BUF634AIDR

BUF634A SBOS948F – FEBRUARY 2019 – REVISED MAY 2021 BUF634A 36-V, 210-MHz, 250-mA Output, High-Speed Buffer The BUF634A device can be used as a standalone open-loop driver, or used inside the feedback loop of a precision op amp to provide both high-precision and large output current drive with improved capacitive load drive. 1 Features Pin-Selected Bandwidth: 35 MHz to 210 MHz High Output Current: 250 mA Slew Rate: 3750 V/µs Low Quiescent Current: 1.5 mA (35-MHz BW) Wide Supply Range: ±2.25 V to ±18 V Internal Output Current Limit Thermal Shutdown Protection Available in Packages with Thermal Pad Extended Temperature Operation: –40°C to +125°C For low-power applications, the BUF634A device operates on a 1.5-mA quiescent current with a 250-mA output, 3750-V/µs slew rate, and 35-MHz bandwidth. The device consumes 8.5-mA quiescent current in wide-bandwidth mode with a 210-MHz bandwidth. The BUF634A is fully protected by an internal current limit in its output stage and by thermal shutdown, making the device rugged and easy to use. 2 Applications • • • • • • • Memory, Semiconductor Testers Test Equipment Headphone Drivers Flight Control Systems Capacitive Load Drivers Valve Drivers, Solenoid Drivers Line Drivers 3 Description The BUF634A device is a high-performance, highfidelity, open-loop buffer that is capable of driving 250 mA of output current. The BUF634A is a 36-V device with an adjustable bandwidth of 35 MHz to 210 MHz, which is accomplished by varying the value of an external resistor between the V– and BW pins. The BUF634A device is rated to function over the extended industrial temperature range of –40°C to +125°C. The BUF634A comes in three packages: D (SOIC), DRB (VSON), and DDA (HSOIC). The DRB (VSON) and DDA (HSOIC) packages have excellent thermal performance resulting from the thermal pad on the bottom side. The DRB package comes in a very small form factor of 3.0 mm × 3.0 mm, making the device a very suitable option for portable and sizeconstrained applications. Device Information(1) PART NUMBER BUF634A (1) PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.90 mm VSON (8) 3.00 mm × 3.00 mm HSOIC (8) 4.90 mm × 3.90 mm For all available packages, see the orderable addendum at the end of the data sheet. 100 TJA (°C/W) 4 Layer Board