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CSD18504KCS
SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
CSD18504KCS 40 V N-Channel NexFET™ Power MOSFET
1 Features
•
•
•
•
•
•
•
•
1
Product Summary
Ultra Low Qg and Qgd
Low Thermal Resistance
Avalanche Rated
Logic Level
Pb Free Terminal Plating
RoHS Compliant
Halogen Free
TO-220 Plastic Package
TA = 25°C
UNIT
Drain-to-Source Voltage
40
V
Qg
Gate Charge Total (10 V)
19
nC
Qgd
Gate Charge Gate-to-Drain
RDS(on)
Drain-to-Source On-Resistance
VGS(th)
Threshold Voltage
3.5
nC
VGS = 4.5 V
8.0
mΩ
VGS = 10 V
5.5
mΩ
1.9
V
Ordering Information(1)
2 Applications
•
•
•
TYPICAL VALUE
VDS
DC-DC Conversion
Secondary Side Synchronous Rectifier
Motor Control
Device
Package
Media
Qty
Ship
CSD18504KCS
TO-220 Plastic Package
Tube
50
Tube
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Absolute Maximum Ratings
3 Description
TA = 25°C
VALUE
UNIT
This 40 V, 5.5 mΩ, TO-220 NexFET™ power
MOSFET is designed to minimize losses in power
conversion applications.
VDS
Drain to Source Voltage
40
V
VGS
Gate to Source Voltage
±20
V
Continuous Drain Current (Package limited),
TC = 25°C
100
Continuous Drain Current (Silicon limited),
TC = 25°C
89
Continuous Drain Current (Silicon limited),
TC = 100°C
63
IDM
Pulsed Drain Current (1)
238
A
PD
Power Dissipation
115
W
TJ,
Tstg
Operating Junction and
Storage Temperature Range
–55 to 175
°C
EAS
Avalanche Energy, single pulse
ID = 42 A, L = 0.1 mH, RG = 25 Ω
88
mJ
ID
A
(1) Max RθJC = 1.3ºC/W, pulse duration ≤100 μs, duty cycle ≤1%
RDS(on) vs VGS
Gate Charge
10
TC = 25° C, I D = 40 A
TC = 125° C, I D = 40 A
18
VGS - Gate-to-Source Voltage (V)
RDS(on) - On-State Resistance (m:)
20
16
14
12
10
8
6
4
2
0
ID = 40 A
VDS = 20 V
8
6
4
2
0
2
4
6
8
10
12
14
16
VGS - Gate-to-Source Voltage (V)
18
20
D007
0
2
4
6
8
10
12
14
Qg - Gate Charge (nC)
16
18
20
D004
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CSD18504KCS
SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Specifications.........................................................
1
1
1
2
3
5.1 Electrical Characteristics........................................... 3
5.2 Thermal Information .................................................. 3
5.3 Typical MOSFET Characteristics .............................. 4
6
Device and Documentation Support.................... 7
6.1 Trademarks ............................................................... 7
6.2 Electrostatic Discharge Caution ................................ 7
6.3 Glossary .................................................................... 7
7
Mechanical, Packaging, and Orderable
Information ............................................................. 8
7.1 KCS Package Dimensions........................................ 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (October 2012) to Revision A
Page
•
Added part number to title ..................................................................................................................................................... 1
•
Increased the TC = 25º continuous drain current to 89 A ....................................................................................................... 1
•
Increased the TC = 125º continuous drain current to 63 A .................................................................................................... 1
•
Increased the pulsed drain current to 238 A ......................................................................................................................... 1
•
Increased the max power dissipation to 115 W ..................................................................................................................... 1
•
Increased the max operating junction and storage temperature to 175º ............................................................................... 1
•
Updated the pulsed current conditions .................................................................................................................................. 1
•
Updated Figure 1 from a normalized RθJA to an RθJC curve ................................................................................................... 4
•
Updated Figure 6 to extend to 175°C .................................................................................................................................... 5
•
Updated Figure 8 to extend to 175°C .................................................................................................................................... 5
•
Updated the SOA in Figure 10 .............................................................................................................................................. 6
•
Updated Figure 12 to extend to 175°C .................................................................................................................................. 6
2
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SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
5 Specifications
5.1 Electrical Characteristics
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC CHARACTERISTICS
BVDSS
Drain-to-Source Voltage
VGS = 0 V, ID = 250 μA
IDSS
Drain-to-Source Leakage Current
VGS = 0 V, VDS = 32 V
1
μA
IGSS
Gate-to-Source Leakage Current
VDS = 0 V, VGS = 20 V
100
nA
VGS(th)
Gate-to-Source Threshold Voltage
VDS = VGS, ID = 250 μA
RDS(on)
Drain-to-Source On-Resistance
gƒs
Transconductance
40
1.5
V
1.9
2.3
V
VGS = 4.5 V, ID = 40 A
8
10
mΩ
VGS = 10 V, ID = 40 A
5.5
7
mΩ
VDS = 20 V, ID = 40 A
72
S
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Series Gate Resistance
Qg
Gate Charge Total (4.5 V)
Qg
Gate Charge Total (10 V)
Qgd
Gate Charge Gate-to-Drain
Qgs
Gate Charge Gate-to-Source
Qg(th)
Gate Charge at Vth
Qoss
Output Charge
td(on)
VGS = 0 V, VDS = 20 V, ƒ = 1 MHz
VDS = 20 V, ID = 40 A
1380
1800
pF
320
416
pF
8
10.4
pF
1.5
3
Ω
9.2
12
nC
19
25
nC
3.5
nC
4.4
nC
3
nC
19
nC
Turn On Delay Time
4.4
ns
tr
Rise Time
5.2
ns
td(off)
Turn Off Delay Time
11.2
ns
tƒ
Fall Time
4.2
ns
VDS = 20 V, VGS = 0 V
VDS = 20 V, VGS = 10 V,
IDS = 40 A, RG = 0 Ω
DIODE CHARACTERISTICS
VSD
Diode Forward Voltage
Qrr
Reverse Recovery Charge
trr
Reverse Recovery Time
ISD = 40 A, VGS = 0 V
0.8
VDS= 20 V, IF = 40 A,
di/dt = 300 A/μs
46
1
nC
V
33
ns
5.2 Thermal Information
(TA = 25°C unless otherwise stated)
THERMAL METRIC
MIN
TYP
MAX
RθJC
Junction-to-Case Thermal Resistance
1.3
RθJA
Junction-to-Ambient Thermal Resistance
62
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UNIT
°C/W
3
CSD18504KCS
SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
www.ti.com
5.3 Typical MOSFET Characteristics
(TA = 25°C unless otherwise stated)
Figure 1. Transient Thermal Impedance
100
IDS - Drain-to-Source Current (A)
IDS - Drain-to-Source Current (A)
100
80
60
40
20
VGS = 4.5 V
VGS = 6.5 V
VGS = 10 V
0
TC = 125° C
TC = 25° C
TC = -55° C
80
60
40
20
0
0
0.2
0.4
0.6
0.8
1
VDS - Drain-to-Source Voltage (V)
1.2
1.4
0
D002
1
2
3
4
VGS - Gate-to-Source Voltage (V)
5
D003
VDS = 5 V
Figure 2. Saturation Characteristics
4
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Figure 3. Transfer Characteristics
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Product Folder Links: CSD18504KCS
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SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
Typical MOSFET Characteristics (continued)
(TA = 25°C unless otherwise stated)
10000
8
1000
C - Capacitance (pF)
VGS - Gate-to-Source Voltage (V)
10
6
4
100
10
2
Ciss = Cgd + Cgs
Coss = Cds + Cgd
Crss = Cgd
1
0
0
2
4
6
VDS = 20 V
8
10
12
14
Qg - Gate Charge (nC)
16
18
0
20
10
20
30
VDS - Drain-to-Source Voltage (V)
D004
Figure 5. Capacitance
2.5
20
2.3
18
RDS(on) - On-State Resistance (m:)
VGS(th) - Threshold Voltage (V)
D005
ID = 40 A
Figure 4. Gate Charge
2.1
1.9
1.7
1.5
1.3
1.1
0.9
0.7
-75
40
TC = 25° C, I D = 40 A
TC = 125° C, I D = 40 A
16
14
12
10
8
6
4
2
0
-50
-25
2
0
25 50 75 100 125 150 175 200
TC - Case Temperature (° C)
D006
4
6
8
10
12
14
16
VGS - Gate-to-Source Voltage (V)
18
20
D007
ID = 250 µA
Figure 6. Threshold Voltage vs Temperature
Figure 7. On-State Resistance vs Gate-to-Source Voltage
100
2.2
VGS = 4.5 V
VGS = 10 V
ISD - Source-to-Drain Current (A)
Normalized On-State Resistance
2.4
2
1.8
1.6
1.4
1.2
1
0.8
TC = 25° C
TC = 125° C
10
1
0.1
0.01
0.001
0.6
0.4
-75
0.0001
-50
-25
0
25 50 75 100 125 150 175 200
TC - Case Temperature (° C)
D008
0
0.2
0.4
0.6
0.8
VSD - Source-to-Drain Voltage (V)
1
D009
ID = 40 A
Figure 8. Normalized On-State Resistance vs Temperature
Figure 9. Typical Diode Forward Voltage
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CSD18504KCS
SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
www.ti.com
Typical MOSFET Characteristics (continued)
(TA = 25°C unless otherwise stated)
100
100
10
1
DC
10 ms
1 ms
0.1
0.1
TC = 25q C
TC = 125q C
IAV - Peak Avalanche Current (A)
IDS - Drain-to-Source Current (A)
1000
100 µs
10 µs
1
10
VDS - Drain-to-Source Voltage (V)
100
10
0.01
0.1
TAV - Time in Avalanche (ms)
D010
1
D011
Single Pulse, Typical RθJC = 55°C/W
Figure 10. Maximum Safe Operating Area
Figure 11. Single Pulse Unclamped Inductive Switching
IDS - Drain-to-Source Current (A)
120
100
80
60
40
20
0
-50
-25
0
25
50
75 100 125
TC - Case Temperature (° C)
150
175
200
D012
Figure 12. Maximum Drain Current vs Temperature
6
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SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
6 Device and Documentation Support
6.1 Trademarks
NexFET is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
6.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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7
CSD18504KCS
SLPS365A – OCTOBER 2012 – REVISED FEBRUARY 2015
www.ti.com
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
7.1 KCS Package Dimensions
Notes:
1. All linear dimensions are in inches
2. This drawing is subject to change without notice
3. Lead Dimensions are not controlled within "C" area
4. All lead dimensions apply before solder dip
5. The center lead is in electrical contact with the mounting tab
6. The chamfer at "F" is optional
7. Thermal pad contour at "G" optional with these dimensions
8. "H" Falls within JEDEC TO-220 variation AB, except minimum lead thickness, minimum exposed pad length,
and maximum body length.
Pin Configuration
Position
8
Designation
Pin 1
Gate
Pin 2 / Tab
Drain
Pin 3
Source
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
CSD18504KCS
ACTIVE
TO-220
KCS
3
50
RoHS-Exempt
& Green
SN
N / A for Pkg Type
-55 to 175
CSD18504KCS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of