DS91M124TMA/NOPB

DS91M124 www.ti.com SNLS287E – AUGUST 2008 – REVISED APRIL 2013 DS91M124 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input Check for Samples: DS91M124 FEATURES DESCRIPTION • The DS91M124 is a 1:4 M-LVDS repeater for driving and distributing clock or data signals to up to four multipoint networks. 1 2 • • • • • • • DC - 125 MHz / 250 Mbps Low Jitter, Low Skew, Low Power Operation Independent Driver Enable Pins Conforms to TIA/EIA-899 M-LVDS Standard Controlled Transition Times Minimize Reflections 8 kV ESD on M-LVDS I/O Pins Protects Adjoining Components Flow-Through Pinout Simplifies PCB Layout Industrial Operating Temperature Range (−40°C to +85°C) Available in a Space Saving SOIC-16 Package APPLICATIONS • • • Multidrop / Multipoint Clock and Data Distribution High-Speed, Low Power, Short-Reach Alternative to TIA/EIA-485/422 Clock Distribution in AdvancedTCA (ATCA) and MicroTCA (μTCA) Backplanes M-LVDS (Multipoint LVDS) is a new family of bus interface devices based on LVDS technology specifically designed for multipoint and multidrop cable and backplane applications. It differs from standard LVDS in providing increased drive current to handle double terminations that are required in multipoint applications. Controlled transition times minimize reflections that are common in multipoint configurations due to unterminated stubs. A single DS91M124 channel is a 1:4 repeater that accepts LVTTL/LVCMOS signals at the driver inputs and converts them to differential M-LVDS signal levels. It features independent driver enable pins for each driver output. The DS91M124 has a flow-through pinout for easy PCB layout. It provides a new alternative for high speed multipoint interface applications. It is packaged in a space saving SOIC-16 package. Typical Application Line Card in SLOT 1 DS91M124 Line Card in SLOT N-1 Line Card in SLOT N M-LVDS Receivers M-LVDS Receivers RT Z0 RT RT Z0 RT RT Z0 RT RT Z0 RT RT = ZLOADED BACKPLANE 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated DS91M124 SNLS287E – AUGUST 2008 – REVISED APRIL 2013 www.ti.com Pin Diagram DE0 1 16 B0 DE1 2 15 A0 DE2 3 14 A1 VDD 4 13 B1 GND 5 12 B2 DI 6 11 A2 N/C 7 10 A3 DE3 8 9 B3 Figure 1. SOIC Package See Package Number D0016A Logic Diagram DE0 B0 A0 DE1 B1 A1 DI B2 A2 DE2 B3 A3 DE3 Pin Descriptions Number Name I/O, Type 1, 2, 3, 8 DE I, LVCMOS Driver enable pin: When a DE pin is low, the corresponding driver output is disabled. When a DE pin is high, the corresponding driver output is enabled. There is a 300 kΩ pulldown resistor on each DE pin. Description 6 DI I, LVCMOS Driver input pin. 5 GND Power 10, 11, 14, 15 A O, M-LVDS Ground pin. Non-inverting driver output pins. 9, 12, 13, 16 B O, M-LVDS Inverting driver output pins. 4 VDD Power 7 N/C N/A Power supply pin, +3.3V ± 0.3V NO CONNECT pin. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 DS91M124 www.ti.com Absolute Maximum Ratings SNLS287E – AUGUST 2008 – REVISED APRIL 2013 (1) (2) −0.3V to +4V Power Supply Voltage −0.3V to (VDD + 0.3V) LVCMOS Input Voltage −1.9V to +5.5V M-LVDS Output Voltage M-LVDS Output Short Circuit Current Duration Continuous Junction Temperature +140°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Package Power Dissipation @ +25°C D0016A Package 2.21W Derate D0016A Package 19.2 mW/°C above +25°C Package Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC) θJA +52°C/W θJC +19°C/W ESD Susceptibility HBM MM (2) (3) (4) (5) ≥8 kV (4) CDM (1) (3) ≥250V (5) ≥1250V “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human Body Model, applicable std. JESD22-A114C Machine Model, applicable std. JESD22-A115-A Field Induced Charge Device Model, applicable std. JESD22-C101-C Recommended Operating Conditions Min Typ Max Units 3.0 3.3 3.6 V −1.4 +3.8 V LVTTL Input Voltage High VIH 2.0 VDD V LVTTL Input Voltage Low VIL 0 0.8 V +85 °C Supply Voltage, VDD Voltage at Any Bus Terminal (Separate or Common-Mode) Operating Free Air −40 Temperature TA +25 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 3 DS91M124 SNLS287E – AUGUST 2008 – REVISED APRIL 2013 www.ti.com DC Electrical Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. Parameter (1) (2) (3) (4) Test Conditions Min Typ Max Units V LVCMOS DC Specifications VIH High-Level Input Voltage 2.0 VDD VIL Low-Level Input Voltage GND 0.8 V IIH High-Level Input Current VIH = 3.6V IIL Low-Level Input Current VCL Input Clamp Voltage -15 ±1 15 μA VIL = 0V -15 ±1 15 μA IIN = -18 mA -1.5 RL = 50Ω, CL = 5 pF Figure 2 Figure 4 480 650 mV −50 50 mV 2.10 V 0 50 mV 0 2.4 V 0 2.4 V V M-LVDS DC Specifications |VAB| Differential Output Voltage Magnitude ΔVAB Change in Differential Output Voltage Magnitude Between Logic States VOS(SS) Steady-State Common-Mode Output Voltage |ΔVOS(SS)| Change in Steady-State Common-Mode Output Voltage Between Logic States VA(OC) Maximum Steady-State Open-Circuit Output Voltage VB(OC) Maximum Steady-State Open-Circuit Output Voltage VP(H) Voltage Overshoot, Low-to-High Level Output VP(L) Voltage Overshoot, High-to-Low Level Output IOS Output Short-Circuit Current (5) (5) (6) 0.30 Figure 2 Figure 3 RL = 50Ω Figure 5 RL = 50Ω, CL = 5 pF CD = 0.5 pF Figure 7 Figure 8 Figure 6 Driver High-Impedance Output Current IB Driver High-Impedance Output Current 1.2VSS V −0.2VSS 43 mA 0 32 μA VA = 0V or 2.4V, VB = 1.2V −20 20 μA VA = −1.4V, VB = 1.2V −32 0 μA VA = 3.8V, VB = 1.2V 0 32 μA VA = 0V or 2.4V, VB = 1.2V −20 20 μA VA = −1.4V, VB = 1.2V −32 0 μA IAB Driver High-Impedance Output Differential Curent (IA − IB) VA = VB, −1.4V ≤ V ≤ 3.8V −4 4 IA(OFF) Driver High-Impedance Output Power-Off Current VA = 3.8V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V 0 32 VA = 0V or 2.4V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V −20 20 VA = −1.4V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V −32 0 (1) (2) (3) (4) (5) (6) 4 V -43 VA = 3.8V, VB = 1.2V IA 1.6 μA μA μA μA The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and ΔVOD. Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. CL includes fixture capacitance and CD includes probe capacitance. Specification is ensured by characterization and is not tested in production. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 DS91M124 www.ti.com SNLS287E – AUGUST 2008 – REVISED APRIL 2013 DC Electrical Characteristics (continued) Over supply voltage and operating temperature ranges, unless otherwise specified. (1)(2)(3)(4) Parameter IB(OFF) IAB(OFF) Test Conditions Driver High-Impedance Output Power-Off Current Driver High-Impedance Output Power-Off Current (IA(OFF) − IB(OFF)) Min Typ Max Units μA VA = 3.8V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V 0 32 VA = 0V or 2.4V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V −20 20 VA = −1.4V, VB = 1.2V DEn = 0V 0V ≤ VDD ≤ 1.5V −32 0 VA = VB, −1.4V ≤ V ≤ 3.8V DEn = 0V 0V ≤ VDD ≤ 1.5V −4 4 μA μA μA CA Driver Output Capacitance 7.8 pF CB Driver Output Capacitance 7.8 pF CAB Driver Output Differential Capacitance 3 pF CA/B Driver Output Capacitance Balance (CA/CB) ICCL Loaded Supply Current Enabled ICCZ VDD = 0V No Load Supply Current Disabled 1 RL = 50Ω (All Outputs) DI = VDD or GND DEn = VDD or GND (All Outputs) 65 75 mA DI = VDD or GND, DEn = GND (All Outputs) 19 24 mA Switching Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. Parameter (1) (2) (3) Min Typ Max Units tPHL Differential Propagation Delay High to Low Test Conditions 1.8 3.9 6.5 ns tPLH Differential Propagation Delay Low to High 1.8 3.9 6.5 ns 0 25 100 ps 0 70 250 ps 0 1.5 2 ns tSKD1 Differential Pulse Skew |tPHL − tPLH| tSKD2 Channel-to-Channel Skew tSKD3 Differential Part-to-Part Skew (Constant TA and VDD) (4) (7) tSKD4 Differential Part-to-Part Skew (4) (8) (4) (6) Rise Time tTHL Fall Time tPHZ Disable Time High to Z tPLZ Disable Time Low to Z tPZH Enable Time Z to High tPZL Enable Time Z to Low fMAX Maximum Operating Frequency (2) (3) (4) (5) (6) (7) (8) RL = 50Ω CL = 5 pF, CD = 0.5 pF Figure 7 Figure 8 (4) tTLH (1) (4) (5) (4) 4.7 ns 1.1 0 2.0 3.0 ns 1.1 2.0 3.0 ns 6 11 ns 6 11 ns 6 11 ns 6 11 RL = 50Ω CL = 5 pF, CD = 0.5 pF Figure 9 Figure 10 (4) 125 ns MHz The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. CL includes fixture capacitance and CD includes probe capacitance. Specification is ensured by characterization and is not tested in production. tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. tSKD2, Channel-to-Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels. tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range. tSKD4, Part-to-Part Skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 5 DS91M124 SNLS287E – AUGUST 2008 – REVISED APRIL 2013 www.ti.com Test Circuits and Waveforms Figure 2. Differential Driver Test Circuit A ~ 1.9V B ~ 1.3V 'VOS(SS) VOS VOS(PP) Figure 3. Differential Driver Waveforms Figure 4. Differential Driver Full Load Test Circuit Figure 5. Differential Driver DC Open Test Circuit 6 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 DS91M124 www.ti.com SNLS287E – AUGUST 2008 – REVISED APRIL 2013 Figure 6. Differential Driver Short-Circuit Test Circuit Figure 7. Driver Propagation Delay and Transition Time Test Circuit Figure 8. Driver Propagation Delays and Transition Time Waveforms Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 7 DS91M124 SNLS287E – AUGUST 2008 – REVISED APRIL 2013 www.ti.com Figure 9. Driver TRI-STATE Delay Test Circuit Figure 10. Driver TRI-STATE Delay Waveforms 8 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 DS91M124 www.ti.com SNLS287E – AUGUST 2008 – REVISED APRIL 2013 Typical Performance Characteristics 3.4 3.4 f = 125 MHz DRIVER FALL TIME (10-90%) (ns) DRIVER RISE TIME (10-90%) (ns) f = 125 MHz 3.0 VCC = 3.0 V 2.6 2.2 1.8 VCC = 3.6 V VCC = 3.3 V 1.4 1.0 -50 -10 30 70 110 3.0 VCC = 3.0 V 2.6 2.2 1.8 1.4 VCC = 3.3 V 1.0 -50 150 -10 TEMPERATURE (°C) 750 600 450 f = 1 MHz VCC = 3.3V TA = 25°C 150 0 25 50 75 100 125 f = 125 MHz VCC = 3.0 V 5.0 4.5 4.0 3.5 VCC = 3.6 V 3.0 VCC = 3.3 V 2.5 -50 -10 70 110 150 Figure 14. Driver Propagation Delay (tPLHD) as a Function of Temperature 5.5 180 f = 125 MHz VCC = 3.0 V 5.0 POWER SUPPLY CURRENT (mA) DRIVER PROPAGATION DELAY (tPHLD) (ns) 30 TEMPERATURE (°C) Figure 13. Driver Output Signal Amplitude as a Function of Resistive Load 4.5 4.0 3.5 VCC = 3.6 V 2.5 -50 150 5.5 RESISTIVE LOAD (:) 3.0 110 Figure 12. Driver Fall Time as a Function of Temperature DRIVER PROPAGATION DELAY (tPLHD) (ns) VOD - DRIVER OUTPUT AMPLITUDE (mV) 900 0 70 TEMPERATURE (°C) Figure 11. Driver Rise Time as a Function of Temperature 300 30 VCC = 3.6 V VCC = 3.3 V VCC = 3.3V TA = 25°C RL = 50: On all CH) 150 120 4 Outputs ON 3 Outputs ON 90 2 Outputs ON 60 30 1 Output ON 0 -10 30 70 110 150 0 TEMPERATURE (°C) 25 50 75 100 125 FREQUENCY (MHz) Figure 15. Driver Propagation Delay (tPHLD) as a Function of Temperature Figure 16. Driver Power Supply Current as a Function of Frequency Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 9 DS91M124 SNLS287E – AUGUST 2008 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS91M124 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS91M124TMA/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS91M124 TMA DS91M124TMAX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS91M124 TMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of