BQ51010BEVM-764

User's Guide SLUUAE3A – August 2013 – Revised December 2013 bq51010BEVM-764 Evaluation Module (WCSP Package) The bq51010BEVM-764 (EVM) wireless power receiver evaluation kit from TI is a high-performance, easyto-use development kit for the design of wireless power solutions. The EVM helps designers to evaluate the operation and performance of the bq51010B, 7-V power supply for wireless power transfer. The bq51010B devices provide AC/DC power conversion and regulation while integrating the digital control required to comply with the Qi-communication protocol. The kit speeds up the development of end-use applications. 1 2 3 4 5 6 7 Contents Considerations with this EVM ............................................................................................. 2 Modifications ................................................................................................................. 2 Recommended Operation Condition ..................................................................................... 2 Equipment and EVM setup ................................................................................................ 3 4.1 Schematic ........................................................................................................... 3 4.2 Connector and Test Point Descriptions ......................................................................... 3 4.3 Jumpers and Switches ............................................................................................ 3 4.4 Test Point Descriptions ............................................................................................ 4 4.5 Pin Description of the IC .......................................................................................... 5 Test Procedure .............................................................................................................. 6 5.1 Definition ............................................................................................................ 6 5.2 Recommended Test Equipment ................................................................................. 6 5.3 Equipment Setup ................................................................................................... 7 5.4 Procedure ........................................................................................................... 8 Test Results ................................................................................................................ 10 6.1 Load Step .......................................................................................................... 10 6.2 Load Dump ........................................................................................................ 10 6.3 Start-Up ............................................................................................................ 11 6.4 Efficiency .......................................................................................................... 12 6.5 Thermal Performance ............................................................................................ 12 Layout and Bill of Material ................................................................................................ 14 7.1 Layout .............................................................................................................. 14 7.2 Bill of Materials (BOM) ........................................................................................... 17 List of Figures 1 HPA764 Schematic ......................................................................................................... 2 Test Set Up .................................................................................................................. 7 3 Load Step, 0 mA to 600 mA ............................................................................................. Load Dump, 500 mA to 0 mA ........................................................................................... Start-Up .................................................................................................................... Efficiency for the bq51010B versus IOUT ............................................................................... Thermal Image ............................................................................................................. bq51010BEVM-764 Layout Example .................................................................................. bq51010BEVM-764 Top Assembly ..................................................................................... bq51010BEVM-764 Top Layer .......................................................................................... bq51010BEVM-764 Bottom Copper Layer ............................................................................ 10 4 5 6 7 8 9 10 11 3 11 12 12 13 14 15 15 16 bqTESLA is a trademark of Texas Instruments, Inc.. SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 1 Considerations with this EVM 12 www.ti.com bq51010BEVM-764 Bottom Assembly ................................................................................. 16 List of Tables 1 1 bq51010BEVM-764 Electrical Performance Specifications ........................................................... 2 2 Pin Description .............................................................................................................. 5 3 bq51010BEVM-764 Bill of Materials ................................................................................... 17 Considerations with this EVM The bq51010BEVM-764 evaluation module (HPA764-005) demonstrates the receiver portion of the bqTESLA™ wireless power system. This receiver EVM is a complete receiver-side solution that produces 7-V output at up to a 720-mA load (5 W). • The bqTESLA receiver is used in any number of low-power battery portable devices such as a power supply to a direct battery charger. With contact-free charging capability, no connections to the device are needed. • Output voltage of 7 V up to 720-mA charge current • External adapter switchover • Low-profile, external pick-up coil • Frame is configured to provide correct receiver to transmitter spacing • Room above coil for testing with battery, key for tuning • Option to adjust the max output current using variable resistor R16 2 Modifications Refer to the datasheet when changing components (SLUSBB8). To aid in such customization of the EVM, the board was designed with devices having 0603 or larger footprints. A real implementation likely occupies less total board space. Note that changing components can improve or degrade EVM performance. 3 Recommended Operation Condition Table 1 provides a summary of the bq51010BEVM-764 performance specifications. All specifications are given for an ambient temperature of 25°C. Table 1. bq51010BEVM-764 Electrical Performance Specifications Parameter 2 Test Condition MAX UNIT 10 V 20 V Voltage at V-rectified 750 mA Current limit programming range 750 mA 205 kHz VIN Input voltage range Vadapter Adapter input voltage OVP Input overvoltage protection IOUT Output current range VOUT Output voltage ILOAD = 700 mA Fs Switching frequency Efficiency AC-AC efficiency MIN Typical Vrect Voltage at TP12 TYP 4 4 7 7 110 76 bq51010BEVM-764 Evaluation Module (WCSP Package) V % SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Equipment and EVM setup www.ti.com 4 Equipment and EVM setup 4.1 Schematic 1 1 1 1 1 Figure 1. HPA764 Schematic 4.2 Connector and Test Point Descriptions The connection points are described in the following paragraphs. 4.2.1 J1 – AD External Adapter Input, J2-GND Power cannot be provided to simulate an external adapter applied to the receiver in this bq51010BEVM764 (HPA764-005). 4.2.2 J3 – Output Voltage, J4-GND Output voltage is 7 V in wireless power mode up to 750 mA. 4.2.3 J5 – TS and Return Connector External connection for temperature sense resistor, see the datasheet for additional information. 4.2.4 J6 – Programming Connector This connector is populated and is only useful at the factory level for programming the IC. 4.3 Jumpers and Switches The control jumpers are described in the following paragraphs. SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 3 Equipment and EVM setup 4.3.1 www.ti.com JP1 – EN1 Enable 1 Not populated in this EVM (HPA764-005). 4.3.2 JP2 – EN2 Enable 2 Enable signal input that allows the system to assert wireless charging. If EN2 is set to low, wireless charging is enabled unless AD voltage > 3.6 V. If EN2 is set to High, AD mode disabled, wireless charging always enabled. Used when OTG plus wireless charging is active. 4.3.3 JP3 – TS Enable or Disable This jumper enables the TS adjustment feature using R3. The disable position sets voltage at the TS pin to a safe value. The default shorting jumper setting is disabled. 4.3.4 JP4 – Pull-Up to Out or Vz EN2 pull-up can be powered from OUT or RECT. Vz is derived from RECT through a resistor and Zener diode D2. 4.3.5 JP5 – Termination This jumper along with R14 and R13 are not installed in HPA764-001-003-005. 4.3.6 JP6 – ILIM Fix or ADJ Max output current is set by ILIM pin. In the FIX position, the current is set to a fixed value. In the ADJ position the current is set by R16. 4.4 Test Point Descriptions The test points are described in the following paragraphs. 4.4.1 TP1 – AD-EN This push-pull driver for the external PFET connects the adapter and the output from the bq51010B. 4.4.2 TP2 – AC Input 2 This is the test point for measuring AC voltage applied to the EVM from the receiver coil. 4.4.3 TP3 – COM2 Communication 2 Drive Communication driver signal, open-drain output connected to communication capacitor. 4.4.4 TP4 – AC Input 1 This is the test point for measuring AC voltage applied to the EVM from the receiver coil. 4.4.5 TP5 – CLMP 1 Overvoltage clamp driver signal, open-drain output is connected to OVP capacitor. 4.4.6 TP6 – CLMP 2 Overvoltage clamp drive signal, open-drain output is connected to OVP capacitor. 4.4.7 TP7 – OUT Output Voltage This test point is the output voltage. 4 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Equipment and EVM setup www.ti.com 4.4.8 TP8 – Boot-1 Boot Capacitor This bootstrap capacitor 1 drive connects to the integrated circuit (IC). 4.4.9 TP9 – Boot-2 Boot Capacitor This bootstrap capacitor 2 drive connects to the IC. 4.4.10 TP10 – CHG Charge This output signal indicates that the output current is being delivered to OUT, the open-drain output. 4.4.11 TP11 – AC1 IC input This is the AC input to the IC from series capacitors. 4.4.12 TP12 – Rectified Voltage The input AC voltage is rectified into unregulated DC voltage; additional capacitance is used to filter the voltage before the regulator. 4.4.13 TP13, TP14, TP15 – GND These are the ground test points. 4.4.14 TP16 – TS Temp Sensor This is the connection point for external thermistor; see the data sheet for additional information. 4.4.15 TP17 – FET Open Detection (FOD) Input for rectified power measurement, pin F2 of the IC. 4.4.16 TP18– ILIM Programming pin for over current limit, pin G1 of the IC. 4.5 Pin Description of the IC Table 2. Pin Description PIN Number (WCSP) bq51010B A1, A2, A3, A4 PGND B1, B2 AC2, AC2 B3, B4 AC1, AC1 C1 BOOT2 C2, C3 RECT C4 BOOT1 D1, D2, D3, D4 OUT E1 COM2 E2 CLMP2 E3 CLMP1 E4 COM1 F1 TS/CTRL F2 FOD F3 AD-EN F4 CHG SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 5 Test Procedure www.ti.com Table 2. Pin Description (continued) 5 PIN Number (WCSP) bq51010B G1 ILIM G2 EN2 G3 EN1 G4 AD Test Procedure This procedure describes test configuration of the bq51010B evaluation board (HPA764-005) for bench evaluation. 5.1 Definition The following naming conventions are used: VXXX : External voltage supply name (VADP, VBT, VSBT) LOADW: External load name (LOADR, LOADI) V(TPyy): Voltage at internal test point TPyy. For example, V(TP02) means the voltage at TP02. V(Jxx): Voltage at header Jxx V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test point which is marked as ACDET. V(XXX, YYY): Voltage across point XXX and YYY. I(JXX(YYY)): Current going out from the YYY terminal of header XX. Jxx(BBB): Terminal or pin BBB of header xx. JPx ON: Internal jumper Jxx terminals are shorted. JPx OFF : Internal jumper Jxx terminals are open. JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted. Assembly drawings have location for jumpers, test points, and individual components. 5.2 Recommended Test Equipment The following equipment is needed to complete this test procedure. 5.2.1 Power Supplies A power supply capable of supplying 19 V at 1 A is required for testing procedures. 5.2.2 Loads A resistive load or electronic load set to 9.5 Ω at 750 mA, 14 Ω at 500 mA, and 5 kΩ at 1 mA, power rating should be 5 W. 5.2.3 Meters Two DC voltmeters and two DC ammeters are required. 5.2.4 bqTesla Transmitter The transmitter HPA689 or equivalent is used for final test. 6 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Test Procedure www.ti.com 5.3 Equipment Setup 5.3.1 Test Set Up The final assembly is tested using a bqTesla transmitter provided (HPA689). Input voltage to the transmitter is set to 19 VDC, ±200 mV with current limit of 1 A and connected to J1 and J2. Set power supply to OFF. Place UUT on the transmitter coil. The unit under test (UUT) is placed in the center of HPA689 TX coil. Other bqTesla transmitter base units are also acceptable for this test. A VOUT A PS VIN V Wireless Transmitter bq51010BEVM-764 V Load GND GND Figure 2. Test Set Up 5.3.2 Load The load is connected between J3 OUT and J4 GND of the UUT. A DC ammeter is connected between UUT and Load. Set the load for 10 Ω/700 mA. 5.3.3 Jumper Settings JP1: EN1/TERM and Low shorted JP2: EN2 and Low shorted JP3: TS and DIS shorted JP4: Pullup and Vz shorted JP5: Open JP6: ILIM and ADJ shorted 5.3.4 Meters • • • • 5.3.5 Connect ammeter to measure 19-V input current to transmitter. Connect voltmeter to monitor input voltage at J1 and J2 of TX unit. On UUT, a voltmeter is used to measure output voltage at TP7 with ground at J4. Connect ammeter to measure load current. R3 Set Up Connect ohmmeter across J5. Connect shorting jumper JP3 from TS to EN. Adjust R3 for a 10 kΩ, ±200Ω reading on the ohmmeter 5.3.6 R16 Set Up Connect ohm meter between JP6 ADJ and J2 (GND). Adjust R16 to 415 Ω, ±20-Ω reading on the ohmmeter. SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 7 Test Procedure 5.4 Procedure 5.4.1 • • • • • • • 5.4.2 www.ti.com Turn ON Operation and Operation at 500-mA Load Turn ON transmitter power supply (19 V) Transmitter: Verify LED D2 is ON UUT: Adjust load current to 700 mA, ±50mA Put the receiver EVM on the Transmitter coil and align them correctly After 5 seconds, verify that: 1. Transmitter: Status LED D5 should be green flashing for approximately 1 second 2. The transmitter beeps 3. Transmitter: LED D2 still ON 4. Receiver: LED D1 is ON UUT: Verify that Vout is 6.9 V to 7.1 V (between TP7 and J4) UUT: Verify that the rectified voltage is 7.4 V to 7.05 V (between TP12 and TP13) (Note: a modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower value or base line) Efficiency Test (500-mA Load) • Verify the input current to TX is less than 260 mA, with input voltage at 19 VDC • Turn OFF Transmitter Power Supply (19) 5.4.3 • • • • • • • Operation (1-mA Load) Turn ON transmitter power supply (19 V) Transmitter: Verify LED D2 is ON UUT: Adjust load current to 1mA, ±200 µA Put the receiver EVM on the transmitter coil and align them correctly After 5 seconds verify that: 1. Transmitter: Status LED D5 is flashing green for approximately 1 second 2. The transmitter beeps 3. Transmitter: LED D2 still ON 4. Receiver: LED D1 is ON UUT: Verify that Vout is 6.9 V to 7.1 V (between J3 or TP7 and J4) UUT: Verify that rectified voltage should be 10 V to 7.5 V (between TP12 and TP13) (Note: a modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower value or base line) 5.4.4 Efficiency Test (1-mA Load) • Verify the input current to TX is less than 80 mA, with the input voltage at 19 VDC • Turn OFF Transmitter Power Supply (19) 5.4.5 Operation (700-mA Load) • UUT: Adjust load current to 700 mA, ±50 mA • UUT: Verify that VOUT is 6.9 V to 7.1 V (between J3 or TP7 and J4) • UUT: Verify that the rectified voltage should be 7.5 V to 7.05 V (between TP12 and TP13) (Note: a modulation signal is present on this voltage every 250 ms and may cause fluctuation in the reading, use lower value or base line) 8 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Test Procedure www.ti.com 5.4.6 • • 5.4.7 • • • • Efficiency Test (700-mA Load) Verify that input current to TX is less than 350 mA with input voltage at 19 VDC Turn OFF Transmitter Power Supply (19) Adapter Test (700-mA Load) Connect 6-V, ±200 mV power supply with current limit set to 1.0 A to J1 and return to J2 on the HPA764-005 receiver. Adjust load current to 700 mA, ±50 mA Turn on power supply Verify that: 1. UUT: TP7 VOUT is 6.5 V to 7.1 V 2. Transmitter: Status LED D5 is off SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 9 Test Results 6 Test Results 6.1 Load Step www.ti.com The procedure for load step is as follows: • Set up the test bench as described in Section 5. • Power TX with 19 V. • Provide a load step from no load (high impedance) to 11.5 Ω or 600 mA (if using current source load). • Monitor load current, rectifier voltage, and output voltage as shown in Figure 3. Figure 3. Load Step, 0 mA to 600 mA 6.2 Load Dump The procedure for load dump is as follows: • Set up the test bench as described in Section 5. • Power TX with 19 V • Provide a load dump from 14 Ω or 500 mA (if using a current source load) to no load (high impedance). • Monitor load current, rectifier voltage, and output voltage as shown in Figure 4. 10 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Test Results www.ti.com Figure 4. Load Dump, 500 mA to 0 mA 6.3 Start-Up These procedures demonstrates start-up: • Set up the test bench as described in Section 5. • Power TX with 19 V • Trigger scope sweep on TP2 AC IN SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 11 Test Results www.ti.com Figure 5. Start-Up 6.4 Efficiency Figure 6 shows the efficiency data for the wireless power receiver, bq51010B. The efficiency data are measured from 100- to 700-mA load. 100 90 Efficiency (%) 80 70 60 50 40 30 20 0 100 200 300 400 500 600 IOUT (mA) 700 C006 Figure 6. Efficiency for the bq51010B versus IOUT 6.5 Thermal Performance This section shows a thermal image of the bq51010BEVM-764. A 7.0-V output is used at a 720-mA load. There is no air flow and the ambient temperature is 25°C. The peak temperature of the IC, 44.9°C, is well below the maximum recommended operating condition listed in the data sheet. 12 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Test Results www.ti.com Figure 7. Thermal Image SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 13 Layout and Bill of Material www.ti.com 7 Layout and Bill of Material 7.1 Layout 7.1.1 Printed-Circuit Board Layout Guideline The primary concerns when laying out a custom receiver PCB are: • AC1 and AC2 trace resistance • OUT trace resistance • RECT trace resistance • GND connection • Copper weight ≥ 2 oz For a 720-mA load current application, the current rating for each net is as follows: • AC1 = AC2 = 900 mA • BOOT1 = BOOT2 = 10 mA • RECT = 750 mA • OUT = 750 mA • COM1 = COM2 = 300 mA • CLAMP1 = CLAMP2 = 500 mA • ILIM = 10 mA • AD = AD_EN = TS-CTRL = EN1 = EN2 = TERM = FOD = 1 mA • CHG = 10 mA It is also recommended to have the following capacitance on RECT and OUT: • RECT ≥ ±10 μF • OUT ≥ 1 μF It is always a good practice to place high-frequency bypass capacitors of 0.1 μF next to RECT and OUT. Figure 8 illustrates an example of a WCSP layout: Figure 8. bq51010BEVM-764 Layout Example 14 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Layout and Bill of Material www.ti.com 7.1.2 Layout Figure 9. bq51010BEVM-764 Top Assembly Figure 10. bq51010BEVM-764 Top Layer SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 15 Layout and Bill of Material www.ti.com Figure 11. bq51010BEVM-764 Bottom Copper Layer Figure 12. bq51010BEVM-764 Bottom Assembly 16 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Layout and Bill of Material www.ti.com 7.2 Bill of Materials (BOM) Table 3. bq51010BEVM-764 Bill of Materials COUNT 001 002 003 004 005 RefDes Value Description Size Part Number MFR 1 1 1 1 1 C1 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 1 1 1 0 C2 68nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 0 0 0 0 1 C2 12nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 1 1 1 1 C3 47nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 1 1 1 0 C4 1800pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 0 0 0 0 1 C4 1500pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 1 1 1 1 C5 100pF Capacitor, Ceramic, 50V, C0G, 5% 0603 Std Std 4 4 4 4 4 C6, C16, C18, C19 0.1uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 3 3 3 3 3 C7, C17, C20 1.0uF Capacitor, Ceramic, 50V, X5R, 10% 0805 Std Std 2 2 2 2 2 C8, C13 22nF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 2 2 2 2 2 C9, C12 0.47uF Capacitor, Ceramic, 25V, X5R, 10% 0603 Std Std 2 2 2 2 2 C10, C11 0.01uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 2 2 2 2 2 C14, C15 10uF Capacitor, Ceramic, 25V, X5R, 10% 1206 Std Std 1 1 1 1 1 D1 LTST-C190GKT Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 0603 LTST-C190GKT Lite On 1 1 1 1 1 D2 5.1V Diode, Zener, 5.1V, 300mW SOD-523 BZT52C5V1T-7 Diodes, Inc. 5 5 5 5 5 J1, J2, J3, J4, J5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins 1 1 1 1 1 J6 N2510-6002-RB Connector, Male Straight 2x5 pin, 100mil spacing, 4 Wall 0.338 x 0.788 inch N2510-6002-RB 3M 4 4 4 4 4 JP2, JP3, JP4, JP6 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins 1 0 1 0 1 JP1 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins 0 1 0 1 0 JP5 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins 1 0 1 0 1 Q1 CSD75205W1015 MOSFET, Dual PChan, -20V, 1.2A, 190 milliOhm CSP 1x1.5mm CSD75205W1015 TI 0 0 0 0 0 R1 Open Resistor, Chip, 1/16W, 1% 0603 Std Std 1 0 0 0 0 R2 150 Resistor, Chip, 1/16W, 1% 0603 Std Std 0 0 1 0 0 R2 196 Resistor, Chip, 1/16W, 1% 0603 Std Std 0 1 0 1 1 R2 200 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 1 1 1 R3 200k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-204LF Bourns 0 0 1 0 0 R4 75 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 0 1 1 R4 110 Resistor, Chip, 1/16W, 1% 0603 Std Std 0 0 0 0 0 R5 Open Resistor, Chip, 1/16W, 1% 0603 Std Std 0 0 0 0 0 R6, R12 Open Resistor, Metal Film, 1/4 watt, ± 1% 1206 CRCW120624R0FKEA Vishay 1 1 1 1 1 R7 1.50K Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 1 1 1 R8, R9 200 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 1 1 1 R10 499 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 1 1 1 R11 10.0k Resistor, Chip, 1/16W, 1% 0603 Std Std 0 1 0 1 0 R14 1.0k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 1 1 1 1 R15 1.0K Resistor, Chip, 1/16W, 1% 0603 Std Std 0 1 0 1 0 R13 20k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-203LF Bourns SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 17 Layout and Bill of Material www.ti.com Table 3. bq51010BEVM-764 Bill of Materials (continued) COUNT 001 002 003 004 005 RefDes Value Description Size Part Number MFR 1 1 1 1 1 R16 5k Potentiometer, 1/4 in. Cermet, 12-Turn, Top-Adjust 0.25x0.17 3266W-1-502LF Bourns 0 0 1 0 0 R17 20K Resistor, Chip, 1/16W, 1% 0603 Std Std 0 1 0 1 0 R17 42.2K Resistor, Chip, 1/16W, 1% 0603 Std Std 0 0 0 0 1 R17 36K Resistor, Chip, 1/16W, 1% 0603 Std Std 15 15 15 15 15 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP16, TP17, TP18 5000 Test Point, Red, Thru Hole Color Keyed 0.100 x 0.100 inch 5000 Keystone 3 3 3 3 3 TP13, TP14, TP15 5001 Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 inch 5001 Keystone 1 0 0 0 0 U1 bq51013AYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013AYFP TI 0 1 0 0 0 U1 bq51050BYFP IC, Wirless Secondary-Side Power Controller and Battery Charger DSBGA bq51050BYFP TI 0 0 1 0 0 U1 bq51013BYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013BYFP TI 0 0 0 1 0 U1 bq51051BYFP IC, Wirless Secondary-Side Power Controller and Battery Charger DSBGA bq51013BYFP TI 0 0 0 0 1 U1 bq51010BYFP IC, Wirless Secondary-Side Power Controller DSBGA bq51013BYFP TI 5 5 5 5 5 -- Shunt, 100-mil, Black — See note 6 929950-00 3M 1 1 1 1 1 -- PCB, 2.1" x 2.1" x 0.031" HPA764 Any 1 1 1 1 1 -- Case Modified Polycase LP-11B with 4 screws — See note 7 J-6838A Polycase 1 1 1 1 0 -- Coil, RX with Attractor IWAS-4832FF-50 WR-483250-15M2-G 760308103204 Vishay TDK Wyurth 0 0 0 0 1 Coil, RX with Attractor — See note 8 IWAS4832ECEB160J50 Vishay 1 1 1 1 1 Tape segment, Low Static Polyimide Film — See note 9 5419-1 1/2" 3M 1 1 1 1 1 THT-53-423-3 Brady Notes: 1. These assemblies are ESD sensitive, observe ESD precautions. Label Label Thermal Label — See note 10 1.5" x 2.3" 2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. 5. Tape "Coil, RX" into bottom of case, centered, coil side down, lead wires passing through milled groove. 6. Install Shunts on: JP1: (Only for HPA764-001, 003, & 005) between EN1/TERM and LOW JP4: between Pull-up and Vz JP2: between EN2 and LOW JP5: (Only for HPA764-002 and HPA764-004) between two ends JP3: between TS and DIS 7. Install PCB in case using screws provided with case 8. WR483225-16M6-TI3 from TDK coil can also be used as second option. 9. Used to secure RX coil to case. Cut tape section from 36 yard roll identified in part number field. 10. Install label on back of PCB near J6 on the top edge of the PCB after final wash (box). Text shall be 8 pt font or lower. Text shall be per Table 1. The ref designators should not be hidden by the label. Table 1 Assembly Number 18 Text HPA764-001 bq51013AEVM-764 HPA764-002 bq51050BEVM-764 HPA764-003 bq51013BEVM-764 bq51010BEVM-764 Evaluation Module (WCSP Package) SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Layout and Bill of Material www.ti.com Table 3. bq51010BEVM-764 Bill of Materials (continued) COUNT 001 002 003 004 005 RefDes Value HPA764-004 bq51051BEVM-764 HPA764-005 bq51010BEVM-764 Description SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Size Part Number MFR bq51010BEVM-764 Evaluation Module (WCSP Package) Copyright © 2013, Texas Instruments Incorporated 19 Revision History www.ti.com Revision History Changes from Original (August 2013) to A Revision ..................................................................................................... Page • Added Wyurth part 760308103204, in 'Coil, RX with Attractor' row of BOM. ................................................... 17 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 20 Revision History SLUUAE3A – August 2013 – Revised December 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of EVMs for RF Products in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 　　　上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL, CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. 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