exit From WAIT_HIBERNATE Cell relaxed AND Ι AverageCurrent () Ι < Hibernate Current OR Cell relaxed AND VCELL < Hibernate Voltage Fuel gauging and data updated every 20 seconds. BAT_GD unchanged. Exit From SLEEP Host has set CONTROL_STATUS [HIBERNATE] = 1 OR VCELL < Hibernate Voltage System Shutdown Figure 5. Power Mode Diagram for System Shutdown Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 11 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com Device Functional Modes (continued) Exit From HIBERNATE Battery Removed POR BAT INSERT CHECK Exit From HIBERNATE Communication Activity AND Comm address is for bq27510 bq27510 clears CONTROL_STATUS [HIBERNATE] = 0 Recommend Host also set CONTROL_STATUS [HEBERNATE] = 0 Check for battery insertion from HALT state. No gauging Entry To NORMAL Flags [BAT_DET] = 1 Exit From NORMAL Flags [BAT_DET] = 0 NORMAL Entry To SNOOZE Operation Configuration [SLEEP] = 1 AND CONTROL_STATUS [SNOOZE] = 1] AND Ι AverageCurrent ( ) Ι < Sleep Current Flags [BAT_DET] = 0 Fuel gauging and data updated every second Exit From SLEEP Flags [BAT_DET] = 0 Exit From SLEEP Ι AverageCurrent ( ) Ι > Sleep Current OR Current is detected above Ι WAKE Exit From SNOOZE Any communication to the gauge OR Ι AverageCurrent ( ) Ι > Sleep Current OR Current is detected above Ι WAKE SNOOZE Entry To SLEEP Operation Configuration [SLEEP] = 1 AND CONTROL_STATUS [SNOOZE] = 0] AND Ι AverageCurrent ( ) Ι < Sleep Current Fuel gauging and data updated every 20 seconds. Both LFO and HFO are ON. Entry to SNOOZE CONTROL_STATUS [SNOOZE] = 1 Entry to SLEEP CONTROL_STATUS [SNOOZE] = 0 SLEEP Fuel gauging and data updated every 20 seconds. (LFO ON and HFO OFF) Exit From WAIT_HIBERNATE Host must set CONTROL_STATUS [HIBERNATE] = 0 AND VCELL < Hibernate Voltage To WAIT_HIBERNATE System Sleep Exit From SLEEP Host has set CONTROL_STATUS [HIBERNATE] = 1 OR VCELL < Hibernate Voltage Figure 6. Power Mode Diagram for System Sleep 12 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 7.5 Programming 7.5.1 Standard Data Commands The BQ27510-G3 fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 2. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional options for transferring data are described in Communications. Standard commands are accessible in NORMAL operation. Read and write permissions depend on the active access mode, SEALED or UNSEALED. Additional details are found in the BQ27510-G3 Technical Reference Manual, SLUUA97. Table 2. Standard Commands COMMAND CODE UNIT SEALED ACCESS Control() NAME 0x00 / 0x01 N/A R/W AtRate() 0x02 / 0x03 mA R/W AtRateTimeToEmpty() 0x04 / 0x05 minutes R Temperature() 0x06 / 0x07 0.1 K R/W Voltage() 0x08 / 0x09 mV R Flags() 0x0a / 0x0b N/A R NominalAvailableCapacity() 0x0c / 0x0d mAh R FullAvailableCapacity() 0x0e / 0x0f mAh R RemainingCapacity() 0x10 / 0x11 mAh R FullChargeCapacity() 0x12 / 0x13 mAh R AverageCurrent() 0x14 / 0x15 mA R TimeToEmpty() 0x16 / 0x17 minutes R StandbyCurrent() 0x18 / 0x19 mA R StandbyTimeToEmpty() 0x1a/ 0x1b minutes R StateOfHealth() 0x1c / 0x1d % / num R CycleCount() 0x1e/ 0x1f num R StateOfCharge() 0x20/ 0x21 % R InstantaneousCurrent() 0x22 / 0x23 mA R InternalTemperature() 0x28 / 0x29 0.1 K R ResistanceScale() 0x2a / 0x2b OperationConfiguration() 0x2c/ 0x2d N/A R DesignCapacity() 0x2e / 0x2f mAh R R Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 13 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 7.5.1.1 Control(): 0x00/0x01 Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control() command allows the system to control specific features of the fuel gauge during normal operation and additional features when the device is in different access modes, as described in Table 3. Additional details are found in the BQ27510-G3 Technical Reference Manual, SLUUA97. Table 3. Control() Subcommands CNTL DATA SEALED ACCESS CONTROL_STATUS CNTL FUNCTION 0x0000 Yes Reports the status of DF checksum, hibernate, IT, and so forth DESCRIPTION DEVICE_TYPE 0x0001 Yes Reports the device type (for example: 0x0520) FW_VERSION 0x0002 Yes Reports the firmware version on the device type PREV_MACWRITE 0x0007 Yes Returns previous Control() subcommand code CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration OCV_CMD 0x000C Yes Requests the fuel gauge to take an OCV measurement BAT_INSERT 0x000D Yes Forces Flags() [BAT_DET] bit set when OpConfig B [BIE] = 0 BAT_REMOVE 0x000E Yes Forces Flags() [BAT_DET] bit clear when OpConfig B [BIE] = 0 SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1 CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0 SET_SLEEP+ 0x0013 Yes Forces CONTROL_STATUS [SNOOZE] to 1 CLEAR_SLEEP+ 0x0014 Yes Forces CONTROL_STATUS [SNOOZE] to 0 DF_VERSION 0x001F Yes Returns the Data Flash Version code SEALED 0x0020 No Places the fuel gauge in SEALED access mode IT_ENABLE 0x0021 No Enables the Impedance Track™ (IT) algorithm RESET 0x0041 No Forces a full reset of the fuel gauge 7.5.2 Communications 7.5.2.1 I2C Interface The BQ27510-G3 fuel gauge supports the standard I2C read, incremental read, quick read, one byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8-bits of the I2C protocol is, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). Figure 7. I2C Read, Incremental Read, Quick Read, One Byte Write, and Incremental Write Functions 14 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 The “quick read” returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data) The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Figure 8. Invalid Write Attempt to read an address above 0x6B (NACK command): Figure 9. Invalid Read 7.5.2.2 I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge was holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. 7.5.2.3 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus free waiting time must be inserted between all packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-only standard commands, there is no waiting time required beyond t(BUF); however, the host should not issue more than 22 commands (2 × the number of standard commands) within a 2-s period. For example, issuing a command every 100 ms is acceptable and so is issuing 11 in a burst every 1 second. Otherwise, the fuel gauge could result in a reset due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL £ 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] DATA [7:0] A P A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL £ 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read Figure 10. Standard I2C Command Waiting Time Required Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 15 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 7.5.2.4 I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT INSERT CHECK, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of Data Flash are updated. The following table summarizes the approximate clock stretch duration for various fuel gauge operating conditions. Table 4. Approximate Clock Stretch Duration GAUGING MODE SLEEP HIBERNATE BAT INSERT CHECK, NORMAL 16 APPROXIMATE DURATION OPERATING CONDITION OR COMMENT Clock stretch occurs at the beginning of all traffic as the device wakes up ≤ 4 ms Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit) ≤ 4 ms Normal Ra table data flash updates 24 ms Data flash block writes 72 ms Restored Data Flash block write after loss of power 116 ms End of discharge Ra table data flash update 144 ms Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The BQ27510-G3 system-side Li-Ion battery fuel gauge is a microcontroller peripheral that provides fuel gauging for single-cell Li-Ion battery packs. The device requires little system microcontroller firmware development. The fuel resides on the main board of the system and manages an embedded battery (non-removable) or a up to 32000-mAh Capacity removable battery pack.To allow for optimal performance in the end application, special considerations must be taken to ensure minimization of measurement error through proper printed circuit board (PCB) board layout. Such requirements are detailed in Design Requirements. 8.2 Typical Application bq27510DRZ GPOUT GPOUT Figure 11. BQ27510-G3 Typical Application 8.2.1 Design Requirements Several key parameters must be updated to align with a given application's battery characteristics. For highest accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a "golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on system production time. If going this route, it is recommended to average the voltage and current measurement calibration data from a large sample size and use these in the golden file. Table 5, Key Data Flash Parameters for Configuration, shows the items that should be configured to achieve reliable protection and accurate gauging with minimal initial configuration. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 17 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com Typical Application (continued) Table 5. Key Data Flash Parameters for Configuration NAME DEFAULT UNIT RECOMMENDED SETTING Set based on the nominal pack capacity as interpreted from cell manufacturer's datasheet. If multiple parallel cells are used, should be set to N × Cell Capacity. Design Capacity 1000 mAh Design Energy Scale 1 — Reserve Capacity-mAh 0 mAh Set to desired runtime remaining (in seconds / 3600) × typical applied load between reporting 0% SOC and reaching Terminate Voltage, if needed. Should be configured using TI-supplied Battery Management Studio software. Default open-circuit voltage and resistance tables are also updated in conjunction with this step. Do not attempt to manually update reported Device Chemistry as this does not change all chemistry information! Always update chemistry using the appropriate software tool (that is, BQSTUDIO). Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy is divided by this value. Chem ID 0100 hex Load Mode 1 — Set to applicable load model, 0 for constant current or 1 for constant power. Load Select 1 — Set to load profile which most closely matches typical system load. Qmax Cell 0 1000 mAh Set to initial configured value for Design Capacity. The gauge will update this parameter automatically after the optimization cycle and for every regular Qmax update thereafter. Cell0 V at Chg Term 4200 mV Set to nominal cell voltage for a fully charged cell. The gauge will update this parameter automatically each time full charge termination is detected. Terminate Voltage 3200 mV Set to empty point reference of battery based on system needs. Typical is between 3000 and 3200 mV. Ra Max Delta 44 mΩ Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed. Charging Voltage 4200 mV Set based on nominal charge voltage for the battery in normal conditions (25°C, etc). Used as the reference point for offsetting by Taper Voltage for full charge termination detection. Taper Current 100 mA Set to the nominal taper current of the charger + taper current tolerance to ensure that the gauge will reliably detect charge termination. Taper Voltage 100 mV Sets the voltage window for qualifying full charge termination. Can be set tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer JEITA temperature ranges that use derated charging voltage. Dsg Current Threshold 60 mA Sets threshold for gauge detecting battery discharge. Should be set lower than minimal system load expected in the application and higher than Quit Current. Chg Current Threshold 75 mA Sets the threshold for detecting battery charge. Can be set higher or lower depending on typical trickle charge current used. Also should be set higher than Quit Current. Quit Current 40 mA Sets threshold for gauge detecting battery relaxation. Can be set higher or lower depending on typical standby current and exhibited in the end system. Avg I Last Run –299 mA Current profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system load. Is automatically updated by the gauge every cycle. Avg P Last Run –1131 mW Power profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system power. Is automatically updated by the gauge every cycle. Sleep Current 10 mA Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in setting above typical standby currents else entry to SLEEP may be unintentionally blocked. CC Gain 10 mΩ Calibrate this parameter using TI-supplied BQSTUDIO software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to current. CC Delta 10 mΩ Calibrate this parameter using TI-supplied BQSTUDIO software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to passed charge. Board Offset 0 Counts Calibrate this parameter using TI-supplied BQSTUDIO software and calibration procedure in the TRM. Determines native offset of the printed circuit board parasitics that should be removed from conversions. 18 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 Typical Application (continued) Table 5. Key Data Flash Parameters for Configuration (continued) NAME Pack V Offset DEFAULT UNIT RECOMMENDED SETTING mV Calibrate this parameter using TI-supplied BQSTUDIO software and calibration procedure in the TRM. Determines voltage offset between cell tab and ADC input node to incorporate back into or remove from measurement, depending on polarity. 0 8.2.2 Detailed Design Procedure 8.2.2.1 BAT Voltage Sense Input A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing its influence on battery voltage measurements. It proves most effective in applications with load profiles that exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to reduce noise on this sensitive high-impedance measurement node. 8.2.2.2 SRP and SRN Current Sense Inputs The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage measured across the sense resistor. These components should be placed as close as possible to the coulomb counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatchinduced measurement errors. 8.2.2.3 Sense Resistor Selection Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift sense resistor with a 1-W power rating. 8.2.2.4 TS Temperature Sense Input Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering performance. 8.2.2.5 Thermistor Selection The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type (NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest accuracy temperature measurement performance. 8.2.2.6 REGIN Power Supply Input Filtering A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection (PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of coupling into the internal supply rails of the fuel gauge. 8.2.2.7 VCC LDO Output Filtering A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage ripple inside of the fuel gauge. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 19 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 2.58 32.8 2.56 32.75 2.54 32.7 L F O (kH Z ) R E G 2 5 O u tp u t (V ) 8.2.3 Application Curves 2.52 2.5 2.48 32.6 32.55 2.46 2.44 -40 32.65 32.5 I OUT = 16 mA, REGIN = 5 V I OUT = 3 mA, REGIN = 2.7 V -20 0 20 40 Temperature (qC) 60 80 32.45 -40 100 -20 0 20 40 Temperature (qC) D001 Figure 12. REG25 vs. Temperature 60 80 100 D002 Figure 13. Low Frequency Oscillator vs. Temperature 8.4 8.395 H F O (M H Z ) 8.39 8.385 8.38 8.375 8.37 8.365 -40 -20 0 20 40 Temperature (qC) 60 80 100 D003 Figure 14. High Frequency Oscillator vs. Temperature 9 Power Supply Recommendations 9.1 Power Supply Decoupling Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF capacitor at VCC will suffice for satisfactory device performance. 20 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 BQ27510-G3 www.ti.com SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 10 Layout 10.1 Layout Guidelines 10.1.1 Sense Resistor Connections Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The differential traces should be connected at the inside of the sense resistor pads and not anywhere along the highcurrent trace path to prevent false increases to measured current that could result when measuring between the sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely matched in length as possible else additional measurement offset could occur. It is further recommended to add copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as close as possible to the coulomb counter input pins. 10.1.2 Thermistor Connections The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses periodically during temperature sensing windows. 10.1.3 High-Current and Low-Current Path Separation For best possible noise performance, it is extremely important to separate the low-current and high-current loops to different areas of the board layout. The fuel gauge and all support components should be situated on one side of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the low-current ground around instead of under high-current traces will further help to improve noise rejection. 10.2 Layout Example Kelvin connect BAT sense line right at positive battery terminal Battery power Connection to System PACKP Use copper pours for battery power path to minimize IR losses BI/TOUT R1 R2 THERM BI/ TOUT GPOUT REG25 SCL REGIN SDA BAT TS VCC SRN VSS SRP GPOUT RESD3 RESD4 RESD5 RESD4 SCL SDA CREGIN CBAT CVCC Place capacitors close to gauge IC. Trace to pin and VSS should be short Use short and wide traces to minimize inductance Star ground right at PACKfor ESD return path 10mŸ 1% PACKN Via connects to Power Ground Ground Return to system Kelvin connect SRP and SRN connections right at Rsense terminals Figure 15. BQ27510-G3 Board Layout Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 21 BQ27510-G3 SLUSAT1B – MARCH 2013 – REVISED MARCH 2020 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: • BQ27510-G3 Technical Reference Manual, BQ27510-G3 System-Side Impedance Track™ Fuel Gauge With Integrated LDO, SLUUA97 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.4 Trademarks Impedance Track, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 22 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: BQ27510-G3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) BQ27510DRZR-G3 ACTIVE SON DRZ 12 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 7510 BQ27510DRZT-G3 ACTIVE SON DRZ 12 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 7510 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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