DDC1128ZKLR

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DDC1128 SLASE36A – MARCH 2014 – REVISED MAY 2016 DDC1128 128-Channel, Current-Input Analog-to-Digital Converter 1 Features 3 Description • The DDC1128 is a 20-bit, 128-channel, current-input analog-to-digital (A/D) converter. It combines both current-to-voltage and A/D conversion so that 128 separate low-level current output devices, such as photodiodes, can be directly connected to its inputs and digitized. 1 • • • • • • • • • Single-Chip Solution to Directly Measure 128 Low-Level Currents Proven High-Precision, True Integrating Architecture with 100% Charge Collection Easy Upgrade for Existing DDC Family Applications Low Power: 3 mW/channel at 3 kSPS Extremely Linear: INL = ±0.025% of Reading ±1 ppm of FSR Low Noise: 6.3 ppm of FSR Adjustable Full-Scale Range Adjustable Speed – Data Rates up to 6 kSPS with 20-bit Performance – Integration Times as low as 160 μs Daisy-Chainable Serial Interface In-Package Bypass Capacitors Simplify PCB Design Area and Design Complexity For each of the 128 inputs, the DDC1128 uses the proven dual switched integrator front-end. This configuration allows for continuous current integration: while one integrator is being digitized by the onboard A/D converter, the other is integrating the input current. This architecture provides both a stable offset and a loss-less collection of the input current. Adjustable integration times range from 160μs to 1s, allowing currents from fAs to μAs to be continuously measured with outstanding precision. The DDC1128 has a serial interface designed for daisy-chaining in multi-device systems. Simply connect the output of one device to the input of the next to create the chain. Common clocking feeds all the devices in the chain so that the digital overhead in a multi-DDC1128 system is minimal. 2 Applications • • • The DDC1128 operates from a +5 V analog supply and a 2.7 V to 3.6 V digital supply, it is specified from 0°C to 70°C operating temperature and it is available in a 9 x 9 mm2 192-ball BGA, which includes on board bypass capacitors to help minimize the external component requirements and further reduce board space. CT Scanner DAS Photodiode Sensors X-Ray Detection Systems To request a full data sheet or other design resources: request DDC1128 Device Information ORDER NUMBER PACKAGE BODY SIZE DDC1128 NFBGA (192) 9.00 mm x 9.00 mm SPACER Simplified Schematic REF3040 OPA350 VREF Buffer AVDD DVDD VREF IN1 Configuration and Control CLK CONV DIN_CFG CLK_CFG RESET To/From Controller DVALID Serial Interface DCLK DIN DOUT IN128 DDC1128 QGND AGND DGND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DDC1128 SLASE36A – MARCH 2014 – REVISED MAY 2016 www.ti.com 4 Revision History Changes from Original (March 2014) to Revision A • 2 Page Added link to request full data sheet ...................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DDC1128 DDC1128 www.ti.com SLASE36A – MARCH 2014 – REVISED MAY 2016 5 Device and Documentation Support 5.1 Trademarks All trademarks are the property of their respective owners. 5.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DDC1128 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DDC1128ZKLR ACTIVE NFBGA ZKL 192 1000 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC1128 DDC1128ZKLT ACTIVE NFBGA ZKL 192 250 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC1128 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of