CD74HC4049M

[ /Title (CD74H C4049, CD74H C4050) /Subject (High Speed CMOS Logic Hex CD54HC4049, CD74HC4049, CD54HC4050, CD74HC4050 Data sheet acquired from Harris Semiconductor SCHS205I High-Speed CMOS Logic Hex Buffers, Inverting and Non-Inverting February 1998 - Revised February 2005 Features Description • Typical Propagation Delay: 6ns at VCC = 5V, CL = 15pF, TA = 25oC The ’HC4049 and ’HC4050 are fabricated with high-speed silicon gate technology. They have a modified input protection structure that enables these parts to be usedas logic level translators which convert high-level logic to a lowlevel logic while operating off the low-level logic supply. For example, 15-V input pulse levels can be down-converted to 0-V to 5-V logic levels. The modified input protection structure protects the input from negative electrostatic discharge. These parts also can be used as simple buffers or inverters without level translation. The ’HC4049 and ’HC4050 are enhanced versions of equivalent CMOS types. • High-to-Low Voltage Level Converter for up to Vl = 16V • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . .–55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs Ordering Information • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V PART NUMBER Pinout CD54HC4049, CD54HC4050 (CERDIP) CD74HC4049, CD74HC4050 (PDIP, SOIC, SOP, TSSOP) TOP VIEW 4050 4049 TEMP. RANGE (oC) PACKAGE CD54HC4049F3A –55 to 125 16 Ld CERDIP CD54HC4050F3A –55 to 125 16 Ld CERDIP CD74HC4049E –55 to 125 16 Ld PDIP CD74HC4049M –55 to 125 16 Ld SOIC CD74HCT4050MT –55 to 125 16 Ld SOIC CD74HC4049M96 –55 to 125 16 Ld SOIC CD74HC4049NSR –55 to 125 16 Ld SOP CD74HC4049PW –55 to 125 16 Ld TSSOP 4049 4050 VCC VCC 1 16 NC NC 1Y 1Y 2 15 6Y 6Y 1A 1A 3 14 6A 6A CD74HC4049PWR –55 to 125 16 Ld TSSOP CD74HC4049PWT –55 to 125 16 Ld TSSOP CD74HC4050E –55 to 125 16 Ld PDIP CD74HC4050M –55 to 125 16 Ld SOIC CD74HC4050MT –55 to 125 16 Ld SOIC CD74HC4050M96 –55 to 125 16 Ld SOIC CD74HC4050NSR –55 to 125 16 Ld SOP CD74HC4050PW –55 to 125 16 Ld TSSOP CD74HC4050PWR –55 to 125 16 Ld TSSOP CD74HC4050PWT –55 to 125 16 Ld TSSOP 2Y 2Y 4 13 NC NC 2A 2A 5 12 5Y 5Y 3Y 3Y 6 11 5A 5A 3A 3A 7 10 4Y 4Y GND GND 8 9 4A 4A NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2005,Texas Instruments Incorporated 1 CD54HC4049, CD74HC4049, CD54HC4050, CD74HC4050 Functional Diagram 4050 4049 16 1 VCC 2 15 6Y 3 6A 4 13 2Y NC 5 NC 12 2A 5Y 6 3Y 6Y 14 1A 2Y 4050 NC 1Y 1Y 4049 11 3Y 5A 7 5Y 10 3A 4Y 8 9 4A GND Logic Diagrams HC4049 A HC4050 A Y 2 Y CD54HC4049, CD74HC4049, CD54HC4050, CD74HC4050 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . –0.5V to 7V Input Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5V to 16V DC Input Diode Current, IIK For VI < –0.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20mA DC Output Diode Current, IOK For VO < –0.5V or VO > VCC + 0.5V. . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > –0.5V or VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Package Thermal Impedance, θJA (see Note 1): E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . –65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) VCC Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . .–55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to 15V DC Output Voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) VOLTAGE RELATIONSHIPS MAXIMUM LIMITS Vl +7V +16V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS 25oC –40oC TO 85oC –55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS High Level Input Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V Low Level Input Voltage VIL High Level Output Voltage CMOS Loads VOH PARAMETER HC TYPES - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II - 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V –0.02 2 1.9 - - 1.9 - 1.9 - V –0.02 4.5 4.4 - - 4.4 - 4.4 - V –0.02 6 5.9 - - 5.9 - 5.9 - V –4 4.5 3.98 - - 3.84 - 3.7 - V –5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA 15 - 6 - - ±0.5 - ±5 - ±5 3 CD54HC4049, CD74HC4049, CD54HC4050, CD74HC4050 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Quiescent Device Current 25oC –40oC TO 85oC –55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS ICC VCC or GND 0 6 - - 2 - 20 - 40 µA Switching Specifications Input tr, tf = 6ns PARAMETER HC TYPES Propagation Delay, nA to nY HC4049 nA to nY HC4050 Transition Times (Figure 1) Input Capacitance Power Dissipation Capacitance (Notes 2, 3) –40oC TO 85oC 25oC –55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 85 - 105 - 130 ns tTLH, tTHL 4.5 - - 17 - 21 - 26 ns 6 - - 14 - 18 - 22 ns CL = 15pF 5 - 6 - - - - - ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns CI - - - - 10 - 10 - 10 pF CPD - 5 - 35 - - - - - pF NOTES: 2. CPD is used to determine the dynamic power consumption, per gate. 3. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuit and Waveform tr = 6ns tf = 6ns VCC 90% 50% 10% INPUT GND tTHL tTLH 90% 50% 10% INVERTING OUTPUT tPLH tPHL FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 4 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) 5962-8681901EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8681901EA CD54HC4049F3A Samples 5962-8682001EA ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8682001EA CD54HC4050F3A Samples CD54HC4049F3A ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8681901EA CD54HC4049F3A Samples CD54HC4050F3A ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-8682001EA CD54HC4050F3A Samples CD74HC4049E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC4049E Samples CD74HC4049EE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC4049E Samples CD74HC4049M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4049M Samples CD74HC4049M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4049M Samples CD74HC4049M96G4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4049M Samples CD74HC4049MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4049M Samples CD74HC4049NS ACTIVE SO NS 16 50 RoHS & Green NIPDAU Level-1-260C-UNLIM HC4049M Samples CD74HC4049NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4049M Samples CD74HC4049PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4049 Samples CD74HC4049PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4049 Samples CD74HC4050E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC4050E Samples CD74HC4050M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4050M Samples CD74HC4050M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4050M Samples CD74HC4050ME4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4050M Samples CD74HC4050MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4050M Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Oct-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CD74HC4050NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4050M Samples CD74HC4050PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4050 Samples CD74HC4050PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4050 Samples CD74HC4050PWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4050 Samples CD74HC4050PWT ACTIVE TSSOP PW 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4050 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of