DAC161P997TDA2

DAC161P997-DIE www.ti.com SLAS940 – MARCH 2013 Single-Wire 16-Bit DAC Check for Samples: DAC161P997-DIE FEATURES 1 • • • • • • • • • 2 16-Bit Linearity Single-Wire Interface (SWIF) With Handshake Digital Data Transmission (No Loss of Fidelity) Pin Programmable Power-Up Condition Self Adjusting to Input Data Rate Loop Error Detection and Reporting Programmable Output Current Error Level No External Precision Components Simple Interface to HART Modulator APPLICATIONS • • • • • • • • Current Loop Transmitter Industrial Process Control Actuator Control Factory Automation Building Automation Precision Instruments Data Acquisition Systems Test Systems DESCRIPTION The DAC161P997-DIE is a 16- bit ∑Δ digital-to-analog converter (DAC) for transmitting an analog output current. The data link to the DAC161P997-DIE is a single wire interface (SWIF) which allows sensor data to be transferred in digital format over an isolation boundary using a single isolation component. The DAC161P997-DIE’s digital input is compatible with standard isolation transformers and optocouplers. Error detection and handshaking features within the SWIF protocol ensure error free communication across the isolation boundary. For applications where isolation is not required, the DAC161P997-DIE interfaces directly to a microcontroller. The loop drive of the DAC161P997-DIE interfaces to a highway addressable remote transducer (HART) modulator, allowing injection of FSK modulated digital data into the current loop. This combination of specifications and features makes the DAC161P997-DIE ideal for 2- and 4-wire industrial transmitters. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE DAC161P997 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY DAC161P997TDA1 324 DAC161P997TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated DAC161P997-DIE SLAS940 – MARCH 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlCu (0.5%) 850 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: DAC161P997-DIE DAC161P997-DIE www.ti.com SLAS940 – MARCH 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX COMA 1 -811 719 -719 811 COMA 2 -715.5 527 -651.5 591 COMD 3 -715.5 266.25 -651.5 330.25 VD 4 -715.5 -196.95 -651.5 -132.95 DIN 5 -715.5 -406.95 -651.5 -342.95 DBACK 6 -715.5 -583.55 -651.5 -519.55 ACKB 7 -254.2 -710.5 -190.2 -646.5 C1 8 177.15 651.6 241.15 715.6 715.6 C2 9 524 651.6 588 C3 10 650.95 319 714.95 383 NC 11 650.95 -3.15 714.95 60.85 LOW 12 650.95 -436.2 714.95 -372.2 OUT 13 719 -811 811 -719 ERRLVL 14 371.9 -710.5 435.9 -646.5 ERRB 15 49.6 -710.5 113.6 -646.5 VA 16 -108.65 651.6 -44.65 715.6 BASE 17 -443.1 651.6 -379.1 715.6 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: DAC161P997-DIE 3 PACKAGE OPTION ADDENDUM www.ti.com 6-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) DAC161P997TDA1 ACTIVE 0 324 RoHS & Green Call TI N / A for Pkg Type 25 to 25 DAC161P997TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of