Data sheet acquired from Harris Semiconductor
SCHS287B − Revised January 2004
The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the
CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal
buffer/line drivers use the RCA ADVANCED CMOS technology. The
CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output
enables (1OE, 2OE). The CD54/74AC/ACT241 has one active-LOW (1OE)
and one active-HIGH (2OE) output enable.
The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line
plastic packages (E suffix) and 20-lead small-outline packages (M and
M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic
packages (E suffix) and the CD74ACT241 is supplied in 20-lead
dual-in-line plastic packages (E suffix) and 20-lead small-outline
packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied
in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline
packages (M and M96 suffixes), and 20-lead shrink small-outline
packages (SM96 suffix). These package types are operable over the
following temperature ranges: Commerical (0 to 705C); Industrial (−40
to +855C); and Extended Industrial/Military (−55 to + 1255C).
The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241,
and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic
packages (F3A suffix) and are operable over the −55 to +1255C
temperature range.
This data sheet is applicable to the CD54/74AC240, CD54ACT240, and CD54/74ACT241. The CD54/74AC241 were not acquired from
Harris Semiconductor. See SCHS244 for information on the CD74ACT240, CD74AC244, and CD74ACT244.
Copyright 2004, Texas Instruments Incorporated
For TA = -40 to +85°C (Package Type E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
For TA = -40 to +70°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mW
For TA = +70 to +85°C (Package Type M) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Derate Linearly at 6 mW/°C to 310 mW
OPERATING-TEMPERATURE RANGE (TA): CD54 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125°C
CD74 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to +85°C
STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to +150°C
LEAD TEMPERATURE (DURING SOLDERING):
At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..+265°C
Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only. . . . . . . . . . . . . . . . . . . . . . . . . . .+300°C
* For up to 4 outputs per device: add ± 25 mA for each additional output.
LIMITS
CHARACTERISTIC
Supply-Voltage Range, VCC*:
(For TA = Full Package-Temperature Range)
AC Types
ACT Types
DC Input or Output Voltage, VI, Vo
Operating Temperature, TA
Input Rise and Fall Slew Rate, dt/dv
at 1.5 V to 3 V (AC Types)
at 3.6 v to 5.5 V (AC Types)
at 4.5 V to 5.5 V (ACT Types)
* Unless otherwise specified, all voltages are referenced to ground.
CD54
CD74
UNITS
MIN.
MAX.
1.5
4.5
5.5
5.5
V
V
0
V
-55
-40
VCC
+125
+85
0
0
0
50
20
10
°C
ns/V
ns/V
ns/V
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD54AC240F3A
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
CD54AC240F3A
CD54AC244F3A
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
CD54AC244F3A
CD54ACT240F3A
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
CD54ACT240F3A
CD54ACT241F3A
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
CD54ACT241F3A
CD54ACT244F3A
ACTIVE
CDIP
J
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
CD54ACT244F3A
CD74AC240E
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74AC240E
CD74AC240EE4
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74AC240E
CD74AC240M
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
AC240M
CD74AC240M96
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
AC240M
CD74AC244E
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74AC244E
CD74AC244M
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
AC244M
CD74AC244M96
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
AC244M
CD74ACT240E
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT240E
CD74ACT240M
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT240M
CD74ACT240M96
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT240M
CD74ACT240M96E4
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT240M
CD74ACT241E
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT241E
CD74ACT241M96
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT241M
CD74ACT244E
ACTIVE
PDIP
N
20
20
RoHS & Green
NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT244E
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
10-Mar-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD74ACT244M
ACTIVE
SOIC
DW
20
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT244M
CD74ACT244M96
ACTIVE
SOIC
DW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT244M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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