DS26LS32ACM

DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M www.ti.com SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers Check for Samples: DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M FEATURES DESCRIPTION • The DS26LS32 and DS26LS32A are quad differential line receivers designed to meet the RS-422, RS-423 and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission. 1 2 • • • • • • High Differential or Common-Mode Input Voltage Ranges of ±7V on the DS26LS32 and DS26LS32A and ±15V on the DS26LS33 ±0.2V Sensitivity Over the Input Voltage Range on the DS26LS32 and DS26LS32A, ±0.5V Sensitivity on the DS26LS33 DS26LS32 and DS26LS32A Meet All Requirements of RS-422 and RS-423 6k Minimum Input Impedance 100 mV Input Hysteresis on the DS26LS32 and DS26LS32A, 200 mV on the DS26LS33 Operation From a Single 5V Supply TRI-STATE Outputs, with Choice of Complementary Output Enables for Receiving Directly onto a Data Bus The DS26LS32 and DS26LS32A have an input sensitivity of 200 mV over the input voltage range of ±7V and the DS26LS33 has an input sensitivity of 500 mV over the input voltage range of ±15V. The DS26LS32A differs in function from the popular DS26LS32 and DS26LS33 in that input pull-up and pull-down resistors are included which prevent output oscillation on unused channels. Each version provides an enable and disable function common to all four receivers and features TRI-STATE outputs with 8 mA sink capability. Constructed using low power Schottky processing, these devices are available over the full military and commercial operating temperature ranges. Logic Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 www.ti.com Connection Diagram For Complete Military Product Specifications, refer to the appropriate SMD or MDS. Figure 1. Dual-In-Line Package (Top View) D Package or NFG0016E Package Figure 2. 20-Lead Ceramic Leadless Chip Carrier Truth Table ENABLE ENABLE Input Output 0 1 X Hi-Z See note below. (2) (1) (2) 2 (1) VID ≥ VTH (Max) 1 VID ≤ VTH (Min) 0 Hi-Z = TRI-STATE Note: Input conditions may be any combination not defined for ENABLE and ENABLE . Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M www.ti.com SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 7V Common-Mode Range ±25V Differential Input Voltage ±25V Enable Voltage 7V Output Sink Current Maximum Power Dissipation 50 mA (3) at 25°C Cavity Package 1433 mW Molded DIP Package 1362 mW SOIC Package (4) DS26LS32 1002 mW DS26LS32A 1051 mW −65°C to +165°C Storage Temperature Range Lead Temperature (Soldering, 4 seconds) (1) 260°C “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of “Electrical Characteristics” provides conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Derate cavity package 9.6 mW/°C above 25°C; derate molded DIP package 10.9 mW/°C above 25°C. Derate SOIC Package 8.01 mW/°C for DS26LS32 8.41 mW/°C for DS26LS32A (2) (3) (4) Operating Conditions Min Max Units Supply Voltage, (VCC) DS26LS32M, DS26LS33M (MIL) 4.5 5.5 V DS26LS32C, DS26LS32AC (COML) 4.75 5.25 V −55 +125 °C 0 +70 °C Temperature, (TA) DS26LS32M, DS26LS33M (MIL) DS26LS32C, DS26LS32AC (COML) Electrical Characteristics (1) (2) (3) over the operating temperature range unless otherwise specified Symbol Parameter Min Typ Max Units DS26LS32, DS26LS32A, −7V ≤ VCM ≤ +7V Conditions −0.2 ±0.07 0.2 V DS26LS33, DS26LS33A, −15V ≤ VCM +15V −0.5 ±0.14 0.5 6.0 8.5 VTH Differential Input Voltage VOUT = VOH or VOL RIN Input Resistance −15V ≤ VCM ≤ +15V (One Input AC GND) IIN Input Current (Under Test) V IN = 15V, Other Input −15V ≤ VIN ≤ +15V 2.3 mA V IN = −15V, Other Input −15V ≤ VIN ≤ +15V −2.8 mA Output High Voltage VCC = MIN, ΔVIN = 1V, Commercial 2.7 4.2 VENABLE = 0.8V, IOH = −440 μA Military 2.5 4.2 VCC = Min, ΔVIN = −1V, IOL = 4 mA 0.4 V VENABLE = 0.8V IOL = 8 mA 0.45 V 0.8 V VOH VOL Output Low Voltage VIL Enable Low Voltage VIH Enable High Voltage VI Enable Clamp Voltage (1) (2) (3) V V 2.0 VCC = Min, IIN = −18 mA V kΩ V −1.5 V All currents into device pins are shown as positive, all currents out of device pins are shown as negative, all voltages are referenced to ground, unless otherwise specified. All values shown as max or min are so classified on absolute value basis. All typical values are VCC = 5V, TA = 25°C. Only one output at a time should be shorted. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M 3 DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 Electrical Characteristics (1) (2) (3) www.ti.com (continued) over the operating temperature range unless otherwise specified Symbol IO Parameter Conditions Min Typ Max Units VO = 2.4V 20 μA VO = 0.4V −20 μA OFF-State (High Impedance) Output Current V CC = Max IIL Enable Low Current VIN = 0.4V −0.36 mA IIH Enable High Current VIN = 2.7V 20 μA ISC Output Short-Circuit Current V O = 0V, VCC = Max, ΔVIN = 1V −85 mA ICC Power Supply Current VCC = Max, All VIN = GND, DS26LS32, DS26LS32A 52 70 mA Outputs Disabled DS26LS33, DS26LS33A 57 80 mA II Input High Current VIN = 5.5V VHYST Input Hysteresis TA = 25°C, VCC = 5V, DS26LS32, DS26S32A 100 mV VCM = 0V DS26LS33, DS26LS33A 200 mV −15 100 μA Switching Characteristics VCC = 5V, TA = 25°C Symbol tPLH Parameter Conditions Input to Output CL = 15 pF tPHL tLZ ENABLE to Output CL = 5 pF ENABLE to Output CL = 15 pF tHZ tZL tZH DS26LS32/DS26LS33 Min DS26LS32A/DS26LS33A Typ Max 17 17 Min Units Typ Max 25 23 35 ns 25 23 35 ns 20 30 15 30 ns 15 22 20 25 ns 15 22 14 22 ns 15 22 15 22 ns AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS Figure 3. Load Test Circuit for TRI-STATE Outputs 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M www.ti.com SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 Diagram shown for ENABLE low. Pulse generator for all pulses: Rate = 1.0 MHz; ZO = 50Ω; tr ≤ 6 ns; tf ≤ 6.0 ns. Figure 4. Propagation Delay S1 and S2 of load circuit are closed except where shown. Pulse generator for all pulses: Rate = 1.0 MHz; ZO = 50Ω; tr ≤ 6 ns; tf ≤ 6.0 ns. Figure 5. Enable and Disable Times TYPICAL APPLICATIONS Figure 6. Two-Wire Balanced Interface—RS-422 Figure 7. Single Wire with Driver Ground Reference—RS-423 Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M 5 DS26LS32AC, DS26LS32C, DS26LS32M, DS26LS33M SNLS352C – MAY 1999 – REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Revision B (February 2013) to Revision C • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS26LS32AC DS26LS32C DS26LS32M DS26LS33M PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS26LS32ACM/NOPB LIFEBUY SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS32 ACM DS26LS32ACMX/NOPB LIFEBUY SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS32 ACM DS26LS32CM/NOPB LIFEBUY SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS32CM DS26LS32CMX/NOPB LIFEBUY SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS32CM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of