0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
DS90LV019TMX/NOPB

DS90LV019TMX/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC14_150MIL

  • 描述:

    IC TRANSCEIVER FULL 1/1 14SOIC

  • 数据手册
  • 价格&库存
DS90LV019TMX/NOPB 数据手册
DS90LV019 DS90LV019 3.3V or 5V LVDS Driver/Receiver Literature Number: SNLS008B DS90LV019 3.3V or 5V LVDS Driver/Receiver General Description Features The DS90LV019 is a Driver/Receiver designed specifically for the high speed low power point-to-point interconnect applications. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. The DS90LV019 features an independent driver and receiver with TTL/CMOS compatibility (DIN and ROUT). The logic interface provides maximum flexibility as 4 separate lines are provided (DIN, DE, RE, and ROUT). The device also features a flow-through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver has 3.5 mA output loop current. The driver translates between TTL levels (single-ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common-mode noise rejection. The receiver threshold is ± 100 mV over a ± 1V commonmode range and translates the low swing differential levels to standard (TTL/CMOS) levels. n n n n n n n n n n n n LVDS Signaling 3.3V or 5.0V operation Low power CMOS design Balanced Output Impedance Glitch free power up/down (Driver disabled) High Signaling Rate Capacity (above 100 Mbps) Ultra Low Power Dissipation ± 1V Common-Mode Range ± 100 mV Receiver Sensitivity Product offered in SOIC and TSSOP packages Flow-Through Pin Out Industrial Temperature Range Operation Connection Diagram DS100053-1 Order Number DS90LV019TM or DS90LV019TMTC See NS Package Number M14A or MTC14 Block Diagram DS100053-2 TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 2000 National Semiconductor Corporation DS100053 www.national.com DS90LV019 3.3V or 5V LVDS Driver/Receiver August 2000 DS90LV019 Absolute Maximum Ratings (Note 1) Derate SOIC Package If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. TSSOP Supply Voltage VCC −0.3V to (VCC + 0.3V) Receiver Output Voltage (ROUT) −0.3V to (VCC + 0.3V) Driver Output Voltage (DO ± ) −0.3V to +3.9V Receiver Input Voltage (RI ± ) −0.3V to (VCC + 0.3V) Driver Short Circuit Current 260˚C Recommended Operating Conditions ESD (Note 4) > 2.0 kV > 200 V (EIAJ, 0 Ω, 200 pF) −65˚C to +150˚C Lead Temperature (Soldering, 4 sec.) Continuous (HBM, 1.5 kΩ, 100 pF) 6.3mW/˚C Storage Temperature Range −0.3V to (VCC +0.3V) Driver Input Voltage (DIN) 790 mW Derate TSSOP Package 6.0V Enable Input Voltage (DE, RE) 7.7mW/˚C Min Max Units Supply Voltage (VCC) or 3.0 3.6 V Supply Voltage (VCC) 4.5 5.5 V Receiver Input Voltage 0.0 2.4 V Operating Free Air Temperature TA −40 +85 ˚C Units Maximum Package Power Dissipation at 25˚C SOIC 960 mW DC Electrical Characteristics TA = −40˚C to +85˚C unless otherwise noted, VCC = 3.3 ± 0.3V. (Notes 2, 3) Symbol Parameter Conditions Pin Min Typ Max DO+, DO− 250 350 450 mV 6 60 mV 1 1.25 1.7 V 5 60 mV +10 µA +10 µA −4 mA DIFFERENTIAL DRIVER CHARACTERISTICS RL = 100Ω (Figure 1) VOD Output Differential Voltage ∆VOD VOD Magnitude Change VOS Offset Voltage ∆VOS Offset Magnitude Change IOZD TRI-STATE ® Leakage VOUT = VCC or GND, DE = 0V −10 IOXD Power-Off Leakage VOUT = 3.6V or GND, VCC = 0V −10 ±1 ±1 IOSD Output Short Circuit Current VOUT = 0V, DE = VCC −10 −6 2.9 3.3 V 2.9 3.3 V 0.1 0.4 V −75 −34 −20 mA +100 mV DIFFERENTIAL RECEIVER CHARACTERISTICS VOH Voltage Output High VID = +100 mV IOH = −400 µA ROUT Inputs Open VOL Voltage Output Low IOL = 2.0 mA, VID = −100 mV IOS Output Short Circuit Current VOUT = 0V VTH Input Threshold High VTH Input Threshold Low IIN Input Current RI+, RI− VIN = +2.4V or 0V, VCC = 3.6V or 0V −100 −10 mV ±1 +10 µA VCC V DEVICE CHARACTERISTICS VIH Minimum Input High Voltage DIN, DE, RE VIL Maximum Input Low Voltage IIH Input High Current VIN = VCC or 2.4V IIL Input Low Current VIN = GND or 0.4V VCL Input Diode Clamp Voltage ICLAMP = −18 mA ICCD Power Supply Current 2.0 GND ±1 ±1 −1.5 VCC V µA −0.7 µA V 9 12.5 mA ICCR DE = RE = 0V 4.5 7.0 mA ICCZ DE = 0V, RE = VCC 3.7 7.0 mA 15 20 mA ICC DE = RE = VCC 0.8 ± 10 ± 10 DE = VCC, RE = 0V CD output Capacitance DO+, DO− 5 pF CR input Capacitance RI+, RI− 5 pF www.national.com 2 Symbol Parameter Conditions Pin Min Typ Max Units DO+, DO− 250 360 450 mV 6 60 mV 1 1.25 1.8 V 5 60 mV +10 µA +10 µA −4 mA DIFFERENTIAL DRIVER CHARACTERISTICS VOD Output Differential Voltage ∆VOD VOD Magnitude Change VOS Offset Voltage ∆VOS Offset Magnitude Change IOZD TRI-STATE Leakage IOXD IOSD R L = 100Ω (Figure 1) VOUT = VCC or GND, DE = 0V −10 Power-Off Leakage VOUT = 5.5V or GND, VCC = 0V −10 ±1 ±1 Output Short Circuit Current VOUT = 0V, DE = VCC −10 −6 4.3 5.0 4.3 5.0 DIFFERENTIAL RECEIVER CHARACTERISTICS VOH Voltage High VID = +100 mV IOH = −400 µA ROUT Inputs Open VOL Voltage Output Low IOL = 2.0 mA, VID = −100 mV IOS Output Short Circuit Current VOUT = 0V VTH Input Threshold High VTH Input Threshold Low IIN Input Current −150 RI+, RI− V V 0.1 0.4 V −75 −40 mA +100 mV −100 VIN = +2.4V or 0V, VCC = 5.5V or 0V mV ±1 −15 +15 µA DEVICE CHARACTERISTICS VIH Minimum Input High Voltage VIL Maximum Input Low Voltage IIH Input High Current VIN = VCC or 2.4 V IIL Input Low Current VIN = GND or 0.4V VCL Input Diode Clamp Voltage ICLAMP = −18 mA ICCD Power Supply Current DE = RE = VCC DIN, DE ,RE 2.0 VCC V GND 0.8 V ± 10 ± 10 µA 12 19 mA ±1 ±1 −1.5 −0.8 VCC µA V ICCR DE = RE = 0V 5.8 8 mA ICCZ DE = 0V, RE = VCC 4.5 8.5 mA ICC DE = VCC, RE = 0V 18 48 mA CD output Capacitance DO+, DO− 5 pF CR input Capacitance RI+, RI− 5 pF Note 1: “Absolute Maximum Ratings” are these beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of “Electrical Characteristics” provides conditions for actual device operation. Note 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 3: All typicals are given for VCC = +3.3V or +5.0V and TA = +25˚C, unless otherwise stated. Note 4: ESD Rating: > 2.0 kV > 200V. HBM (1.5 kΩ, 100 pF) EIAJ (0Ω, 200 pF) Note 5: CL includes probe and fixture capacitance. Note 6: Generator waveforms for all tests unless otherwise specified; f = 1 MHz, ZO = 50Ω, tr = tf ≤ 6.0 ns (0%–100%). AC Electrical Characteristics TA = −40˚C to +85˚C, VCC = 3.3V ± 0.3V. (Note 6) Symbol Parameter Conditions Min Typ Max Units RL = 100Ω, CL = 10 pF (Figure 2 and Figure 3) 2.0 4.0 6.5 ns 1.0 5.6 7.0 ns 0.4 1.0 ns DRIVER TIMING REQUIREMENTS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| tTLH Transition Time Low to High 0.2 0.7 3.0 ns tTHL Transition Time High to Low 0.2 0.8 3.0 ns 3 www.national.com DS90LV019 DC Electrical Characteristics TA = −40˚C to +85˚C unless otherwise noted, VCC = 5.0 ± 0.5V. (Notes 2, 3) DS90LV019 AC Electrical Characteristics (Continued) TA = −40˚C to +85˚C, VCC = 3.3V ± 0.3V. (Note 6) Symbol Parameter Conditions Min Typ Max Units RL = 100Ω, CL = 10 pF (Figure 4 and Figure 5) 1.5 4.0 8.0 ns DRIVER TIMING REQUIREMENTS tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low 2.5 5.3 9.0 ns 4.0 6.0 8.0 ns 3.5 6.0 8.0 ns 3.0 5.8 7.0 ns 3.0 5.6 9.0 ns 0.55 1.5 ns RECEIVER TIMING REQUIREMENTS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| CL = 10 pF, VID = 200 mV (Figure 6 and Figure 7) tr Rise Time 0.15 2.0 3.0 ns tf Fall Time 0.15 0.9 3.0 ns tPHZ Disable Time High to Z 3.0 4.0 6.0 ns tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low RL = 500Ω, CL = 10 pF (Figure 8 and Figure 9) 3.0 4.5 6.0 ns 3.0 6.0 8.0 ns 3.0 6.0 8.0 ns Conditions Min Typ Max Units RL = 100Ω, CL = 10 pF (Figure 2 and Figure 3) 2.0 3.3 6.0 ns AC Electrical Characteristics TA = −40˚C to +85˚C, VCC = 5.0V ± 0.5V. (Note 6) Symbol Parameter DRIVER TIMING REQUIREMENTS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| tTLH Transition Time Low to High tTHL Transition Time High to Low tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low 1.0 0.15 RL = 100Ω, CL = 10 pF (Figure 4 and Figure 5) 3.3 5.0 ns 0.6 1.0 ns 0.9 3.0 ns 0.15 1.2 3.0 ns 1.5 3.5 7.0 ns 3.0 5.2 9.0 ns 2.0 4.5 7.0 ns 2.0 4.5 7.0 ns 3.0 6.0 8.0 ns RECEIVER TIMING REQUIREMENTS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| tr Rise Time tf Fall Time tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low www.national.com CL = 10 pF, VID = 200 mV (Figure 6 and Figure 7) RL = 500Ω, CL = 10 pF (Figure 8 and Figure 9) 4 3.0 5.6 8.0 ns 0.7 1.6 ns 0.15 0.8 3.0 ns 0.15 0.8 3.0 ns 3.0 3.5 4.5 ns 3.5 3.6 7.0 ns 3.0 5.0 7.0 ns 3.0 5.0 7.0 ns DS90LV019 Test Circuits and Timing Waveforms DS100053-3 FIGURE 1. Differential Driver DC Test Circuit DS100053-4 FIGURE 2. Differential Driver Propagation Delay and Transition Test Circuit DS100053-5 FIGURE 3. Differential Driver Propagation and Transition Time Waveforms DS100053-6 FIGURE 4. Driver TRI-STATE Delay Test Circuit 5 www.national.com DS90LV019 Test Circuits and Timing Waveforms (Continued) DS100053-7 FIGURE 5. Driver TRI-STATE Delay Waveforms DS100053-8 FIGURE 6. Receiver Propagation Delay and Transition Time Test Circuit DS100053-9 FIGURE 7. Receiver Propagation Delay and Transition Time Waveforms DS100053-10 FIGURE 8. Receiver TRI-STATE Delay Test Circuit www.national.com 6 DS90LV019 Test Circuits and Timing Waveforms (Continued) DS100053-11 FIGURE 9. Receiver TRI-STATE Delay Waveforms TRI-STATE Delay Waveforms DS100053-13 FIGURE 10. Terminated Input Fail-Safe Circuit Typical Application Diagram DS100053-12 and 0.01 µF in parallel should be used between each VCC and ground. The capacitors should be as close as possible to the VCC pin. Applications Information The DS90LV019 has two control pins, which allows the device to operate as a driver, a receiver or both driver and a receiver at the same time. There are a few common practices which should be implied when designing PCB for LVDS signaling. Recommended practices are: • Use at least 4 PCB board layer (LVDS signals, ground, power and TTL signals). • Keep drivers and receivers as close to the (LVDS port side) connector as possible. • Bypass each LVDS device and also use distributed bulk capacitance. Surface mount capacitors placed close to power and ground pins work best. Two or three multilayer ceramic (MLC) surface mount capacitors 0.1 µF, • Use controlled impedance traces which match the differential impedance of your transmission medium (i.e., Cable) and termination resistor. • Use the termination resistor which best matches the differential impedance of your transmission line. • Isolate TTL signals from LVDS signals. MEDIA (CABLE AND CONNECTOR) SELECTION: • 7 Use controlled impedance media. The cables and connectors should have a matched differential impedance of about 100Ω. www.national.com DS90LV019 Applications Information • (Continued) • Balanced cables (e.g., twisted pair) are usually better than unbalanced cables (ribbon cable, simple coax) for noise reduction and signal quality. • For cable distances < 0.5m, most cables can be made to work effectively. For distances 0.5m ≤ d ≤ 10m, CAT 3 (category 3) twisted pair cable works well and is readily available and relatively inexpensive. For distances > 10m, and high data rates CAT 5 twisted pair is recommended. There are three Fail-Safe scenarios, open input pins, shorted inputs pins and terminated input pins. The first case is guaranteed for DS90LV019. A HIGH state on ROUT pin can be achieved by using two external resistors (one to VCC and one to GND) per Figure 10 (Terminated Input Fail-Safe Circuit). R1 and R2 should be RT to limit the loading to the LVDS driver . RT is selected to match the impedance of the cable. TABLE 1. Functional Table MODE SELECTED DE RE DRIVER MODE H H RECEIVER MODE L L TRI-STATE MODE L H FULL DUPLEX MODE H L TABLE 2. Transmitter Mode INPUTS TABLE 3. Receiver Mode OUTPUTS INPUTS OUTPUT DE DI DO+ DO− RE (RI+) − (RI−) H L L H L L ( < −100 mV) L H H H L L H ( > +100 mV) H H 2 > & > 0.8 X X L 100 mV > & > −100 mV X L X Z Z H X Z X = High or Low logic state Z = High impedance state L = Low state H = High state X = High or Low logic state Z = High impedance state L = Low state H = High state TABLE 4. Device Pin Description Pin Name Pin # Input/Output DIN 2 I TTL Driver Input DO ± 11, 12 O LVDS Driver Outputs RI ± 9, 10 I LVDS Receiver Inputs ROUT 4 O TTL Receiver Output RE 8 I Receiver Enable TTL Input (Active Low) DE 1 I GND 7 NA Ground VCC 14 NA Power Supply (3.3V ± 0.3V or 5.0V ± 0.5V) www.national.com Description Driver Enable TTL Input (Active High) 8 DS90LV019 Physical Dimensions inches (millimeters) unless otherwise noted Order Number DS90LV019TM NS Package Number M14A 9 www.national.com DS90LV019 3.3V or 5V LVDS Driver/Receiver Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Order Number DS90LV019TMTC NS Package Number MTC14 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: ap.support@nsc.com National Semiconductor Japan Ltd. Tel: 81-3-5639-7560 Fax: 81-3-5639-7507 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated
DS90LV019TMX/NOPB 价格&库存

很抱歉,暂时无法提供与“DS90LV019TMX/NOPB”相匹配的价格&库存,您可以联系我们找货

免费人工找货
DS90LV019TMX/NOPB
  •  国内价格 香港价格
  • 1+29.041881+3.60264
  • 10+21.0221810+2.60779
  • 25+19.0257525+2.36014
  • 100+16.82749100+2.08745
  • 250+15.77929250+1.95742
  • 500+15.14748500+1.87904
  • 1000+14.627081000+1.81449

库存:4817