DRV3245AEPHPRQ1

Order Now Product Folder Support & Community Tools & Software Technical Documents DRV3245E-Q1 SLVSEE5 – APRIL 2019 DRV3245E-Q1 3-Phase Grade 0 Automotive Gate Driver Unit (GDU) With High Performance Sensing, Protection and Diagnostics 1 Features 2 Applications • • 1 • • • • • • • • • • • AEC-Q100 qualified for automotive applications: – Device temperature grade 0: –40°C to +150°C, TA SafeTI™semiconductor component – Developed according to the applicable requirements of ISO 26262 4.5-V to 45-V operating voltage Programmable peak gate drive currents up to 1A Charge-pump gate driver for 100% Duty Cycle Current-shunt amplifiers and phase comparators – A Device: 3 current-shunt amplifiers and 3phase comparators with status through SPI – B Device: 2 current-shunt amplifiers and 3phase comparators with real-time monitor through digital pins 3-PWM or 6-PWM input control up to 20 kHz Single PWM-mode commutation capability Supports both 3.3-V and 5-V digital interface Serial peripheral interface (SPI) Thermally-enhanced 48-Pin HTQFP Protection features: – Internal regulators, battery voltage monitor – SPI CRC – Clock monitor – Analog built-in self test – Programmable dead-time control – MOSFET shoot-through prevention – MOSFET VDS overcurrent monitors – Gate-source voltage real time monitor – Overtemperature warning High temperature 12-V automotive applications – Automated manual transmission and dual clutch transmission – Shift by wire – Transfer case and pumps 3 Description The DRV3245E-Q1 device is a FET gate driver IC for three-phase motor-drive applications. The device is intended for high-temperature automotive applications and is designed according to the applicable requirements of ISO 26262 for functional safety applications. The device provides three half-bridge drivers each capable of driving a high-side and lowside N-channel MOSFET while also providing sophisticated protection and monitoring of the FETs. A charge-pump driver enables 100% duty cycle and supports low battery voltages during cold-crank operation. The integration of current-sense amplifiers, integrated phase comparators, and SPI-based configuration enable reduction of the bill of materials (BOM) and space on the printed circuit board (PCB) because of the elimination of most external and passive components. The DRV3245E-Q1 device also integrates diagnostics and protection for each internal block and provides support for common system diagnostic checks each of which can be instantiated and reported through SPI. This flexibility of the integrated features allows the device to integrate seamlessly into a variety of safety architectures. Device Information PART NUMBER DRV3245E-Q1 PACKAGE HTQFP (48) (1) BODY SIZE (NOM) 7.00 mm × 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic 4.5 to 45 V 4.5 to 45 V 3-Phase Gate Driver SPI 4 nFAULT Protection Diagnostics Monitoring Gate Drive 6(Gate) +6(Source) Sense Shunt Amplifiers 3 Shunt Amplifiers 3(P) + 2(N) 2 PWM 6 SPI M MCU MCU 6 Shutdown A Device N-Channel MOSFETs 2 PWM 4 nFAULT B Device 3-Phase Gate Driver Protection Diagnostics Monitoring Gate Drive 6(Gate) +6(Source) Shunt Amplifiers 3 Phase Comparators 3 Shunt Amplifiers Sense Phase Comparators 2(P) + 2(N) N-Channel MOSFETs Shutdown M 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV3245E-Q1 SLVSEE5 – APRIL 2019 www.ti.com 4 Device and Documentation Support 4.1 Device Support 4.1.1 Device Nomenclature Figure 1 shows a legend for reading the complete orderable device name for the DRV3245E-Q1 device DRV32 (45) (A) (Q) (PHP) (R) (Q1) Prefix DRV32: Three Phase Gate Driver AEC-Q100 Q1: Automotive qualification Blank: Non-automotive Series 45: 4.5 ± 45 V device Tape and Reel R: 3000 pieces/reel T: 250 pieces/reel Current-shunt amplifiers A: 3x current-shunt amplifiers B: 2x current-shunt amplifiers Package PHP: 48-pin QFP Temperature Range Q: ±40°C to 125°C E: ±40°C to 150°C Figure 1. Device Nomenclature 4.2 Documentation Support For related documentation see the following: • Texas Instruments, PowerPAD™ Thermally Enhanced Package application report • Texas Instruments, PowerPAD™ Made Easy application report • Texas Instruments, Sensored 3-Phase BLDC Motor Control Using MSP430 application report • Texas Instruments, Understanding IDRIVE and TDRIVE in TI Motor Gate Drivers application report 4.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 4.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.5 Trademarks SafeTI, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 4.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: DRV3245E-Q1 DRV3245E-Q1 www.ti.com SLVSEE5 – APRIL 2019 4.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: DRV3245E-Q1 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DRV3245AEPHPRQ1 ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 150 D3245AE DRV3245BEPHPRQ1 ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 150 D3245BE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of