DS3680
QUAD TELEPHONE RELAY DRIVER
SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
•
•
•
•
•
•
•
•
D OR N PACKAGE
(TOP VIEW)
Designed for – 52-V Battery Operation
50-mA Output Current Capability
Input Compatible With TTL and CMOS
High Common-Mode Input Voltage Range
Very Low Input Current
Fail-Safe Disconnect Feature
Built-in Output Clamp Diode
Direct Replacement for National DS3680
and Fairchild µA3680
description
1 IN +
1 IN –
2 IN –
2 IN +
3 IN +
3 IN –
4 IN –
1
14
2
13
3
12
4
11
5
10
6
9
7
8
BAT GND
1 OUT
2 OUT
3 OUT
4 OUT
BAT NEG
4 IN +
symbol (each driver)
The DS3680 telephone relay driver is a monolithic
integrated circuit designed to interface – 48-V
relay systems to TTL or other systems in
telephone applications. It is capable of sourcing
up to 50 mA from standard – 52-V battery power.
To reduce the effects of noise and IR drop between
logic ground and battery ground, these drivers are
designed to operate with a common-mode input
range of ± 20 V referenced to battery ground. The
common-mode input voltages for the four drivers
can be different, so a wide range of input elements
can be accommodated. The high-impedance
inputs are compatible with positive TTL and
CMOS levels or negative logic levels. A clamp
network is included in the driver outputs to limit
high-voltage transients generated by the relay coil
during switching. The complementary inputs
ensure that the driver output is off as a fail-safe
condition when either output is open.
BAT GND
IN +
+
IN –
–
OUT
BAT NEG
schematic diagram (each driver)
IN +
15 kΩ
BAT GND
IN –
The DS3680 is characterized for operation from
0°C to 70°C.
OUT
BAT NEG
All resistor values shown are nominal.
Copyright 1995, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
DS3680
QUAD TELEPHONE RELAY DRIVER
SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range at BAT NEG, VBAT – (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 70 V to 0.5 V
Input voltage range with respect to BAT GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 70 V to 20 V
Input voltage range with respect to BAT NEG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 70 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 V
Output current, IO: Resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 100 mA
Inductive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 50 mA
Inductive output load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 H
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
NOTES: 1. All voltages are with respect to BAT GND, unless otherwise specified.
2. Differential input voltages are at the noninverting input terminal IN + with respect to the inverting input terminal IN –.
DISSIPATION RATING TABLE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
D
950 mW
7.6 mW/°C
608 mW
N
1150 mW
9.2 mW/°C
736 mW
PACKAGE
recommended operating conditions
Supply voltage, VBAT –
Input voltage, either input
High-level differential input voltage, VIDH
Low-level differential input voltage, VIDL
MIN
MAX
UNIT
– 10
– 20†
– 60
V
20
V
2
†
– 20
20
V
0.8
V
Operating free-air temperature, TA
0
70
°C
† The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for input voltage levels.
electrical characteristics over recommended operating free-air temperature range, VBAT– = –52 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
IIH
High level input current (into IN + )
High-level
VID = 2 V
VID = 7 V
IIL
Low level input current (into IN + )
Low-level
VID = 0.4 V
VID = – 7 V
VO(on)
On-stage output voltage
IO = 50 mA,
IO(off)
O( ff)
Off stage output current
Off-stage
VO = VBAT –
IR
Clamp diode reverse current
VOK
Output clamp voltage
VO = 0
IO = 50 mA
IO = – 50 mA,
All drivers on
IBAT(on) On-state battery current
IBAT(off) Off-state battery current
‡ All typical values are at TA = 25°C.
2
All drivers off
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
TYP‡
MAX
40
100
375
1000
0.01
5
–1
– 100
VID = 2 V
VID = 0.8 V
– 1.6
– 2.1
–2
– 100
Inputs open
–2
– 100
2
100
VBAT – = 0
0.9
1.2
– 0.9
– 1.2
UNIT
µA
µA
V
µA
µA
V
–2
– 4.4
mA
–1
– 100
µA
DS3680
QUAD TELEPHONE RELAY DRIVER
SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
switching characteristics VBAT– = –52 V, TA = 25°C
PARAMETER
ton
toff
TEST CONDITIONS
Turn-on time
VID = 3-V pulse,
L = 1 H,
Turn-off time
MIN
RL = 1 kΩ,
See Figure 2
TYP
MAX
1
10
UNIT
µs
1
10
µs
PARAMETER MEASUREMENT INFORMATION
BAT GND
II
+
VI
IO
Load
–
BAT NEG
VO
– 52 V
– 52 V
Figure 1. Generalized Test Circuit, Each Driver
BAT GND
+
Input
Output
–
RL = 1 kΩ
BAT NEG
L=1H
– 52 V
TEST CIRCUIT
3V
Input
– 1.5 V
0V
ton
toff
VO(on)
Output
– 25 V
– 25 V
VOLTAGE WAVEFORMS
≈ – 52 V
Figure 2. Test Circuit and Voltage Waveforms, Each Driver
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
DS3680
QUAD TELEPHONE RELAY DRIVER
SLRS014C – MARCH 1986 – REVISED SEPTEMBER 1995
APPLICATION INFORMATION
52-V Battery
+
–
SN74XX
9 DS3680
1
2
3
4
5
6
8
7
K1
BAT NEG
1 IN +
1 IN –
13
2 IN +
1 OUT
2 IN –
K2
3 IN +
3 IN –
12
4 IN +
2 OUT
4 IN –
K3
ControlSignal
Source
11
3 OUT
K4
10
4 OUT
K1 – K4
50-V Relay Coils – 50 mA MAX
BAT GND
14
Figure 3. Relay Driver
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
DS3680D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DS3680N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
DS3680NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS3680DR
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS3680DR
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated