BQ29400PWR

bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Lion BATTERIES (2nd PROTECTION) FEATURES • • • • • • • FUNCTION 2-, 3-, or 4-Cell Secondary Protection Low Power Consumption ICC < 2 µA [VCELL(ALL) < V(PROTECT)] High Accuracy Over Sense Voltage: – bq29400: 4.35 V ±25 mV – bq29400A: 4.40 V ±25 mV – bq29401: 4.45 V ±25 mV – bq29405: 4.65 V ±25 mV Prefixed Protection Threshold Voltage Programmable Delay Time High Power Supply Ripple Rejection Stable During Pulse Charge Operation Each cell in a multiple cell pack is compared to an internal reference voltage. If one cell reaches an overvoltage condition, the protection sequence begins. The bq2940x device starts charging an external capacitor through the CD pin. When the CD pin voltage reaches 1.2 V, the OUT pin changes from a low level to a high level. PW PACKAGE (TOP VIEW) 1 2 3 4 VC1 VC2 VC3 GND APPLICATIONS • 8 7 6 5 OUT VDD CD VC4 DCT PACKAGE (TOP VIEW) 2nd Level Protection in Lion Battery Packs in – Notebook PCs – Portable Instrumentation – Medical and Test Equipment OUT VDD CD 1 8 2 7 3 6 VC1 VC2 VC3 VC4 4 5 GND DESCRIPTION The bq29400, bq29400A, bq29401, and bq29405 are BiCMOS secondary protection ICs for 2-, 3-, or 4-cell Lithium-Ion battery packs that incorporate a high-accuracy precision over voltage detection circuit. They include a programmable delay circuit for over voltage detection time. ORDERING INFORMATION TA –25°C to 85°C (1) V(PROTECT) PACKAGE MSSOP (DCT3) SYMBOL TSSOP (PW) (1) SYMBOL 4.35 V bq29400DCT3 CIQ bq29400PW 2400 4.40 V bq29400ADCT3 CIT Not Available - 4.45 V bq29401DCT3 CIR bq29401PW 2401 4.65 V bq29405DCT3 CIS Not Available - The bq29400, bq29400A, bq29401, and bq29405 are available taped and reeled. Add an R suffix to the device type (e.g., bq29400PWR) to order tape and reel version. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2005, Texas Instruments Incorporated bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) (2) UNIT Supply voltage range (VDD) –0.3 V to 28 V Input voltage range (VC1, VC2, VC3, VC4) –0.3 V to 28 V (OUT) –0.3 V to 28 V Output voltage range (CD) –0.3 V to 28 V Continuous total power dissipation See Dissipation Rating Table Storage temperature range, Tstg –65°C to 150°C Lead temperature (soldering, 10 sec) (1) 300°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4 and VC4-GND. (2) PACKAGE DISSIPATION RATINGS PACKAGE TA = 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING DCT 412 mW 3.3 mW/°C 264 mW 214 mW PW 525 mW 4.2 mW/°C 336 mW 273 mW RECOMMENDED OPERATING CONDITIONS MIN VDD Supply Voltage VC1, VC2, VC3, VC4 NOM MAX UNIT 4.0 25 V 0 VDD+0. 3 V VI Input voltage range td(CD) Delay time capacitance RIN Voltage-monitor filter resistance 100 1k Ω CIN Voltage-monitor filter capacitance 0.01 0.1 µF RVD Supply-voltage filter resistance CVD Supply-voltage filter capacitance TA Operating ambient temperature range 2 0.22 0 µF 1 0.1 –25 kΩ µF 85 °C bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted) (1) PARAMETER V(OA) TEST CONDITION Over voltage detection accuracy MIN TA = –20°C to 85°C bq29400 25 50 4.40 bq29401 4.45 bq29405 4.65 Vhys Over voltage detection hysteresis (1) II Input current V2, V3 , VC4 input = VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V tD1 Over voltage detection delay time CD = 0.22 µF I(CD_dis) CD GND clamp current CD = 1 V ICC Supply current UNIT mV V 300 mV 0.3 1.0 1.5 5 12 2.0 µA S µA VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V (see Figure 1) 2.0 3.0 VC1 = VC2 = VC3 = VC4 = VC3–VC4 = VC4–GND = 2.3 V (see Figure 1) 1.5 2.5 µA VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = V(PROTECT)MAX, VDD = VC1, IOH = 0 mA 7 V VC1=VC2=VC3=VC4=V(PROTECT)MAX, VDD=4.3V, TA= 0°C to 70°C, IOH = – 40µA 1.5 –1 mA 5 µA IOH High-level output current OUT = 3V, VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 4.7 V IOL Low-level output current OUT = 0.1 V VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V (1) 35 4.35 Over voltage detection voltage (1) OUT pin drive voltage 25 bq2940A V(PROTECT) V(OUT) NOM MAX 2.0 2.5 V Levels of the over-voltage detection and the hysteresis can be adjusted. For assistance contact Texas Instruments sales representative. 1 VC1 OUT 8 IIN 2 VC2 VDD 7 IIN 3 VC3 CD 6 4 GND VC4 5 ICC V1 V2 V3 IIN V4 Figure 1. ICC, IIN Measurement (TSSOP Package) Terminal Functions TERMINAL DESCRIPTION MSOP (DTC) TSSOP (PW) NAME 8 1 VC1 Sense voltage input for most positive cell 7 2 VC2 Sense voltage input for second most positive cell 6 3 VC3 Sense voltage input for third most positive cell 5 4 GND Ground pin 4 5 VC4 Sense voltage input for least positive cell 3 bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 Terminal Functions (continued) TERMINAL DESCRIPTION MSOP (DTC) TSSOP (PW) NAME 3 6 CD 2 7 VDD Power supply 1 8 OUT Output An external capacitor is connected to determine the programmable delay time FUNCTIONAL BLOCK DIAGRAM RVD CVD VDD VC1 RIN ICD = 0.2
A (TYP) CIN RIN VC2 CIN VC3 OUT RIN CIN VC4 1.2V (TYP) RIN CIN GND CD OVERVOLTAGE PROTECTION When one of the cell voltages exceeds V(PROTECT), an internal current source begins to charge the capacitor, C(DELAY), connected to the CD pin. If the voltage at the CD pin, VCD, reaches 1.2 V, the OUT pin is activated and transitions high. An externally connected NCH FET is activiated and blows the external fuse in the positive battery rail, see Figure 1. If all cell voltages fall below V(PROTECT) before the voltage at pin CD reaches 1.2 V, the delay time does not run out. An internal switch clamps the CD pin to GND and discharges the capacitor, C(DELAY), and secures the full delay time for the next occurring overvoltage event. Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V(PROTECT) - Vhys. DELAY TIME CALCULATION The delay time is calculated as follows: 4 bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 t  d C 1.2 V
C(DELAY) I (DELAY)  CD td
ICD 1.2 V Where I(CD) = CD current source = 0.2 µA V(PROTECT) V(PROTECT) - Vhys Cell Voltage (VCn - VC(n-1), VC4 - GND) 1.2 V CD tDELAY OUT td = (1.2 V x CDELAY)/ICD Figure 2. Timing for Overvoltage Sensing VCC vs VO(H) (IO(H) = 0mA) VCC vs VO(H) (IO(H) = -1mA 7 8 TA = 85
C 6 TA = −25
C 5 4 TA = 25
C 3 2 1 0 VOH − High-Level Output Voltage − V VOH − High-Level Output Voltage − V 7 6 TA = −25
C 5 TA = 85
C 4 TA = 25
C 3 2 1 0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 VDD − Supply Voltage − V VDD − Supply Voltage − V Figure 3. Figure 4. 5 bq29400, bq29400A bq29401, bq29405 www.ti.com SLUS568C – JULY 2003 – REVISED SEPTEMBER 2005 APPLICATION INFORMATION BATTERY CONNECTIONS The following diagrams show the TSSOP package device in different cell configurations. 1 VC1 OUT 8 1 VC1 OUT 8 2 VC2 VDD 7 2 VC2 VDD 7 3 VC3 CD 6 3 VC3 CD 6 4 GND VC4 5 4 GND VC4 5 CDELAY Figure 5. 4-Series Cell Configuration Figure 6. 3-Series Cell Configuration (Connect together VC1 and VC2) 1 VC1 OUT 8 2 VC2 VDD 7 3 VC3 CD 6 4 GND VC4 5 CDELAY Figure 7. 2-Series Cell Configuration CELL CONNECTIONS To prevent incorrect output activation the following connection sequences must be used. 4-Series Cell Configuration • VC1(=VDD) → VC2 → VC3 → VC4 → GND or • GND → VC4 → VC3 → VC2 → VC1(=VDD) 3-Series Cell Configuration • VC1(=VC2=VDD) → VC3 → VC4 → GND or • GND → VC4 → VC3 → VC1(=VC2=VDD) 2-Series Cell Configuration • VC1(=VC2=VC3=VDD) → VC4 → GND or • GND → VC4 → VC1(=VC2=VC3=VDD) 6 CDELAY PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) BQ29400DCT3 ACTIVE SM8 DCT 8 3000 RoHS & Non-Green SNBI Level-1-260C-UNLIM CIQ BQ29400DCT3E6 ACTIVE SM8 DCT 8 3000 RoHS & Non-Green SNBI Level-1-260C-UNLIM CIQ BQ29400PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 29400 BQ29401PW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -20 to 85 29401 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of