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bq501210
SLUSCF5C – APRIL 2016 – REVISED JULY 2016
bq501210 WPC v1.2 Wireless Power Transmitter Manager with 15-W Power Delivery
1 Features
3 Description
•
The bq501210 is a Wireless Power Consortium
(WPC) v1.2 compliant wireless power digital
controller that integrates the logic functions required
to wirelessly transfer power to a WPC-compliant
receiver with the capability of delivering up to 15 W.
The bq501210 is an intelligent device that periodically
pings the surrounding environment for available
devices to be powered, detects if a foreign metal
object is present on the charging pad, monitors all
communication from the device being wirelessly
powered, and adjusts power applied to the transmitter
coil per feedback received from the powered device.
The bq501210 also manages the fault conditions
associated with the power transfer and controls the
operating mode status indicator. The bq501210 uses
a rail voltage control scheme instead of the traditional
frequency control to adjust the amount of power
delivered to the receiver.
1
•
•
•
•
•
•
•
•
Qi-Certified Wireless Power Consortium (WPC)
v1.2 Solution for 15-W Operation
– Faster Charging Time
– Backward Compatible With Existing 5-W WPC
Receivers
12-V to 19-V Input, Fixed Frequency, Rail Voltage
Control Architecture
– 15 V to 19 V can achieve 15 W
– 9 V and 12 V capable for HVDCP
– Dynamic Power Limiting (DPL) Allows
Operation From Weak Supplies
Conforms to WPC MP-A5 Transmitter Type
Specification
Enhanced Foreign Objection Detection (FOD)
Implementation With FOD Ping that Detects Metal
Objects Prior to Power Transfer
Low Standby Power During Idle and 'Charge
Complete'
Bi-directional Communication
Digital Demodulation Reduces Components and
Simplifies Circuitry
Support Fast Charge Operation with Compatible
Receivers
10 Configurable LED Modes Indicate Charging
State and Fault Status
WPC v1.2 Wireless Chargers:
– Smart Phones, Tablets, and Other Handhelds
– Point-of-Sale Devices
– Custom Wireless Power Applications
space
Transmitter Solution Simplified Diagram
19-V
Supply
Fast Charge support provides more power for
compatible receiver devices.
See www.ti.com/wirelesspower for more information
on TI's Wireless Charging Solutions
Device Information(1)
PART NUMBER
2 Applications
•
Through negotiation with a High Voltage Dedicated
Charging Port (HVDCP) adapter, the bq501210
provides power between the WPC low power
capability of 5 W, and the medium power
specifications of 15 W.
PACKAGE
bq501210
VQFN (64)
BODY SIZE (NOM)
9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
System Efficiency With Typical WPC 15-W
Receiver
Vin
100%
90%
3.3-V
DCDC
80%
Variable Vout
DCDC
bq501210
Wireless Power
Controller
70%
Vrail
Efficiency
HVDCP
Adapter
Full-Bridge
Power
Stage
60%
50%
40%
30%
Coil
Assembly
TX
20%
10%
0
0
Copyright © 2016, Texas Instruments Incorporated
2
4
6
8
10
Output Power (W)
12
14
16
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq501210
SLUSCF5C – APRIL 2016 – REVISED JULY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison ...............................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
7
7.1
7.2
7.3
7.4
7.5
7.6
7
7
7
7
8
9
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 16
9
Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical Application .................................................. 19
10 Power Supply Recommendations ..................... 22
11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
11.2 Layout Example .................................................... 22
12 Device and Documentation Support ................. 28
12.1
12.2
12.3
12.4
12.5
12.6
Device Support......................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
28
28
28
28
28
28
13 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
Changes from Revision B (July 2016) to Revision C
Page
•
Changed Features From: Qi-Compatible Wireless Power Consortium To: Qi-Certified Wireless Power Consortium .......... 1
•
Changed "WPC-compatible" To: "WPC-compliant" in the Description................................................................................... 1
•
Changed "WPC compatible" To: "WPC compliant" in the Overview .................................................................................... 10
•
Changed "WPC compatible" To: "WPC compliant" in the Application Information .............................................................. 19
Changes from Revision A (June 2016) to Revision B
Page
•
Changed Features From: Qi-Certified Wireless Power Consortium To: Qi-Compatible Wireless Power Consortium........... 1
•
Deleted "Qi-Certified" in the Applications list.......................................................................................................................... 1
•
Changed "WPC-compliant" To: "WPC-compatible" in the Description................................................................................... 1
•
Changed "WPC compliant" To: "WPC compatible" in the Overview .................................................................................... 10
•
Changed "WPC compliant" To: "WPC compatible" in the Application Information .............................................................. 19
Changes from Original (April 2016) to Revision A
•
2
Page
Changed from Product Preview To Production ..................................................................................................................... 1
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SLUSCF5C – APRIL 2016 – REVISED JULY 2016
5 Device Comparison
DEVICE
FUNCTION
SYSTEM VIN
PROTOCOL
MAXIMUM
DELIVERED POWER
NOTE
bq500212A
Wireless Power Transmitter Manager
5V
WPC v1.1
5W
1 Coil
bq500215
Wireless Power Transmitter Manager
12 V
WPC v1.1
10 W
1 Coil, 5 W or 10 W
operation
bq500412
Wireless Power Transmitter Manager
5 V, 12 V
WPC v1.1
5W
1, 2 or 3 Coils
bq500414Q
Wireless Power Transmitter Manager
12 V
WPC v1.1
5W
1, 2 or 3 Coils,
Automotive
bq500511
bq50002
Wireless Power Transmitter Controller
Wireless Power Transmitter Analog
Front End
5V
WPC v1.1
5W
1 Coil
bq501210
Wireless Power Transmitter Manager
12 V – 19 V
WPC v1.2
15 W
1 Coil
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bq501210
SLUSCF5C – APRIL 2016 – REVISED JULY 2016
www.ti.com
6 Pin Configuration and Functions
4
AGND3
V_SENSE
PWR_UP
LED_MODE
CAL_INPUT
Reserved
V33FB
COMM_C–
COMM_C+
V_RAIL–
V_RAIL+
COMM_B–
COMM_B+
COMM_A-
COMM_A+
AGND
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RGC Package
64-Pin VQFN
Top View
PEAK_DET
1
48
AGND2
Reserved
2
47
BPCAP
V_IN
3
46
V33A
T_SENSE
4
45
V33D
I_SENSE
5
44
V33DIO
Unused
6
43
DGND
V33DIO
7
42
D+HI
DGND
8
41
RX_PROP
RESET
9
40
Reserved
Thermal
Pad
30
31
32
BUZZ_AC
BUZZ_DC
TX_COMM
Unused
33
29
16
Unused
DATA
28
DPING_DISABLE
Reserved
34
27
15
Reserved
CLK
26
D+LO
DGND
35
25
14
LED-C
SNOOZE
24
Reserved
PMOD
36
23
13
FOD
LED-B
22
Reserved
FOD_CAL
37
21
12
PWM_RAIL
LED-A
20
Reserved
FP_OFFSET
38
19
11
FP_GAIN
D-LO
18
Reserved
PWM-B
39
17
10
PWM-A
Reserved
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SLUSCF5C – APRIL 2016 – REVISED JULY 2016
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
PEAK_DET
1
I
Reserved
2
—
Input from peak detect circuit
V_IN
3
I
Transmitter Input Voltage Sense
T_SENSE
4
I
Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply
connecting to 3.3-V supply
I_SENSE
5
I
Full bridge input current sense
Unused
6, 29, 30
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout
grounding.
V33DIO
7, 44
—
3.3-V IO power supply
DGND
8, 26, 43
—
GND
RESET
9
I
Reserved
10
—
This pin must be left open.
D-LO
11
O
HVDCP interface
LED-A
12
O
Connect to an LED with a 470-Ω resistor for status indication.
LED-B
13
O
Connect to an LED with a 470-Ω resistor for status indication.
SNOOZE
14
O
Force SNOOZE (500 ms low power)
CLK
15
I
I2C interface, Clock
DATA
16
I/O
I2C interface, Data
PWM-A
17
O
PWM output A, controls one half of the full bridge in a phase-shifted full bridge. Switching dead
times must be externally generated.
PWM-B
18
O
PWM output B, controls other half of the full bridge in a phase-shifted full bridge. Switching dead
times must be externally generated.
FP_GAIN
19
O
Output to select the FOD ping calibration gain
FP_OFFSET
20
O
Output to select the FOD ping calibration offset
PWM_RAIL
21
O
PWM control signal for full bridge rail voltage
FOD_CAL
22
O
Output to select the FOD calibration
FOD
23
O
Output to select the foreign object detection (FOD) threshold
PMOD
24
O
Output to select the PMOD threshold
LED-C
25
O
Connect to an LED with a 470-Ω resistor for status indication.
Reserved
27, 28
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout
grounding.
BUZZ_AC
31
O
AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins
BUZZ_DC
32
O
DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to
an LED with a 470-Ω resistor.
TX_COMM
33
O
Debug only. This pin echoes all TX_COMM
DPING_DISABLE
34
I
Disable periodic ping backup
D+LO
35
O
HVDCP interface
Reserved
36, 37, 38,
39
—
These pins must be left open.
Reserved
40
—
Reserved, connect to 10-kΩ resistor to GND
RX_PROP
41
O
Indicates RX proprietary packet received
D+HI
42
O
HVDCP interface
V33D
45
—
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
V33A
46
—
Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor
and additional bypass capacitors.
BPCAP
47
—
Connect to 1uF bypass capacitors to 3.3-V supply and GND
AGND2
48
—
GND
AGND
49
—
GND
This pin must be connected to GND.
Device reset. Use 10- to 100-kΩ pullup resistor to 3.3-V supply
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Pin Functions (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
COMM_A+
50
I
Digital demodulation non-inverting input A. Connect parallel to input B+
COMM_A-
51
I
Digital demodulation inverting input A. Connect parallel to input B–
COMM_B+
52
I
Digital demodulation non-inverting input B. Connect parallel to input A+
COMM_B–
53
I
Digital demodulation inverting input B. Connect parallel to input A–
V_RAIL+
54
I
Feedback for full bridge rail voltage control +
V_RAIL–
55
I
Feedback for full bridge rail voltage control –
COMM_C+
56
I
Digital demodulation non-inverting input C. Connect parallel to input A+
COMM_C–
57
I
Digital demodulation inverting input C. Connect parallel to input A–
V33FB
58
I
Reserved, leave this pin open
Reserved
59
—
CAL_INPUT
60
I
Input for FOD configuration
LED_MODE
61
I
LED mode select
PWR_UP
62
I
First power-up indicator (pull high if unused)
V_SENSE
63
I
Transmitter rail voltage sense
AGND3
64
—
GND
PAD
--
—
Flood with copper GND plane and stitch vias to PCB internal GND plane
6
This pin must be connected to GND.
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SLUSCF5C – APRIL 2016 – REVISED JULY 2016
7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature (unless otherwise noted)
MIN
MAX
Voltage applied at V33D to DGND
–0.3
3.8
Voltage applied at V33A to AGND
–0.3
3.8
Voltage applied to any pin (2)
–0.3
3.8
Storage temperature, Tstg
–40
150
(1)
(2)
UNIT
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
7.2 ESD Ratings
MAX
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
UNIT
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
V
±750
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
V
Supply voltage during operation, V33D, V33A
3.0
3.3
3.6
TA
Operating free-air temperature range
–40
TJ
Junction temperature
UNIT
V
85
°C
125
7.4 Thermal Information
THERMAL METRIC (1)
bq501210
RGC (VQFN)
UNIT
64 Pins
RθJA
Junction-to-ambient thermal resistance
29.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
15.1
°C/W
RθJB
Junction-to-board thermal resistance
8.4
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
8.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLUSCF5C – APRIL 2016 – REVISED JULY 2016
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
44
55
V33D = V33A = 3.3 V
52
70
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITotal
mA
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
3.3-V slew rate
3.3-V slew rate between 2.3 and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A–, COMM_B+, COMM_B–, COMM_C+, COMM_C–
VCM
Common mode voltage each pin
–0.15
COMM+,
COMM–
Modulation voltage digital resolution
REA
Input Impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
1.631
1
1.5
V
mV
3
MΩ
5
µA
ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, CAL_INPUT, V_IN
VADC_OPEN
Voltage indicating open pin
LED_MODE, CAL_INPUT open
VADC_SHOR
Voltage indicating pin shorted to
GND
LED_MODE, CAL_INPUT shorted to ground
All analog inputs
E
Measurement range for voltage
monitoring
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3 V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
T
VADC_RANG
2.37
0.36
0
V
2.5
–2.5
2.5
100
8
mV
nA
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
DGND1 +
0.25
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = –6 mA , V33D = 3 V
VIH
High-level input voltage
V33D = 3 V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high-source current
4
IOL(MAX)
Output low-sink current
4
V33D – 0.6
V
V
2.1
3.6
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of
reset
V33D pin
tRESET
Pulse duration needed for reset
RESET pin
Switching frequency (wireless power
transfer)
ƒSW
2.4
System input power at startup
2
µs
>6V
130