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DAC5652IPFBG4

DAC5652IPFBG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TQFP48

  • 描述:

    DAC, 2 FUNC, PARALLEL INPUT

  • 数据手册
  • 价格&库存
DAC5652IPFBG4 数据手册
DAC5652 DAC5652 SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 www.ti.com DAC5652 Dual, 10-BIT 275 MSPS Digital-to-Analog Converter 1 Features • • • • • • • • • • • 10-Bit Dual Transmit Digital-to-Analog Converter (DAC) 275 MSPS Update Rate Single Supply: 3.0 V to 3.6 V High Spurious-Free Dynamic Range (SFDR): 80 dBc at 5 MHz High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 MHz and 16.1 MHz Independent or Single Resistor Gain Control Dual or Interleaved Data On-Chip 1.2-V Reference Low Power: 290 mW Power-Down Mode: 9 mW Package: 48-Pin Thin-Quad Flat Pack (TQFP) 2 Applications • • • • • Cellular Base Transceiver Station Transmit Channel – CDMA: W-CDMA, CDMA2000, IS-95 – TDMA: GSM, IS-136, EDGE/UWC-136 Medical/Test Instrumentation Arbitrary Waveform Generators (ARB) Direct Digital Synthesis (DDS) Cable Modem Termination System (CMTS) 3 Description The DAC5652 is a monolithic, dual-channel, 10-bit, high-speed DAC with on-chip voltage reference. Operating with update rates of up to 275 MSPS, the DAC5652 offers exceptional dynamic performance, tight-gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications. Each DAC has a high-impedance, differential-current output, suitable for single-ended or differential analogoutput configurations. External resistors allow scaling of the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature-compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used. The DAC5652 has two, 10-bit, parallel input ports with separate clocks and data latches. For flexibility, the DAC5652 also supports multiplexed data for each DAC on one port when operating in the interleaved mode. The DAC5652 has been specifically designed for a differential transformer-coupled output with a 50-Ω doubly-terminated load. For a 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm output power) are supported. The DAC5652 is available in a 48-pin TQFP package. Pin compatibility between family members provides 10-bit (DAC5652), 12-bit (DAC5662), and 14-bit (DAC5672) resolution. Furthermore, the DAC5652 is pin compatible to the DAC2900 and AD9763 dual DACs. The device is characterized for operation over the industrial temperature range of –40°C to 85°C. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) DAC5652 TQFP 7.00 mm x 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. WRTB WRTA CLKB CLKA DEMUX IOUTA1 Latch A 10−b DAC IOUTA2 DA[9:0] BIASJ_A IOUTB1 Latch B DB[9:0] 10−b DAC IOUTB2 MODE BIASJ_B GSET 1.2 V Reference EXTIO SLEEP DVDD DGND AVDD AGND Functional Block Diagram An©IMPORTANT NOTICEIncorporated at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Copyright 2021 Texas Instruments Submit Document Feedback intellectual property matters and other important disclaimers. PRODUCTION DATA. Product Folder Links: DAC5652 1 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Rationgs...................................... 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Resistance Characteristics........................... 4 6.5 Electrical Characteristics.............................................5 6.6 Electrical Characteristics.............................................6 6.7 Electrical Characteristics, AC......................................7 6.8 Electrical Characteristics, DC..................................... 8 6.9 Switching Characteristics............................................8 6.10 Typical Characteristics.............................................. 9 7 Parameter Measurement Information.......................... 12 7.1 Digital Inputs and Timing...........................................12 8 Detailed Description......................................................15 8.1 Overview................................................................... 15 8.2 Functional Block Diagram......................................... 15 8.3 Feature Description...................................................16 8.4 Device Functional Modes..........................................20 9 Application Information Disclaimer............................. 21 9.1 Application Informmation.......................................... 21 9.2 Typical Application.................................................... 21 10 Power Supply Recommendations..............................23 11 Layout........................................................................... 24 11.1 Layout Guidelines................................................... 24 11.2 Layout Example...................................................... 24 12 Device and Documentation Support..........................28 12.1 Documentation Support.......................................... 28 12.2 Receiving Notification of Documentation Updates..28 12.3 Support Resources................................................. 28 12.4 Trademarks............................................................. 28 12.5 Electrostatic Discharge Caution..............................28 12.6 Glossary..................................................................28 13 Mechanical, Packaging, and Orderable Information.................................................................... 29 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (October 2020) to Revision E (January 2021) Page • Chhaged the Functional Block Diagram to inprove image quality...................................................................... 1 Changes from Revision C (Decmeber 2010) to Revision D (October 2020) Page • Added Device Information table, ESD Ratings table, Thermal Resistance Characteristics table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section...................................................................................................1 • Changed Figure 7-1 and Figure 7-2 by removing extra wire connecting the gates of the CMOS inverter to the output node.......................................................................................................................................................12 Changes from Revision B (March 2005) to Revision C (December 2010) Page • Changed the non-printing µ symbols in the Digital Input section of the Electrical Characteristics table (Units column) to the correct µ symbols recognized by the PDF processor..................................................................8 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 MODE AVDD IOUTA1 IOUTA2 BIASJ_A EXTIO GSET BIASJ_B IOUTB2 IOUTB1 AGND SLEEP 5 Pin Configuration and Functions 1 48 47 46 45 44 43 42 41 40 39 38 37 36 2 35 3 34 33 4 5 Top View 48-Pin TQFP PFB Package 6 7 32 31 30 8 29 9 28 10 27 11 26 25 12 13 14 15 16 17 18 19 20 21 22 23 24 NC NC NC NC DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 NC NC DGND DVDD WRTA/WRTIQ CLKA/CLKIQ CLKB/RESETIQ WRTB/SELECTIQ DGND DVDD DB9 (MSB) DB8 DA9 (MSB) DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 (LSB) NC NC Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME NO. AGND 38 I Analog ground AVDD 47 I Analog supply voltage BIASJ_A 44 O Full-scale output current bias for DACA BIASJ_B 41 O Full-scale output current bias for DACB CLKA/CLKIQ 18 I Clock input for DACA, CLKIQ in interleaved mode CLKB/RESETIQ 19 I Clock input for DACB, RESETIQ in interleaved mode DA[9:0] 1-10 I Data port A. DA9 is MSB and DA0 is LSB. Internal pulldown. DB[9:0] 23-32 I Data port B. DB9 is MSB and DB0 is LSB. Internal pulldown. DGND 15, 21 I Digital ground DVDD 16, 22 I Digital supply voltage EXTIO 43 I/O GSET 42 I Gain-setting mode: H – 1 resistor, L – 2 resistors. Internal pullup. IOUTA1 46 O DACA current output. Full-scale with all bits of DA high. IOUTA2 45 O DACA complementary current output. Full-scale with all bits of DA low. IOUTB1 39 O DACB current output. Full-scale with all bits of DB high. IOUTB2 40 O DACB complementary current output. Full-scale with all bits of DB low. MODE Internal reference output (bypass with 0.1 μF to AGND) or external reference input 48 I Mode Select: H – Dual Bus, L – Interleaved. Internal pullup. 11-14, 33-36 - Factory use only. Pins must be connected to DGND or left unconnected. SLEEP 37 I Sleep function control input: H – DAC in power-down mode, L – DAC in operating mode. Internal pulldown. WRTA/WRTIQ 17 I Input write signal for PORT A (WRTIQ in interleaving mode) WRTB/SELECTIQ 20 I Input write signal for PORT B (SELECTIQ in interleaving mode) NC Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 3 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 6 Specifications 6.1 Absolute Maximum Rationgs over TA (unless otherwise noted)(1) AVDD(2) Supply voltage range DVDD(3) Voltage between AGND and DGND Voltage between AVDD and DVDD Supply voltage range Min Max –0.5 4 UNIT V –0.5 4 V –0.5 0.5 V –0.5 0.5 V DA[9:0] and DB[9:0](3) –0.5 DVDD + 0.5 V MODE, SLEEP, CLKA, CLKB, WRTA, WRTB(3) –0.5 DVDD + 0.5 IOUTA1, IOUTA2, IOUTB1, IOUTB2(2) –1 EXTIO, BIASJ_A, BIASJ_B, GSET(2) V AVDD + 0.5 –0.5 V AVDD + 0.5 Peak input current (any input) Peak total input current (all inputs) V +20 mA –30 mA Operating free-air temperature range –40 85 °C Storage temperature range –65 150 °C (1) (2) (3) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Measured with respect to AGND. Measured with respect to DGND. 6.2 ESD Ratings VALUE V (ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-0011 ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C1012 ±1000 UNIT V over operating free-air temperature range (unless otherwise noted) 6.3 Recommended Operating Conditions AVDD Analog supply voltage DVDD Digital supply voltage Output voltage compliance range(1) MIN NOM MAX 3 3.3 3.6 V 3 3.3 -1 Clock input frequency TA Operating free-air temperature -40 UNIT 3.6 V 1.25 V 275 MHz 85 °C 1. The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown, resulting in reduced reliability of the DAC5652 device. The upper limit of the output compliance is determined by the load resistors and full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity. 6.4 Thermal Resistance Characteristics DAC5652 THERMAL METRIC(1) TQFP (PFB) UNIT 48-Pins 4 R θJA Junction-to-ambient thermal resistance 65.3 °C/W R θJC(top) Junction-to-case (top) thermal resistance 16.4 °C/W Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 6.4 Thermal Resistance Characteristics (continued) DAC5652 THERMAL METRIC(1) TQFP (PFB) UNIT 48-Pins R θJB Junction-to-board thermal resistance 28.6 °C/W ψ JT Junction-to-top characterization parameter 0.4 °C/W ψ JB Junction-to-board characterization parameter 28.4 °C/W R θJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. 6.5 Electrical Characteristics over TA, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC Specifications Resolution DC 10 Bits Accuracy(1) INL Integral nonlinearity DNL Differential nonlinearity 1 LSB = IOUTFS/210, TMIN to TMAX –1 ±0.25 1 LSB –0.5 ±0.16 0.5 LSB Analog Output Offset error Midscale value (internal reference) ±0.05 %FSR Offset mismatch Midscale value (internal reference) ±0.03 %FSR Gain error With internal reference ±0.75 %FSR current(2) 2 mA Maximum full-scale output current(2) 20 mA Minimum full-scale output Gain mismatch With internal reference Output voltage compliance range(3) RO Output resistance CO Output capacitance –2 0.2 –1 2 1.25 %FSR V 300 kΩ 5 pF Reference Output Reference voltage Reference output 1.14 current(4) 1.2 1.26 100 V nA Reference Input VEXTIO Input voltage RI Input resistance CI 0.1 1.25 V 1 MΩ Small signal bandwidth 300 kHz Input capacitance 100 pF Temperature Coefficients 2 ppm of FSR/°C With external reference ±20 ppm of FSR/°C With internal reference ±40 ppm of FSR/°C ±20 ppm/°C Offset drift Gain drift Reference voltage drift (1) (2) Measured differentially through 50 Ω to AGND. Nominal full-scale current, IOUTFS, equals 32x the IBIAS current. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 5 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 (3) (4) The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown, resulting in reduced reliability of the DAC5652 device. The upper limit of the output compliance is determined by the load resistors and full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity. Use an external buffer amplifier with high-impedance input to drive any external load. 6.6 Electrical Characteristics over TA, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, fDATA = 200 MSPS, fOUT = 1 MHz, independent gain set mode (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power Supply AVDD Analog supply voltage 3 3.3 3.6 V DVDD Digital supply voltage 3 3.3 3.6 V Including output current through load resistor 75 90 Sleep mode with clock 2.5 Sleep mode without clock 2.5 IAVDD Supply current, analog IDVDD Supply current, digital Sleep mode with clock Sleep mode without clock 12 20 11.3 18 6 mA 0.6 290 Power dissipation mA Sleep mode with clock 360 45.5 Sleep mode without clock 9.2 fDATA = 275 MSPS, fOUT = 20 MHz 310 mW APSRR Analog power supply rejection ratio –0.2 –0.01 0.2 %FSR/V DPSRR Digital power supply rejection ratio –0.2 0 0.2 %FSR/V TA Operating free-air temperature –40 85 °C Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 6.7 Electrical Characteristics, AC AC specifications over TA, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode, differential 1:1 impedance ratio transformer coupled output, 50-Ω doubly terminated load (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Analog Output fclk Maximum output update rate(1) ts Output settling time to 0.1% (DAC) tr tf 275 20 ns Output rise time 10% to 90% (OUT) 1.4 ns Output fall time 90% to 10% (OUT) 1.5 ns Output noise Mid-scale transition MSPS IOUTFS = 20 mA 55 IOUTFS = 2 mA 30 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = 0 dB 79 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = –6 dB 78 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = –12 dB 73 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 5 MHz, IOUTFS = 0 dB 80 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 76 pA/√Hz AC Linearity SFDR Spurious-free dynamic range 1st Nyquist zone, TMIN to TMAX, fDATA = 200 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB SNR Signal-to-noise ratio IMD3 IMD Third-order two-tone intermodulation Four-tone intermodulation Channel isolation (1) dBc 61 70 1st Nyquist zone, TA = 25°C, fDATA = 200 MSPS, fOUT = 41 MHz, IOUTFS = 0 dB 67 1st Nyquist zone, TA = 25°C, fDATA = 275 MSPS, fOUT = 20 MHz 70 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 5 MHz, IOUTFS = 0 dB 63 dB 1st Nyquist zone, TA = 25°C, fDATA = 160 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 62 dB Each tone at –6 dBFS, TA = 25°C, fDATA = 200 MSPS, fOUT = 45.4 MHz and 46.4 MHz 61 Each tone at –6 dBFS, TA = 25°C, fDATA = 100 MSPS, fOUT = 15.1 MHz and 16.1 MHz 78 Each tone at –12 dBFS, TA = 25°C fDATA = 100 MSPS, fOUT = 15.6, 15.8, 16.2, and 16.4 MHz 76 Each tone at –12 dBFS, TA = 25°C fDATA = 165 MSPS, fOUT = 19.0, 19.1, 19.3, and 19.4 MHz 55 Each tone at –12 dBFS, TA = 25°C fDATA = 165 MSPS, fOUT = 68.8, 69.6, 71.2, and 72.0 MHz 70 TA = 25°C, fDATA = 165 MSPS fOUT (CH1) = 20 MHz, fOUT (CH2) = 21 MHz 90 dBc dBc dBc Specified by design and bench characterization. Not production tested. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 7 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 6.8 Electrical Characteristics, DC Digital specifications over TA, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Digital Input VIH High-level input voltage 2 0 3.3 0.8 V VIL Low-level input voltage IIH High-level input current ±50 µA V IIL Low-level input current ±10 µA IIH(GSET) High-level input current, GSET pin 7 µA IIL(GSET) Low-level input current, GSET pin –80 µA IIH(MODE) High-level input current, MODE pin –30 µA IIL(MODE) Low-level input current, MODE pin –80 µA CI Input capacitance 5 pF 6.9 Switching Characteristics Digital specifications over TA, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Timing - Dual Bus Mode tsu Input setup time 1 ns th Input hold time 1 ns tLPH Input clock pulse high time tLAT Clock latency (WRTA/B to outputs) tPD Propagation delay time 1 4 ns 4 clk 1.5 ns Timing - Single Bus Interleaved Mode 8 tsu Input setup time 0.5 ns th Input hold time 0.5 ns tLAT Clock latency (WRTA/B to outputs) tPD Propagation delay time 4 4 1.5 Submit Document Feedback clk ns Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 INL − Integral Nonlinearity Error − LSB 6.10 Typical Characteristics 0.5 0.4 0.3 0.2 0.1 0.0 −0.1 −0.2 −0.3 −0.4 −0.5 0 100 200 300 400 500 600 700 800 900 1000 Input Code G001 DNL − Differential Nonlinearity Error − LSB Figure 6-1. Integral Nonlinearity vs Input Code 0.25 0.20 0.15 0.10 0.05 0.00 −0.05 −0.10 −0.15 −0.20 −0.25 0 100 200 300 400 500 600 700 800 900 1000 Input Code G002 Figure 6-2. Differential Nonlinearity vs Input Code 100 SFDR − Spurious-Free Dynamic Range − dBc SFDR − Spurious-Free Dynamic Range − dBc 100 fdata = 52 MSPS Dual Bus Mode 95 90 85 −6 dBfS 0 dBfS 80 75 −12 dBfS 70 65 60 fdata = 78 MSPS Dual Bus Mode 95 90 85 −6 dBfS 80 75 −12 dBfS 70 0 dBfS 65 60 0 4 8 12 16 fout − Output Frequency − MHz 20 0 10 15 20 fout − Output Frequency − MHz G003 Figure 6-3. Spurious-Free Dynamic Range vs Output Frequency 5 25 30 G004 Figure 6-4. Spurious-Free Dynamic Range vs Output Frequency Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 9 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 100 SFDR − Spurious-Free Dynamic Range − dBc SFDR − Spurious-Free Dynamic Range − dBc 100 fdata = 100 MSPS Dual Bus Mode 95 90 85 −6 dBfS 80 0 dBfS 75 −12 dBfS 70 65 60 fdata = 165 MSPS Dual Bus Mode 95 90 85 80 0 dBfS −6 dBfS 75 70 −12 dBfS 65 60 0 5 10 15 20 25 30 fout − Output Frequency − MHz 35 0 10 15 20 25 30 35 40 45 50 55 60 fout − Output Frequency − MHz G005 Figure 6-5. Spurious-Free Dynamic Range vs Output Frequency 5 0 0 fdata = 78 MSPS fOUT = 15 MHz Dual Bus Mode fdata = 165 MSPS fOUT = 30.1 MHz Dual Bus Mode −20 Power − dBm −20 Power − dBm G006 Figure 6-6. Spurious-Free Dynamic Range vs Output Frequency −40 −60 −80 −40 −60 −80 −100 0.0 7.8 15.6 23.4 31.2 −100 0.0 39.0 16.5 f − Frequency − MHz 33.0 49.5 66.0 82.5 f − Frequency − MHz G007 G008 Figure 6-7. Single-Tone Spectrum Figure 6-8. Single-Tone Spectrum 95 100 95 90 Two-Tone IMD3 − dBc Two-Tone IMD3 − dBc 90 85 80 75 70 85 80 75 70 65 60 fdata = 78 MSPS Dual Bus Mode fout2 = fout1 + 1 MHz 65 60 50 0 5 10 15 20 25 fout1 − Output Frequency − MHz 30 35 0 10 20 30 40 fout1 − Output Frequency − MHz G009 Figure 6-9. Two-Tone IMD3 vs Output Frequency 10 fdata = 165 MSPS Dual Bus Mode fout2 = fout1 + 1 MHz 55 50 G010 Figure 6-10. Two-Tone IMD3 vs Output Frequency Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 −10 fdata = 165 MSPS fdata = 78 MSPS fout1 = 20.1 MHz fout2 = 21.1 MHz Dual Bus Mode −10 fout1 = 30.1 MHz fout2 = 31.1 MHz Dual Bus Mode −30 Power − dBm Power − dBm −30 −50 −70 −90 −110 19.0 −50 −70 −90 19.5 20.0 20.5 21.0 21.5 −110 29.0 22.0 f − Frequency − MHz 29.5 30.0 30.5 31.0 31.5 32.0 f − Frequency − MHz G011 Figure 6-11. Two-Tone Spectrum G012 Figure 6-12. Two-Tone Spectrum Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 11 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 7 Parameter Measurement Information 7.1 Digital Inputs and Timing 7.1.1 Digital Inputs The data input ports of the DAC5652 accept a standard positive coding with data bits DA9 and DB9 being the most significant bits (MSB). The converter outputs support a clock rate of up to 275 MSPS. The best performance is typically achieved with a symmetric duty cycle for write and clock; however, the duty cycle may vary as long as the timing specifications are met. Similarly, the setup and hold times may be chosen within their specified limits. All digital inputs of the DAC5652 are CMOS compatible. Figure 7-1 and Figure 7-2 show schematics of the equivalent CMOS digital inputs of the DAC5652. The pullup and pulldown circuitry is approximately equivalent to 100kΩ.The 10-bit digital data input follows the offset positive binary coding scheme. The DAC5652 is designed to operate with a digital supply (DVDD) of 3 V to 3.6 V. DVDD DA[9:0] DB[9:0] SLEEP CLKA/B WRTA/B 400W Internal Digital In 100kW DGND Figure 7-1. CMOS/TTL Digital Equivalent Input With Internal Pulldown Resistor DVDD 100kW GSET MODE 400W Internal Digital In DGND Figure 7-2. CMOS/TTL Digital Equivalent Input With Internal Pullup Resistor 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 7.1.2 Input Interfaces The DAC5652 features two operating modes selected by the MODE pin, as shown in Table 7-1. • • For dual-bus input mode, the device essentially consists of two separate DACs. Each DAC has its own separate data input bus, clock input, and data write signal (data latch-in). In single-bus interleaved mode, the data must be presented interleaved at the A-channel input bus. The Bchannel input bus is not used in this mode. The clock and write input are now shared by both DACs. Table 7-1. Operating Modes MODE Pin MODE pin connected to DGND MODE pin connected to DVDD Bus input Single-bus interleaved mode, clock and write input equal for both DACs Dual-bus mode, DACs operate independently 7.1.3 Dual-Bus Data Interface and Timing In dual-bus mode, the MODE pin is connected to DVDD. The two converter channels within the DAC5652 consist of two independent, 10-bit, parallel data ports. Each DAC channel is controlled by its own set of write (WRTA, WRTB) and clock (CLKA, CLKB) lines. The WRTA/B lines control the channel input latches and the CLKA/B lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the WRTA/B line. The internal data transfer requires a correct sequence of write and clock inputs, since essentially two clock domains having equal periods (but possibly different phases) are input to the DAC5652. This is defined by a minimum requirement of the time between the rising edge of the clock and the rising edge of the write inputs. This essentially implies that the rising edge of CLKA/B must occur at the same time or before the rising edge of the WRTA/B signal. A minimum delay of 2 ns must be maintained if the rising edge of the clock occurs after the rising edge of the write. Note that these conditions are satisfied when the clock and write inputs are connected externally. Note that all specifications were measured with the WRTA/B and CLKA/B lines connected together. DA[9:0]/DB[9:0] Valid Data tsu th tLPH WRTA/WRTB CLKA/CLKB ts tPD tLAT IOUT or IOUT Figure 7-3. Dual-Bus Mode Operation Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 13 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 7.1.4 Single-Bus Interleaved Data Interface and Timing In single-bus interleaved mode, the MODE pin is connected to DGND. Figure 7-4 shows the timing diagram. In interleaved mode, the A- and B-channels share the write input (WRTIQ) and update clock (CLKIQ and internal CLKDACIQ). Multiplexing logic directs the input word at the A-channel input bus to either the A-channel input latch (SELECTIQ is high) or to the B-channel input latch (SELECTIQ is low). When SELECTIQ is high, the data value in the B-channel latch is retained by presenting the latch output data to its input again. When SELECTIQ is low, the data value in the A-channel latch is retained by presenting the latch output data to its input. In interleaved mode, the A-channel input data rate is twice the update rate of the DAC core. As in dual-bus mode, it is important to maintain a correct sequence of write and clock inputs. The edge-triggered flip-flops latch the A- and B-channel input words on the rising edge of the write input (WRTIQ). This data is presented to the Aand B-DAC latches on the following falling edge of the write inputs. The DAC5652 clock input is divided by a factor of two before it is presented to the DAC latches. Correct pairing of the A- and B-channel data is done by RESETIQ. In interleaved mode, the clock input CLKIQ is divided by two, which would translate to a non-deterministic relation between the rising edges of the CLKIQ and CLKDACIQ. RESETIQ ensures, however, that the correct position of the rising edge of CLKDACIQ with respect to the data at the input of the DAC latch is determined. CLKDACIQ is disabled (low) when RESETIQ is high. DA[9:0] Valid Data tsu th SELECTIQ WRTIQ CLKIQ RESETIQ ts tPD tLAT IOUT or IOUT Figure 7-4. Single-Bus Interleaved Mode Operation 14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 8 Detailed Description 8.1 Overview The architecture of the DAC5652 uses a current steering technique to enable fast switching and high update rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to deliver a full-scale output current of up to 20 mA. An internal decoder addresses the differential current switches each time the DAC is updated and a corresponding output current is formed by steering all currents to either output summing node, IOUT1 or IOUT2. The complementary outputs deliver a differential output signal, which improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peak-to-peak output signal swing by a factor of two, as compared to single-ended operation. The segmented architecture results in a significant reduction of the glitch energy and improves the dynamic performance (SFDR) and DNL. The current outputs maintain a very high output impedance of greater than 300 kΩ. When pin 42 (GSET) is high (simultaneous gain set mode), the full-scale output current for both DACs is determined by the ratio of the internal reference voltage (1.2 V) and an external resistor (RSET) connected to BIASJ_A. When GSET is low (independent gain set mode), the full-scale output current for each DAC is determined by the ratio of the internal reference voltage (1.2 V) and separate external resistors (RSET) connected to BIASJ_A and BIASJ_B. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current that can range from 2 mA to 20 mA, depending on the value of RSET. The DAC5652 is split into a digital and an analog portion, each of which is powered through its own supply pin. The digital section includes edge-triggered input latches and the decoder logic, while the analog section comprises both the current source array with its associated switches, and the reference circuitry. 8.2 Functional Block Diagram WRTB WRTA CLKB CLKA DEMUX IOUTA1 Latch A 10−b DAC IOUTA2 DA[9:0] BIASJ_A IOUTB1 Latch B DB[9:0] 10−b DAC IOUTB2 MODE BIASJ_B GSET 1.2 V Reference EXTIO SLEEP DVDD DGND AVDD AGND Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 15 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 8.3 Feature Description 8.3.1 DAC Transfer Function Each of the DACs in the DAC5652 has a set of complementary current outputs, IOUT1 and IOUT2. The full-scale output current, IOUTFS, is the summation of the two complementary output currents: I OUTFS +I OUT1 )I OUT2 (1) The individual output currents depend on the DAC code and can be expressed as: I I OUT1 +I OUTFS Ǔ ǒCode 1024 (2) OUT2 +I OUTFS * CodeǓ ǒ10231024 (3) where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the reference current IREF, which is determined by the reference voltage and the external setting resistor (RSET). V I OUTFS + 32 I REF + 32 REF R SET (4) In most cases, the complementary outputs drive resistive loads or a terminated transformer. A signal voltage develops at each output according to: V V OUT1 +I OUT1 OUT2 +I OUT2 R R LOAD (5) LOAD (6) The value of the load resistance is limited by the output compliance specification of the DAC5652. To maintain specified linearity performance, the voltage for IOUT1 and IOUT2 must not exceed the maximum allowable compliance range. The total differential output voltage is: V V 16 OUTDIFF +V OUTDIFF + OUT1 (2 *V OUT2 Code * 1023) 1024 (7) I OUTFS R LOAD Submit Document Feedback (8) Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 8.3.2 Analog Outputs The DAC5652 provides two complementary current outputs, IOUT1 and IOUT2. The simplified circuit of the analog output stage representing the differential topology is shown in Figure 8-1. The output impedance of IOUT1 and IOUT2 results from the parallel combination of the differential switches, along with the current sources and associated parasitic capacitances. AVDD S(1) IOUT1 RLOAD S(1)C IOUT2 S(2) S(2)C S(N) S(N)C Current Source Array RLOAD Figure 8-1. Analog Outputs The signal voltage swing that may develop at the two outputs, IOUT1 and IOUT2, is limited by a negative and positive compliance. The negative limit of –1 V is given by the breakdown voltage of the CMOS process and exceeding it compromises the reliability of the DAC5652 (or even causes permanent damage). With the fullscale output set to 20 mA, the positive compliance equals 1.2 V. Note that the compliance range decreases to about 1 V for a selected output current of IOUTFS = 2 mA. Care must be taken that the configuration of DAC5652 does not exceed the compliance range to avoid degradation of the distortion performance and integral linearity. Best distortion performance is typically achieved with the maximum full-scale output signal limited to approximately 0.5 VPP. This is the case for a 50-Ω doubly-terminated load and a 20-mA full-scale output current. A variety of loads can be adapted to the output of the DAC5652 by selecting a suitable transformer while maintaining optimum voltage levels at IOUT1 and I OUT2. Furthermore, using the differential output configuration in combination with a transformer is instrumental for achieving excellent distortion performance. Common-mode errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with high output frequencies. For those applications requiring the optimum distortion and noise performance, it is recommended to select a full-scale output of 20 mA. A lower full-scale range of 2 mA may be considered for applications that require low power consumption, but can tolerate a slight reduction in performance level. 8.3.3 Output Configurations The current outputs of the DAC5652 allow for a variety of configurations. As mentioned previously, utilizing the converter’s differential outputs yield the best dynamic performance. Such a differential output circuit may consist of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most applications with ac coupling, while op amps are suitable for a dc-coupled configuration. The single-ended configuration may be considered for applications requiring a unipolar output voltage. Connecting a resistor from either one of the outputs to ground converts the output current into a groundreferenced voltage signal. To improve on the dc linearity by maintaining a virtual ground, an I-to-V or op-amp configuration may be considered. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 17 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 8.3.4 Differential With Transformer Using an RF transformer provides a convenient way of converting the differential output signal into a singleended signal while achieving excellent dynamic performance. The appropriate transformer must be carefully selected based on the output frequency spectrum and impedance requirements. The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable impedance ratio (winding ratio) the transformer can provide optimum impedance matching while controlling the compliance voltage for the converter outputs. Figure 8-2 and Figure 8-3 show 50-Ω doubly-terminated transformer configurations with 1:1 and 4:1 impedance ratios, respectively. Note that the center tap of the primary input of the transformer has to be grounded to enable a dc-current flow. Applying a 20-mA full-scale output current would lead to a 0.5-VPP output for a 1:1 transformer and a 1-VPP output for a 4:1 transformer. In general, the 1:1 transformer configuration will have slightly better output distortion, but the 4:1 transformer will have 6 dB higher output power. 50 Ω 1:1 IOUT1 RLOAD 50 Ω AGND 100 Ω IOUT2 50 Ω Figure 8-2. Driving a Doubly-Terminated 50-Ω Cable Using a 1:1 Impedance Ratio Transformer 100 Ω 4:1 IOUT1 AGND RLOAD 50 Ω IOUT2 100 Ω Figure 8-3. Driving a Doubly-Terminated 50-Ω Cable Using a 4:1 Impedance Ratio Transformer 8.3.5 Single-Ended Configuration Figure 8-4 shows the single-ended output configuration, where the output current IOUT1 flows into an equivalent load resistance of 25 Ω. Node IOUT2 must be connected to AGND or terminated with a resistor of 25 Ω to AGND. The nominal resistor load of 25 Ω gives a differential output swing of 1 VPP when applying a 20-mA fullscale output current. 18 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 IOUT1 RLOAD 50 Ω IOUT2 50 Ω 25 Ω AGND Figure 8-4. Driving a Doubly-Terminated 50-Ω Cable Using a Single-Ended Output 8.3.6 Reference Operation 8.3.6.1 Internal Reference The DAC5652 has an on-chip reference circuit which comprises a 1.2-V bandgap reference and two control amplifiers, one for each DAC. The full-scale output current, IOUTFS, of the DAC5652 is determined by the reference voltage, VREF, and the value of resistor RSET. IOUTFS can be calculated by: V I OUTFS + 32 I REF + 32 REF R SET (9) The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is determined by the ratio of VREF and RSET (see Equation 9). The full-scale output current, IOUTFS, results from multiplying IREF by a fixed factor of 32. Using the internal reference, a 2-kΩ resistor value results in a full-scale output of approximately 20 mA. Resistors with a tolerance of 1% or better should be considered. Selecting higher values, the output current can be adjusted from 20 mA down to 2 mA. Operating the DAC5652 at lower than 20-mA output currents may be desirable for reasons of reducing the total power consumption, improving the distortion performance, or observing the output compliance voltage limitations for a given load condition. It is recommended to bypass the EXTIO pin with a ceramic chip capacitor of 0.1 µF or more. The control amplifier is internally compensated and its small signal bandwidth is approximately 300 kHz. 8.3.6.2 External Reference The internal reference can be disabled by simply applying an external reference voltage into the EXTIO pin, which in this case functions as an input. The use of an external reference may be considered for applications that require higher accuracy and drift performance or to add the ability of dynamic gain control. While a 0.1-µF capacitor is recommended to be used with the internal reference, it is optional for the external reference operation. The reference input, EXTIO, has a high input impedance (1 MΩ) and can easily be driven by various sources. Note that the voltage range of the external reference must stay within the compliance range of the reference input. 8.3.7 Gain Setting Option The full-scale output current on the DAC5652 can be set two ways: either for each of the two DAC channels independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42) must be low (that is, connected to AGND). In this mode, two external resistors are required — one RSET connected to the BIASJ_A pin (pin 44) and the other to the BIASJ_B pin (pin 41). In this configuration, the user has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the compensation of possible gain mismatches elsewhere within the transmit signal path. Alternatively, bringing the GSET pin high (that is, connected to AVDD), the DAC5652 switches into the simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 19 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 external RSET resistor connected to the BIASJ_A pin. The resistor at the BIASJ_B pin may be removed; however, this is not required since this pin is not functional in this mode and the resistor has no effect on the gain equation. 8.4 Device Functional Modes 8.4.1 Sleep Mode The DAC5652 features a power-down function which can reduce the total supply current to approximately 3.1 mA over the specified supply range if no clock is present. Applying a logic high to the SLEEP pin initiates the power-down mode, while a logic low enables normal operation. When left unconnected, an internal active pulldown circuit enables the normal operation of the converter. 20 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 9 Application Information Disclaimer Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Informmation The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown, resulting in reduced reliability of the DAC5652 device. The upper limit of the output compliance is determined by the load resistors and full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity. 9.2 Typical Application A typical application for the DAC5652 is a dual- or single-carrier transmitter. The DAC is provided with some input digital baseband signal, and outputs an analog carrier. A design example for a single-carrier transmitter is described in this section. WRT B WRT A CLK B CLK A 50 DE-MUX 14-Bit ADC LATCH A 1:1 Output 50 100 DA[13:0] 50 FPGA 50 DB[13:0] 14-Bit ADC LATCH A 1:1 Output 50 100 50 EXTIO 1.2-V Reference 0.1 …F Figure 9-1. Single-Carrier Transmitter 9.2.1 Design Requirements The requirements for this design are to generate a single WCDMA signal at an intermediate frequency of 30.72 MHz. The ACLR needs to be better than 72 dBc. Table 9-1. Design Parameters FEATURE SPECIFICATION Number of carriers 1 AVDD and DVDD 3.3 V Clock rate 122.88 MSPS Input data WCDMA with IF at 30.72 MHz Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 21 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 Table 9-1. Design Parameters (continued) FEATURE SPECIFICATION ACPR > 72 dB 9.2.2 Detailed Design Procedure The single WCDMA carrier signal with an intermediate frequency (IF) of 30.72 MHz must be created in the digital processor at a sample rate of 122.88 MSPS for the DAC. These 10-bit samples are placed on the 10-bit CMOS input port of the DAC. A CMOS DAC clock must be generated from a clock source at 122.88 MHz. This clock must be provided to the CLK pin of the DAC. The IOUTA and IOUTB differential connections must be connected to a transformer in order to provide a single-ended output. A typical 1:1 impedance transformer is used on the device EVM. The DAC5672A evaluation module (EVM) provides a good reference for this design example. 9.2.3 Application Performance Plots This spectrum analyzer plot shows the adjacent channel power ratio (ACPR) for the transformeroutput, singlecarrier signal with an intermediate frequency of 30.72 MHz. The results meet the system requirements for a minimum of 72 dBc ACPR. Figure 9-2. ACPR Performance 22 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 10 Power Supply Recommendations Power the device with the nominal supply voltages as indicated in the Recommended Operating Conditions. In most instances, the best performance is achieved with LDO supplies. However, the supplies may be driven with direct outputs from a DC/DC switcher, as long as the noise performance of the switcher is acceptable. For best performance: • Use at least two power layers. • Avoid placing digital supplies and clean supplies on adjacent board layers. • Use a ground layer between noisy and clean supplies, if possible. • Decouple all supply pins as close to the pins as possible, using small-value capacitors, with larger , bulk capacitors placed further away. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 23 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 11 Layout 11.1 Layout Guidelines Use the DAC5652EVM layout as reference to obtain the best performance. A sample layout is shown in in the Figure 12-1 through Figure 12-4. Some important layout recommendations are: 1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board. This may be virtually divided down the middle of the device package when doing placement and layout. 2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This keeps coupling from the digital circuits to the analog outputs to a minimum. 3. Keep decoupling capacitors close to the power pins of the device. 11.2 Layout Example Figure 11-1 through Figure 11-4 show the layout examples. Digital Signal Analog Output Digital Signal Figure 11-1. Top Layer (Layer 1) 24 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 Figure 11-2. Single Ground Plane (Layer 2) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 25 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 Digital Power Plane Analog Power Plane Figure 11-3. Power Plane (Layer 3) 26 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 Decoupling Capacitors Figure 11-4. Bottom Layer (Layer 4) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 27 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 12 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary TI Glossary 28 This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 DAC5652 www.ti.com SLAS452E – OCTOBER 2020 – REVISED JANUARY 2021 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC5652 29 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DAC5652IPFB ACTIVE TQFP PFB 48 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC5652I DAC5652IPFBR ACTIVE TQFP PFB 48 1000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 DAC5652I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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