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CD74HCT4094E

CD74HCT4094E

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    PDIP16

  • 描述:

    IC BUS REG TRI-ST 8STG 16-DIP

  • 数据手册
  • 价格&库存
CD74HCT4094E 数据手册
CD54HC4094, CD74HC4094, CD74HCT4094 SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 CDx4HC4094, CD74HCT4094 High-Speed CMOS Logic 8-Stage Shift and Store Bus Register, Three-State 1 Features 2 Description • • The CDx4HC4094 and CD74HCT4094 are 8-stage serial shift registers having a storage latch associated with each stage for strobing data from the serial input to parallel buffered tri-state outputs. The parallel outputs may be connected directly to common bus lines. Data is shifted on positive clock transitions. The data in each shift register stage is transferred to the storage register when the Strobe input is high. Data in the storage register appears at the outputs whenever the Output-Enable signal is high. • • • • • • Buffered inputs Separate serial outputs synchronous to both positive and negative clock edges for cascading Fanout (over temperature range) – Standard outputs: 10 LSTTL loads – Bus driver outputs: 15 LSTTL loads Wide operating temp range: −55°C to 125°C Balanced propagation delay and transition times Significant power reduction compared to LSTTL logic ICs HC types – 2- to 6-V operation – High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V HCT types – 4.5- to 5.5-V operation – Direct LSTTL input logic compatibility, VIL= 0.8 V (Max), VIH = 2 V (Min) – CMOS input compatibility, Il ≤ 1μA at VOL, VOH Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) CD54HC4094F3A CDIP (16) 24.38 mm × 6.92 mm CD74HC4094M SOIC (16) 9.90 mm × 3.90 mm CD74HC4094E PDIP (16) 19.31 mm × 6.35 mm CD74HC4094NSR SO (16) 6.20 mm × 5.30 mm CD74HC4094PW TSSOP (16) 5.00 mm × 4.40 mm CD74HCT4094M SOIC (16) 9.90 mm × 3.90 mm CD74HCT4094E PDIP (16) 19.31 mm × 6.35 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. OE STR CP DATA D Q D S D Q Q Q0 Q Q1 D S Q2 Q3 Q4 Q5 Q6 D Q D S Q Q7 QS1 D Q QS2 Functional Block Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 Table of Contents 1 Features............................................................................1 2 Description.......................................................................1 3 Revision History.............................................................. 2 4 Pin Configuration and Functions...................................3 5 Specifications.................................................................. 4 5.1 Absolute Maximum Ratings........................................ 4 5.2 Recommended Operating Conditions.........................4 5.3 Thermal Information....................................................4 5.4 Electrical Characteristics.............................................5 5.5 Prerequisite for Switching Characteristics.................. 6 5.6 Switching Characteristics............................................7 6 Parameter Measurement Information............................ 9 7 Detailed Description......................................................10 7.1 Overview................................................................... 10 7.2 Functional Block Diagram......................................... 10 7.3 Device Functional Modes..........................................11 8 Power Supply Recommendations................................12 9 Layout.............................................................................12 9.1 Layout Guidelines..................................................... 12 10 Device and Documentation Support..........................13 10.1 Documentation Support.......................................... 13 10.2 Receiving Notification of Documentation Updates..13 10.3 Support Resources................................................. 13 10.4 Trademarks............................................................. 13 10.5 Electrostatic Discharge Caution..............................13 10.6 Glossary..................................................................13 11 Mechanical, Packaging, and Orderable Information.................................................................... 13 3 Revision History Changes from Revision E (December 2010) to Revision F (March 2022) Page • Updated the numbering, formatting, tables, figures, and cross-references throughout the doucment to reflect modern data sheet standards............................................................................................................................. 1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 4 Pin Configuration and Functions STROBE 1 16 VCC DATA 2 OE CP Q0 3 15 14 4 13 Q1 5 12 Q5 Q6 Q2 Q3 6 11 Q7 7 8 10 QS2 QS1 GND 9 Q4 J, N, D, NS, or PW package 16-Pin CDIP, PDIP, SOIC, SO, or TSSOP Top View Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 Submit Document Feedback 3 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX –0.5 7 UNIT VCC Supply voltage IIK Input diode current For VI < –0.5 V or VI > VCC + 0.5 V ±20 mA IOK Output diode current For VO < –0.5 V or VO > VCC + 0.5 V ±20 mA IO Output source or sink current per output pin For VO > –0.5 V or VO < VCC + 0.5 V ±25 mA ±50 mA 150 °C 150 °C 300 °C Continuous current through VCC or GND TJ Junction temperature Tstg Storage temperature – 65 Maximum lead temperature (Soldering 10s) (SOIC - lead tips only) (1) V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 5.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VCC Supply voltage range VI, VO Input or output voltage HC types HCT types NOM MAX 2 6 4.5 5.5 0 VCC 2V tt TA Input rise and fall time UNIT V V 1000 4.5 V 500 6V 400 Temperature range –55 125 ns °C 5.3 Thermal Information THERMAL METRIC RθJA (1) (2) 4 Junction-to-ambient thermal resistance(1) N (PDIP) D (SOIC)(2) NS (SOP) PW (TSSOP) PINS PINS PINS PINS 67 73 64 108 UNIT °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. Lead tips only Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 5.4 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS(2) PARAMETER VCC (V) 25°C MIN TYP –40°C to 85°C MAX MIN MAX –55°C to 125°C MIN MAX UNIT HC TYPES VIH High-level input voltage VIL Low-level input voltage High-level output voltage CMOS loads VOH High-level output voltage TTL loads Low-level output voltage CMOS loads VOL 2 1.5 1.5 1.5 V 4.5 3.15 3.15 3.15 V 6 4.2 4.2 4.2 V 2 0.5 0.5 0.5 V 4.5 1.35 1.35 1.35 V 6 1.8 1.8 1.8 V IOH = – 20μA 2 1.9 1.9 1.9 V IOH = – 20μA 4.5 4.4 4.4 4.4 V IOH = – 20μA 6 5.9 5.9 5.9 V IOH = – 6mA 4.5 3.98 3.84 3.7 V 6 5.48 5.34 5.2 V IOH = – 7.8mA IOL = 20μA 2 0.1 0.1 0.1 V IOL = 20μA 4.5 0.1 0.1 0.1 V IOL = 20μA 6 0.1 0.1 0.1 V Low-level output voltage TTL loads IOL = 6mA 4.5 0.26 0.33 0.4 V IOL = 7.8mA 6 0.26 0.33 0.4 V II Input leakage current VCC or GND 6 ±0.1 ±1 ±1 µA ICC Supply current VCC or GND 6 8 80 160 µA HCT TYPES VIH High-level input voltage 4.5 to 5.5 VIL Low-level input voltage 4.5 to 5.5 2 2 0.8 2 0.8 V 0.8 V High-level output voltage CMOS loads IOH = – 20μA 4.5 4.4 4.4 4.4 V High-level output voltage TTL loads IOH = – 6mA 4.5 3.98 3.84 3.7 V Low-level output voltage CMOS loads IOL = 20μA 4.5 0.1 0.1 0.1 V Low-level output voltage TTL loads IOL = 6mA 4.5 0.26 0.33 0.4 V II Input leakage current VCC and GND 5.5 ±0.1 ±1 ±1 µA ICC Supply Current VCC and GND 5.5 8 80 160 µA VOH VOL ΔICC (1) (3) (1) (2) (3) Additional quiescent device current per input pin: 1 unit load D 4.5 to 5.5 40 144 180 196 µA CP, OE 4.5 to 5.5 150 540 675 735 µA STR 4.5 to 5.5 100 360 450 490 µA For dual−supply systems theoretical worst case (VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA. VI = VIH or VIL, unless otherwise noted. Inputs held at VCC – 2.1. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 Submit Document Feedback 5 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 5.5 Prerequisite for Switching Characteristics over operating free-air temperature range (unless otherwise noted) 25°C –40 to 85°C –55 to 125°C PARAMETER VCC (V) 2 80 100 120 CP pulse duration 4.5 16 20 24 6 14 17 20 2 80 100 120 4.5 16 20 24 6 14 17 20 MIN MAX MIN MAX MIN MAX UNIT HC TYPES tW tWH STR pulse duration tSU Data set-up time tH Data hold time tSU STR set-up time tH STR hold time ƒCL (MAX) Maximum CP frequency 2 50 65 75 4.5 10 13 15 6 9 11 13 2 3 3 3 4.5 3 3 3 6 3 3 3 2 100 125 150 4.5 20 25 30 6 17 21 26 2 0 0 0 4.5 0 0 0 6 0 0 0 2 6 5 4 4.5 30 24 20 6 35 28 24 ns ns ns ns ns ns MHz HCT TYPES 6 tW CP pulse duration 4.5 16 20 24 ns tWH STR pulse duration 4.5 16 20 24 ns tSU Data set-up time 4.5 10 13 15 ns tH Data hold time 4.5 4 4 4 ns tSU STR set-up time 4.5 20 25 30 ns tH STR hold time 4.5 0 0 0 ns ƒCL (MAX) Maximum CP frequency 4.5 30 24 20 MHz Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 5.6 Switching Characteristics Input tr, tf = 6 ns. Unless otherwise specified, CL = 50pF Parameter Measurement Information PARAMETER VCC (V) 25°C MIN TYP –40 to 85°C MAX MIN –55 to 125°C MAX MIN MAX UNIT HC TYPES 2 tpd tpd Propagation delay time CP to QS1 4.5 STR to Qn tPZH, tPZL Output enable to Qn tPHZ, tPLZ Output disable to Qn 33 38 170 205 27 34 41 23 29 35 195 245 295 39 49 59 6 33 42 50 2 180 225 270 4.5 36 45 54 11(3) 16(3) 6 31 38 46 2 175 220 265 4.5 35 44 53 6 30 37 45 2 125 155 190 4.5 25 31 38 6 21 26 32 2 75 95 110 4.5 15 19 22 6 13 16 19 tTLH, tTHL Output transition time tPHZ, tPLZ Output disabling time 5 10(3) ƒMAX Maximum CP frequency 5 60(3) CIN Input capacitance Power dissipation 45 26 2 tt 225 38 135 4.5 CP to Qn 190 30 2 6 tpd 150 6 4.5 CP to QS2 12(3) CPD (2) CO Tri-state output capacitance 5 ns ns ns ns ns ns ns MHz 10 capacitance(1), ns 10 10 90(3) pF pF 15 15 15 pF HCT TYPES Propagation delay time CP to QS1 4.5 16(3) 39 ns CP to QS2 4.5 15(3) 36 ns CP to Qn 4.5 18(3) 43 ns STR to Qn 4.5 39 ns tPZH, tPZL Output enable to Qn 4.5 35 ns tPHZ, tPLZ Output disable to Qn 4.5 35 ns tTLH, tTHL Output transition time 4.5 15 ns tPHZ, tPLZ Output disabling time 5 14(3) ns ƒMAX Maximum CP frequency 5 60(3) MHz CIN Input capacitance tPLH, tPHL 10 Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 10 10 pF Submit Document Feedback 7 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 Input tr, tf = 6 ns. Unless otherwise specified, CL = 50pF Parameter Measurement Information PARAMETER Power dissipation capacitance(1), CPD (2) CO Tri-state output capacitance (1) (2) (3) 8 VCC (V) 5 25°C MIN TYP –40 to 85°C MAX MIN –55 to 125°C MAX MIN MAX 110(3) UNIT pF 15 15 15 pF CPD is used to determine the dynamic power consumption, per register. PD = VCC 2 ƒi (CPD + CL) where ƒi = Input frequency, CL = Output load capacitance, VCC = Supply voltage. Typical value tested at 5V, CL = 15pF Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 6 Parameter Measurement Information tPD is the maximum between tPLH and tPHL tt is the maximum between tTLH and tTHL Figure 6-1. HC and HCT transition times and propagation delay times, combination logic Figure 6-3. HC three-state propagation delay waveform Figure 6-2. HCT transition times and tpopationg delay times, combination logic Figure 6-4. HCT three-state propagation delay waveform NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to VCC, CL = 50pF. Figure 6-5. HC and HCT three-state propagation delay test circuit Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 Submit Document Feedback 9 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 7 Detailed Description 7.1 Overview The CDx4HC4094 and CD74HCT4094 are 8-stage serial shift registers having a storage latch associated with each stage for strobing data from the serial input to parallel buffered tri-state outputs. The parallel outputs may be connected directly to common bus lines. Data is shifted on positive clock transitions. The data in each shift register stage is transferred to the storage register when the Strobe input is high. Data in the storage register appears at the outputs whenever the Output-Enable signal is high. Two serial outputs are available for cascading a number of these devices. Data is available at the QS1 serial output terminal on positive clock edges to allow for high-speed operation in cascaded system in which the clock rise time is fast. The same serial information, available at the QS2 terminal on the next negative clock edge, provides a means for cascading these devices when the clock rise time is slow. 7.2 Functional Block Diagram OE STR CP DATA D Q D S D Q Q Q0 Q Q1 D S Q2 Q3 Q4 Q5 Q6 D Q D S Q Q7 QS1 D 10 Submit Document Feedback Q QS2 Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 7.3 Device Functional Modes Table 7-1. Truth Table Inputs(2) (1) (2) Parallel Outputs Serial Outputs CP OE STR D Q0 Qn QS1 (1) QS2 ↑ L X X Z Z Q6 NC ↓ L X X Z Z NC Q7 ↑ H L X NC NC Q6 NC ↑ H H L L Qn – 1 Q6 NC ↑ H H H H Qn – 1 Q6 NC ↓ H H H NC NC NC Q7 At the positive clock edge the information in the seventh register stage is transferred to the eighth register stage and QS1 output. H = High voltage level, L = Low voltage level, X = Don't care, NC = No charge, Z = High-impedance off−state, ↑ = Transition from low-to-high level, ↓ = Transition from high to low. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 Submit Document Feedback 11 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 8 Power Supply Recommendations The power supply can be any voltage between the minimum and maximum supply voltage rating located in the Recommended Operating Conditions. Each VCC terminal should have a good bypass capacitor to prevent power disturbance. A 0.1-μF capacitor is recommended for this device. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible for best results. 9 Layout 9.1 Layout Guidelines When using multiple-input and multiple-channel logic devices inputs must not ever be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient. 12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 CD54HC4094, CD74HC4094, CD74HCT4094 www.ti.com SCHS211F – NOVEMBER 1997 – REVISED MARCH 2022 10 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 10.1 Documentation Support 10.1.1 Related Documentation 10.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2022 Texas Instruments Incorporated Product Folder Links: CD54HC4094 CD74HC4094 CD74HCT4094 Submit Document Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) CD54HC4094F3A ACTIVE CDIP J 16 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 CD54HC4094F3A CD74HC4094E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HC4094E CD74HC4094M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094M96G3 ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094M96G4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094MT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094NSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094NSRE4 ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HC4094M CD74HC4094PW ACTIVE TSSOP PW 16 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4094 CD74HC4094PWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 HJ4094 CD74HC4094PWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4094 CD74HC4094PWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HJ4094 CD74HCT4094E ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4094E CD74HCT4094EE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4094E CD74HCT4094M ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT4094M CD74HCT4094M96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -55 to 125 HCT4094M CD74HCT4094ME4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 HCT4094M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2021 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
CD74HCT4094E 价格&库存

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