DAC161P997-DIE
www.ti.com
SLAS940 – MARCH 2013
Single-Wire 16-Bit DAC
Check for Samples: DAC161P997-DIE
FEATURES
1
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•
•
•
•
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•
•
2
16-Bit Linearity
Single-Wire Interface (SWIF) With Handshake
Digital Data Transmission (No Loss of Fidelity)
Pin Programmable Power-Up Condition
Self Adjusting to Input Data Rate
Loop Error Detection and Reporting
Programmable Output Current Error Level
No External Precision Components
Simple Interface to HART Modulator
APPLICATIONS
•
•
•
•
•
•
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•
Current Loop Transmitter
Industrial Process Control
Actuator Control
Factory Automation
Building Automation
Precision Instruments
Data Acquisition Systems
Test Systems
DESCRIPTION
The DAC161P997-DIE is a 16- bit ∑Δ digital-to-analog converter (DAC) for transmitting an analog output current.
The data link to the DAC161P997-DIE is a single wire interface (SWIF) which allows sensor data to be
transferred in digital format over an isolation boundary using a single isolation component. The
DAC161P997-DIE’s digital input is compatible with standard isolation transformers and optocouplers. Error
detection and handshaking features within the SWIF protocol ensure error free communication across the
isolation boundary. For applications where isolation is not required, the DAC161P997-DIE interfaces directly to a
microcontroller.
The loop drive of the DAC161P997-DIE interfaces to a highway addressable remote transducer (HART)
modulator, allowing injection of FSK modulated digital data into the current loop. This combination of
specifications and features makes the DAC161P997-DIE ideal for 2- and 4-wire industrial transmitters.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
DAC161P997
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
DAC161P997TDA1
324
DAC161P997TDA2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
DAC161P997-DIE
SLAS940 – MARCH 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlCu (0.5%)
850 nm
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: DAC161P997-DIE
DAC161P997-DIE
www.ti.com
SLAS940 – MARCH 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
COMA
1
-811
719
-719
811
COMA
2
-715.5
527
-651.5
591
COMD
3
-715.5
266.25
-651.5
330.25
VD
4
-715.5
-196.95
-651.5
-132.95
DIN
5
-715.5
-406.95
-651.5
-342.95
DBACK
6
-715.5
-583.55
-651.5
-519.55
ACKB
7
-254.2
-710.5
-190.2
-646.5
C1
8
177.15
651.6
241.15
715.6
715.6
C2
9
524
651.6
588
C3
10
650.95
319
714.95
383
NC
11
650.95
-3.15
714.95
60.85
LOW
12
650.95
-436.2
714.95
-372.2
OUT
13
719
-811
811
-719
ERRLVL
14
371.9
-710.5
435.9
-646.5
ERRB
15
49.6
-710.5
113.6
-646.5
VA
16
-108.65
651.6
-44.65
715.6
BASE
17
-443.1
651.6
-379.1
715.6
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: DAC161P997-DIE
3
PACKAGE OPTION ADDENDUM
www.ti.com
6-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
DAC161P997TDA1
ACTIVE
0
324
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
DAC161P997TDA2
ACTIVE
0
10
RoHS & Green
Call TI
N / A for Pkg Type
25 to 25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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