CY74FCT2541TSOCT


            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 D Function and Pinout Compatible With FCT Q OR SO PACKAGE (TOP VIEW) and F Logic D 25-Ω Output Series Resistors to Reduce OEA D0 D1 D2 D3 D4 D5 D6 D7 GND Transmission-Line Reflection Noise D Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions D Edge-Rate Control Circuitry for D D D D D D Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels 12-mA Output Sink Current 15-mA Output Source Current 3-State Outputs 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OEB O0 O1 O2 O3 O4 O5 O6 O7 description The CY74FCT2541T is an octal buffer and line driver designed to be employed as a memory-address driver, clock driver, and bus-oriented transmitter/receiver. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2541T can replace the CY74FCT541T to reduce noise in an existing design. The speed of the CY74FCT2541T is comparable to bipolar logic counterparts, while reducing power dissipation. Input and output voltage levels allow direct interface with TTL and CMOS devices without external components. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE† QSOP – Q SOIC – SO QSOP – Q –40°C 40 C to 85°C 85 C SOIC – SO QSOP – Q SPEED (ns) ORDERABLE PART NUMBER Tape and reel 4.1 CY74FCT2541CTQCT Tube 4.1 CY74FCT2541CTSOC Tape and reel 4.1 CY74FCT2541CTSOCT Tape and reel 4.8 CY74FCT2541ATQCT Tube 4.8 CY74FCT2541ATSOC Tape and reel 4.8 CY74FCT2541ATSOCT Tape and reel 8 CY74FCT2541TQCT TOP-SIDE MARKING FCT2541C FCT2541C FCT2541A FCT2541A FCT2541 Tube 8 CY74FCT2541TSOC FCT2541 Tape and reel 8 CY74FCT2541TSOCT † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. SOIC – SO Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated 
    !"#$%! & '("")% $& ! *(+,'$%! -$%). "!-('%& '! !"# %! &*)' '$%!& *)" %/) %)"#& ! )0$& &%"(#)%& &%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 

            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 FUNCTION TABLE INPUTS OUTPUT OEA OEB D L L L L L L H H H H X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state logic diagram (positive logic) 1 OEA OEB D0 D1 D2 D3 D4 D5 D6 D7 19 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 O0 O1 O2 O3 O4 O5 O6 O7 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, qJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 recommended operating conditions (see Note 2) MIN NOM MAX UNIT 4.75 5 5.25 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current –15 mA IOL TA Low-level output current 12 mA 85 °C High-level input voltage 2 Operating free-air temperature –40 V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 

            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VOH VCC = 4.75 V, VCC = 4.75 V, IIN = –18 mA IOH = –15 mA VOL Rout VCC = 4.75 V, VCC = 4.75 V, IOL = 12 mA IOL = 12 mA Vhys II All inputs IIH IIL IOZH IOZL IOS‡ Ioff ICC ∆ICC ICCD¶ IC# 2.4 20 TYP† MAX UNIT –0.7 –1.2 V 3.3 V 0.3 0.55 V 25 40 Ω 5 µA ±1 µA ±1 µA 15 µA 0.2 VCC = 5.25 V, VCC = 5.25 V, VIN = VCC VIN = 2.7 V VCC = 5.25 V, VCC = 5.25 V, VIN = 0.5 V VOUT = 2.7 V VCC = 5.25 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0 V –60 VCC = 0 V, VCC = 5.25 V, VOUT = 4.5 V VIN ≤ 0.2 V, VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V at 50% duty cycle, Outputs open, One bit switching, OEA = OEB = GND, VIN ≤ 0.2 V or VIN≥VCC – 0.2 V VCC = 5.25 V, Outputs open, open OEA = OEB = GND MIN V –15 µA –120 –225 mA ±1 µA 0.1 0.2 mA 0.5 2 mA 0.06 0.12 mA/ MHz 0.7 1.4 1 2.4 One bit switching at f1 = 10 MHz, MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC– 0.2 V Eight bits switching at f1 = 2.5 2 5 MHz, MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.3 2.6|| VIN = 3.4 V or GND 3.3 10.6|| 5 10 9 12 VIN = 3.4 V or GND Ci Co mA pF pF † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O PARAMETER CY74FCT2541T POST OFFICE BOX 655303 CY74FCT2541AT CY74FCT2541CT MIN MAX MIN MAX MIN MAX 1.5 8 1.5 4.8 1.5 4.1 1.5 8 1.5 4.8 1.5 4.1 1.5 10 1.5 6.2 1.5 5.8 1.5 10 1.5 6.2 1.5 5.8 1.5 9.5 1.5 5.6 1.5 5.2 1.5 9.5 1.5 5.6 1.5 5.2 • DALLAS, TEXAS 75265 UNIT ns ns ns 5 

            SCCS041B – SEPTEMBER 1994 – REVISED SEPTEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test CL = 50 pF (see Note A) 500 Ω From Output Under Test Test Point LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω Open 7V Open LOAD CIRCUIT FOR 3-STATE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) CY74FCT2541ATQCT ACTIVE SSOP DBQ 20 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2541A Samples CY74FCT2541ATSOC ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2541A Samples CY74FCT2541CTQCT ACTIVE SSOP DBQ 20 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2541C Samples CY74FCT2541CTSOC ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2541C Samples CY74FCT2541TQCT ACTIVE SSOP DBQ 20 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2541 Samples CY74FCT2541TQCTE4 ACTIVE SSOP DBQ 20 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2541 Samples CY74FCT2541TQCTG4 ACTIVE SSOP DBQ 20 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 FCT2541 Samples CY74FCT2541TSOC ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2541 Samples CY74FCT2541TSOCE4 ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2541 Samples CY74FCT2541TSOCT ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 FCT2541 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of