DLP5500FYA

Product Folder Order Now Support & Community Tools & Software Technical Documents DLP5500 DLPS013G – APRIL 2010 – REVISED JANUARY 2019 DLP5500 DLP® 0.55 XGA Series 450 DMD 1 Features 2 Applications • • 1 • • • • • 0.55-Inch Micromirror Array Diagonal – 1024 × 768 Array of Aluminum, MicrometerSized Mirrors (XGA Resolution) – 10.8-µm Micromirror Pitch – ±12° Micromirror Tilt Angle (Relative to Flat State) – Designed for Corner Illumination Designed for Use With Broadband Visible Light (420 nm – 700 nm): – Window Transmission 97% (Single Pass, Through Two Window Surfaces) – Micromirror Reflectivity 88% – Array Diffraction Efficiency 86% – Array Fill Factor 92% 16-Bit, Low Voltage Differential Signaling (LVDS) Double Data Rate (DDR) Input Data Bus 200 MHz Input Data Clock Rate Dedicated DLPC200 Controller for High-Speed Pattern Rates: – 5,000 Hz (1-Bit Binary Patterns) – 500 Hz (8-Bit Grayscale Patterns) Series 450 Package Characteristics: – Thermal Area 18 mm × 12 mm Enabling High on Screen Lumens (>2000 lm) – 149 Micro Pin Grid Array Robust Electrical Connection – Package Mates to Amphenol InterCon Systems 450-2.700-L-13.25-149 Socket • • Industrial – 3D Scanners for Machine Vision and Quality Control – 3D Printing – Direct Imaging Lithography – Laser Marking and Repair – Industrial and Medical Imaging – Medical Instrumentation – Digital Exposure Systems Medical – Opthamology – 3D Scanners for Limb and Skin Measurement – Hyperspectral Imaging Displays – 3D Imaging Microscopes – Intelligent and Adaptive Lighting 3 Description Featuring over 750000 micromirrors, the high resolution DLP5500 (0.55" XGA) digital micromirror device (DMD) is a spatial light modulator (SLM) that modulates the amplitude, direction, and/or phase of incoming light. This advanced light control technology has numerous applications in the industrial, medical, and consumer markets. The DLP5500 enables fine resolution for 3D printing applications. Device Information(1) PART NUMBER DLP5500 PACKAGE CPGA (149) BODY SIZE (NOM) 22.30 mm × 32.20 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 4 Typical Application Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DLP5500 DLPS013G – APRIL 2010 – REVISED JANUARY 2019 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Typical Application Schematic............................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 9 1 1 1 1 2 4 4 7 Absolute Maximum Ratings ...................................... 7 Storage Conditions.................................................... 7 ESD Ratings.............................................................. 7 Recommended Operating Conditions....................... 8 Thermal Information ................................................ 10 Electrical Characteristics......................................... 10 Timing Requirements .............................................. 11 System Mounting Interface Loads .......................... 15 Micromirror Array Physical Characteristics ............. 16 Micromirror Array Optical Characteristics ............. 17 Window Characteristics......................................... 18 Chipset Component Usage Specification ............. 18 Detailed Description ............................................ 19 9.1 Overview ................................................................. 19 9.2 Functional Block Diagram ....................................... 20 9.3 9.4 9.5 9.6 9.7 Feature Description................................................. 21 Device Functional Modes........................................ 24 Window Characteristics and Optics ....................... 24 Micromirror Array Temperature Calculation............ 25 Micromirror Landed-on/Landed-Off Duty Cycle ...... 27 10 Application and Implementation........................ 29 10.1 Application Information.......................................... 29 10.2 Typical Application ................................................ 30 11 Power Supply Recommendations ..................... 32 11.1 DMD Power-Up and Power-Down Procedures..... 32 12 Layout................................................................... 32 12.1 Layout Guidelines ................................................. 32 12.2 Layout Example .................................................... 33 13 Device and Documentation Support ................. 34 13.1 13.2 13.3 13.4 13.5 13.6 13.7 Device Support .................................................... Documentation Support ........................................ Related Documentation......................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 34 34 34 34 35 35 35 14 Mechanical, Packaging, and Orderable Information ........................................................... 35 5 Revision History Changes from Revision F (May 2015) to Revision G • Page Changed DMD Marking Image Object for Figure 19 ........................................................................................................... 34 Changes from Revision E (September 2013) to Revision F Page • Added ESD Ratings, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed Incorrect VCC2 value from 9V to 8V ......................................................................................................................... 7 • Changed LVDS ƒclock to200 MHz - previously incorrectly listed as 150 MHz......................................................................... 9 • Added Max Recommended DMD Temperature – Derating Curve......................................................................................... 9 • Added LVCMOS Output Measurement Condition Figure..................................................................................................... 10 • Changed Incorrect tC value from 4 ns to 5 ns (200 MHz clock) ........................................................................................... 11 • Changed Incorrect tW value from 1.25 ns to 2.5 ns (200 MHz clock)................................................................................... 11 • Changed SCP Bus Diagrams ............................................................................................................................................... 11 • Added LVDS Voltage Definition Figure ................................................................................................................................ 12 • Changed LVDS Waveform Requirements Figure................................................................................................................. 13 • Added LVDS Equivalent Input Circuit Figure ....................................................................................................................... 13 • Added LVDS & SCP Rise and Fall Time Figures................................................................................................................. 14 • Moved the Mechanical section from Recommended Operating Conditions table to the System Mounting Interface Loads section ...................................................................................................................................................................... 15 • Added Micromirror Array Physical Characteristics section .................................................................................................. 16 • Changed Micromirror Array Physical Characteristics Figure to generic image (M x N)....................................................... 16 2 Submit Documentation Feedback Copyright © 2010–2019, Texas Instruments Incorporated Product Folder Links: DLP5500 DLP5500 www.ti.com DLPS013G – APRIL 2010 – REVISED JANUARY 2019 • Added Micromirror Array Optical Characteristics section .................................................................................................... 17 • Changed specular reflectivity wavelength range to 420 - 700 nm (from 400 - 700 nm) to match Recommended Operating Conditions ............................................................................................................................................................ 17 • Changed Micromirror Landed Orientation and Tilt Figure to generic image (M x N) ........................................................... 18 • Added Window Characteristics section ............................................................................................................................... 18 • Added Chipset Component Usage Specification section .................................................................................................... 18 • Changed Micromirror Array, Pitch, Hinge Axis Orientation Figure to generic image (M x N) .............................................. 22 • Changed Micromirror States: On, Off, Flat Figure to generic DMD image .......................................................................... 23 • Changed Test Point locations from TC1 & TC2 to TP1 - TP5 ............................................................................................. 25 • Changed Test Point location Diagram to show TP1 - TP5................................................................................................... 26 • Added Micromirror Landed-on/Landed-Off Duty Cycle section............................................................................................ 27 • Changed Typical Application diagram .................................................................................................................................. 30 • Replaced "DAD" with "DLPA200" ......................................................................................................................................... 31 Changes from Revision D (October 2012) to Revision E • Page Deleted the Device Part Number Nomenclature section...................................................................................................... 34 Changes from Revision C (June 2012) to Revision D Page • Changed the Device Part Number Nomenclature From: DLP5500FYA To: DLP5500AFYA............................................... 34 • Updated Mechanical ICD to V2 with a minor change in the window height......................................................................... 34 Changes from Revision B (Spetember 2011) to Revision C Page • Added the Package Footprint and Socket information in the Features list ........................................................................... 1 • Deleted redundant information from the Description.............................................................................................................. 1 • Changed the Illumination power density Max value of