User's Guide
SLVUAO6 – June 2016
bq501210 bqTESLA™ Wireless Power TX EVM
The bq501210EVM-756 wireless power transmitter evaluation module from TI is a high-performance,
easy-to-use development module for the design of wireless power solutions. The bq501210 evaluation
module (EVM) provides all the basic functions of a Qi-compliant, wireless charger pad. The 15-V to 19-V
input, single coil transmitter (TX) enables designers to speed the development of their end-applications.
The EVM supports WPC v1.0, WPC v1.1, and WPC v1.2 receivers (RX) and supports output power up to
15 W when paired with a WPC v1.2 15-W receiver.
1
2
3
4
5
6
7
8
Contents
Applications ................................................................................................................... 2
bq501210EVM-756 Electrical Performance Specifications............................................................. 2
Modifications.................................................................................................................. 3
Connector and Test Point Descriptions ................................................................................... 3
4.1
Input/Output Connections .......................................................................................... 3
4.2
Test Point Descriptions ............................................................................................ 4
Schematic and Bill of Materials ............................................................................................ 6
Test Setup ................................................................................................................... 14
6.1
Equipment .......................................................................................................... 14
6.2
Equipment Setup .................................................................................................. 15
bq501210EVM-756 Assembly Drawings and Layout .................................................................. 21
Reference ................................................................................................................... 24
List of Figures
.......................................................................................
1
bq501210EVM-756 Full Schematic
2
bq501210EVM-756 Transmitter Manager Schematic ................................................................... 7
3
bq501210EVM-756 Current Sense Schematic
4
bq501210EVM-756 Coil Control Schematic.............................................................................. 9
5
bq501210EVM-756 Power Schematic................................................................................... 10
6
bq501210EVM-756 Schematic ........................................................................................... 11
7
Equipment Setup ........................................................................................................... 15
8
EVM Test Points
9
Analog and Digital Pings with No RX .................................................................................... 16
10
Efficiency vs Power, bq501210EVM-756 Transmitter and a 15-W Receiver....................................... 17
11
Start Up ...................................................................................................................... 18
12
TX_COMM at Start Up
13
14
15
16
17
18
19
20
.........................................................................
...........................................................................................................
....................................................................................................
Thermal Performance......................................................................................................
Sense Resistor Layout ....................................................................................................
Assembly Top...............................................................................................................
Top Silk ......................................................................................................................
Top Layer ...................................................................................................................
Inner Layer 1 ................................................................................................................
Inner Layer 2 ................................................................................................................
Bottom Layer ................................................................................................................
6
8
16
18
20
21
22
22
23
23
24
24
bqTESLA is a trademark of Texas Instruments.
Avid is a registered trademark of Avid Technology, Inc..
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
1
Applications
www.ti.com
List of Tables
1
2
1
............................................................ 2
Bill of Materials ............................................................................................................. 12
bq501210EVM-756 Electrical Performance Specifications
Applications
The bq501210EVM-756 evaluation module demonstrates the transmitter portion of the bqTESLA™
wireless power system. This transmitter EVM is a complete transmitter-side solution that powers a
bqTESLA receiver. The EVM requires a single 15-V to 19-V power supply capable of up to 2.0 A to
operate and combines the transmitter electronics, input power circuit, LED indicators, and the transmitting
coil on the single printed-circuit board (PCB). The EVM is a non-space optimized, open design allowing
easy access to key points of the electrical schematic.
This EVM has the following features:
• Qi-Certified WPC v1.2 for 15-W operation with a WPC v1.2 15-W receiver
• 5-W solution for WPC v1.1 or v1.2 Baseline Power Profile (BPP) receivers
• 15-V to 19-V input and fixed operating frequency for full 15-W results
• 12-V input for reduced power (> 10 W) solutions
• Enhanced Foreign Object Detection (FOD) with FOD ping detecting objects prior to power transfer
• WPC v1.2 FOD, WPC v1.1 FOD, and WPC v1.0 Parasitic Metal Object Detection (PMOD)
• Transmitter-coil mounting pad providing the correct receiver interface
• Compact power section design using the bq500101 NexFET power stage
• High-accuracy current sense design using the bq500100 current monitor
• WPC MP-A5 type transmitter coil
• LED and audio indication of power transfer
2
bq501210EVM-756 Electrical Performance Specifications
Table 1 provides a summary of the EVM performance specifications. All specifications are given for an
ambient temperature of 25°C.
Table 1. bq501210EVM-756 Electrical Performance Specifications
Parameter
Notes and Conditions
Min
Typ
Max
Unit
Input Characteristics
VIN
IIN
Input voltage
POUT up to 15 W
15
POUT up to 10 W
12
POUT up to 4.5 W
4.5
19
19
5.0
V
19
Input current
VIN = Nom, IOUT = 1.5 A at 10 V
2.0
A
Input no-load current
VIN = Nom, IOUT = 0 A
90
mA
Input stand-by current
VIN = Nom
4
mA
Output Characteristics – WPC v1.2 10-V Nominal Output Receiver
VOUT
Output voltage
VIN = Nom, IOUT = 1.5A , VOUT = 10 V
IOUT
VIN = Min to Max
VIN = Min to Max, VOUT = 10 V
9.7
10.0
0
10.3
V
1.5
A
Systems Characteristics
fSW
2
Switching frequency
during power transfer
VIN at startup > 6 V
130
VIN at startup < 6 V
110
VIN at startup < 6 V followed by HVDCP change from 5 V to
9 V or 12 V
130
kHz
ηpk
Peak efficiency
VIN = Nom, P Out RX = 13.0 W
84
%
η
Full-load efficiency
VIN = Nom, IOUT = Max
84
%
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
Modifications
www.ti.com
3
Modifications
See the bq501210 data sheet (SLUSCF5) when changing components:
• Use LED Mode – (Resistor R9) to change the behavior of the status LEDs D6, D7, and D8. The
standard value is 42.2 kΩ for control option 1, see the data sheet for additional settings.
• NTC – Connector JP3 provides the option for connecting a negative temperature coefficient (NTC)
sensor for thermal protection, see the data sheet for additional settings.
• FOD – R8 threshold and R49 FOD_Cal (see Section 6.2.2.7)
• FOD_Ping – R47 and R48 (see Section 6.2.2.7)
• PMOD – R16 threshold and disable (see Section 6.2.2.7)
4
Connector and Test Point Descriptions
4.1
Input/Output Connections
The connection points are described in Section 4.1.1 through Section 4.1.9.
4.1.1
J1 – VIN
Input power 12 V to 19 V, return at J2. 15 V to 19 V recommended for full 15-W delivery.
4.1.2
J2 – GND
Return for input power, input at J1.
4.1.3
J3 – JTAG
Factory use only, not populated.
4.1.4
J4 – Serial Interface
2
I C interface connection to communicate with the device. Used with bqTESLA TX Tuning Tool to monitor
behavior.
4.1.5
J5 – Micro-USB
Micro-USB input used for HVDCP testing.
4.1.6
JP1 – FOD / PMOD Enable
Shorting jumper must be installed to enable FOD and PMOD functions. See the data sheet for additional
details. Default - Shorted.
4.1.7
JP2 – LED Mode
External connection for LED MODE resistor, if R9 is removed. When shorted, the device disables the LED
and inhibits low-power mode. This is useful for troubleshooting. Default - Open.
4.1.8
JP3 – NTC
The connection point for the external temperature sensor. See the data sheet for more information.
Default - Open.
4.1.9
JP4 – Input Selection
Shunt selects 19-V input (J1) or micro-USB input (J5). Default position is J1 for 19-V input.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
3
Connector and Test Point Descriptions
4.2
www.ti.com
Test Point Descriptions
The test points are described in Section 4.2.1 through Section 4.2.25.
4.2.1
TP1 – FP_GAIN
FOD ping calibration gain setting, see the data sheet for more information.
4.2.2
TP2 – Drive A
Output from power section A of H-Bridge, U2.
4.2.3
TP3 – Coil Monitor L / C
Coil signal at junction between transmitter coil and resonant capacitors.
4.2.4
TP4 – Low Noise Analog Ground
Low noise ground test point (TP).
4.2.5
TP5 – Low Noise Analog Ground
Low noise ground TP.
4.2.6
TP6 – PEAK_DET
Peak detect circuit - input to PEAK_DET of bq501210.
4.2.7
TP7 – Demodulation Comm + Output
Primary communications channel, input to COMM_A+, COMM_B+, and COMM_C+ of bq501210, U1 from
demodulation circuit.
4.2.8
TP8 – I_Sense
Input current-sense voltage, scale 1 V = 1 A.
4.2.9
TP9 – RAIL+
Sample voltage from rail converter output, input to bq501210 rail control circuit.
4.2.10
TP10 – Proprietary Packet
RX_PROP indicates RX proprietary packet received.
4.2.11
TP11 – V33FB
Reserved, leave this pin open.
4.2.12
TP12 – Low Noise Analog Ground
Low noise ground TP.
4.2.13
TP13 – Debug only
TX_COMM is used for debug only. This pin echoes all TX_COMM.
4.2.14
TP14 – FP_OFFSET
FOD ping circuit setting, see the data sheet for more information.
4
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
Connector and Test Point Descriptions
www.ti.com
4.2.15
TP15 – Drive B
Output from power section B of H-Bridge, U3.
4.2.16
TP16 – FOD_Cal
FOD calibration resistor test point, connected to pin 22 of bq501210.
4.2.17
TP17 – Low Noise Analog Ground
Low noise ground TP.
4.2.18
TP18 – Rail Output Voltage
Output voltage from rail buck converter that feeds H-Bridge power section.
4.2.19
TP19 – PWM_RAIL
Digital input to rail converter power section from bq501210. Signal is PWM, used to control rail voltage.
4.2.20
TP20 – DPWM-A Signal
Digital output signal from bq501210 to H-Bridge drive for U2.
4.2.21
TP21 – DPWM-B Signal
Digital output signal from bq501210 to H-Bridge drive for U3.
4.2.22
TP22 – BUZZ_DC
DC output when power transfer is started. Can be used to drive a DC style buzzer or LED. See the data
sheet for more information.
4.2.23
TP23 – Unused IC Pin 30
Unused pin.
4.2.24
TP24 – Unused IC Pin 29
Unused pin.
4.2.25
TP25 – Unused IC Pin 6
Unused pin.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
5
Schematic and Bill of Materials
5
www.ti.com
Schematic and Bill of Materials
This section includes the schematics and bill of materials for the EVM.
Figure 1 through Figure 6 illustrate the schematics for this EVM.
VIN
J1
C27
3
D4
4
6
SS
COMP
C28
R38
11.0k
1
2
C26
0.1µF
D1
40V, 0.5A
C2
C30
47µF
0.1µF
7
BOOT
VIN
5
BOOT_R
6
VSW
4
PGND
PAD
3
9
1µF
R42
475
R1
10.0k
V_SENSE
WE-PD Type
R54
0
8
C12
PWM
TP19
TPS54231D
TP18
L2
0.1µF
R28
10uH
R44
PWM_RAIL
0.01µF
TP4 TP5 TP12 TP17
VDD
VDD
C1
D+_LO
5
U1
VGATE
300µH
1
5
GND
R37
76.8k
D+_HI
42.2k
10µF
8
C32
NT1
R4
3.16k
2700pF
Net-Tie
R40
0.3
BQ500101DPCR
D2
Green
C44
1µF
R2
130k
GND
Net-Tie
GND
U7
TP9
U6
TLV70450DBVT
VGATE
3
5
3
NC
NC
C39
GND
1µF
3V3
2
RAIL+
3
10.0
2
C35
0.01µF
R3
10.0k
4
C33
R13
RAIL-
0.1µF
R22
1.00k
10.0
TP8
I_SENSE
1.00Meg
C40
4.7µF
C41
0.1µF
R41
1.00Meg
C17
R33
2.2µF
10.0k
POWER
1
R36
511k
R21
PWR_UP
IN
1
2
Q1
BSS138
OUT
BQ500100DCK
R12
6
D11
30V
R34
511k
R17
10.0
C46
C8
47µF
NT2
J2
0.015
R7
10.0
Current Sense
SNOOZE
U2
VGATE
U3
3V3
1
2
R46
22
C7
0.1µF
C21
VDD
VDD
C9
C34
1µF
C3
4.7µF
TP11
R30
C23
10.0k
4700pF
44
45
46
7
47
V33DIO
V33D
V33A
V33DIO
BPCAP
58
3
V33FB
V_IN
COMM+
COMM-
C38
V_SENSE
RAIL+
0.1µF
JP3
COMM_A+
COMM_ACOMM_B+
COMM_B-
56
57
COMM_C+
COMM_C-
54
V_RAIL+
LED-A
R11
C4
10.0k
4700pF
R32
475
D6
D7
Green
Super Red
R31
475
D8
Yellow
JP2
R9
3V3
PEAK_DET
C22
RET_CLK
ALERT
CTRL
TCK
TDO
TDI
TMS
0.1µF
STATUS
/TRST
BUZZ_AC
C31
C15
0.1µF
7
47µF
5
BOOT
VGATE
VDD
VDD
1
2
VIN
C13
1µF
32
SNOOZE
14
20
TX_COMM
33
I_SENSE
PEAK_DET
RESET
2
10
27
28
36
37
38
39
40
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
R49
154k
R8
100k
TP1
LED-A
FP_GAIN
TP14
LED-B
R16
100k
R47
86.6k
FP_OFFSET
R48
86.6k
4700pF
R45
TP7
PWM
8
TP21
VSW
DPWM-B
3
9
PGND
PAD
BQ500101DPCR
C45
0.1µF
R14
23.2k
R29
D10
30V
3
10.0
PS1240P02CT3
R5
10.0k
10.0k
FP_GAIN
C14
33pF
R19
COMM-
10.0
3
TP25
TP24
TP23
41
TP10
59
BOOT_R
3V3
FP_OFFSET
6
29
30
49
48
64
8
26
43
65
0.047µF
4
TP13
UNUSED
UNUSED
UNUSED
AGND
AGND2
AGND3
DGND
DGND
DGND
PAD
0.1µF
R6
200k
34
RESERVED
C19
C16
6
C11
COMM+
TP22
0.1µF
C18
3
9
PGND
PAD
LED-C
SNOOZE
TP15
C10
760308141
DPWM-A
TP16
11
42
35
RX_PROP
VSW
PWM_RAIL
D-LO
D+HI
D+LO
CAL_INPUT
TP3
L3
4
CAL
DPWM-B
19
FP_OFFSET
LED_MODE
1
9
TP20
TP2
6
BOOT_R
PWM
LS1
BUZZ_DC
DATA
5
I_SENSE
25
31
DPING_DISABLE
60
CAL_INPUT
42.2k
R25
10.0k
13
LED-C
FP_GAIN
61
LED-B
LED-C
R15
475
24
CLK
16
PM_DATA
LED
C42
BQ500101DPCR
12
V_SENSE
DPWM-A
22
LED-A
T_SENSE
15
JP1
23
PMOD
V_RAIL-
4
63
PM_CLK
18
21
LED-B
55
RAIL-
R10
76.8k
PWM-B
PWR_UP
51
17
PWM_RAIL
FOD_CAL
50
52
53
R23
10.0k
PWM-A
FOD
62
PWR_UP
3V3
C43
1
1µF
VIN
C20
1µF
C24
0.1µF
47µF
CAL_INPUT
U4
8
R39
100k
C29
5
VIN
1µF
C5
4.7µF
C36 1µF
7
BOOT
2
4
C25
0.1µF
D-_LO
3
R35
C6
10µF
40V, 0.5A
88.7k
BOOT
VSENSE
1
R26
2
PH
EN
7
1
6
7
8
9
10
11
VIN
3
5
2
2
VUSB
J5
3V3
L1
4
WE-TPC Type
U5
1
1
VIN
JP4
19 Vin
D-_LO
D+_HI
D+_LO
D3
TP6
R24
10.0k
R20
PEAK_DET
30V
2
VIN
19 Vin
10.0
C37
R18
1.00Meg
330pF
Coil Control
R43
bq501210 Transmitter Manager
BQ501210RGCR
10.0k
R60
3V3
3V3
4
R27
0
V+
V-
U8A
A
C49
C48
0.01µF
1µF
3V3
R61
0
3
11
1
9
8
7
6
5
4
3
2
1
2
VIN
JTAG
For Development Only
Remove Pin 6 for Polarity
C47
R56
21.5k
4
R50
B
J3
7
V+
V-
5
5
0.1µF
U8B
6
11
4
4
2
EVM Only
R58
1.00k
13
11
9
7
5
3
1
TCK
RET_CLK
TDO
TDI
TMS
C
V+
V-
8
3
U8C
9
10
14
12
10
8
6
4
2
SN74AHC1G08DRLR
U9
1
R53
604
D9
Green
/TRST
3V3
11
4
U8D
13
R57
12.1k
D
V+
V-
11
12
R55
1.20k
PMBus
14
J4
R59
R52
R51 10.0k
10.0k
1.00k
D5
Green
PM_DATA
2
4
6
8
10
1
3
5
7
9
PM_CLK
HVDCP-EVM Only
JTAG and I2C Communication – EVM Only
Copyright © 2016, Texas Instruments Incorporated
Figure 1. bq501210EVM-756 Full Schematic
6
bq501210 bqTESLA™ Wireless Power TX EVM
SLVUAO6 – June 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Schematic and Bill of Materials
www.ti.com
3V3
R46
22
C7
C34
1µF
0.1µF
C3
4.7µF
C5
C21
4.7µF
C36 1µF
1µF
VIN
R39
100k
C20
1µF
TP11
3V3
C23
10.0k
4700pF
COMM+
COMM-
R23
10.0k
C38
V_SENSE
RAIL+
0.1µF
JP3
RAIL-
R10
76.8k
44
45
46
7
47
V33DIO
V33D
V33A
V33DIO
BPCAP
58
3
V33FB
V_IN
62
PWR_UP
R30
LED-A
R11
C4
4700pF
PM_CLK
51
COMM_A-
LED
PM_DATA
LED-B
LED-C
R15
475
R32
475
D6
D7
Green
Super Red
R31
475
D8
Yellow
3V3
R25
10.0k
JP2
R9
42.2k
CAL_INPUT
COMM_B+
COMM_B-
56
57
COMM_C+
COMM_C-
54
V_RAIL+
55
V_RAIL-
I_SENSE
PEAK_DET
C22
RET_CLK
ALERT
CTRL
TCK
TDO
TDI
TMS
0.1µF
STATUS
/TRST
PWM_RAIL
21
FOD_CAL
22
100k
PMOD
R16
100k
LED-A
12
R47
86.6k
R48
86.6k
1
9
PEAK_DET
RESET
2
10
27
28
36
37
38
39
40
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
13
LED-C
25
BUZZ_AC
31
BUZZ_DC
32
SNOOZE
14
19
20
TX_COMM
33
FP_GAIN
TP14
LED-B
FP_OFFSET
LED-C
TP22
SNOOZE
R45
PS1240P02CT3
10.0k
FP_GAIN
FP_OFFSET
TP13
34
D-LO
D+HI
D+LO
11
42
35
UNUSED
UNUSED
UNUSED
6
29
30
TP25
TP24
TP23
41
TP10
RX_PROP
TP1
LED-A
LS1
FP_OFFSET
CAL_INPUT
I_SENSE
TP16
24
DPING_DISABLE
5
PWM_RAIL
154k
CLK
LED_MODE
DPWM-B
R8
V_SENSE
61
CAL
R49
FP_GAIN
DATA
JP1
DPWM-A
23
T_SENSE
16
60
PWM-B
18
LED-B
52
53
15
17
FOD
COMM_A+
63
PWM-A
PWR_UP
50
4
10.0k
CAL_INPUT
U4
RESERVED
59
AGND
AGND2
AGND3
DGND
DGND
DGND
PAD
49
48
64
8
26
43
65
D-_LO
D+_HI
D+_LO
R24
10.0k
R43
bq501210 Transmitter Manager
10.0k
BQ501210RGCR
Copyright © 2016, Texas Instruments Incorporated
Figure 2. bq501210EVM-756 Transmitter Manager Schematic
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
7
Schematic and Bill of Materials
www.ti.com
VIN
C27
U1
VGATE
1
2
C1
VDD
VDD
BOOT
VIN
7
5
1µF
V_SENSE
WE-PD Type
BOOT_R
6
VSW
4
PWM
TP19
C12
0.1µF
TP18
L2
R28
10uH
PWM_RAIL
PGND
PAD
R44
R40
0.3
3
9
BQ500101DPCR
0.015
R7
10.0
C44
C46
C8
47µF
1µF
GND
R2
130k
TP9
RAIL+
R17
10.0
U7
5
8
4
10µF
3V3
BQ500100DCK
2
R12
3
10.0
1
6
C35
0.01µF
R3
10.0k
RAIL-
R22
1.00k
R13
10.0
TP8
I_SENSE
C41
0.1µF
Current Sense
Copyright © 2016, Texas Instruments Incorporated
Figure 3. bq501210EVM-756 Current Sense Schematic
8
bq501210 bqTESLA™ Wireless Power TX EVM
SLVUAO6 – June 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Schematic and Bill of Materials
www.ti.com
To VSW Pin
BQ500101DPCR
U2
VGATE
1
2
C9
U3
VDD
VDD
7
BOOT
C29
C24
0.1µF
C43
C42
47µF
C31
C15
0.1µF
5
VIN
7
47µF
5
VGATE
BOOT
VDD
VDD
1
2
VIN
C13
1µF
1µF
8
PWM
TP20
TP2
6
BOOT_R
L3
TP3
4
VSW
TP15
C10
0.1µF
C19
0.1µF
C16
0.047µF
6
4
BOOT_R
PWM
760308141
DPWM-A
4700pF
BQ500101DPCR
TP21
DPWM-B
C18
3
9
PGND
PAD
8
VSW
3
9
PGND
PAD
BQ500101DPCR
C11
3V3
R6
200k
TP7
2
R14
23.2k
R29
D10
30V
3
10.0
R5
10.0k
C14
33pF
1
COMM+
C45
0.1µF
R19
COMM1
10.0
3
D3
TP6
30V
2
R20
PEAK_DET
10.0
C37
R18
1.00Meg
330pF
Coil Control
Copyright © 2016, Texas Instruments Incorporated
Figure 4. bq501210EVM-756 Coil Control Schematic
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
9
Schematic and Bill of Materials
J1
VIN
1
19 Vin
WE-TPC Type
JP4
19 Vin
2
2
J5
3
VUSB
1
6
7
8
9
10
11
D4
R26
2
88.7k
3
R35
4
R38
11.0k
5
42.2k
40V, 0.5A
C6
10µF
C25
0.1µF
VIN
PH
3
EN
4
6
BOOT
VSENSE
SS
COMP
D-_LO
8
300µH
1
5
C26
0.1µF
D1
40V, 0.5A
C28
R37
76.8k
C2
C30
47µF
0.1µF
R42
475
R1
10.0k
GND
D+_HI
3V3
L1
U5
7
VIN
www.ti.com
TPS54231D
D+_LO
0.01µF
TP4 TP5 TP12 TP17
C32
NT1
R4
3.16k
2700pF
Net-Tie
J2
GND
D2
Green
NT2
Net-Tie
U6
TLV70450DBVT
VGATE
R21
PWR_UP
C40
4.7µF
R36
511k
1
OUT
IN
NC
NC
C39
GND
1µF
1
Q1
BSS138
5
3
2
2
4
C33
0.1µF
1.00Meg
R33
10.0k
POWER
3
D11
30V
R34
511k
SNOOZE
C17
R41
1.00Meg
2.2µF
Copyright © 2016, Texas Instruments Incorporated
Figure 5. bq501210EVM-756 Power Schematic
10
bq501210 bqTESLA™ Wireless Power TX EVM
SLVUAO6 – June 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Schematic and Bill of Materials
www.ti.com
R60
3V3
3V3
4
R27
0
VIN
V+
V-
U8A
A
C48
1µF
3V3
R61
0
3
11
1
C49
0.01µF
9
8
7
6
5
4
3
2
1
2
Remove Pin 6 for Polarity
C47
R56
21.5k
4
R50
JTAG
For Development Only
U8B
6
B
J3
7
V+
V-
5
5
0.1µF
11
1
4
2
4
1.00k
TCK
RET_CLK
TDO
TDI
TMS
U8C
9
10
R58
13
11
9
7
5
3
1
C
V+
V-
8
3
R53
604
14
12
10
8
6
4
2
SN74AHC1G08DRLR
U9
D9
Green
/TRST
3V3
R55
1.20k
R57
12.1k
D
V+
V-
11
12
PMBus
11
4
U8D
13
14
J4
R59
R52
R51 10.0k
10.0k
1.00k
D5
Green
PM_DATA
2
4
6
8
10
1
3
5
7
9
PM_CLK
HVDCP-EVM Only
JTAG and I2C Communication – EVM Only
Copyright © 2016, Texas Instruments Incorporated
Figure 6. bq501210EVM-756 Schematic
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
11
Schematic and Bill of Materials
www.ti.com
Table 2 contains the BOM for this EVM.
Table 2. Bill of Materials (1)
Designator
Qty
Description
Package Reference
Part Number
Manufacturer
U1, U2, U3
3
Synchronous Buck NexFET Power Stage, DPC0008A
DPC0008A
BQ500101DPCR
Texas Instruments
U4
1
WPC 1.2 Wireless Power Transmitter Manager with 15-W Power Deliver, RGC0064B
RGC0064B
BQ501210RGCR
Texas Instruments
U5
1
Buck Step Down Regulator with 3.5 to 28 V Input and 0.8 to 25 V Output, -40 to 150°C, 8-Pin SOIC (D),
Green (RoHS & no Sb/Br)
D0008A
TPS54231D
Texas Instruments
U6
1
Single Output LDO, 150 mA, Fixed 5 V Output, 2.5 to 24 V Input, with Ultra-Low IQ, 5-pin SOT-23 (DBV), 40 to 125°C, Green (RoHS & no Sb/Br)
DBV0005A
TLV70450DBVT
Texas Instruments
U7
1
BQ500100, DCK0006A
DCK0006A
BQ500100DCK
Texas Instruments
L1
1
300uH
Inductor, Shielded, 300uH, 0.13A, 4.1 ohm, SMD
4.8x1.8x4.8mm
744042331
Wurth Elektronik eiSos
L2
1
10uH
Inductor, Shielded Drum Core, Ferrite, 10uH, 2.6A, 0.0515 ohm, SMD
10x3x10mm
7447713100
Wurth Elektronik eiSos
L3
1
10uH
Inductor, Wirewound, 10uH, 9A, 0.028 ohm, TH
54.4x6.5x54.4mm
760308141
Wurth Elektronik eiSos
C1, C9, C13, C20, C21,
C34, C36, C39
8
1uF
CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603
0603
GRM188R71C105KA12D
Murata
C2
1
47uF
CAP, CERM, 47uF, 6.3V, +/-10%, X5R, 1206
1206
GRM31CR60J476KE19L
Murata
C3, C5, C40
3
4.7uF
CAP, CERM, 4.7uF, 10V, +/-10%, X5R, 0603
0603
CGB3B1X5R1A475K055AC
TDK
C4, C18, C23
3
4700pF
CAP, CERM, 4700pF, 50V, +/-10%, X7R, 0603
0603
GRM188R71H472KA01D
Murata
C6, C27
2
10uF
CAP, CERM, 10uF, 35V, +/-10%, X7R, 1210
1210
GRM32ER7YA106KA12L
Murata
C7, C12, C15, C22, C25,
C26, C29, C30, C33,
C38, C41, C45
12
0.1uF
CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603
0603
GRM188R71H104KA93D
Murata
C8
1
47uF
CAP, CERM, 47 µF, 25 V, +/- 20%, X5R, 1206_190
1206_190
C3216X5R1E476M160AC
TDK
C10, C19
2
0.1uF
CAP, CERM, 0.1uF, 100V, +/-5%, C0G/NP0, 1812
1812
C1812C104J1GACTU
Kemet
C14
1
33pF
CAP, CERM, 33pF, 50V, +/-5%, C0G/NP0, 0603
0603
GRM1885C1H330JA01D
Murata
C16
1
0.047uF
CAP, CERM, 0.047uF, 100V, +/-5%, C0G/NP0, 1812
1812
C4532C0G2A473J200KA
TDK
C17
1
2.2uF
CAP, CERM, 2.2uF, 25V, +/-10%, X5R, 1206
1206
GRM316R61E225KA12D
Murata
C24, C31
2
47uF
CAP, CERM, 47uF, 25V, +/-20%, X5R, 1206
1206
C3216X5R1E476M160AC
TDK
C28, C35
2
0.01uF
CAP, CERM, 0.01uF, 50V, +/-10%, X7R, 0603
0603
GRM188R71H103KA01D
Murata
C32
1
2700pF
CAP, CERM, 2700pF, 50V, +/-5%, C0G/NP0, 0603
0603
GRM1885C1H272JA01D
Murata
C37
1
330pF
CAP, CERM, 330pF, 50V, +/-5%, C0G/NP0, 0603
0603
GRM1885C1H331JA01D
Murata
C46
1
1uF
CAP, CERM, 1 µF, 16 V, +/- 10%, X7R, 0603
0603
GRM188R71C105KA12D
Murata
D1
1
40V, 0.5A
Diode, Schottky, 40V, 0.5A, SOD-123
SOD-123
MBR0540T1G
ON Semiconductor
D2, D6
2
Green
LED, Green, SMD
LED_0603
150060VS75000
Wurth Elektronik eiSos
D3, D10, D11
3
30V
Diode, Schottky, 30V, 0.2A, SOT-323
SOT-323
BAT54SWT1G
Fairchild Semiconductor
D7
1
Super Red
LED, Super Red, SMD
LED_0603
150060SS75000
Wurth Elektronik eiSos
D8
1
Yellow
LED, Yellow, SMD
LED_0603
150060YS75000
Wurth Elektronik eiSos
J5
1
Receptacle, Micro-USB-B, Right Angle, SMD
Micro USB
receptacle
105017-0001
Molex
LS1
1
Buzzer, Piezo, 4kHz, 12.2mm, TH
12.2x4.0mm
PS1240P02CT3
TDK
Q1
1
MOSFET, N-CH, 50V, 0.22A, SOT-23
SOT-23
BSS138
Fairchild Semiconductor
(1)
12
Value
50V
Unless otherwise noted in the Alternate Part Number or Alternate MFR columns, all parts may be substituted with equivalents.
bq501210 bqTESLA™ Wireless Power TX EVM
SLVUAO6 – June 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Schematic and Bill of Materials
www.ti.com
Table 2. Bill of Materials (1) (continued)
Designator
Qty
Value
Description
Package Reference
Part Number
Manufacturer
R1, R3, R5, R11, R23,
R24, R25, R30, R33,
R43, R45
11
10.0k
RES, 10.0k ohm, 1%, 0.1W, 0603
0603
CRCW060310K0FKEA
Vishay-Dale
R2
1
130k
RES, 130k ohm, 1%, 0.1W, 0603
0603
CRCW0603130KFKEA
Vishay-Dale
R4
1
3.16k
RES, 3.16k ohm, 1%, 0.1W, 0603
0603
CRCW06033K16FKEA
Vishay-Dale
R6
1
200k
RES, 200k ohm, 1%, 0.1W, 0603
0603
CRCW0603200KFKEA
Vishay-Dale
R7, R17
2
10.0
RES, 10.0, 1%, 0.1 W, 0603
0603
CRCW060310R0FKEA
Vishay-Dale
R8
1
100k
RES, 100 k, 1%, 0.1 W, 0603
0603
CRCW0603100KFKEA
Vishay-Dale
R9, R35
2
42.2k
RES, 42.2 k, 1%, 0.1 W, 0603
0603
CRCW060342K2FKEA
Vishay-Dale
R10, R37
2
76.8k
RES, 76.8k ohm, 1%, 0.1W, 0603
0603
CRCW060376K8FKEA
Vishay-Dale
R12, R13, R19, R20, R29
5
10.0
RES, 10.0 ohm, 1%, 0.1W, 0603
0603
CRCW060310R0FKEA
Vishay-Dale
R14
1
23.2k
RES, 23.2k ohm, 1%, 0.1W, 0603
0603
CRCW060323K2FKEA
Vishay-Dale
R15, R31, R32, R42
4
475
RES, 475 ohm, 1%, 0.1W, 0603
0603
CRCW0603475RFKEA
Vishay-Dale
R16
1
100k
RES, 100k ohm, 1%, 0.1W, 0603
0603
CRCW0603100KFKEA
Vishay-Dale
R18, R21, R41
3
1.00Meg
RES, 1.00Meg ohm, 1%, 0.1W, 0603
0603
CRCW06031M00FKEA
Vishay-Dale
R22
1
1.00k
RES, 1.00k ohm, 1%, 0.1W, 0603
0603
CRCW06031K00FKEA
Vishay-Dale
R26
1
88.7k
RES, 88.7 k, 1%, 0.1 W, 0603
0603
CRCW060388K7FKEA
Vishay-Dale
R28
1
0.015
RES, 0.015, 0.5%, 0.5 W, 1206 sense
1206 sense
LVK12R015DER
Ohmite
R34, R36
2
511k
RES, 511 k, 1%, 0.1 W, 0603
0603
CRCW0603511KFKEA
Vishay-Dale
R38
1
11.0k
RES, 11.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0711KL
Yageo America
R39
1
100k
RES, 100 k, 1%, 0.1 W, 0603
0603
RC0603FR-07100KL
Yageo America
R40
1
0.3
RES, 0.3, 1%, 0.5 W, 1206
1206
CSR1206FKR300
Stackpole Electronics Inc
R46
1
22
RES, 22 ohm, 0.5%, 0.1W, 0805
0805
RR1220Q-220-D
Susumu Co Ltd
R47, R48
2
86.6k
RES, 86.6 k, 1%, 0.1 W, 0603
0603
CRCW060386K6FKEA
Vishay-Dale
R49
0
154k
RES, 154 k, 1%, 0.1 W, 0603
0603
CRCW0603154KFKEA
Vishay-Dale
R54
1
0
RES, 0, 5%, 0.1 W, 0603
0603
RC0603JR-070RL
Yageo America
SH-JP1, SH-JP4
2
1x2
Shunt, 100mil, Gold plated, Black
Shunt
969102-0000-DA
3M
TP2, TP3, TP15, TP18
4
White
Test Point, Compact, White, TH
White Compact
Testpoint
5007
Keystone
TP4, TP5, TP12, TP17
4
Black
Test Point, Multipurpose, Black, TH
Black Multipurpose
Testpoint
5011
Keystone
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
13
Test Setup
6
Test Setup
6.1
Equipment
6.1.1
www.ti.com
WPC v1.2 15-W Receiver
Use a WPC v1.2 15-W receiver for evaluation. When paired with the bq51025EVM-749, the system can
produce 10 W. If a low power Qi-compliant receiver such as bq51020EVM-520 or bq51013BEVM-764 is
used, then the maximum output power is 5 W. Note that the following test set-up only discusses the WPC
v1.2 15-W RX configuration.
6.1.2
Voltage Source
To deliver 15 W, the input voltage source must provide a regulated DC voltage of 15 V to 19 V and deliver
at least 2-A continuous load current; current limit must be set to 3 A.
CAUTION
To help assure safety integrity of the system and minimize risk of electrical
shock hazard, always use a power supply providing suitable isolation and
supplemental insulation (double insulated). Compliance to IEC 61010-1, Safety
Requirements for Electrical Equipment for Measurement, Control and
Laboratory Use, Part 1, General Requirements, or its equivalent is strongly
suggested, including any required regional regulatory compliance certification
approvals. Always select a power source that is suitably rated for use with this
EVM as referenced in this user manual.
External Power Supply Requirements:
Nom Voltage:15.0–19.0 VDC
Max Current: 2.0 A
Efficiency Level V
External Power Supply Regulatory Compliance Certifications: Recommend
selection and use of an external power supply which meets TI’s required
minimum electrical ratings in addition to complying with applicable regional
product regulatory/safety certification requirements such as (by example) UL,
CSA, VDE, CCC, PSE, and so forth.
The bq501210EVM-756 works with 5-V to 19-V input voltage. Levels between 15 V and 19 V will deliver
15 W, which is required for a WPC Extended Power Profile (EPP) transmitter.
5-V input supplies are aimed to negotiate to HVDCP voltages of 9 V or 12 V which enables Fast Charging
of capable receivers. The system may also deliver power as a normal 5-V transmitter, however, the power
level will be reduced and providing power to higher voltage receivers may not be successful. A typical 5-V
receiver has shown to produce 4.5 W consistently. Coupling and other factors will greatly influence the
results of each system.
6.1.3
Meters
Monitor the output voltage of the 15-W RX with a voltmeter. Monitor the input current into the load with an
appropriate ammeter. You can also monitor the transmitter input current and voltage, but the meter must
use the averaging function for reducing error, due to communications packets.
6.1.4
Loads
A single load is required at 7 V to 12 V (dependent on the RX used) with a maximum current of 2 A. The
load can be resistive or electronic.
14
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
Test Setup
www.ti.com
6.1.5
Oscilloscope
Use a dual-channel oscilloscope with appropriate probes to observe the VOUT of the 15-W RX and other
signals.
6.1.6
Recommended Wire Gauge
For proper operation, use 22-AWG wire when connecting the EVM to the input supply and the 15-W RX to
the load.
6.2
Equipment Setup
•
•
•
•
6.2.1
Verify jumper positions
– JP1 - Shorted
– JP2 - Open
– JP3 - Open
– JP4 - 19-V input selected
With the power supply OFF, connect the supply to the bq501210EVM-756 transmitter.
Connect the VIN positive power source to J1, and connect the negative terminal of the VIN source to J2.
Do not place the 15-W RX on the transmitter. Connect a load to OUT with a return to GND, monitor
current through the load with the ammeter, and monitor the voltage to the load at OUT. All voltmeters
must be Kelvin connected (at the pin) to the point of interest.
Equipment Setup Diagram
The diagram in Figure 7 shows the test setup.
Wireless Transmitter
Wireless Receiver
TP15 Drive B
A
VIN
+
J1 POS
TP3 AC1
TX
Coil
V
±
J2 RTN
V
Voltmeter
AC1
A
Ammeter
TP2 AC2
+
Power Supply
Output
RX
Coil
Rectifier
AC2
A
V
RL
Ground
Oscilloscope
±
Figure 7. Equipment Setup
6.2.2
EVM Procedures
This section provides guidance for a few general test procedures to exercise the functionality of the
presented hardware. Figure 8 shows the TX and RX test points.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
15
Test Setup
www.ti.com
Drive B
TP15
AC1
TP3
Output
15-W WPC v1.2
Receiver
LOAD
Ground
AC2
TP2
Figure 8. EVM Test Points
Some key notes are shown in the following sub-sections.
6.2.2.1
Start-Up No Receiver
Turn on VIN, and observe that the green power LED D2 is flashing. LEDs D6, D7, D8, D9 and D12 are
OFF until the power transfer starts.
Apply the scope probe to the TX test point, TP15 drive B. Figure 9 shows TP15 and the input current
during the ping stage.
Ping Response with No Receiver on Pad
IIN
Analog pings
TP15
Drive B
Digital ping
Analog pings
Figure 9. Analog and Digital Pings with No RX
Observe the single-pulse burst approximately every 500 ms. A digital ping is longer and is added at
random intervals. This digital ping begins communication with a receiver placed on the TX coil. In most
cases, the Analog pin will detect a receiver being placed on the TX pad. The digital ping is a backup which
captures any certified RX. Note that the overall current during the analog pin is substantially lower than the
digital ping.
16
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
Test Setup
www.ti.com
6.2.2.2
Apply Receivers
Place the15-W RX on the top of the transmitting coil. Align the centers of the RX and TX coils. In the next
few seconds, observe that there is a "beep" from the TX and the status LED D6 flashes. Depending on the
15-W RX chosen, there may be LED indicators. These are an indication that communication between the
transmitter and the receiver is established and that power transfer has begun.
• The TX status LED, D6, flashes green during power transfer.
• Typical RX output voltage is 10 V, and the output current range is 0 mA to 1.5 A.
• Observe a continuous sine-wave on the TX test point TP15 when power transfer is active; the
frequency is 130 kHz.
• Make tests and measurements applicable to a normal 10-V power supply.
6.2.2.3
Efficiency
Measure the system efficiency by measuring the output voltage, output current, input voltage, and input
current and calculate efficiency as the ratio of the output power to the input power. Connect voltage
meters at the input and output of TX and RX (see Figure 7). Average the input current (the communication
pulses modulate the input current, distorting the reading). Figure 10 shows efficiency.
100%
90%
80%
Efficiency
70%
60%
50%
40%
30%
20%
15-W RX 8 V
15-W RX 10 V
15-W RX 12 V
10%
0
0
2
4
6
8
10
Output Power (W)
12
14
16
D002
Figure 10. Efficiency vs Power, bq501210EVM-756 Transmitter and a 15-W Receiver
6.2.2.4
TX LED Behavior
The LED behavior of D6, D7 and D8 is set by the resistance from the LED_MODE pin to ground. The
default for the bq501210EVM-756 is 42.2 kΩ, making this LED CONTROL OPTION 1 (as seen in the
bq501210 data sheet, Table 3, LED Modes.
D2 – Green LED indicator of 3.3-V DC-to-DC converter. During STANDBY (no RX), D2 flashes at about a
one-half second rate. D2 is ON during power transfer and during fault conditions.
D6 – Green status LED driven by bq501210 (LED-A). Blinks during power transfer, D6 blinks about once
per second for 5 W or 15 W and about twice per second for the proprietary 10 W solution with the
bq51025 RX.
D7 – Red status LED driven by bq501210 (LED-B). On during fault condition (for example: FOD failure
and Temperature Fault) and blinks during FOD warning.
D8 – Yellow status LED driven by bq501210 (LED-C). D8 is unused for LED Option 1.
D9 – Green LED controlled by TX input voltage. Only on when the input voltage is between 8 V and 12 V.
D12 – Green LED controlled by TX input voltage. On when the input voltage is above 12 V. See
Section 6.2.2.8 for more information on D9 and D12.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
17
Test Setup
www.ti.com
NOTE: Status LED behavior is controlled by LED mode resistor R9, 42.4 kΩ for mode 1. See the
bq501210 data sheet for additional options and configurations of LEDs D6, D7, and D8.
6.2.2.5
Start Up Receiver Placed on Transmitter
The transmitter sends a digital ping about every 500 ms. If a receiver is present, it powers up and replies,
then begins the power transfer. Figure 11 is a scope capture of the bq501210EVM-756 beginning a power
transfer with the 15-W RX.
Figure 11. Start Up
The bq501210 device supports 2-way communication between the receiver and transmitter. All
communication between the TX and RX is initiated by the RX. The TX will respond as appropriate.
Figure 12 shows the activity of the request and response during the startup phase. The TX_COMM (TP13)
is a test point that shows the simplified information sent from the TX to the RX following the WPC v1.2 2way communication protocol. See the WPC v1.2 specification for details on the communication protocol.
RX Initiates
Communication
0
1
TX
Communication
Digital ping
Figure 12. TX_COMM at Start Up
18
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
Test Setup
www.ti.com
6.2.2.6
Thermal Protection, NTC
Thermal protection is provided by an NTC resistor connected to JP3. At approximately 1 V on the sense
side (T_SENSE), the thermal fault is set, and the unit is shut down. The status LED, D8, illuminates. The
system tries to restart in 5 minutes.
6.2.2.7
Foreign Object Detection (FOD) and Parasitic Metal Object Detection (PMOD)
The bq501210 EVM supports multiple levels of protection against heating metal objects placed in the
magnetic field during power transfer. PMOD is used for older WPC v1.0 version receivers and FOD is
used for WPC v1.1 and WPC v1.2.
The first level is a short FOD ping that detects most objects before any power transfer is initiated, analysis
of the impulse response is used. Resistors R47 and R48 are used to tune this function, see the data sheet
for additional information.
The second level is power loss accounting, a comparison between power transmitted to the receiver (RX)
with the power the RX reported receiving. The difference is lost power possibly going into a foreign object.
The transmitter determines the power sent to the RX by measuring input power and calculating internal
losses. The RX measures the power it received and also calculates losses. The RX sends this information
to the TX in a digital word, message packet. Unaccounted for power loss is presumed to be a foreign
object on the charging pad. Should this lost power exceed the threshold set by R8, a FOD fault is set and
power transfer is stopped.
Three key measurements for the TX FOD calculation:
• Input Power – Product of input voltage and current. Input voltage is measured at V_SENSE though
R10 and R11. Input current is measured using sense resistor R28 and current sense amp U7
(bq500100). Since these measurements are used to calculate the power lost through a foreign object,
both measurements must be accurate.
• Power Loss in Transmitter – This is an internal calculation based on the operating point of the
transmitter. The calculation is adjusted using FOD_CAL resistor, R49. This calculation changes with
external component changes in the power path such as MOSFETs, resonate capacitors, and the TX
coil. Recalculation of R49 and R8 is required if changes are made.
• Receiver Reported Power – The receiver calculates and reports power it receives in the message
packet Received Power Packet.
The FOD threshold on the EVM is set to 600 mW, R8 is set to 100 kΩ. Increasing R8 increases the
threshold and reduces the sensitivity to foreign objects.
This loss threshold is determined after making a measurement of transmitter performance using a receiver
calibrated for FOD similar to a unit manufactured by Avid® Technology. Contact Texas Instruments for the
FOD calibration procedure for bq501210.
The PMOD threshold on the EVM is set to 600 mW, R16 is 100 kΩ. Removing R16 disables this function.
6.2.2.8
HVDCP: High Voltage Dedicated Charger Port
The HVDCP Circuitry is shown in Figure 6. The purpose of this circuitry is to give a visual indication of the
negotiation result when using a USB power source that has HVDCP capability. The circuit has been
disabled by default on this EVM to allow more precise measurement of efficiency. To enable the circuit,
simply insert 0-Ω resistors for R60 and R61 along with an 8.66-kΩ resistor for R50.
To enable the USB port, jumper JP4 must be set to select USB. When an HVDCP supply is plugged into
J5, 5 V is passed to the system. The negotiation for higher voltage is done through the resistors on the
D+/D- pins.
Once the circuit is enabled, two LEDs will indicate the voltage level of the system. When D9 is on, it
indicates the system is about 9 V. D12 indicates the USB is > 12 V.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
19
Test Setup
6.2.2.9
www.ti.com
Thermal Performance
This section shows a thermal image of the bq501210EVM-756. A 1500-mA load is used at the 10-V 15-W
receiver output. Output power is approximately 15 W, 1.5 A at 10 V. The maximum board temperature, at
L2, is 35.5°C.
Figure 13. Thermal Performance
20
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210EVM-756 Assembly Drawings and Layout
www.ti.com
7
bq501210EVM-756 Assembly Drawings and Layout
Figure 15 through Figure 20 show the design of the bq501210EVM PCB. The EVM layout has been
designed with the intent of easy access to critical notes and, therefore, is not optimized for space. The
EVM has been designed using a 4-layer, 2-oz, copper-clad circuit board, 13.2 cm × 7.24 cm with all
components in a 4.0-cm x 5.0-cm active area on the top side and all active traces to the top and bottom
layers to allow the user to easily view, probe, and evaluate the bq501210 control IC in a practical
application. Moving components to both sides of the PCB or using additional internal layers offers
additional size reduction for space-constrained systems. Gerber files are available for download from the
EVM product folder (bq501210EVM-756).
A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer
PCB presents a high risk of poor performance. Grounding between the bq501210 GND pins and filter
capacitor returns for V33A and V33D should be a good low-impedance path.
Special note should be taken of R28, the sense resistor in the Current Sense Schematic (Figure 14). The
current sense layout is critical in the FOD performance. To get the best performance we use a 4-terminal
resistor which allows the sense pins to go directly to the current monitor eliminating any solder connection
resistance to be eliminated to get the true voltage across the sense resistor.
Current Path
- +
Sense Path
Figure 14. Sense Resistor Layout
Coil Grounding – A ground plane area under the coil is recommended to reduce noise coupling into the
receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point
back to the circuit area.
NOTE: The clear plastic cover thickness (0.93 in or 2.4 mm) is the z-gap thickness for the
transmitter, which is within the WPC specification limits.
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
21
bq501210EVM-756 Assembly Drawings and Layout
www.ti.com
Figure 15. Assembly Top
Figure 16. Top Silk
22
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
www.ti.com
bq501210EVM-756 Assembly Drawings and Layout
Figure 17. Top Layer
Figure 18. Inner Layer 1
SLVUAO6 – June 2016
Submit Documentation Feedback
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
23
Reference
www.ti.com
Figure 19. Inner Layer 2
Figure 20. Bottom Layer
8
Reference
For additional information about the bq50120 WPC v1.2 Wireless Power Transmitter with 15-W Power
Delivery and its Evaluation module, visit the product folder on the TI Web site at
http://www.ti.com/product/bq501210.
For additional information on all of TI's wireless power products, visit www.ti.com/wirelesspower.
24
bq501210 bqTESLA™ Wireless Power TX EVM
Copyright © 2016, Texas Instruments Incorporated
SLVUAO6 – June 2016
Submit Documentation Feedback
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
