SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
D Use CDCVF2509A as a Replacement for
D
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PW PACKAGE
(TOP VIEW)
this Device
Designed to Meet PC133 SDRAM
Registered DIMM Specification Rev. 0.9
Spread Spectrum Clock Compatible
Operating Frequency 25 MHz to 140 MHz
Static Phase Error Distribution at 66 MHz to
133 MHz is ±125 ps
Jitter (cyc−cyc) at 66 MHz to 133 MHz Is
|70| ps
Available in Plastic 24-Pin TSSOP
Phase-Lock Loop Clock Distribution for
Synchronous DRAM Applications
Distributes One Clock Input to One Bank of
Five and One Bank of Four Outputs
Separate Output Enable for Each Output
Bank
External Feedback (FBIN) Terminal Is Used
to Synchronize the Outputs to the Clock
Input
On-Chip Series Damping Resistors
No External RC Network Required
Operates at 3.3 V
AGND
VCC
1Y0
1Y1
1Y2
GND
GND
1Y3
1Y4
VCC
1G
FBOUT
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
CLK
AVCC
VCC
2Y0
2Y1
GND
GND
2Y2
2Y3
VCC
2G
FBIN
description
The CDCF2509 is a high-performance, low-skew, low-jitter, phase-lock loop (PLL) clock driver. It uses a PLL
to precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal.
It is specifically designed for use with synchronous DRAMs. The CDCF2509 operates at 3.3 V VCC. It also
provides integrated series-damping resistors that make it ideal for driving point-to-point loads.
One bank of five outputs and one bank of four outputs provide nine low-skew, low-jitter copies of CLK. Output
signal duty cycles are adjusted to 50%, independent of the duty cycle at CLK. Each bank of outputs is enabled
or disabled separately via the control (1G and 2G) inputs. When the G inputs are high, the outputs switch in
phase and frequency with CLK; when the G inputs are low, the outputs are disabled to the logic-low state.
Unlike many products containing PLLs, the CDCF2509 does not require external RC networks. The loop filter
for the PLL is included on-chip, minimizing component count, board space, and cost.
Because it is based on PLL circuitry, the CDCF2509 requires a stabilization time to achieve phase lock of the
feedback signal to the reference signal. This stabilization time is required following power up and application
of a fixed-frequency, fixed-phase signal at CLK, and following any changes to the PLL reference or feedback
signals. The PLL can be bypassed for test purposes by strapping AVCC to ground.
The CDCF2509 is characterized for operation from 0°C to 85°C.
For application information refer to application reports High Speed Distribution Design Techniques for
CDC509/516/2509/2510/2516 (literature number SLMA003) and Using CDC2509A/2510A PLL with Spread
Spectrum Clocking (SSC) (literature number SCAA039).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001 − 2004, Texas Instruments Incorporated
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1
SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
FUNCTION TABLE
OUTPUTS
INPUTS
1G
2G
CLK
1Y
(0:4)
2Y
(0:3)
FBOUT
X
X
L
L
L
L
L
L
H
L
L
H
L
H
H
L
H
H
H
L
H
H
L
H
H
H
H
H
H
H
functional block diagram
1G
11
3
4
5
8
9
2G
20
24
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÁÁÁÁÁÁ
ÎÎÎÎÎÎÎ
ÁÁÁÁÁÁ
ÎÎÎÎÎÎÎ
PLL
FBIN
AVCC
13
23
AVAILABLE OPTIONS
PACKAGE
2
1Y1
1Y2
1Y3
1Y4
14
21
CLK
1Y0
TA
SMALL OUTLINE
(PW)
0°C to 85°C
CDCF2509PWR
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17
16
12
2Y0
2Y1
2Y2
2Y3
FBOUT
SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
Terminal Functions
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
CLK
24
I
Clock input. CLK provides the clock signal to be distributed by the CDCF2509 clock driver. CLK is used
to provide the reference signal to the integrated PLL that generates the clock output signals. CLK must
have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit is powered
up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase lock the
feedback signal to its reference signal.
FBIN
13
I
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hard-wired to
FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is nominally
zero phase error between CLK and FBIN.
1G
11
I
Output bank enable. 1G is the output enable for outputs 1Y(0:4). When 1G is low, outputs 1Y(0:4) are
disabled to a logic-low state. When 1G is high, all outputs 1Y(0:4) are enabled and switched at the same
frequency as CLK.
2G
14
I
Output bank enable. 2G is the output enable for outputs 2Y(0:3). When 2G is low, outputs 2Y(0:3) are
disabled to a logic low state. When 2G is high, all outputs 2Y(0:3) are enabled and switch at the same
frequency as CLK.
FBOUT
12
O
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as CLK.
When externally wired to FBIN, FBOUT completes the feedback loop of the PLL. FBOUT has an
integrated 25-Ω series-damping resistor.
1Y (0:4)
3, 4, 5, 8, 9
O
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:4) is enabled via the
1G input. These outputs can be disabled to a logic-low state by deasserting the 1G control input. Each
output has an integrated 25-Ω series-damping resistor.
2Y (0:3)
21, 20, 17, 16
O
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 2Y(0:3) is enabled via the
2G input. These outputs can be disabled to a logic-low state by deasserting the 2G control input. Each
output has an integrated 25-Ω series-damping resistor.
AVCC
23
Power
Analog power supply. AVCC provides the power reference for the analog circuitry. In addition, AVCC can
be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL is bypassed and
CLK is buffered directly to the device outputs.
AGND
1
Ground
Analog ground. AGND provides the ground reference for the analog circuitry.
VCC
GND
2, 10, 15, 22
Power
Power supply
6, 7, 18, 19
Ground
Ground
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3
SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, AVCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AVCC < VCC +0.7 V
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high or low state,
VO (see Notes 2 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. AVCC must not exceed VCC.
2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. This value is limited to 4.6 V maximum.
4. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data
Book, literature number SCBD002.
recommended operating conditions (see Note 5)
MIN
MAX
Supply voltage, VCC, AVCC
3
3.6
High-level input voltage, VIH
2
Low-level input voltage, VIL
0
High-level output current, IOH
Low-level output current, IOL
Operating free-air temperature, TA
0
V
V
0.8
Input voltage, VI
UNIT
V
VCC
−12
mA
V
12
mA
85
°C
NOTE 5: Unused inputs must be held high or low to prevent them from floating.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature
fclk
Clock frequency
Input clock duty cycle
Stabilization time‡
MIN
MAX
UNIT
25
140
MHz
40%
60%
1
ms
‡ Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained, a
fixed-frequency, fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay, skew,
and jitter parameters given in the switching characteristics table are not applicable. This parameter does not apply for input modulation under
SSC application.
4
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SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input clamp voltage
II = −18 mA
IOH = −100 µA
VOH
High-level output voltage
IOH = −12 mA
IOH = − 6 mA
VOL
Low-level output voltage
IOL = 100 µA
IOL = 12 mA
VCC, AVCC
3V
MIN
MIN to MAX
3V
VCC−0.2
2.1
3V
2.4
High-level output current
IOL
Low-level output current
VO = 1.95 V
VO = 1.65 V
II
Input current
VO = 0.4 V
VI = VCC or GND
0.55
−36
3.465 V
−12
3.135 V
34
3.465 V
14
3.6 V
±5
µA
3.6 V
10
µA
3.3 V to 3.6 V
500
µA
3.3 V
ICC‡
Supply current
∆ICC
Change in supply current
One input at VCC − 0.6 V,
Other inputs at VCC or GND
V
−32
3.3 V
VI = VCC or GND,
Outputs: low or high
V
0.8
3V
VO = 1.65 V
VO = 3.135 V
UNIT
−1.2
0.2
3V
3.135 V
MAX
V
MIN to MAX
IOL = 6 mA
VO = 1 V
IOH
TYP†
IO = 0,
40
Ci
Input capacitance
VI = VCC or GND
3.3 V
Co
Output capacitance
VO = VCC or GND
3.3 V
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ For ICC of AVCC, and ICC vs Frequency (see Figures 8 and 9).
4
pF
6
pF
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 25 pF (see Note 6 and Figures 1 and 2)§
PARAMETER
tsk(o)
FROM
(INPUT)
Phase error time − static (normalized)
(See Figures 3−6)
CLKIN↑ = 66 MHz to133 MHz
Output skew time¶
Any Y or FBOUT
TO
(OUTPUT)
FBIN↑
VCC, AVCC = 3.3 V
± 0.3 V
MIN
TYP
−125
Any Y or FBOUT
Phase error time − jitter (see Note 7)
Any Y or FBOUT
Clkin = 66 MHz to 100 MHz
−50
UNIT
MAX
125
ps
200
ps
50
Any Y or FBOUT
|70|
Clkin = 100 MHz to 133 MHz
Any Y or FBOUT
|65|
Duty cycle
F(clkin > 60 MHz)
Any Y or FBOUT
45%
55%
tr
Rise time (See Notes 8 and 9)
VO = 1.2 V to 1.8 V,
IBIS simulation
Any Y or FBOUT
2.5
1
V/ns
tf
Fall time (See Notes 8 and 9)
VO = 1.2 V to 1.8 V,
IBIS simulation
Any Y or FBOUT
2.5
1
V/ns
Jitter(cycle-cycle) (See Figure 7)
ps
§ These parameters are not production tested.
¶ The tsk(o) specification is only valid for equal loading of all outputs.
NOTES: 6. The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed.
7. Calculated per PC DRAM SPEC (tphase error, static − jitter(cycle-to-cycle)).
8. This is equivalent to 0.8 ns/2.5 ns and 0.8 ns/2.7 ns into standard 500 Ω/ 30 pf load for output swing of 0.4 V to 2 V.
9. 64 MB DIMM configuration according to PC SDRAM Registered DIMM Design Support Document, Figure 20 and Table 13.
Intel is a trademark of Intel Corporation.
PC SDRAM Register DIMM Design Support Document is published by Intel Corporation.
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SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION
3V
Input
50% VCC
0V
tpd
From Output
Under Test
500 W
Output
25 pF
2V
0.4 V
tr
LOAD CIRCUIT FOR OUTPUTS
50% VCC
VOH
2V
0.4 V
VOL
tf
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 133 MHz, ZO = 50 Ω, tr ≤ 1.2 ns, tf ≤ 1.2 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
CLKIN
FBIN
tphase error
FBOUT
Any Y
tsk(o)
Any Y
Any Y
tsk(o)
Figure 2. Phase Error and Skew Calculations
6
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SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS
PHASE ADJUSTMENT SLOPE AND PHASE ERROR
vs
LOAD CAPACITANCE
200
VCC = 3.3 V
fc = 133 MHz
C(LY) = 25 pF
C(LF) = 12 pF
TA = 25°C
See Notes A and B
10
0
100
0
Phase Error
−10
−100
−20
−200
−30
−300
Phase Error − ps
Phase Adjustment Slope − ps/pF
20
Phase Adjustment Slope
−40
−400
0
5
10
15
20
25
30
35
40
45
50
C(LF) − Load Capacitance − pF
Figure 3
NOTES: A. Trace feedback length FBOUT to FBIN = 5 mm, ZO = 50 Ω, phase error measured from CLK to Yn
B. C(LF) = Lumped feedback capacitance at FBIN
PHASE ERROR
vs
CLOCK FREQUENCY
PHASE ERROR
vs
SUPPLY VOLTAGE
0
0
VCC = 3.3 V
C(LY) = 25 pF
C(LF) = 12 pF
TA = 25°C
See Note A
−50
−150
−100
−150
Phase Error − ps
Phase Error − ps
−100
−200
−250
−300
−200
−250
−300
−350
−350
−400
−400
−450
−450
−500
fc = 133 MHz
C(LY) = 25 pF
C(LF) = 12 pF
TA = 25°C
See Note A
−50
50
60
70
80
90
100 110
120 130
140
−500
3
3.1
fc − Clock Frequency − MHz
3.2
3.3
3.4
3.5
3.6
VCC − Supply Voltage − V
Figure 4
Figure 5
NOTE A: Trace feedback length FBOUT to FBIN = 5 mm, ZO = 50 Ω
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7
SCAS624C − APRIL 1999 − REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS
JITTER
vs
CLOCK FREQUENCY
STATIC PHASE ERROR
vs
CLOCK FREQUENCY
300
0
VCC = 3.3 V
C(LY) = 25 pF
C(LF) = 12 pF
TA = 25°C
See Note A
−50
−150
250
200
Jitter − ps
Phase Error − ps
−100
VCC = 3.3 V
C(LY) = 25 pF
C(LF) = 12 pF
TA = 25°C
See Notes A and B
−200
−250
150
−300
Peak to Peak
100
−350
−400
50
Cycle to Cycle
−450
−500
50
60
70
80
90
100 110
120 130
0
50
140
60
70
80
Figure 6
AI CC − Analog Supply Current − mA
12
10
SUPPLY CURRENT
vs
CLOCK FREQUENCY
300
AVCC = VCC = 3.465 V
Bias = 0/3 V
C(LY) = 25 pF
C(LF) = 0
TA = 25°C
See Notes A and B
250
8
6
4
200
AVCC = VCC = 3.465 V
Bias = 0/3 V
C(LY) = 25 Ff
C(LF) = 0
TA = 25°C
See Notes A and B
150
100
50
2
0
10
30
50
70
90
110
130
150
0
10
30
fc − Clock Frequency − MHz
50
70
Figure 9
NOTES: A. C(LY) = Lumped capacitive load at Y
B. C(LF) = Lumped feedback capacitance at FBIN
POST OFFICE BOX 655303
90
110
fc − Clock Frequency − MHz
Figure 8
8
120 130 140
Figure 7
ANALOG SUPPLY CURRENT
vs
CLOCK FREQUENCY
16
14
100 110
Trace feedback length FBOUT to FBIN = 5 mm, ZO = 50 Ω
Phase error measured from CLK to FBIN
C(LY) = Lumped capacitive load at Y
C(LF) = Lumped feedback capacitance at FBIN
I CC − Supply Current − mA
NOTES: A.
B.
C.
D.
90
fc − Clock Frequency − MHz
fc − Clock Frequency − MHz
• DALLAS, TEXAS 75265
130
150
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CDCF2509PWR
NRND
TSSOP
PW
24
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
CDCF2509
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of