CC1180RSPT

CC1180 Sub-1GHz 6LoWPAN Network Processor Accelerate your 6LoWPAN Development Applications Large scale mesh networks that require IP backbone interconnectivity Automated Meter Reading Street Lighting Systems Home/Building automation Industrial control and monitoring Mesh sensor networks Product Description The CC1180 is a cost-effective, low power, sub1GHz 6LoWPAN Network Processor that provides 6LoWPAN functionality with a minimal development effort. CC1180 is a preloaded version of CC1110F32, where TI third party Sensinode’s The 6LoWPAN stack, NanoStack 2.0 Lite, runs on the CC1180 Network Processor. The application controlling the Network Processor runs on an external host microcontroller. The CC1180 handles all the timing critical and processing intensive 6LoWPAN protocol tasks, and leaves the resources of the application microcontroller free to handle the application. CC1180 makes it easy to add 6LoWPAN functionality to new or existing products at the same time as it provides great flexibility in choice of microcontroller. How to use Sensinode NanoStack 2.0 is described in the User’s Guide SWRU298.pdf. CC1180 interfaces almost any microcontroller through a UART interface; CC1180 can e.g. be combined with an MSP430. The CC1180 contains a bootloader, Sensinode NanoBoot. The bootloader is used to download the Sensinode 6LoWPAN stack, NanoStack 2.0 Lite. CC1180 supports Sensinode’s simple NAP protocol API. The NAP Protocol API has only a small amount of API calls to learn, which drastically simplifies the development of 6LoWPAN applications. The API has a socket like approach, to enable easy and fast integration between the host and network processor. CC1180 comes preloaded with Sensinode NanoBoot and a TI IEEE EUID (MAC address); the MAC address can be read and written using NanoBoot. Key Features Simple integration of 6LoWPAN with mesh support into any design Running Sensinode’s mature and stable 6LoWPAN mesh stack, NanoStack 2.0 Lite UART interface to microcontroller running the application Supports updating of the NanoStack 2.0 Lite 6LoWPAN stack using Sensinode NanoBoot API. Over-The-Air updates are supported, provided that the host microcontroller has enough memory to store the new stack image. Example 6LoWPAN mesh system overview Radio features: o 315/433/868/915 MHz ISM/SRD bands o Output power: -30dBm to +10dBm o Date rates: 50, 100, 150 and 200kbps o AES-CCM* secured IEEE802.15.4e payloads, using network-wide key. o Excellent receiver sensitivity and best in class robustness to interferers Power Supply o Wide supply voltage range (2.0V – 3.6V) o Low current consumption External System o Very few external components RoHS compliant 6x6 mm QFN 36 package Note: Erasing the chip will result in having a blank device, with no possible way to recover the Sensinode NanoBoot. CC1180 Data Sheet SWRS113A Page 1 of 13 CC1180 Table of Contents APPLICATIONS ................................................................................................................................. 1 PRODUCT DESCRIPTION ................................................................................................................. 1 KEY FEATURES ................................................................................................................................ 1 TABLE OF CONTENTS ..................................................................................................................... 2 ABBREVIATIONS .............................................................................................................................. 3 1 ELECTRICAL CHARACTERISTICS ........................................................................................ 4 2 PIN AND I/O PORT CONFIGURATION ................................................................................... 4 3 APPLICATION CIRCUIT .......................................................................................................... 6 4 SENSINODE NANOBOOT API ................................................................................................ 7 4.1 INTRODUCTION ......................................................................................................................... 7 4.2 OVERVIEW ............................................................................................................................... 7 4.3 NANOBOOT PROTOCOL ............................................................................................................ 7 4.4 API COMMANDS ....................................................................................................................... 8 4.5 STATE MACHINE ....................................................................................................................... 9 4.6 SOFTWARE UPDATE PROCESS ................................................................................................. 10 5 DEBUG INTERFACE .............................................................................................................. 12 6 DEVELOPMENT KIT ORDERING INFORMATION ............................................................... 13 7 REFERENCES ........................................................................................................................ 13 8 GENERAL INFORMATION .................................................................................................... 13 8.1 DOCUMENT HISTORY .............................................................................................................. 13 CC1180 Data Sheet SWRS113A Page 2 of 13 CC1180 Abbreviations AES Advanced Encryption Standard LQI Link Quality Indicator API Application Programming Interface LSB Least Significant Byte ARIB Association of Radio Industries and Businesses MAC Medium Access Control MSB Most Significant Byte BOM Bill of Materials NA Not Available CFR Code of Federal Regulations NC Not Connected CPU Central Processing Unit PA Power Amplifier CRC Cyclic Redundancy Check PCB Printed Circuit Board DC Direct Current PER Packet Error Rate EM Evaluation Module PHY Physical Layer ESD Electro Static Discharge RAM Random Access Memory ETSI European Telecommunications Standards Institute RF Radio Frequency FCC Federal Communications Commission RoHS Restriction on Hazardous Substances FCS Frame Check Sequence RSSI Received Signal Strength Indicator I/O Input / Output RX Receive IEEE Institute of Electrical and Electronics Engineers TBD To Be Decided / To Be Defined TI Texas Instruments ISM Industrial, Scientific and Medical TX Transmit JEDEC Joint Electron Device Engineering Council UART Universal Asynchronous Receiver/Transmitter kB 1024 bytes USART kbps kilobits per second Universal Synchronous/Asynchronous Receiver/Transmitter CC1180 Data Sheet SWRS113A Page 3 of 13 CC1180 1 Electrical Characteristics For Electrical Characteristics tables, see SWRS033.pdf. 2 Pin and I/O Port Configuration GUARD AVDD_DREG DCOUPL RESET_N NC NC NC NC NC The CC1180 has the exact same pinout as CC1110F32 and is shown in Figure 1 and Table 1. 36 35 34 33 32 31 30 29 28 MODE 1 27 RBIAS DVDD 2 26 AVDD STATUS_1 3 25 AVDD STATUS_0 4 24 RF_N NC 5 23 RF_P 22 AVDD NC 6 UART_RX 7 21 XOSC_Q1 UART_TX 8 20 XOSC_Q2 NC 9 19 AVDD 10 11 12 13 14 15 16 17 18 XOSC32_Q2 XOSC32_Q1 DEBUG_CLOCK DEBUG_DATA NC NC NC NC DVDD AGND Exposed die attached pad Figure 1: Pinout top view Note: The exposed die attach pad must be connected to a solid ground plane as this is the ground connection for the chip. CC1180 Data Sheet SWRS113A Page 4 of 13 CC1180 Pin Pin name Pin type Description - GND Ground The exposed die attach pad must be connected to a solid ground plane 1 MODE Digital Input CC1180 Input, connection with host MCU to control application or bootloader mode [2]. Must be high by default. Falling edge toggles mode. 2 DVDD Power (Digital) 2.0V-3.6V digital power supply for digital I/O 3 STATUS_1 Digital Output CC1180 Output, can be connected to e.g. LED to indicate application / 4 STATUS_0 Digital Output CC1180 Output, can be connected to e.g. LED to indicate application / bootloader mode [2]. bootloader mode [2]. 5 NC D I/O NC 6 NC D I/O NC 7 UART_RX Digital Input CC1180 USART0 RX Input, connection to host MCU [2]. 8 UART_TX Digital Output CC1180 USART0 TX Output, connection to host MCU [2]. 9 NC D I/O NC 10 DVDD Power (Digital) 2.0V-3.6V digital power supply for digital I/O 11 NC D I/O NC 12 NC D I/O NC 13 NC D I/O NC 14 NC D I/O NC 15 DEBUG_DATA D I/O Debug Data 16 DEBUG_CLOCK D I/O Debug Clock 17 XOSC32_Q1 D I/O 32.768 kHz crystal oscillator pin 1 18 XOSC32_Q2 D I/O 32.768 kHz crystal oscillator pin 2 19 AVDD Power (Analog) 2.0V-3.6V analog power supply connection 20 XOSC_Q2 Analog I/O 26 MHz crystal oscillator pin 2 21 XOSC_Q1 Analog I/O 26 MHz crystal oscillator pin 1, or external clock input 22 AVDD Power (Analog) 2.0V-3.6V analog power supply connection 23 RF_P RF I/O Positive RF input signal to LNA in receive mode Positive RF output signal from PA in transmit mode 24 RF_N RF I/O Negative RF input signal to LNA in receive mode Negative RF output signal from PA in transmit mode 25 AVDD Power (Analog) 2.0V-3.6V analog power supply connection 26 AVDD Power (Analog) 2.0V-3.6V analog power supply connection 27 RBIAS Analog I/O External precision bias resistor for reference current 28 GUARD Power (Digital) Power supply connection for digital noise isolation 29 AVDD_DREG Power (Digital) 2.0V-3.6V digital power supply for digital core voltage regulator 30 DCOUPL Power decoupling 1.8V digital power supply decoupling 31 RESET_N DI Reset, active low 32 NC D I/O NC 33 NC D I/O NC 34 NC D I/O NC 35 NC D I/O NC 36 NC D I/O NC Table 1: Pinout overview CC1180 Data Sheet SWRS113A Page 5 of 13 CC1180 3 Application Circuit Since CC1180 is a preloaded version of CC1110F32, the application circuit for CC1180 can be found in [1]. Figure 2 shows the software architecture for an application circuit where the CC1180 network processor is controlled from a host MCU. Figure 2. CC1180 based 6LoWPAN System CC1180 Data Sheet SWRS113A Page 6 of 13 CC1180 4 Sensinode NanoBoot API 4.1 Introduction This section contains protocol description of Sensinode NanoBoot – the NanoStack 2.0 Lite bootloader. NanoBoot is a separate software component that can be used to update the 6LoWPAN stack firmware installed in flash. The Sensinode NanoStack 2.0 Lite stack firmware is encrypted; it is not possible to download stack firmware not verified by Sensinode. The use of bootloader requires the device that uploads the new flash image (i.e. the host) to implement the host part of the bootloader protocol. 4.2 Overview NanoBoot is installed into flash address 0x0000. When the CC1180 device is powered up, the bootloader is initialized. Depending on the contents of the flash memory at address 0x6FF7 the software will remain in bootloader mode or the Sensinode NanoStack 2.0 Lite 6LoWPAN stack will be executed. The Bootloader will remain active if the byte value is 0xFF, while value 0x00 will cause the 6LoWPAN stack to start executing. The Bootloader requires a total of 5kB of flash memory. CC1180 has 32kB of flash in total, thus 27kB of flash memory is available for the NanoStack 2.0 Lite 6LoWPAN stack. Available RAM is not affected. The MAC address of CC1180 is stored at flash address 0x6FF8 and is 8 bytes long. 4.2.1 Changing Application Mode Before the application MCU can communicate with the NanoBoot module on the CC1180 the module must be enabled properly. This is done by pulling CC1180 MODE signal down to ground (0 volts); this causes a falling edge interrupt to occur. The NanoBoot mode is toggled on each falling edge of the MODE signal. The currently active mode can be identified from the state of the STATUS_0 (pin 4) and STATUS_1 (pin 3) pins. When STATUS_0 and STATUS_1 are constantly high, the CC1180 device is in bootloader mode. See [2] for details. 4.3 NanoBoot Protocol The Sensinode NanoBoot protocol has been designed to be an easy-to-parse, low-overhead serial protocol that has enough flexibility and extendibility for the NanoBoot bootloader. Low complexity has been an important design goal so that the protocol can be efficiently parsed even on MCUs with very limited resources. The potentially limited serial port data rates have imposed the need for a very low overhead compared to the actual payload data. Each packet of bootloader protocol is a NAP configuration packet with a special control byte (CT). This allows the application MCU to use the same NAP protocol implementation for all communication with the CC1180 device. See [2] for more details on the Sensinode NAP Protocol. The high level packet format is described in Table 2. Byte Name 1 2 Length 3 'N' 4 'A' … 5 CT cmd_id N [Variable] CS Table 2. High level NAP packet format 4.3.1 Length Byte The first byte of a packet is always the total length of the packet not including the length byte itself but including the last byte (CS). The byte is in normal host order i.e. MSB. 4.3.2 Header Bytes The two bytes following the Length byte are ASCII characters 'N' and 'A' (0x4e and 0x41 respectively). The two bytes are static and present in all packets. Wrong bytes will result in that NanoBoot discards the packet. CC1180 Data Sheet SWRS113A Page 7 of 13 CC1180 4.3.3 CT Byte The Sensinode NAP protocol specifies a control (CT) byte to separate control and data messages as well as used protocol and addressing modes. This byte is 0xCD for NAP configuration message identifying NanoBoot protocol data. Packets with unknown CT byte will be discarded. 4.3.4 cmd_id byte The cmd_id byte is a byte which defines the packet type. Packet types relevant to the NanoBoot are listed in Table 3. cmd_id Packet type 0x01 FLASH_WRITE_PAGE 0x81 FLASH_WRITE_PAGE_CONFIRM 0x02 FLASH_WRITE_PAGE_DONE 0x05 MAC_ADDRESS_READ MAC_ADDRESS_READ_CONFIRM / 0x85 MAC_ADDRESS_SET_CONFIRM 0x08 MAC_ADDRESS_SET 0x0A APPLICATION_MODE_TOGGLE 0x8A APPLICATION_MODE_TOGGLE_REPLY 0x09 UNSUPPORTED_MESSAGE 0x0B VERSION_REQUEST 0x8B VERSION_REPLY Table 3. Command types 4.3.5 CS Byte The checksum byte is calculated as Exclusive-OR (XOR) from all bytes of the packet (excluding the CS byte itself but including the length byte). The Sensinode NanoBoot protocol parser will discard packet if the checksum does not match. 4.4 API Commands Table 4 describes the available commands and their respective payload structures. Bytes# describes variable fields of basic packet structure for each command. Command CC1180 Byte #1 Byte #2 Byte #3 Byte #4 Byte #5 Byte #N DIR. FLASH_WRITE_PAGE IN Page number Encoding flag Page setups DATA byte 1 DATA byte 2 DATA byte 64 FLASH_WRITE_PAGE_CONFIRM OUT Page number - - - - - FLASH_WRITE_PAGE_DONE OUT Page number - - - - - MAC_ADDRESS_READ IN - - - - - - MAC_ADDRESS_READ_CONFIRM OUT MAC byte 1 MAC byte 2 MAC byte 3 MAC byte 4 MAC byte 5 MAC byte 8 MAC_ADDRESS_SET IN MAC byte 1 MAC byte 2 MAC byte 3 MAC byte 4 MAC byte 5 MAC byte 8 APPLICATION_MODE_TOGGLE IN - - - - - - APPLICATION_MODE_TOGGLE_ OUT - - - - - - MAC_ADDRESS_SET_CONFIRM REPLY VERSION_REQUST IN CC1180 Data Sheet SWRS113A Page 8 of 13 CC1180 Command CC1180 Byte #1 Byte #2 Byte #3 Byte #4 Byte #5 Byte #N Application Application Application Application DIR. VERSION_REPLY OUT BL version byte Application version 1 UNSUPPORTED_MESSAGE OUT byte version byte version 2 3 byte version byte version byte 4 6 Error type Table 4. Supported commands and their packet format BL version byte – 0xf0 bits indicates integer part of version number, 0x0f bits indicates decimal part of version number, as integers. E.g. 0x10 shall be interpreted as version 1.0. Application version byte – Version of the Sensinode NanoStack 2.0 Lite 6LoWPAN stack Error type – 0x00 for NAP frame errors, any other value indicates a NanoBoot protocol error. Encoding flag – is always 0x01. 4.5 State machine This chapter describes the recommended method for implementing a state machine for a host application using NanoBoot protocol to communicate with a CC1180 network Processor. An example application that can be used to interact with the Sensinode NanoBoot bootloader to e.g. perform software update is described in CC-6LOWPAN-DK-868 User’s Guide (SWRU298.pdf). The figures below introduce the basic message flows that are supported in NanoBoot. 4.5.1 Example Message flows Common for all figures below is that NanoBoot in CC1180 must be set in NanoBoot mode before any communication is initiated. NanoBoot mode can be entered by setting the MODE pin to ground once, or by sending APPLICATION_MODE_TOGGLE NAP protocol message from Host to Network Processor; assuming it has a valid application which supports mode toggle. Figure 3 explains how MAC address is set to a CC1180 Network Processor. Same communication flow also applies for message pairs MAC_ADDRESS_READ/MAC_ADDRESS_READ_CONFIRM and VERSION_REQUEST/VERSION_REPLY. Figure 3. MAC address request CC1180 Data Sheet SWRS113A Page 9 of 13 CC1180 HOST represents PC or a host MCU device that implements the Host part of the communication protocol defined in this document. BL Device is the device running NanoBoot, i.e. CC1180. Figure 4 describes a situation where HOST sends an unrecognized message to BL Device. If BL Device is in NanoBoot mode it responds with UNSUPPORTED_MESSAGE cmd_id. If CS byte match fails, 'N' / 'A' headers are missing or CT byte does not match, then no UNSUPPORTED_MESSAGE response is sent as received data is quietly discarded on BL Device. Figure 4. Unsupported data received by BL Device To toggle between NanoBoot mode and application mode, message APPLICATION_MODE_TOGGLE can be used. This message type is one-way communication only as it switches BL Device mode immediately to application mode if NanoBoot is running when it is received. If the HOST sends the APPLICATION_MODE_TOGGLE message to BL Device while it is in application mode the BL Device will immediately toggle to NanoBoot mode. 4.6 Software update process Software update can only be performed with a binary file provided by Sensinode Ltd. since Sensinode Ltd. encrypts the NanoStack 2.0 Lite 6LoWPAN stack. The HOST initializes communication by verifying that BL Device is in NanoBoot mode. This can be done by e.g. reading the MAC address of the CC1180 device. If a valid reply is received, BL Device is in NanoBoot mode, since reading the MAC address is only possible if the device is in bootloader mode. FLASH_WRITE_PAGE message consists of first page number, encoding flag, page setups and payload. Payload consists of 64 byte fragments of the complete binary file. The binary file has to th be read so that first byte of FLASH_WRITE_PAGE payload is the 1024 byte of the binary file and rd the second byte of FLASH_WRITE_PAGE is the 1023 byte of the binary file etc. Figure 5 demonstrates communication between HOST and BL Device during one flash page update. CC1180 Data Sheet SWRS113A Page 10 of 13 CC1180 Figure 5. Software update process for one page The single page flash update process is then repeated in order to send the complete binary file to BL Device in 64 byte blocks. If any errors occur during the process programming has to be restarted from beginning since binary is decrypted on BL Device. Possible error message is UNSUPPORTED_MESSAGE. If programming is interrupted by the BL Device and it is not responding to requests it must be reset and NanoBoot mode initiated. The NanoBoot cannot be overwritten as its bootloader flash memory area has write protection. Failure in the programming phase cannot cause errors to NanoBoot. The only way to remove the NanoBoot is to perform a complete chip erase via the debug interface. The debug interface is locked as well; the only allowed command is chip erase. Note: Erasing the chip will result in having a blank CC1110F32, with no possible way to recover the Sensinode NanoBoot. 4.6.1 FLASH_WRITE_PAGE message details When a fragment of the firmware is sent to BL Device, headers of FLASH_WRITE_PAGE message must contain page specific and slice specific information. Page Number, Encoding flag and Page Setup contains information to which address the binary data payload should go on device. Page Number is offset multiple(s) of 1024 bytes and Page Setup is an offset multiple(s) of 64 bytes. One flash page in CC1180 is 1024 bytes. Therefore minimum Page Number is 1 and maximum Page Number is 27, as application firmware (stack) must be placed in segment from 0x0400 to 0x6FFF. If the binary is transferred in 64 byte blocks, it makes 16 blocks of 64 byte each per page. Therefore minimum Page Setup is 0 and maximum is 15 for one flash page. Page number byte states to which page payload is going to be flashed. Byte Bit #7 Bit #6 Bit #5 Bit #4 Bit #3 Bit #2 Bit #1 Bit #0 Page Number MSB -- -- -- -- -- -- LSB Page Setup -- -- -- -- -- -- LSB MSB Table 5. FLASH_WRITE_PAGE message configuration bytes Encoding flag is always 0x01. CC1180 Data Sheet SWRS113A Page 11 of 13 CC1180 5 Debug Interface The CC1180 includes an on-chip debug interface, which communicates over a two-wire interface. The functionality of the debug interface in CC1180 is limited to erasing the on-chip flash memory. Note: Erasing the chip will result in having a blank CC1110F32, with no possible way to recover the Sensinode NanoBoot. Do not connect the Debug Interface unless the intention is to remove the NanoBoot bootloader. The debug interface uses pins DEBUG_DATA and DEBUG_CLOCK. The only way to remove the NanoBoot bootloader is to perform a complete chip erase via the debug interface. For more information, see SWRS033.pdf. CC1180 Data Sheet SWRS113A Page 12 of 13 CC1180 6 Development Kit Ordering Information Orderable Evaluation Module Description Minimum Order Quantity CC-6LOWPAN-DK-868 Sub-GHz 6LoPWAN Development Kit, 868/915 MHz 1 Table 6. Development Kit Ordering Information 7 References [1] CC1110 Datasheet (SWRS033.pdf) [2] CC-6LOWPAN-DK-868 User’s Guide (SWRU298.pdf) 8 8.1 General Information Document History Revision Date Description/Changes SWRS113 29.08.2011 Initial Release SWRS113A 09.09.2011 Editorial updates Table 7: Document History CC1180 Data Sheet SWRS113A Page 13 of 13 PACKAGE OPTION ADDENDUM www.ti.com 19-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC1180RSPR ACTIVE VQFN RSP 36 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1180 CC1180RSPT ACTIVE VQFN RSP 36 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1180 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Mar-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC1180RSPR VQFN RSP 36 2500 330.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 CC1180RSPT VQFN RSP 36 250 180.0 16.4 6.3 6.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Mar-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC1180RSPR VQFN RSP 36 2500 336.6 336.6 28.6 CC1180RSPT VQFN RSP 36 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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